TWI850026B - 光束調整裝置、雷射退火裝置 - Google Patents

光束調整裝置、雷射退火裝置 Download PDF

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Publication number
TWI850026B
TWI850026B TW112126489A TW112126489A TWI850026B TW I850026 B TWI850026 B TW I850026B TW 112126489 A TW112126489 A TW 112126489A TW 112126489 A TW112126489 A TW 112126489A TW I850026 B TWI850026 B TW I850026B
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TW
Taiwan
Prior art keywords
lens
size
optical element
laser
shaping optical
Prior art date
Application number
TW112126489A
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English (en)
Chinese (zh)
Other versions
TW202405907A (zh
Inventor
萬雅史
岡田康弘
Original Assignee
日商住友重機械工業股份有限公司
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Application filed by 日商住友重機械工業股份有限公司 filed Critical 日商住友重機械工業股份有限公司
Publication of TW202405907A publication Critical patent/TW202405907A/zh
Application granted granted Critical
Publication of TWI850026B publication Critical patent/TWI850026B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
  • Lenses (AREA)
TW112126489A 2022-07-19 2023-07-17 光束調整裝置、雷射退火裝置 TWI850026B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022114797 2022-07-19
JP2022-114797 2022-07-19

Publications (2)

Publication Number Publication Date
TW202405907A TW202405907A (zh) 2024-02-01
TWI850026B true TWI850026B (zh) 2024-07-21

Family

ID=89617564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112126489A TWI850026B (zh) 2022-07-19 2023-07-17 光束調整裝置、雷射退火裝置

Country Status (2)

Country Link
TW (1) TWI850026B (fr)
WO (1) WO2024018785A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102135665A (zh) * 2011-04-01 2011-07-27 北京工业大学 将高斯光束整形为平顶光束的装置和方法
CN104991347A (zh) * 2015-07-16 2015-10-21 哈尔滨工业大学 基于微透镜阵列的激光整形照明器
WO2021256434A1 (fr) * 2020-06-18 2021-12-23 住友重機械工業株式会社 Dispositif de commande d'appareil de recuit au laser et procédé de recuit au laser

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5100127B2 (ja) * 2006-01-12 2012-12-19 株式会社半導体エネルギー研究所 レ−ザー光照射装置
JP5210574B2 (ja) * 2006-09-14 2013-06-12 株式会社半導体エネルギー研究所 レーザ照射装置
US20090323739A1 (en) * 2006-12-22 2009-12-31 Uv Tech Systems Laser optical system
JP5094138B2 (ja) * 2007-01-23 2012-12-12 株式会社半導体エネルギー研究所 結晶性半導体膜の作製方法
JP7523960B2 (ja) * 2020-06-18 2024-07-29 住友重機械工業株式会社 レーザ処理方法、レーザ処理装置の制御装置、及びレーザ処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102135665A (zh) * 2011-04-01 2011-07-27 北京工业大学 将高斯光束整形为平顶光束的装置和方法
CN104991347A (zh) * 2015-07-16 2015-10-21 哈尔滨工业大学 基于微透镜阵列的激光整形照明器
WO2021256434A1 (fr) * 2020-06-18 2021-12-23 住友重機械工業株式会社 Dispositif de commande d'appareil de recuit au laser et procédé de recuit au laser

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Publication number Publication date
TW202405907A (zh) 2024-02-01
WO2024018785A1 (fr) 2024-01-25

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