TWI756431B - 嵌段共聚物及其製造方法、環氧樹脂組成物、及其硬化物以及半導體封裝材料 - Google Patents

嵌段共聚物及其製造方法、環氧樹脂組成物、及其硬化物以及半導體封裝材料 Download PDF

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TWI756431B
TWI756431B TW107118100A TW107118100A TWI756431B TW I756431 B TWI756431 B TW I756431B TW 107118100 A TW107118100 A TW 107118100A TW 107118100 A TW107118100 A TW 107118100A TW I756431 B TWI756431 B TW I756431B
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polysiloxane
group
block copolymer
polyalkylene glycol
epoxy resin
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TW107118100A
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Chinese (zh)
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TW201902999A (zh
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田中寬子
井砂友香
淺野到
竹崎宏
御山壽
本田史郎
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日商東麗股份有限公司
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    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • C08L87/005—Block or graft polymers not provided for in groups C08L1/00 - C08L85/04
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  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
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TW107118100A 2017-05-31 2018-05-28 嵌段共聚物及其製造方法、環氧樹脂組成物、及其硬化物以及半導體封裝材料 TWI756431B (zh)

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KR (1) KR20200015475A (fr)
CN (1) CN110637047B (fr)
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WO2020255749A1 (fr) * 2019-06-21 2020-12-24 パナソニックＩｐマネジメント株式会社 Composition d'étanchéité, dispositif à semi-conducteur et procédé de production de dispositif à semi-conducteur
CN110791196B (zh) * 2019-11-15 2021-03-09 江南大学 一种可光热双重固化的高耐候有机硅改性环氧树脂的制备方法
JP7465790B2 (ja) * 2020-11-18 2024-04-11 信越化学工業株式会社 シリコーンハイブリッド樹脂組成物、及び半導体装置
CN113308089A (zh) * 2021-06-24 2021-08-27 泉州师范学院 一种高白度、韧性环氧树脂复合材料的制备方法

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JPWO2018221373A1 (ja) 2019-06-27
EP3632961A4 (fr) 2020-12-16
US11104766B2 (en) 2021-08-31
CN110637047B (zh) 2021-11-12
TW201902999A (zh) 2019-01-16
JP6642761B2 (ja) 2020-02-12
JP2019210486A (ja) 2019-12-12
WO2018221373A1 (fr) 2018-12-06
CN110637047A (zh) 2019-12-31

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