TWI684225B - 自定向計量和圖樣分類 - Google Patents

自定向計量和圖樣分類 Download PDF

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Publication number
TWI684225B
TWI684225B TW105127595A TW105127595A TWI684225B TW I684225 B TWI684225 B TW I684225B TW 105127595 A TW105127595 A TW 105127595A TW 105127595 A TW105127595 A TW 105127595A TW I684225 B TWI684225 B TW I684225B
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TW
Taiwan
Prior art keywords
design
defect
sample
information
area
Prior art date
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TW105127595A
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English (en)
Chinese (zh)
Other versions
TW201727789A (zh
Inventor
艾倫 派克
艾潔 古普傑
珍 勞勃
Original Assignee
美商克萊譚克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from US15/247,774 external-priority patent/US10483081B2/en
Application filed by 美商克萊譚克公司 filed Critical 美商克萊譚克公司
Publication of TW201727789A publication Critical patent/TW201727789A/zh
Application granted granted Critical
Publication of TWI684225B publication Critical patent/TWI684225B/zh

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Data Mining & Analysis (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW105127595A 2015-08-28 2016-08-26 自定向計量和圖樣分類 TWI684225B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562211375P 2015-08-28 2015-08-28
US62/211,375 2015-08-28
US15/247,774 US10483081B2 (en) 2014-10-22 2016-08-25 Self directed metrology and pattern classification
US15/247,774 2016-08-25

Publications (2)

Publication Number Publication Date
TW201727789A TW201727789A (zh) 2017-08-01
TWI684225B true TWI684225B (zh) 2020-02-01

Family

ID=58188172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105127595A TWI684225B (zh) 2015-08-28 2016-08-26 自定向計量和圖樣分類

Country Status (6)

Country Link
JP (1) JP6914249B2 (he)
KR (1) KR102340756B1 (he)
CN (1) CN107924850B (he)
IL (1) IL257205B (he)
TW (1) TWI684225B (he)
WO (1) WO2017040351A1 (he)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10997710B2 (en) * 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
US11094053B2 (en) 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
KR102615980B1 (ko) * 2023-06-09 2023-12-21 (주)오로스 테크놀로지 오버레이 계측 장치 및 오버레이 계측 방법
CN116503397B (zh) * 2023-06-26 2023-09-01 山东天通汽车科技股份有限公司 基于图像数据的车内传输带缺陷检测方法

Citations (8)

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US20080094639A1 (en) * 2006-10-24 2008-04-24 Kla-Tencor Technologies Corporation Waferless recipe optimization
US20090039263A1 (en) * 2007-08-09 2009-02-12 Ryoichi Matsuoka Pattern measurement apparatus
US20090268959A1 (en) * 2008-04-23 2009-10-29 Minoru Harada Method and apparatus for reviewing defects
US20110276935A1 (en) * 2008-06-11 2011-11-10 Kla-Tencor Corporation Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
US20120141011A1 (en) * 2009-06-02 2012-06-07 Hitachi High-Technologies Corporation Defect image processing apparatus, defect image processing method, semiconductor defect classifying apparatus, and semiconductor defect classifying method
US20140376801A1 (en) * 2013-06-19 2014-12-25 Kla-Tencor Corporation Detecting Defects on a Wafer with Run Time Use of Design Data
US20150139531A1 (en) * 2012-05-11 2015-05-21 Hitachi High-Technologies Corporation Defect analysis assistance device, program executed by defect analysis assistance device, and defect analysis system
KR20150113102A (ko) * 2013-02-01 2015-10-07 케이엘에이-텐코 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출

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US6891167B2 (en) * 2000-06-15 2005-05-10 Kla-Tencor Technologies Apparatus and method for applying feedback control to a magnetic lens
JP4154282B2 (ja) * 2003-05-14 2008-09-24 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
US8089058B2 (en) 2005-09-01 2012-01-03 Camtek Ltd. Method for establishing a wafer testing recipe
KR101370154B1 (ko) * 2005-11-18 2014-03-04 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP2008235575A (ja) * 2007-03-20 2008-10-02 Toshiba Corp パターン測定方法、パターン測定装置およびプログラム
JP5118872B2 (ja) * 2007-03-30 2013-01-16 株式会社日立ハイテクノロジーズ 半導体デバイスの欠陥観察方法及びその装置
JP2012068051A (ja) * 2010-09-21 2012-04-05 Toshiba Corp パターン欠陥検査装置およびパターン欠陥検査方法
KR101522804B1 (ko) * 2011-01-26 2015-05-26 가부시키가이샤 히다치 하이테크놀로지즈 패턴 매칭 장치 및 기록 매체
US8656323B2 (en) * 2011-02-22 2014-02-18 Kla-Tencor Corporation Based device risk assessment
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
CN102937599B (zh) * 2012-10-25 2015-01-07 中国科学院自动化研究所 一种通过x射线检测含金属被测物的无损检测系统和方法
US9619876B2 (en) * 2013-03-12 2017-04-11 Kla-Tencor Corp. Detecting defects on wafers based on 2D scatter plots of values determined for output generated using different optics modes
US10079183B2 (en) * 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
US11048159B2 (en) 2016-03-31 2021-06-29 Hoya Corporation Method for manufacturing reflective mask blank, reflective mask blank, method for manufacturing reflective mask, reflective mask, and method for manufacturing semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080094639A1 (en) * 2006-10-24 2008-04-24 Kla-Tencor Technologies Corporation Waferless recipe optimization
US20090039263A1 (en) * 2007-08-09 2009-02-12 Ryoichi Matsuoka Pattern measurement apparatus
US20090268959A1 (en) * 2008-04-23 2009-10-29 Minoru Harada Method and apparatus for reviewing defects
US20110276935A1 (en) * 2008-06-11 2011-11-10 Kla-Tencor Corporation Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
US20120141011A1 (en) * 2009-06-02 2012-06-07 Hitachi High-Technologies Corporation Defect image processing apparatus, defect image processing method, semiconductor defect classifying apparatus, and semiconductor defect classifying method
US20150139531A1 (en) * 2012-05-11 2015-05-21 Hitachi High-Technologies Corporation Defect analysis assistance device, program executed by defect analysis assistance device, and defect analysis system
KR20150113102A (ko) * 2013-02-01 2015-10-07 케이엘에이-텐코 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US20140376801A1 (en) * 2013-06-19 2014-12-25 Kla-Tencor Corporation Detecting Defects on a Wafer with Run Time Use of Design Data

Also Published As

Publication number Publication date
WO2017040351A1 (en) 2017-03-09
KR102340756B1 (ko) 2021-12-16
IL257205B (he) 2021-01-31
JP6914249B2 (ja) 2021-08-04
CN107924850A (zh) 2018-04-17
CN107924850B (zh) 2022-06-28
IL257205A (he) 2018-03-29
TW201727789A (zh) 2017-08-01
JP2018530911A (ja) 2018-10-18
KR20180037055A (ko) 2018-04-10

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