US3594301A - Sputter coating apparatus - Google Patents

Sputter coating apparatus Download PDF

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Publication number
US3594301A
US3594301A US778155A US3594301DA US3594301A US 3594301 A US3594301 A US 3594301A US 778155 A US778155 A US 778155A US 3594301D A US3594301D A US 3594301DA US 3594301 A US3594301 A US 3594301A
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anode
cathodes
cathode
coating
sputtering
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US778155A
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English (en)
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Charles A Bruch
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General Electric Co
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General Electric Co
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Definitions

  • the sputtering apparatus basically includes at least two targets (cathodes) with a porous anode located therebetween with the material to be coated positioned between at least one of the targets and the anode.
  • targets cathodes
  • a porous anode allows sputtering atoms to pass therethrough to provide substantially uniform coating of the material.
  • the coatings may act, for example, as a diffusion barrier to prevent reaction between the fiber and matrix or to promote wetting and bonding between the fiber and matrix. It is necessary in these cases to assure a strong bond between the coating and the fiber so as to achieve high strength in the composites.
  • Coating by cathodic sputtering in a glow discharge is generally considered one of the best methods of coating certain types of materials. As part of this coating process, it is generally desirable to have an ionic cleaning step prior to the actual coating. While prior art devices do generally show apparatus for cathodic sputtering, some of which include the ionic cleaning step, these have not been able to efficiently provide a uniform coating on a significant amount of freshly ionically cleaned surfaces of material, particularly where a mat of fibers is to be coated.
  • a further object is to provide apparatus for continuously sputter coating materials.
  • Another mat of material may be located between the other cathode and anode in which case the side of the mat not facing the cathode is coated by cathodic atoms which have passed through the opposite mat of material and the porous anode. Additional cathodes and/or anodes may be added to the structure to insure uniform coating when the material to be coated, such as a mat of fibers, is such that it does not allow cathodic atoms to readily pass there- 3,594,301 Patented July 20, 1971 through or when more than two mats of material are to be simultaneously coated.
  • FIG. 1 is a side sectional view of one embodiment of sputtering apparatus in accordance with the subject invention
  • FIG. 2 is a perspective view of a second embodiment of sputtering apparatus in accordance with the subject invention.
  • FIG. 3 is a side schematic view of a third and preferred embodiment of the subject invention.
  • FIG. 4 is a simplified side view of the basic apparatus shown in FIG. 1 adapted for continuous processing.
  • Such an anode could have a grid configuration, be of a perforated material or be ring shaped.
  • the anode 16 should be made of a material having good electrical conductivity, such as aluminum, steel or copper.
  • the anode 16 is connected to the base plate 14 by an anode support member 26, the base member in turn being connected to ground.
  • the base member 14 has a large hole 64 therethrough which allows the interior of the bell jar to be connected with a suitable means for retaining a desirable vacuum therein such as a vacuum pump. Also, a small passageway 66 extends through a base member 14 which serves as an inlet for the gas to be used within the bell jar 12:.
  • the coating material and a substrate which in this case is the fibers of the fibrous mat
  • the fiber mats Before the fiber mats are inserted into the sputtering chamber they may be cleaned by such methods as washing in organic solvents or agents, vacuum heat treatment, or any other cleaning method well known in the art.
  • the pressure within the bell jar '12 is maintained very low, in the range of 1-10 microns of pressure so that a dark space known as the Crookes or cathode dark space is present near the cathodes '18, 20 and extending toward the anode 16.
  • Ion cleaning is effected in the dark space because it is a region in which gas ions, formed by collisions with electrons from the cathode, are accelerated toward the cathode and attain maximum energy just before they reach the cathode.
  • the primary method of surface cleaning achieved by these ions involves billard-ball type collisions in which the ions hit the surface atoms with sufiicient energy to dislodge these atoms into the gas. Ionic cleaning is also effected by simple evaporation due to heating of the substrate (fibers) by the ion bombardment.
  • both fibrous mats 52, 54 are cleaned simultaneously.
  • the sides of the fibrous mats nearest the anode 16 receive the preponderance of the ion bombardment, while the sides nearest the cathodes 18, 20 receive the proponderance of the bombardment by the gas atoms which have become de-ionized by collision with the cathodes 18, 20 and have been subsequently reflected back into the gas.
  • the fibers in the mats 52', 54 are generally small enough so that heat produced by ion and atom bombardment is uniformly distributed therethrough so that thermal cleaning (by evaporation) occurs uniformly on both sides. In this manner the fibrous mats 52, 54 are uniformly and effectively cleaned.
  • the gas pressure within the bell jar 12 is increased to the range of about 20-100 microns and the electrode potential is modified to obtain optimum conditions. With this increase in pressure the dark space decreases to a point where it is not discernible and the sputtering of atoms from the cathodes 18, 20, proceeds at much higher rates.
  • the surface atoms which receive sufficient energy in collisions with the gas ions enter the gas and diffuse radially outward. Many of them collide with and adhere to the fibers nearest the source cathodes 18, 20, thereby coating them. Some do not hit the fibers and proceed toward the anode 16; and others become ionized due to the collisions with electrons, gas atoms, and gas ions.
  • FIG. 1A the basic apparatus of FIG. 1 is shown in its simplest form with only one work holder 22 and mat 52 of material to be coated.
  • the side of the mat 52' facing away from the upper cathode 18 is coated by cathodic atoms from the lower cathode 20 which passes through the porous anode 16.
  • the one mat 521 is uniformly coated on both sides regardless of the density of the mat, hence a piece of solid material could be coated.
  • FIG. 1 which is of the cathode-work holder-anode-work holder-cathode construction, allows adequately uniform coating only of multiple fibrous mats of relatively low density, i.e. those being quite porous.
  • a second embodiment of the subject invention (as shown in FIG. 2) may be used.
  • the apparatus shown in FIG. 2 is of a cathode-anodework holder-cathode-anode-work holder-cathode configuration.
  • Three cathodes 68, 70, 72 being located at the top, center and bottom of the apparatus, respectively, are used.
  • the upper and center cathodes 68, 70 are supported by members 74, 76 which are joined together and housed within a hollow tube 78 in a similar manner to that described in FIG. 1.
  • the lower cathode 72 is sup ported by a member 80, the vertical portion of which is located within a hollow tube 82.
  • Two anodes 84, 86 are located, respectively, below the upper and central cathodes 68, 70. Porous anodes 84, 86 similar to those described above are each connected via their support members 88, 90 to the base plate 92 of the apparatus which is electrically grounded.
  • the two 'work holders 94, 96 are each located directly below the two anodes 84, 86, respectively.
  • the work holders 94, 96 are electrically connected via their respective support members 98, 100 and a large series resistance to their adjacent cathodes.
  • a bell jar 102 is located about the apparatus of FIG. 2 and suitably sealed to the base plate 92. Also, a hole 104 is located through the base plate 92 which is connected to a suitable vacuum pump, for maintaining the desired vacuum, as discussed above, within the bell jar. A small gas inlet aperture 106 is also provided for allowing a desired gas to enter the interior of the bell jar.
  • Cathodes 68 and 70 are preferably connected to a common DC electric power supply, and cathode 72 is connected to a separate DC electric power supply (not shown).
  • sputtering atoms from the upper cathode 68 pass through the upper porous anode 84 and are deposited on the upper side of the fiber mat 108.
  • Sputtering atoms from the upper side of the central cathode 70 are deposited on the lower side of the upper fiber mat 108 so as to provide uniform coating of this mat.
  • the upper side of the lower fiber mat 110 is coated by sputtering atoms coming from the lower side of the central cathode 70 which pass through the lower porous anode 86.
  • the lower side of the lower mat 110 is coated by the deposition of sputtering atoms from the lower cathode 72 so as to provide uniform coating of the lower fiber mat 110.
  • one or more of the cathodes 68, 72 may be shielded, as shown in FIG. 1, so as to concentrate the sputtering atoms emanating therefrom into the desired region.
  • FIGS. 1 and 2 To increase the amount of material that can be sputtercoated in a single apparatus many modifications can be made, within the subject invention, to the embodiments shown in FIGS. 1 and 2. By stacking additional elements one or more extra work holders can be added.
  • the apparatus of FIG. 1 may be modified by removing the shield from the upper cathode 18 and installing additional layers of work holder, anode, cathode (if one extra work holder is desired) or work holder, anode, work holder cathode (if two extra work holders are desired). An example of this is shown in FIG. 3 to be described hereinafter.
  • the apparatus of FIG. 2 can be modified by adding above the top cathode 68 layers of work holder, anode, cathode (if one extra layer is desired); or work holder, anode, cathode, work holder, anode, cathode (if two extra work holders are desired).
  • the apparatus of FIG. 1 can also be modified by utilizing a porous anode of cylindrical, spherical or polygonal shape and arranging one or more work holders to be disposed about the anode in a polygonal cylindrical, or spherical shape with one or more cathodes disposed about the work holders in a substantially similar configuration.
  • the apparatus of FIG. 1 is modified so that four work holders may be utilized with a single porous anode 112.
  • the porous anode 112 is centrally located and is preferably of a rectangular shape.
  • Four work holders 114 are spaced therefrom in a substantially rectangular configuration with fibrous mats 116 fixedly attached thereto.
  • Spaced outwardly from each work holder 114 is one of four cathodes 118 each with its respective shield 120.
  • These members are all encased in a suitably'sealed bell jar 121, as in the apparatus of FIG. 1.
  • the support and electrical connections for each of the members are not shown.
  • the electrical connection for each member is the same as that of FIG. 1, i.e. each cathode being connected to an appropriate DC electric power supply (not shown), each work holder being connected in series with a very large resistance which is in turn connected to the cathodes, and the anode being connected to ground.
  • FIGS. 4 and 5 Another way of coating a relatively large amount of material by sputtering is by use of a continuous process apparatus as shown in FIGS. 4 and 5.
  • the embodiments shown in FIG. 4 utilizes the electrode arrangement shown in FIG. 1, and the apparatus of FIG. utilizes the electrode arrangement shown in FIG. 2.
  • the continuous sputter coating embodiments shown in FIGS. 3 and 4 differ only in their electrode configurations.
  • the basic parts of the continuous sputter coating embodiments include a substantially elongated vacuum chamber 122 which is divided off by partial partition members 124 into an ion cleaning subchamber 122A and a sputtering subchamber 122B.
  • Running substantially lengthwise within the subchambers 122A, 122B are two conveying systems 126, 128; each including a continuous, porous belt 130, 132 covering no more than a small percentage of the surface of the material to be coated acting as a work holder which is substantially supported and driven by rotatable members 134, 136 and 138, 140 located at the ends of the respective belts 130, 132.
  • One or both of the rotatable members for each belt may be driven in the direction shown by arrows by suitable means for providing rotational motion such as an electric motor. If only one member is driven, the other member will act as an idler. Additional idler or power driven members may be positioned at suitable locations along the conveyor belt, if needed. Any other suitable conveying system could be employed. Of course, if desired, only one conveying system may be used.
  • an upper set of cathodes 148 is located above the upper conveyor and a lower set of cathodes 150 is located below the lower conveyor 132.
  • a plurality of porous anodes 152 are located between the two conveyors 130, 132. All three sets of electrodes 148, 150, 152 include portions 148A, 150A, 152A extending into the ion cleaning chamber 122A.
  • one or more vacuum pumps are suitably connected to the chamber 122 so as to maintain a pressure distribution such that a substantial portion of the ionic cleaning chamber 122A is maintained within pres sure range (l-10 microns of pressure) needed for effective cleaning and a substantial portion of the sputtering chamber 122B is maintained within the pressure range (20-100 microns) to assure efiective coating.
  • the cathodes 148, 150 are connected to a suitable electrical power supply; the cathodes 148A, 150A are connected to a separate electric power supply to provide the optimum potential; and the anodes 152, 152A are connected to ground.
  • Uncoated fibers enter the chamber 122 via the entrance port 142 and are deposited on the upper surfaces of the moving conveyor belts 130, 132.
  • the fibers are then moved through the ionic cleaning chamber 122A so as to 'be suitably cleaned by the method which has been previously described.
  • the cleaned fibers enter the sputtering chamber 122B wherein cathodic material from the cathodes 148, 150 is substantially uniformly deposited on the fibers, as the conveyors 130, 132 and the anodes 152 all have a substantial percentage of open space. Coating action is similar to that described in regard to the embodiment shown in FIG. 1.
  • the coated fibers then drop ofi? the ends of the moving conveyors 130, 132 into the exit port 146 which allows withdrawal of the fibers from the apparatus with little effect on the pressure within the apparatus.
  • the apparatus of FIG. 5 is substantially the same as that shown in FIG. 4 except for the electrode structure which is basically of the same configuration as that shown in FIG. 2.
  • the electrode structure consists of an upper set of cathodes 154, 154A above the upper conveyor 130 and an upper set of anodes 156, 156A located therebetween. Between the two conveyors 130, 132 are located a center set of cathodes 158, 158A and a lower set located a lower set of cathodes 162, 162A.
  • the basic I continuous coating process in regard to the embodiment shown in FIG. 5 is similar to that described in regard to the embodiment shown in FIG. 4 except that the sputter coating portion of the process works in the manner described in regard to the embodiment shown in FIG. 2.
  • the basic continuous process apparatus shown in FIGS. 4 and 5 can be modified to provide two or more different types of coatings on a continuous basis by using cathodes of different cathodic substances.
  • the electrode structure may be modified in accordance with some of the suggested modifications discussed above with regard to FIGS. 1, 2 and 3.
  • the gas pressure required for both ion cleaning and sputtering should be reduced. This may be accomplished by using one or more auxiliary hot cathodes to supply the electrons required to sustain a glow discharge at reduced pressure.
  • the shape of the cathodes may be modified to improve the uniformity of coating within the mat.
  • the flux of sputtered atoms evaporating from the cathode is highest in the direction perpendicular to the center of the cathode plate and becomes progressively lower with increasing distance from the center of the cathode.
  • the cathode plates are concave (i.e. the concave surfaces face the anode), for example parabolic or hemispheric, the flux of sputtered atoms will increase with increasing distance from the center, thereby providing more uniform coating of the entire fibrous mat.
  • the subject invention provides an efiicient apparatus for providing substantially uniform cathodic sputter coating of substrate materials, particularly fibrous materials.
  • a vacuum sputtering apparatus for coating materials comprised of a vacuum chamber having therewithin electrodes including at least one anode and one target, support means Within said vacuum chamber for supporting the material, the improvement comprising:
  • said support means including at least one work holder covering no more than a small percentage of the surface of said material to be coated and being located between said anode and one of said targets, said work holder permitting deposition on the upper and lower surfaces of said material to be coated from said upper and lower targets, respectively.
  • said support means further includes a second work holder covering no more than a small percentage of the surface of said material to be coated and being located between said anode and the other of said targets.
  • Sputtering apparatus as in claim 2 further including target shielding means for substantially confining any glow discharge to the region between said two targets.
  • a sputtering apparatus as in claim 2 further including a second anode located between said upper target and the adjacent work holder;
  • a sputtering apparatus as in claim 1 including an upper and lower set of targets, each set including a plurality of substantially coplanar, aligned targets;
  • said support means includes means for translating said work holder between one of said sets of targets and said set of anodes in a plane substantially parallel to the planes of said sets of targets.
  • a sputtering apparatus as in claim 8 further including means for depositing uncoated material on said work holder and means for collecting said material after it has been coated.
  • said work holder is adapted to move first through said ion cleaning subclrhamber then through said sputter coating subchamber.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
US778155A 1968-11-22 1968-11-22 Sputter coating apparatus Expired - Lifetime US3594301A (en)

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CH (1) CH500768A (de)
DE (1) DE1956761A1 (de)
FR (1) FR2023919A1 (de)
NL (1) NL6917456A (de)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3779885A (en) * 1970-07-10 1973-12-18 Progil Apparatus and method for cathode sputtering on the two sides of a metallic support having large dimensions
US4049533A (en) * 1975-09-10 1977-09-20 Golyanov Vyacheslav Mikhailovi Device for producing coatings by means of ion sputtering
US4137142A (en) * 1977-12-27 1979-01-30 Stork Brabant B.V. Method and apparatus for sputtering photoconductive coating on endless flexible belts or cylinders
US5415753A (en) * 1993-07-22 1995-05-16 Materials Research Corporation Stationary aperture plate for reactive sputter deposition
US5487821A (en) * 1993-07-01 1996-01-30 The Boc Group, Inc. Anode structure for magnetron sputtering systems
US6228229B1 (en) * 1995-11-15 2001-05-08 Applied Materials, Inc. Method and apparatus for generating a plasma
US6231725B1 (en) 1998-08-04 2001-05-15 Applied Materials, Inc. Apparatus for sputtering material onto a workpiece with the aid of a plasma
US6238528B1 (en) 1998-10-13 2001-05-29 Applied Materials, Inc. Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source
US6254746B1 (en) 1996-05-09 2001-07-03 Applied Materials, Inc. Recessed coil for generating a plasma
US6368469B1 (en) 1996-05-09 2002-04-09 Applied Materials, Inc. Coils for generating a plasma and for sputtering
US6409890B1 (en) 1999-07-27 2002-06-25 Applied Materials, Inc. Method and apparatus for forming a uniform layer on a workpiece during sputtering
US20060070875A1 (en) * 1996-05-09 2006-04-06 Applied Materials, Inc. Coils for generating a plasma and for sputtering
WO2007124879A3 (de) * 2006-04-26 2008-07-17 Systec System Und Anlagentechn Vorrichtung und verfahren zur homogenen pvd-beschichtung

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH611938A5 (de) * 1976-05-19 1979-06-29 Battelle Memorial Institute
DE3912297C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Katodenzerstäubungsanlage
DE3912296C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Vorrichtung zur Aufnahme und Halterung von Substraten
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3779885A (en) * 1970-07-10 1973-12-18 Progil Apparatus and method for cathode sputtering on the two sides of a metallic support having large dimensions
US4049533A (en) * 1975-09-10 1977-09-20 Golyanov Vyacheslav Mikhailovi Device for producing coatings by means of ion sputtering
US4137142A (en) * 1977-12-27 1979-01-30 Stork Brabant B.V. Method and apparatus for sputtering photoconductive coating on endless flexible belts or cylinders
US5487821A (en) * 1993-07-01 1996-01-30 The Boc Group, Inc. Anode structure for magnetron sputtering systems
US5683558A (en) * 1993-07-01 1997-11-04 The Boc Group, Inc. Anode structure for magnetron sputtering systems
US5415753A (en) * 1993-07-22 1995-05-16 Materials Research Corporation Stationary aperture plate for reactive sputter deposition
US6264812B1 (en) 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US6228229B1 (en) * 1995-11-15 2001-05-08 Applied Materials, Inc. Method and apparatus for generating a plasma
US6297595B1 (en) 1995-11-15 2001-10-02 Applied Materials, Inc. Method and apparatus for generating a plasma
US20040256217A1 (en) * 1996-05-09 2004-12-23 Jaim Nulman Coils for generating a plasma and for sputtering
US6254746B1 (en) 1996-05-09 2001-07-03 Applied Materials, Inc. Recessed coil for generating a plasma
US6368469B1 (en) 1996-05-09 2002-04-09 Applied Materials, Inc. Coils for generating a plasma and for sputtering
US20020144901A1 (en) * 1996-05-09 2002-10-10 Jaim Nulman Coils for generating a plasma and for sputtering
US6783639B2 (en) 1996-05-09 2004-08-31 Applied Materials Coils for generating a plasma and for sputtering
US20060070875A1 (en) * 1996-05-09 2006-04-06 Applied Materials, Inc. Coils for generating a plasma and for sputtering
US8398832B2 (en) 1996-05-09 2013-03-19 Applied Materials Inc. Coils for generating a plasma and for sputtering
US6231725B1 (en) 1998-08-04 2001-05-15 Applied Materials, Inc. Apparatus for sputtering material onto a workpiece with the aid of a plasma
US6238528B1 (en) 1998-10-13 2001-05-29 Applied Materials, Inc. Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source
US6409890B1 (en) 1999-07-27 2002-06-25 Applied Materials, Inc. Method and apparatus for forming a uniform layer on a workpiece during sputtering
WO2007124879A3 (de) * 2006-04-26 2008-07-17 Systec System Und Anlagentechn Vorrichtung und verfahren zur homogenen pvd-beschichtung

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Publication number Publication date
FR2023919A1 (de) 1970-08-21
NL6917456A (de) 1970-05-26
CH500768A (de) 1970-12-31
DE1956761A1 (de) 1970-06-18

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