TWI853065B - 擴片裝置 - Google Patents

擴片裝置 Download PDF

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Publication number
TWI853065B
TWI853065B TW109127062A TW109127062A TWI853065B TW I853065 B TWI853065 B TW I853065B TW 109127062 A TW109127062 A TW 109127062A TW 109127062 A TW109127062 A TW 109127062A TW I853065 B TWI853065 B TW I853065B
Authority
TW
Taiwan
Prior art keywords
workpiece
expansion
hot air
unit
sheet
Prior art date
Application number
TW109127062A
Other languages
English (en)
Chinese (zh)
Other versions
TW202107624A (zh
Inventor
松田智人
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202107624A publication Critical patent/TW202107624A/zh
Application granted granted Critical
Publication of TWI853065B publication Critical patent/TWI853065B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW109127062A 2019-08-14 2020-08-10 擴片裝置 TWI853065B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-148838 2019-08-14
JP2019148838A JP7325258B2 (ja) 2019-08-14 2019-08-14 エキスパンド装置

Publications (2)

Publication Number Publication Date
TW202107624A TW202107624A (zh) 2021-02-16
TWI853065B true TWI853065B (zh) 2024-08-21

Family

ID=74603831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109127062A TWI853065B (zh) 2019-08-14 2020-08-10 擴片裝置

Country Status (4)

Country Link
JP (1) JP7325258B2 (ja)
KR (1) KR102819437B1 (ja)
CN (1) CN112397416B (ja)
TW (1) TWI853065B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230081644A (ko) * 2021-11-30 2023-06-07 가부시기가이샤 디스코 익스팬드 장치
KR20230100060A (ko) * 2021-12-28 2023-07-05 세메스 주식회사 다이 사이의 간격을 확장하기 위한 웨이퍼 익스팬더, 및 이를 포함하는 다이 공급 모듈 및 다이 본딩 설비
JP2024080353A (ja) 2022-12-02 2024-06-13 株式会社ディスコ チップ間隔形成方法
JP7584696B1 (ja) * 2024-05-22 2024-11-15 日機装株式会社 加圧装置
WO2025258037A1 (ja) * 2024-06-13 2025-12-18 ヤマハ発動機株式会社 エキスパンド装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009224775A (ja) * 2008-02-20 2009-10-01 Tokyo Electron Ltd ガス供給装置、成膜装置及び成膜方法
TW201929064A (zh) * 2017-12-20 2019-07-16 日商迪思科股份有限公司 分割裝置
TW201929060A (zh) * 2017-10-02 2019-07-16 日商迪思科股份有限公司 膠帶擴張裝置及膠帶擴張方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650187B2 (ja) * 1987-05-13 1994-06-29 三洋電機株式会社 空気調和装置
JP3171055B2 (ja) * 1995-04-28 2001-05-28 株式会社トヨトミ 温風暖房機
JPH09292175A (ja) * 1996-04-26 1997-11-11 Daisoo:Kk 容器乾燥装置
EP1608201A1 (en) 2004-06-15 2005-12-21 Alcatel Positioning of network processor in a packet based access multiplexer
JP4542859B2 (ja) * 2004-10-04 2010-09-15 大陽日酸株式会社 気相成長装置
KR20110077482A (ko) 2009-12-30 2011-07-07 이유에스티(주) 이피트리 데이터가 저장된 알에프아이디를 통한 기부자와 수혜자의 데이터관리 시스템 및 방법
JP6249586B2 (ja) 2011-08-31 2017-12-20 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP5985245B2 (ja) * 2012-05-15 2016-09-06 株式会社ディスコ チップ間隔維持装置
KR101620027B1 (ko) * 2014-04-30 2016-05-12 주식회사 에스에프에이 박막 증착장치용 벤트챔버
JP6425435B2 (ja) * 2014-07-01 2018-11-21 株式会社ディスコ チップ間隔維持装置
JP6829806B2 (ja) * 2016-12-28 2021-02-17 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP6846205B2 (ja) * 2017-01-12 2021-03-24 株式会社ディスコ 分割装置及び分割方法
CN207626956U (zh) * 2017-07-26 2018-07-20 深港东成睡袋（深圳）有限公司 一种新型保暖睡袋

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009224775A (ja) * 2008-02-20 2009-10-01 Tokyo Electron Ltd ガス供給装置、成膜装置及び成膜方法
TW201929060A (zh) * 2017-10-02 2019-07-16 日商迪思科股份有限公司 膠帶擴張裝置及膠帶擴張方法
TW201929064A (zh) * 2017-12-20 2019-07-16 日商迪思科股份有限公司 分割裝置

Also Published As

Publication number Publication date
CN112397416A (zh) 2021-02-23
KR102819437B1 (ko) 2025-06-11
JP2021034397A (ja) 2021-03-01
JP7325258B2 (ja) 2023-08-14
TW202107624A (zh) 2021-02-16
KR20210020766A (ko) 2021-02-24
CN112397416B (zh) 2025-11-28

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