US5170062A - Wire bonding inspecting apparatus with moving imaging area - Google Patents

Wire bonding inspecting apparatus with moving imaging area Download PDF

Info

Publication number
US5170062A
US5170062A US07/774,886 US77488691A US5170062A US 5170062 A US5170062 A US 5170062A US 77488691 A US77488691 A US 77488691A US 5170062 A US5170062 A US 5170062A
Authority
US
United States
Prior art keywords
wire
inspecting
image
positional coordinates
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/774,886
Other languages
English (en)
Inventor
Yuichi Miyahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MIYAHARA, YUICHI
Application granted granted Critical
Publication of US5170062A publication Critical patent/US5170062A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/58—Testing of lines, cables or conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present invention relates to a wire bonding inspecting apparatus, and more specifically to an apparatus suitable for use to automatize the wire bonding inspection process.
  • an optical image of a semiconductor chip on which wires are bonded is focused onto an image sensor and converted into electrical image signals for inspection.
  • the whole long wire cannot be seen within one image area 102.
  • the magnification of the lens of the inspecting apparatus must be reduced, thus resulting in a higher cost because the magnification must be adjusted according to the size of an object to be inspected.
  • an object of the present invention is to provide a wire bonding inspecting apparatus which can inspect bonded wires of different lengths by the use of a constant magnification lens with under high precision.
  • the wire bonding inspecting apparatus is an apparatus for inspecting wires bonded between a semiconductor chip and leads, characterized by being provided with: imaging means for optically taking an image of the wire and converting the optical image into electric image signals; moving means for moving said imaging means; inspecting means for obtaining positional coordinates of the wire on the basis of the converted image signals and inspecting the wire on the basis of the obtained positional coordinates; and control means for controlling the operation of said imaging means, said moving means and said inspecting means, and characterized in that: when a whole wire does not lie within a single image area obtained by said imaging means, said control means controls said moving means so as to be moved; said image means so as to take a plurality of optical images of the wire whenever moved and convert the optical images into image signals, respectively; and said inspecting means so as to obtain the positional coordinates on the basis of the image signals obtained whenever the optical images are taken, and transforms the obtained positional coordinates into those of a single uniform coordinate system for wire inspection
  • the respective means operate under control of the control means as follows: the moving means moves the imaging means; the imaging means takes a plurality of optical images of the wire whenever moved and converts the optical images into image signals, respectively; and the inspecting means obtains the positional coordinates on the basis of the converted image signals whenever the optical images are taken and transforms the obtained positional coordinates into those of a single uniform coordinate system for wire inspection.
  • the inspecting apparatus even if the wire is long and therefore cannot be seen within one image area, since the magnification of the wire imaging means is not reduced, the wire bonding can be inspected under higher fixed lens magnification with high inspection precision.
  • control means comprises discriminating means and movement position calculating means
  • the discriminating means discriminates that the whole wire does not lie within the single image area obtained by the imaging means
  • the movement position calculating means calculates the position to which the imaging means is to be moved by the moving means.
  • the control means controls the X-Y table controller; and the X-Y table controller controls the motor rotational operation to move the X-Y table on an X-Y plane, with a result that the imaging means moves on the X-Y plane under control of the control means.
  • FIG. 1 is a block diagram showing an embodiment of the wire bonding inspecting apparatus according to the present invention
  • FIG. 2 is an illustration indicating the mode of taking divisional images of bonded wires by means of the apparatus shown in FIG. 1;
  • FIG. 3 is an illustration indicating the mode of transforming relative positional coordinates into those of a single absolute coordinate system by dividingly imaging the bonded wires by means of the same apparatus;
  • FIG. 4 is an illustration showing an image area for inspecting short bonded wires by means of a prior-art wire bonding inspecting apparatus
  • FIG. 5 is a partially enlarged view showing the image area shown in FIG. 4.
  • FIG. 6 is an illustration indicating the relationship between an image area for inspecting long bonded wires by means of the prior-art wire bonding inspecting apparatus and the length of the wires.
  • the principal feature of the embodiment is to inspect the wire bonding by dividing the bonding wire into parts, imaging the divided parts to obtain positional coordinates, and synthesizing these positional coordinates into a single coordinates system, in case long bonded wires do not lie within one image area.
  • FIG. 1 shows the organization of the embodiment of the wire bonding inspecting apparatus.
  • An image pickup device or imaging device 14 including an optical lens barrel 14a is disposed over an inspection base or table 11.
  • This imaging device 14 is fixed on an X-Y table 15, and an illuminating device 12 is provided in the vicinity of the imaging device 14.
  • This imaging device 14 is electrically connected to an image processing inspecting unit 20.
  • a motor 15a is provided for the X-Y table 15 to move this X-Y table 15 in both the X and Y directions.
  • the motor 15a is electrically connected to an X-Y table controller 16 for controlling the motor operation.
  • the imaging device 14, the X-Y table controller 16 and the image processing inspecting unit 20 are all electrically connected to a main controller 17, respectively.
  • a semiconductor chip 1 including leads 4 and bonded wires 2 connected between the chip 1 and the leads 4 is mounted on the inspection base 11. Necessary illumination is applied by the illumination device 12 to the bonded wires 2 to be inspected. An optical image of the bonded wires 2 is focused through lenses within the optical lens barrel 14 onto the imaging device 14, by which the optical image is converted into electric image signals. These converted image signals are transmitted to the image processing inspecting unit 20, by which the signals are processed (e.g. binarization) so that the positional coordinates of the bonded wires to be inspected are detected and further inspected.
  • the image processing inspecting unit 20 by which the signals are processed (e.g. binarization) so that the positional coordinates of the bonded wires to be inspected are detected and further inspected.
  • the inspected results are outputted to the main controller 17 and further transmitted to a display unit (not shown) for display.
  • the imaging device 14 is fixed to the X-Y table 15 and therefore movable on an X-Y plane.
  • the movement of this X-Y table 15 is controlled by the X-Y table controller 16.
  • the X-Y table controller 16 controls the drive of the motor 15a provided for the X-Y table 15 on the basis of commands from the main controller 17.
  • inspection procedure is previously stored in order to control the operation of the imaging device 14, the X-Y table controller 16 and the image processing inspecting unit 20, respectively.
  • the imaging device 14 takes or picks up an image of the semiconductor chip 1 and the wires 2 from above, as shown in FIG. 2.
  • the dimensional data Lx and Ly of an image area in. both the longitudinal and transversal directions are stored previously in the main controller 17.
  • the length of the bonded wire 2 can be calculated on the basis of the coordinates of an electrode 3 on the semiconductor chip 1 (one end of the bonded wire 2) and the coordinates of the lead 4 (the other end of the bonded wire 2) of the main controller 17.
  • the number of divided image areas and the coordinates of the respective divided image areas are calculated by the main controller 17. For instance, in the case of the bonded wires 2 shown in FIG. 2, three bonded wires 2 are divided into two image areas 201 and 202 before being imaged.
  • the X-Y table controller 16 moves the X-Y table 15 so that the imaging device 14 can be moved to the first image area 201.
  • An optical image of the bonded wires 2 is taken and converted into image signals.
  • the converted image signals are image processed so that the respective positional coordinates 31, 32 and 33 of the bonded wires 2 can be obtained at various points, respectively.
  • the marks of circles, crosses, triangles, squares, diamonds, etc. indicate that those positional coordinates of the wires 2 are detected in digital fashion along the respective wires.
  • the positional coordinates 31, 32 and 33 are data in relative different coordinate systems within the first image area 201. Therefore, the positional coordinates 31, 32 and 33 are transformed into positional coordinates 31a, 32a and 33a in an absolute uniform coordinate system determined on the basis of the semiconductor chip 1 as shown in FIG. 3 by the image processing inspecting unit 20.
  • the X-Y table 15 is moved under control of the X-Y table controller 16, so that the imaging device 14 is moved to the second image area 202.
  • An image of the semiconductor chip 1 and the wires 2 are taken by the imaging device 14, and the image signals are outputted.
  • the outputted image signals are image processed by the image processing inspecting unit 20, with the result that the positional coordinates 34, 35 and 36 of the bonded wires are detected. Since these positional coordinates 34, 35 and 36 are similarly data in relative coordinate systems within the second image area 202, these coordinates are transformed into positional coordinates 34a, 35a and 36a in the absolute coordinate system as shown in FIG. 3 by the image processing inspecting unit 20.
  • the bonded wires 2 are divided into plural portions, and the respective divided wire portions are imaged optically and converted into image signals to obtain respective positional coordinates of the respective wires 2. Further, the relative positional coordinates obtained for each image area are transformed into the absolute positional coordinates determined on the basis of the semiconductor chip 1. Therefore, all the positional coordinates of all the bonded wires 2 at all the positions are collected as data of a single absolute coordinate system. The wires 2 are inspected on the basis of these positional coordinates in the absolute system by the image processing inspecting unit 20.
  • the cost of the imaging device 14 can be reduced. Further, since it is unnecessary to reduce the lens magnification when a long bonded wires are inspected, a higher inspection precision can be secured.
  • the above embodiment has been described by way of an example and therefore will not limit the scope of the invention.
  • three bonded wires are imaged within a single image area.
  • the number of the wires is not limited thereto, and therefore it is possible to take a wire image wire by wire. Further, it is possible to obtain a similar effect when only a specific single wire is inspected, without inspecting all of the bonded wires.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
US07/774,886 1990-10-12 1991-10-11 Wire bonding inspecting apparatus with moving imaging area Expired - Lifetime US5170062A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-273771 1990-10-12
JP2273771A JP2851151B2 (ja) 1990-10-12 1990-10-12 ワイヤボンディング検査装置

Publications (1)

Publication Number Publication Date
US5170062A true US5170062A (en) 1992-12-08

Family

ID=17532355

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/774,886 Expired - Lifetime US5170062A (en) 1990-10-12 1991-10-11 Wire bonding inspecting apparatus with moving imaging area

Country Status (5)

Country Link
US (1) US5170062A (fr)
EP (1) EP0480452B1 (fr)
JP (1) JP2851151B2 (fr)
KR (1) KR960001824B1 (fr)
DE (1) DE69112756T2 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485398A (en) * 1991-01-31 1996-01-16 Kabushiki Kaisha Shinkawa Method and apparatus for inspecting bent portions in wire loops
US5519496A (en) * 1994-01-07 1996-05-21 Applied Intelligent Systems, Inc. Illumination system and method for generating an image of an object
US5532739A (en) * 1993-10-06 1996-07-02 Cognex Corporation Automated optical inspection apparatus
US5548326A (en) * 1993-10-06 1996-08-20 Cognex Corporation Efficient image registration
US5566877A (en) * 1995-05-01 1996-10-22 Motorola Inc. Method for inspecting a semiconductor device
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US5640199A (en) * 1993-10-06 1997-06-17 Cognex Corporation Automated optical inspection apparatus
US5642158A (en) * 1994-05-02 1997-06-24 Cognex Corporation Method and apparatus to detect capillary indentations
US5745594A (en) * 1992-12-28 1998-04-28 Kabushiki Kaisha Toshiba Apparatus for testing a bonding position of a bonding wire
US6035066A (en) * 1995-06-02 2000-03-07 Cognex Corporation Boundary tracking method and apparatus to find leads
US6061467A (en) * 1994-05-02 2000-05-09 Cognex Corporation Automated optical inspection apparatus using nearest neighbor interpolation
US20070187138A1 (en) * 2005-12-28 2007-08-16 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US10776912B2 (en) * 2016-03-09 2020-09-15 Agency For Science, Technology And Research Self-determining inspection method for automated optical wire bond inspection
CN114353687A (zh) * 2020-10-14 2022-04-15 亿美设备私人有限公司 交叠接合连线的弧高度测量

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2541489B2 (ja) * 1993-12-06 1996-10-09 日本電気株式会社 ワイヤボンディング装置
JPH0982740A (ja) * 1995-09-14 1997-03-28 Tsukuba Seiko Kk ボンディングワイヤ高さ測定装置
US6590670B1 (en) 1997-03-13 2003-07-08 Tsukuba Seiko Ltd. Method and apparatus for measuring heights of test parts of object to be measured
KR100317599B1 (ko) * 2000-02-17 2001-12-24 서경석 와이어 본딩 위치 인식방법
JP6445943B2 (ja) * 2015-08-24 2018-12-26 東芝メモリ株式会社 半導体装置の測定方法
CN118786326A (zh) * 2022-04-14 2024-10-15 库利克和索夫工业公司 在焊线机上确定线弧的高度和高度轮廓的方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389669A (en) * 1981-02-27 1983-06-21 Ilc Data Device Corporation Opto-video inspection system
JPS59171129A (ja) * 1983-03-17 1984-09-27 Fujitsu Ltd 自動配線検査装置
EP0123229A2 (fr) * 1983-04-15 1984-10-31 Hitachi, Ltd. Méthode et appareil pour la détection de défauts dans des configurations de circuits imprimés
US4739175A (en) * 1986-02-24 1988-04-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for inspecting configuration of terminal legs of an electronic device
JPS63164533A (ja) * 1986-12-26 1988-07-07 Oki Electric Ind Co Ltd 多数決復号化装置
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
US4874956A (en) * 1987-04-14 1989-10-17 Kabushiki Kaisha Toshiba Method and apparatus for inspecting semiconductor devices for their bonding status
US4942618A (en) * 1988-08-02 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for determining the shape of wire or like article
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389669A (en) * 1981-02-27 1983-06-21 Ilc Data Device Corporation Opto-video inspection system
JPS59171129A (ja) * 1983-03-17 1984-09-27 Fujitsu Ltd 自動配線検査装置
EP0123229A2 (fr) * 1983-04-15 1984-10-31 Hitachi, Ltd. Méthode et appareil pour la détection de défauts dans des configurations de circuits imprimés
US4739175A (en) * 1986-02-24 1988-04-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for inspecting configuration of terminal legs of an electronic device
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
JPS63164533A (ja) * 1986-12-26 1988-07-07 Oki Electric Ind Co Ltd 多数決復号化装置
US4874956A (en) * 1987-04-14 1989-10-17 Kabushiki Kaisha Toshiba Method and apparatus for inspecting semiconductor devices for their bonding status
US4942618A (en) * 1988-08-02 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for determining the shape of wire or like article
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485398A (en) * 1991-01-31 1996-01-16 Kabushiki Kaisha Shinkawa Method and apparatus for inspecting bent portions in wire loops
US5745594A (en) * 1992-12-28 1998-04-28 Kabushiki Kaisha Toshiba Apparatus for testing a bonding position of a bonding wire
US5532739A (en) * 1993-10-06 1996-07-02 Cognex Corporation Automated optical inspection apparatus
US5548326A (en) * 1993-10-06 1996-08-20 Cognex Corporation Efficient image registration
US5640199A (en) * 1993-10-06 1997-06-17 Cognex Corporation Automated optical inspection apparatus
US5519496A (en) * 1994-01-07 1996-05-21 Applied Intelligent Systems, Inc. Illumination system and method for generating an image of an object
US6061467A (en) * 1994-05-02 2000-05-09 Cognex Corporation Automated optical inspection apparatus using nearest neighbor interpolation
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US5642158A (en) * 1994-05-02 1997-06-24 Cognex Corporation Method and apparatus to detect capillary indentations
US5566877A (en) * 1995-05-01 1996-10-22 Motorola Inc. Method for inspecting a semiconductor device
US6035066A (en) * 1995-06-02 2000-03-07 Cognex Corporation Boundary tracking method and apparatus to find leads
US20070187138A1 (en) * 2005-12-28 2007-08-16 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US7686204B2 (en) * 2005-12-28 2010-03-30 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US20100133322A1 (en) * 2005-12-28 2010-06-03 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program , and bonding method
US7857190B2 (en) 2005-12-28 2010-12-28 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US10776912B2 (en) * 2016-03-09 2020-09-15 Agency For Science, Technology And Research Self-determining inspection method for automated optical wire bond inspection
CN114353687A (zh) * 2020-10-14 2022-04-15 亿美设备私人有限公司 交叠接合连线的弧高度测量

Also Published As

Publication number Publication date
DE69112756T2 (de) 1996-03-21
DE69112756D1 (de) 1995-10-12
KR920008484A (ko) 1992-05-28
JPH04148544A (ja) 1992-05-21
JP2851151B2 (ja) 1999-01-27
KR960001824B1 (ko) 1996-02-05
EP0480452A1 (fr) 1992-04-15
EP0480452B1 (fr) 1995-09-06

Similar Documents

Publication Publication Date Title
EP0480452B1 (fr) Méthode d'inspection pour la connexion de fils
EP0413349B1 (fr) Appareil d'injection de la liaison de fil
US4872052A (en) Semiconductor device inspection system
KR20010033888A (ko) 높이 감지 센서를 구비한 전자 제품 조립 장치
JP3235009B2 (ja) ボンディングワイヤ検査方法
KR100186239B1 (ko) 와이어 굽힘 검사방법 및 장치
US6266891B1 (en) Method of and apparatus for bonding component
JP4396231B2 (ja) プログラマブルロジックコントローラ、これに用いられる画像オートフォーカスモジュール及び部品の製造方法
JPH05296739A (ja) 輪郭形状測定装置
JPH0680717B2 (ja) 検査装置
JP3679460B2 (ja) 移動体装置及びその制御方法
KR100312081B1 (ko) 프로그램가능한 영역 스캔 비전 검사 시스템
JPH04315905A (ja) 物体検査装置
US10055849B2 (en) Image measurement device and controlling method of the same
KR100422277B1 (ko) 화상처리방법 및 장치
KR100363707B1 (ko) 반도체 소자의 검사방법
KR100318227B1 (ko) 반도체소자의 검사시스템에 이용되는 자동 줌 장치
JP2002076050A (ja) ワイヤ接続装置
JPH01243535A (ja) ウエハプローバ装置
JPH06174439A (ja) ボンディングワイヤ検査装置
JPH09325012A (ja) 画像測定装置及びそれに利用される撮像装置
CN120668537A (zh) 基于人工智能的工业计算机屏幕灰尘颗粒检测装置及方法
JPH1137731A (ja) 画像取込みシステム
JPH0531868B2 (fr)
JPH0288908A (ja) 位置検出装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:MIYAHARA, YUICHI;REEL/FRAME:005878/0465

Effective date: 19911007

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12