TWI704174B - 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板 - Google Patents

硬化性樹脂組成物、乾膜、硬化物以及印刷配線板 Download PDF

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Publication number
TWI704174B
TWI704174B TW105116454A TW105116454A TWI704174B TW I704174 B TWI704174 B TW I704174B TW 105116454 A TW105116454 A TW 105116454A TW 105116454 A TW105116454 A TW 105116454A TW I704174 B TWI704174 B TW I704174B
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TW
Taiwan
Prior art keywords
resin composition
curable resin
resin
film
epoxy resin
Prior art date
Application number
TW105116454A
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English (en)
Chinese (zh)
Other versions
TW201708403A (zh
Inventor
福田晋一朗
Original Assignee
日商太陽油墨製造股份有限公司
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Publication of TW201708403A publication Critical patent/TW201708403A/zh
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Publication of TWI704174B publication Critical patent/TWI704174B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
TW105116454A 2015-07-21 2016-05-26 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板 TWI704174B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-144277 2015-07-21
JP2015144277 2015-07-21
JP2016-090155 2016-04-28
JP2016090155A JP6742796B2 (ja) 2015-07-21 2016-04-28 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Publications (2)

Publication Number Publication Date
TW201708403A TW201708403A (zh) 2017-03-01
TWI704174B true TWI704174B (zh) 2020-09-11

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Application Number Title Priority Date Filing Date
TW105116454A TWI704174B (zh) 2015-07-21 2016-05-26 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板

Country Status (3)

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JP (1) JP6742796B2 (ja)
KR (1) KR102588995B1 (ja)
TW (1) TWI704174B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7478659B2 (ja) * 2018-03-30 2024-05-07 太陽ホールディングス株式会社 硬化性樹脂組成物、その硬化物およびプリント配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201423264A (zh) * 2012-09-28 2014-06-16 Taiyo Ink Mfg Co Ltd 光硬化性樹脂組成物、印刷配線板、及光硬化性樹脂組成物之製造方法
TW201439192A (zh) * 2011-10-31 2014-10-16 Taiyo Ink Mfg Co Ltd 熱硬化性樹脂組成物及其硬化物,及使用其之印刷電路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338787A (ja) * 2001-05-15 2002-11-27 Kawamura Inst Of Chem Res エポキシ樹脂組成物及びその硬化物
JP2004277458A (ja) * 2003-03-12 2004-10-07 Nagase Chemtex Corp 1液型エポキシ樹脂組成物およびそれを用いた1液型エポキシ樹脂系接着剤
JP4449402B2 (ja) 2003-08-25 2010-04-14 日立化成工業株式会社 永久レジスト用感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板
JP2008039926A (ja) * 2006-08-02 2008-02-21 Toyo Ink Mfg Co Ltd 感光性熱硬化性樹脂組成物
JP5588646B2 (ja) 2009-09-15 2014-09-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びドライフィルム
KR20130140798A (ko) * 2011-02-01 2013-12-24 디아이씨 가부시끼가이샤 열경화형 수지 조성물, 그 경화물 및 프린트 배선판용 층간 접착 필름
JP2014523451A (ja) * 2011-05-02 2014-09-11 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂中のホウ酸トリメチル
JP6010483B2 (ja) * 2013-02-28 2016-10-19 株式会社カネカ 感光性樹脂組成物作製キット及びその利用
JP5758463B2 (ja) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板
JP5723958B1 (ja) * 2013-12-02 2015-05-27 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201439192A (zh) * 2011-10-31 2014-10-16 Taiyo Ink Mfg Co Ltd 熱硬化性樹脂組成物及其硬化物,及使用其之印刷電路板
TW201423264A (zh) * 2012-09-28 2014-06-16 Taiyo Ink Mfg Co Ltd 光硬化性樹脂組成物、印刷配線板、及光硬化性樹脂組成物之製造方法

Also Published As

Publication number Publication date
JP2017025290A (ja) 2017-02-02
KR102588995B1 (ko) 2023-10-13
TW201708403A (zh) 2017-03-01
KR20170012050A (ko) 2017-02-02
JP6742796B2 (ja) 2020-08-19

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