US6303219B1 - Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device - Google Patents

Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device Download PDF

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US6303219B1
US6303219B1 US08/945,221 US94522197A US6303219B1 US 6303219 B1 US6303219 B1 US 6303219B1 US 94522197 A US94522197 A US 94522197A US 6303219 B1 US6303219 B1 US 6303219B1
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adhesive
resin
semiconductor
layer
tape
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Yasushi Sawamura
Shoji Kigoshi
Taku Hatano
Yukitsuna Konishi
Yoshio Ando
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Toray Industries Inc
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Toray Industries Inc
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Assigned to TORAY INDUSTRIES, INC. reassignment TORAY INDUSTRIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDO, YOSHIO, HATANO, TAKU, KIGOSHI, SHOJI, KONISHI, YUKITSUNA, SAWAMURA, YASUSHI
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Definitions

  • the present invention relates to an adhesive sheet suitable as an adhesive layer for a semiconductor connecting substrate used for mounting a semiconductor integrated circuit, an adhesive-backed tape used for tape automated bonding (TAB) (hereinafter called “a tape for TAB”), an adhesive-backed tape used for wire bonding connection (hereinafter called “a tape for WB”), and a semiconductor connecting substrate and a semiconductor device using any of the foregoing.
  • TAB tape automated bonding
  • WB adhesive-backed tape used for wire bonding connection
  • IC packages produced in this manner are usually provided in such forms as the small outline package (SOP) and the quad flat package (QFP).
  • SOP small outline package
  • QFP quad flat package
  • BGA ball grid array
  • the BGA method is characterized in that solder balls (almost as many as the pins of the corresponding IC) are provided in a grid-like form as external connectors of the IC connecting substrate.
  • solder balls (almost as many as the pins of the corresponding IC) are provided in a grid-like form as external connectors of the IC connecting substrate.
  • the apparatus is placed on the board in such a manner that the solder ball faces conform with the conductor pattern of an already printed solder, and the solder is rendered molten by reflow to achieve the desired connection.
  • the most important feature is that although the conventional QFP, etc. allows only the surrounding edges to be used for arranging connection terminals, BGA allows the surface of the connecting substrate to be used, so that more connection terminals can be arranged in a small space. This size reducing effect is more intensified in the chip scale package (CSP), and it may be called a ⁇ -BGA (micro BGA) in view of its similarity (FIG. 2 ).
  • a method comprising the steps of laminating a material such as a metallic sheet for reinforcement, radiation, electromagnetic shielding, etc., to the wiring board layer for connecting an IC, using an adhesive sheet, and curing by heating is generally adopted for producing a connecting substrate.
  • a connecting substrate for BGA is described below with reference to FIG. 4.
  • a connecting substrate for BGA consists of at least one wiring board layer (being constituted by an insulator layer 26 and a conductor pattern 27 for connecting an IC, at least one layer 29 without any conductor pattern formed (functioning as a reinforcing sheet, radiation sheet or shielding sheet, etc.), and at least one adhesive layer 28 for laminating them.
  • symbol 25 denotes an organic insulation film
  • 27 an inner lead
  • 30 a solder resist.
  • thermoplastic resin or silicone elastomer Japanese Patent Publication (Kokoku) No. 6-504478, etc. is proposed for obtaining the effect of easing the thermal stress caused by the difference in thermal expansion coefficient of different materials such as the printed wiring board, solder balls, wiring board layer and the layer without any conductor pattern formed, during temperature cycles and reflow.
  • a glass epoxy laminated sheet (rigid sheet) had been used, but in recent years, the use of a semiconductor connecting substrate in which a conductor pattern for connecting an IC is formed on an organic insulating film of a polyimide, etc. is increasing.
  • a package using such a tape-like connecting substrate (pattern tape) is generally called a TCP (tape carrier package), and the TCP of a BGA method in particular is called a TAB-BGA or T-BGA.
  • a TCP has an advantage in that low cost packages can be mass-produced by continuously mounting using a long pattern tape.
  • the tape automated bonding (TAB) method in which bump electrodes of an IC are thermally pressure-bonded to the inner leads of a connecting substrate (by gang bonding or single point bonding) is typical, but a method in which the conductor pads of a connecting substrate and the electrodes of an IC are wire-bonded to each other (hereinafter called “WB method”) is also used.
  • a tape for TAB has a three-layer structure in which an adhesive layer and a releasable polyester film, etc. used as a protective film layer are laminated onto a flexible organic insulating film such as a polyimide film.
  • the tape for TAB is generally produced by once producing an adhesive sheet and laminating it onto the organic insulating film.
  • the tape for TAB undergoes (1) perforation to form sprocket and device holes, (2) thermal lamination with a copper foil and heating for curing the adhesive, (3) back treatment of the copper foil for forming inner leads, (4) pattern forming (resist coating, etching, resist removal, removal of copper foil back treating agent), (5) tin or gold plating, etc., to be processed into a connecting substrate (pattern tape).
  • FIG. 3 shows the form of a pattern tape.
  • FIG. 1 is a sectional view showing an embodiment of the TCP type semiconductor device of the present invention.
  • the inner leads 5 of a pattern tape are thermally pressure-bonded to the gold bumps 2 of IC 1 (inner lead bonding), to mount the IC.
  • a sealing resin 10 is applied for sealing, to prepare a semiconductor device.
  • the tape further undergoes a step of laminating a layer functioning as a reinforcing sheet, radiation sheet or shielding sheet, etc. using an adhesive sheet, and a step of installing solder balls.
  • a tape for WB suitable for wire bonding connection in adhesive properties is used, though the tape form and the production method are the same as those of the tape for TAB.
  • a tape for WB undergoes (1) perforation of sprocket and device holes, .(2) thermal lamination with a copper foil and heating for curing the adhesive, (3) pattern forming (resist coating, etching, resist removal), (4) tin or gold plating, etc., to be processed into a connecting substrate (pattern tape) (FIG. 5 ).
  • the pattern tape does not have inner leads, and the conductors of the pattern tape and the gold bumps of a semiconductor integrated circuit are wire-bonded to each other.
  • a sealing resin is applied for sealing, to obtain a semiconductor device (FIG. 6 ).
  • the above TCP type semiconductor device is connected with a circuit board, etc. on which other parts are mounted, through outer leads or solder balls 9 , to be mounted on an electronic apparatus.
  • the adhesive sheet for a semiconductor connecting substrate is required to have the following properties:
  • the adhesive strength of an adhesive can be enhanced by lowering the elastic modulus to increase the breaking energy, but this method presents a problem in that at high temperature and high humidity, the adhesive is softened, to lower the reflow resistance as well as the adhesive strength at high temperature and high humidity.
  • the crosslinking degree of the adhesive is increased to improve the reflow resistance and the adhesive strength at high temperature and high humidity, the adhesive is likely to cause brittle fracture, and the internal stress due to curing shrinkage increases, to unpreferably lower the adhesive strength on the contrary. Furthermore, the effect for easing the thermal stress caused by temperature difference is also lost.
  • An object of the present invention is to solve these problems, and to provide a new adhesive sheet for a semiconductor connecting substrate excellent in processability, adhesive strength, insulation reliability and durability, and also to provide a semiconductor connecting substrate and a semiconductor device using it.
  • the adhesive layer of the tape for TAB finally remains in the package, it is required to satisfy such properties as insulatability, adhesiveness and dimensional stability.
  • the pattern pitches (conductor widths and conductor intervals) of semiconductor connecting substrates become very narrow, and so the adhesive is required to be higher in insulation reliability and in the adhesive strength to the copper foil more narrow in conductor width (hereinafter simply called “adhesive strength”).
  • adheresive strength Especially in an acceleration test of insulation reliability, the declining rate of insulation resistance at high temperature and high humidity of 130° C. and 85% RH or with a voltage applied continuously in a high temperature range of 125° C. to 150° C. is now regarded to be highly important.
  • the conventional tapes for TAB are not satisfactory enough.
  • the insulation drops fast when a voltage is applied continuously at high temperature and high humidity, the insulation reliability is insufficient.
  • the calorific value is large in an integrated circuit acting at a high speed, etc., a serious accident can happen.
  • the adhesive strength is low, it can happen that conductors peel during pattern processing or that the inner leads peculiar to the TAB method are peeled, not allowing production.
  • Another object of the present invention is to solve these problems, and to provide a new tape for TAB excellent in insulation durability and adhesive strength, and a semiconductor connecting substrate and a semiconductor device using it.
  • the conventional tapes for WB cannot be said to be satisfactory enough.
  • the adhesive strength to the conductor is enhanced, the insulation with a voltage applied continuously at high temperature and high humidity drops fast, to show insufficient insulation reliability, and the WB property also drops.
  • the heat resistance is enhanced to improve the insulation reliability and WB property, the adhesive strength drops, causing the conductor to peel during pattern processing and also after completion of WB.
  • a further other object of the present invention is to solve these problems, and to provide a new tape for WB satisfying all of insulation durability, adhesive strength and WB property, and a semiconductor connecting substrate and a semiconductor device using it.
  • the above objects can be achieved by the following present invention.
  • the present invention provides the following:
  • An adhesive sheet for a semiconductor connecting substrate being constituted by a laminate having an adhesive layer on a substrate, comprising said adhesive layer containing a thermoplastic resin (A) and an epoxy resin (B), and said epoxy resin (B) containing at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy reins and (IV) naphthalene skeleton-containing epoxy resins, and a semiconductor connecting substrate and a semiconductor device using it.
  • an adhesive sheet for a semiconductor connecting substrate which forms an adhesive layer (E) of a semiconductor integrated circuit board having at least one wiring board layer (C) being constituted by an insulator layer and a conductor pattern, at least one layer without any conductor pattern formed (D) and at least one adhesive layer (e), comprising said adhesive sheet has a storage elastic modulus of 0.1 to 10000 MPa and has a coefficient of linear expansion of 0.1 ⁇ 10 ⁇ 5 ⁇ 50 ⁇ 10 ⁇ 5 ° C. ⁇ 1 in a temperature range of ⁇ 50 to 150° C. after having been cured by heating, and a semiconductor connecting substrate and a semiconductor device using it.
  • an adhesive-backed tape for TAB being constituted by a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, comprising said adhesive layer has a softening temperature of 60 to 110° C. after having been cured, and has an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied, and a semiconductor connecting substrate and a semiconductor device using it.
  • an adhesive-backed tape for wire bonding being constituted by a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, comprising said adhesive layer has a softening temperature of 120 to 200° C. after having been cured and has a insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied.
  • FIG. 1 is a sectional view showing a semiconductor device (TAB-BGA) using the adhesive sheet for a semiconductor connecting substrate of the present invention, as an embodiment.
  • FIG. 2 is a sectional view showing a semiconductor device (CSP) using the adhesive sheet for a semiconductor connecting substrate of the present invention, as an embodiment.
  • CSP semiconductor device
  • FIG. 3 is a sectional view showing a semiconductor connecting substrate (pattern tape) for BGA before mounting with an IC, obtained by processing the adhesive sheet for a semiconductor connecting substrate of the present invention, as an embodiment.
  • FIG. 4 is a perspective view showing a tape for TAB (pattern tape) before mounting with an IC, obtained by processing the adhesive-backed tape for TAB of the present invention, as an embodiment.
  • FIG. 5 is a perspective view showing a tape for WB (pattern tape) before mounting with an IC, obtained by processing the adhesive-backed tape for WB of the present invention, as an embodiment.
  • FIG. 6 is a sectional view showing a semiconductor device (BGA of WB method) using the adhesive sheet for a semiconductor connecting substrate of the present invention, as an embodiment.
  • FIG. 7 is a drawing showing a comb shaped sample for measuring the insulation resistance.
  • FIG. 8 is a diagram showing the measured results of storage elastic modulus E′ of the adhesive layer as the adhesive sheet for a semiconductor connecting substrate of the present invention.
  • FIG. 9 is a diagram showing the measured results of the coefficient of linear expansion of the adhesive layer as the adhesive sheet for a semiconductor connecting substrate of the present invention.
  • FIG. 10 is a diagram showing the measured results of tan ⁇ of the adhesive layer of the adhesive-backed tape for TAB of the present invention.
  • FIG. 11 is a diagram showing the measured results of insulation durability of the adhesive-backed tape for TAB of the present invention.
  • FIG. 12 is a diagram showing the measured results of storage elastic modulus E′ of the adhesive layer of the adhesive-backed tape for WB of the present invention.
  • FIG. 13 is a diagram showing the measured results of tan ⁇ of the adhesive layer of the adhesive-backed tape for WB of the present invention.
  • the semiconductor connecting substrate referred to in the present invention is intended for connecting an IC (bare chip) obtained by forming elements on a semiconductor substrate made of silicone, etc. and cutting and dividing it, and is not especially limited in form, material or production method, as far as it has (C) at least one wiring board layer being constituted by an insulator layer and a conductor pattern, (D) at least one layer without any conductor pattern formed and (E) at least one adhesive layer formed as an adhesive sheet of the present invention. Therefore, the most basic structure is C/E/D, but the semiconductor connecting substrate includes also a multi-layer structure such as C/E/D/E/D.
  • (C) is a layer with a conductor pattern for connecting the electrode pads of a bare chip with the outside (printed wiring board, etc.) of the package, and is an insulator layer with a conductor pattern formed on either or both sides.
  • a 10 to 125 ⁇ m thick flexible insulating film made of a plastic material such as a polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate or polyarylate, or of a composite material such as resin impregnated glass cloth, or a ceramic board of alumina, zirconia, soda glass or quartz glass can be suitably used.
  • a laminate being constituted by a plurality of layers made of those selected from the foregoing can also be used.
  • the insulator layer can be treated on the surface by hydrolysis, corona discharge, low temperature plasma, physical surface roughening or adhesive coating, etc.
  • a conductor pattern is generally formed by the subtractive method or additive method, and either method can be used in the present invention.
  • a metallic sheet such as a copper foil is bonded onto an insulator layer by an insulating adhesive (the adhesive composition of the present invention can also be used), or a precursor of the insulator layer is laminated on a metallic sheet, being followed by heat treatment, etc. to form the insulator layer.
  • the laminate is etched by chemical treatment, to form the intended pattern.
  • the material in this case can be, for example, a copper clad material for a rigid or flexible printed wiring board, a tape for TAB or a tape for WB.
  • a conductor pattern is directly formed on an insulator layer by electroless plating, electrolytic plating or sputtering, etc.
  • the formed conductor can be plated with a highly corrosion resistant metal for prevention of corrosion.
  • the wiring board layer (C) prepared like this can have through holes formed as required, and conductor patterns formed on both sides by plating can be connected with each other by plating.
  • (D) is a layer substantially independent of (C) and (E) and has a function to reinforce or dimensionally stabilize the semiconductor connecting substrate, or to electromagnetically shield the IC from outside, or to radiate the IC, or to make the semiconductor connecting substrate flame retardant, or to identify the form of the semiconductor connecting substrate, etc. Therefore, its form is not necessarily required to be a layer, and, for example, a three-dimensional form with a structure having plurality of fins for radiation can also be used. Furthermore, as far as any of the above functions is provided, the layer can be either an insulator or conductor, and is not especially limited in material.
  • the materials which can be used for the layer include metals such as copper, iron, aluminum, gold, silver, nickel and titanium, inorganic materials such as alumina, zirconia, soda glass, quartz glass and carbon, and organic materials such as polymers based on a polyimide, polyamide, polyester, vinyl, phenol or epoxy, etc.
  • a composite material obtained by combining them can also be used.
  • a polyimide film thinly plated with a metal, a polymer with carbon kneaded into it render it conductive, and a metallic sheet coated with an organic insulating polymer can be used.
  • the layer can be variously treated on the surface.
  • (E) is an adhesive layer mainly used for bonding (C) and (D) together. However, it can also be used for bonding (C) or (D) with another member (e.g., an IC or printed wiring board, etc.) without any limitation.
  • (E) is usually laminated onto a semiconductor connecting substrate in a semi-cured state, and before or after lamination, it can be preliminarily cured by reaction in a temperature range of 30 to 200° C. for a suitable time, to adjust the curing degree.
  • the adhesive sheet is formed as the adhesive sheet for a semiconductor connecting substrate (hereinafter called “the adhesive sheet”) of the present invention.
  • the adhesive sheet is preferably 0.1 to 10000 MPa, more preferably 1 to 5000 MPa in storage elastic modulus and preferably 0.1 ⁇ 10 ⁇ 5 ⁇ 50 ⁇ 10 ⁇ 5 ° C. ⁇ 1 , more preferably 1 ⁇ 30 ⁇ 10 ⁇ 5 °C. ⁇ 1 in the coefficient of linear expansion in a temperature range of ⁇ 50 to 150° C. after having been cured by heating. If the storage elastic modulus is less than 0.1 MPa, the strength of the adhesive is so low that when an apparatus mounted with the IC package is used, the semiconductor connecting substrate is deformed and that when the adhesive sheet is processed, it is unpreferably poor in handling convenience.
  • the effect of easing the thermal stress is so low as to unpreferably cause warping of the semiconductor connecting substrate, peeling of the respective layers and cracking of solder balls. If the coefficient of linear expansion is less than 0.1 ⁇ 10 ⁇ 5 ° C. ⁇ 1 , it is unpreferable because the effect of easing the thermal stress is too small. If it is more than 50 ⁇ 10 31 5 ° C. ⁇ 1 , the adhesive itself unpreferably causes thermal stress.
  • the adhesive sheet is preferably 5 ⁇ 10 5 Nm ⁇ 1 or more, more preferably 1 ⁇ 10 6 Nm ⁇ 1 in the breaking energy per unit area at 25° C. after having been cured by heating (hereinafter simply called “the breaking energy”).
  • the breaking energy is considered to have correlation with the adhesive strength in the cohesive breaking mode of the adhesive layer.
  • the breaking energy is obtained from the area below the stress-strain curve obtained by a tensile test. If the breaking energy is lower than 5 ⁇ 10 5 Nm ⁇ 1 , the adhesive strength unpreferably drops.
  • the thickness of the adhesive layer can be properly selected in relation to the elastic modulus and the coefficient of linear expansion, but is preferably 2 to 500 ⁇ m, more preferably 20 to 200 ⁇ m.
  • the adhesive composition used in the adhesive sheet of the present invention preferably contains at least one or more thermoplastic resins and thermosetting resins respectively as essential components, but is not limited in their kinds.
  • a thermoplastic resin functions to enhance adhesiveness and flexibility, to ease thermal stress and to enhance insulatability due to low water absorbability, and a thermosetting resin is necessary to realize the balance of physical properties such as heat resistance, insulatability at high temperature, resistance to chemical and the strength of the adhesive layer.
  • thermoplastic resins which can be used here include publicly known resins such as acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-styrene resin (ABS), styrene-butadiene-ethylene resin (SEBS), acrylic resin, polyvinyl butyral, polyamides, polyesters, polyimides, polyamideimides and polyurethanes.
  • NBR acrylonitrile-butadiene copolymer
  • ABS acrylonitrile-butadiene rubber-styrene resin
  • SEBS styrene-butadiene-ethylene resin
  • acrylic resin polyvinyl butyral
  • polyamides polyesters
  • polyimides polyamideimides
  • polyurethanes polyurethanes.
  • These thermoplastic resins may have functional groups capable of reacting with the thermosetting resins described later.
  • the functional groups are, for example, amino groups, carboxyl groups, epoxy groups, hydroxyl groups,
  • thermoplastic resin a copolymer with butadiene as an essential comonomer is preferable having regard to the adhesiveness to the materials of (C) and (D), flexibility and the effect of easing thermal stress, and can be selected from various butadiene-containing resins. Especially having regard to the adhesiveness to metals, resistance to chemicals etc., acrylonitrile-butadiene copolymer (NBR) and styrene-butadiene-ethylene resin (SEBS) are preferable.
  • NBR acrylonitrile-butadiene copolymer
  • SEBS styrene-butadiene-ethylene resin
  • a copolymer with butadiene as an essential comonomer and with carboxyl groups which can be selected, for example, from NBR (NBR-C), SEBS (SEBS-C), etc is more preferable.
  • NBR-C can be, for example, a copolymer rubber obtained by copolymerizing acrylonitrile and butadiene at a molar ratio of about 10/90 ⁇ 50/50 and with its terminal groups carboxylated, or a ternary copolymer rubber being constituted by acrylonitrile, butadiene and a carboxyl group-containing polymerizable monomer such as acrylic acid or maleic acid.
  • SEBS-C can be MX-073 (produced by Asahi Chemical Industry Co., Ltd.).
  • a polyamide resin which can be selected from various polyamide resins is preferable.
  • a resin containing a dicarboxylic acid with 36 carbon atoms (a so-called dimer acid) is suitable since it makes the adhesive layer flexible and is low in the coefficient of water absorption, hence excellent in insulatability.
  • a polyamide resin containing a dimer acid can be obtained by polycondensation of a dimer acid and a diamine according to a conventional method, but in this case, a dicarboxylic acid other than a dimer acid such as adipic acid, azelaic acid or sebacic acid may also be present as a comonomer.
  • the diamines which can be used here include those publicly known such as ethylenediamine, hexamethylenediamine and piperazine, and having regard to moisture absorbability and solubility, a mixture of two or more diamines can also be used. Furthermore, a polymer containing amino groups is excellent in reaction and compatibility with an epoxy resin and further improves insulatability and adhesiveness more. The amount of the amino groups is preferably 1 to 3 in amine value. If the amine value is less than 1, the effect of enhancing insulatability and adhesive strength is too small, and if more than 3, the curing reaction progresses excessively to unpreferably lower processability.
  • thermosetting resins which can be used here include those publicly known such as epoxy resins, phenol resins, melamine resin, xylene resin, furan resins and cyanate resins. Especially epoxy resins and phenol resins can be suitably used since they are excellent in insulatability.
  • the epoxy resin is not especially limited as far as it contains two or more epoxy groups in one molecule, and preferably contains at least one or more dicyclopentadiene skeleton-containing epoxy resins represented by the following general formula (I), terpene skeleton-containing epoxy resins represented by the following general formula (II), biphenyl skeleton-containing epoxy resins represented by the following general formula (III) and naphthalene skeleton-containing epoxy resins represented by the following general formula (IV).
  • R 1 to R 4 stand for, respectively independently, a hydrogen atom, lower alkyl group with 1 to 4 carbon atoms or halogen atom
  • R 1 to R 4 stand for, respectively independently, a hydrogen atom, lower alkyl group with 1 to 4 carbon atoms or halogen atom
  • R 1 to R 8 stand for, respectively independently, a hydrogen atom, lower alkyl group with 1 to 4 carbon atoms or halogen atom
  • R 1 to R 8 stand for a 2,3-epoxypropoxy group respectively, and the remaining groups stand for, respectively independently, a hydrogen atom, lower alkyl group with 1 to 4 carbon atoms or halogen atom).
  • the epoxy resin can also be used together with a glycidyl ether such as bisphenol F, bisphenol A, bisphenol S, resorcinol or trihydroxybenzene, or another epoxy resin, for example, an alicyclic epoxy resin such as epoxydated phenol novolak, epoxydated cresol novolak, epoxydated trisphenylolmethane, epoxydated tetraphenylolethane, epoxydated metaxylenediamine or cyclohexane epoxide, copolymer type brominated epoxy resin of tetrabromobisphenol A and bisphenol A, brominated phenol novolak type epoxy resin, etc.
  • a glycidyl ether such as bisphenol F, bisphenol A, bisphenol S, resorcinol or trihydroxybenzene
  • another epoxy resin for example, an alicyclic epoxy resin such as epoxydated phenol novolak, epoxydated cresol novolak, epoxydated trisphenylolmethane, epoxy
  • the phenol resins which can be used include all the publicly known phenol resins such as novolak type phenol resins and resol type phenol resins, for example, resins of phenol, alkyl substituted phenols such as cresol, p-t-butylphenol, nonylphenol and p-phenylphenol, cyclic alkyl modified phenols such as terpene and dicyclopentadiene, resins with functional groups containing a hetero atom such as nitro groups, halogen groups, cyano groups or amino groups, resins with a skeleton of naphthalene or anthracene, etc., resins of a polyfunctional phenol such as bisphenol F, bisphenol A, bisphenol S, resorcinol or pyrogallol.
  • phenol resins such as novolak type phenol resins and resol type phenol resins
  • resins of phenol alkyl substituted phenols such as cresol, p-t-butyl
  • the amount of the thermosetting resin added is 5 to 400 parts by weight, preferably 50 to 200 parts by weight against 100 parts by weight of the thermoplastic resin. If the amount of the thermosetting resin added is less than 5 parts by weight, it is not preferable because the elastic modulus at high temperature drops so remarkably that the semiconductor integrated circuit connecting substrate is deformed while using the apparatus on which the semiconductor device is mounted, and that the handling convenience during processing is poor. If the amount of the thermosetting resin used exceeds 400 parts by weight, the elastic modulus is so high that the coefficient of linear expansion becomes small, to unpreferably lower the effect of easing the thermal stress.
  • a curing agent and a curing accelerator for epoxy resins and phenol resins can be added without any limitation, which can be selected, for example, from aromatic polyamines such as 3,3′,5,5′-tetramethyl-4,4′-diaminodiphenylmethane, 3,3′,5,5′-tetraethyl-4,4′-diaminodiphenylm ethane, 3,3′-dimethyl-5,5′-diethyl-4,4′-diaminodiphenylmethane, 3,3′-dichloro-4,4′-diaminodiphenylmethane, 2,2′,3,3′-tetrachloro-4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl sulfide, 3,3′-diaminobenzophenone, 3,3′-diaminodiphenyls
  • organic and inorganic ingredients such as an antioxidant and ion arrestor can also be added without any limitation as far as the properties of the adhesive are not impaired.
  • Fine grained inorganic ingredients include metal hydroxides such as aluminum hydroxide, magnesium hydroxide and calcium aluminate hydrate, metal oxides such as silica, alumina, zirconium oxide, zinc oxide, antimony trioxide, antimony pentoxide, magnesium oxide, titanium oxide, iron oxide, cobalt oxide, chromium oxide and talc, inorganic salts such as calcium carbonate, fine metal grains of aluminum, gold, silver, nickel, iron, etc., and carbon black and glass, and organic ingredients include crosslinked polymers such as styrene, NBR rubber, acrylic rubber, polyamides, polyimides and silicone.
  • the average grain size of the fine grained ingredients is preferably 0.2 to 5 ⁇ , considering the dispersion stability.
  • a suitable amount of the ingredients added is 2 to 50 parts by weight against 100 parts by weight of the entire adhesive composition.
  • a protective film layer may be provided for the adhesive layer.
  • the protective film layer is not especially limited, as far as it can be removed from the adhesive face without impairing the form of the semiconductor integrated circuit connecting substrate before bonding the semiconductor integrated circuit connecting substrate to another member (e.g., IC or printed wiring board, etc.), and can be, for example, a polyester film or polyolefin film coated with silicone or fluorine compound, or paper laminated with any of them, etc.
  • the semiconductor device referred to in the present invention means a device using the semiconductor connecting substrate of the present invention, and is not especially limited in form or structure.
  • the connection between the semiconductor connecting substrate and an IC can be achieved by any of TAB, WB, resin sealing with flip chips mounted, anisotropically conductive film (adhesive) bonding, etc.
  • a package called a CSP is also included in the semiconductor device of the present invention.
  • a tape for TAB with a three-layer structure with an adhesive layer and a protective film layer laminated on a polyimide film is prepared by the following steps of (a) to (d): (a) perforation of sprocket and device holes, (b) thermal lamination with a copper foil, (c) pattern forming (resist coating, etching and resist removal), and (d) tin or gold plating.
  • FIG. 5 shows an example of the form of the TAB tape obtained (pattern tape).
  • the solvent is not especially limited, but can be preferably selected from aromatic hydrocarbons such as toluene, xylene and chlorobenzene, ketones such as methyl ethyl ketone and methyl isobutyl ketone, aprotic polar solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone, and their mixtures.
  • aromatic hydrocarbons such as toluene, xylene and chlorobenzene
  • ketones such as methyl ethyl ketone and methyl isobutyl ketone
  • aprotic polar solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone, and their mixtures.
  • a releasable polyester or polyolefin protective film lower than the film of (a) in peeling strength is laminated onto the film of (a), to obtain an adhesive sheet.
  • the adhesive sheet can be laminated a plurality of times. After completion of lamination,
  • FIG. 3 shows an example of the semiconductor connecting substrate.
  • symbol 19 denotes an adhesive layer of a TAB tape; 20 ; an organic insulating film; 21 , a sprocket hole; 22 , a conductor pattern; 23 , a conductor at a solder ball joint; and 24 , a device hole.
  • (a) (D) with an adhesive laminated is punched by a die, and for example, a square die is used to prepare a metallic sheet with an adhesive with a square hole at the center.
  • FIGS. 1 and 2 are sectional views showing embodiments of the semiconductor device of the present invention. In FIG.
  • symbol 1 denotes an IC chip; 2 , a gold bump; 3 , an organic insulating film; 4 , an adhesive of a TAB tape; 5 , an inner lead; 6 , an adhesive layer of a semiconductor connecting substrate; 7 , a layer without any conductor pattern formed (reinforcing sheet); 8 , a solder resist; 9 , a solder ball; and 10 , a sealing resin.
  • symbol 11 denotes a protective film; 12 , an IC chip; 13 , an inner lead;, 14 , an organic insulating film; 15 , a sealing resin; 16 , an adhesive layer of a TAB tape; 17 , a solder ball; and 18 , a solder resist.
  • the softening temperature is considered to have correlation with the dimensional accuracy at high temperature, and is preferably 60 to 110° C., more preferably 70 to 90° C. If the softening temperature is lower than 60° C., the adhesive sheet is so soft as to lower the dimensional accuracy such as the position of the conductor, and to unpreferably lower insulatability. If higher than 110° C., the difference from the copper foil or insulating base film in the coefficient of linear expansion cannot be absorbed, and warping is caused, to unpreferably lower the dimensional accuracy.
  • the adhesive sheet is preferably 5 ⁇ 10 5 Nm ⁇ 1 or more, more preferably 8 ⁇ 10 5 Nm ⁇ 1 in the breaking energy at 25° C. after having been cured by heating. If the breaking energy is lower than 5 ⁇ 10 5 Nm ⁇ 1 , the adhesive strength unpreferably drops.
  • the insulation resistance value and the insulation resistance dropping time refer to those measured under accelerated evaluation conditions, i.e., conditions of evaluation methods (5) and (6) for the examples.
  • the insulation resistance value is preferably 5 ⁇ 10 8 ⁇ or more, more preferably 1 ⁇ 10 9 ⁇ or more. If the insulation resistance value is lower than 5 ⁇ 10 8 ⁇ , the insulation durability of the semiconductor device of the present invention unpreferably drops.
  • the insulation resistance dropping time is defined as the time taken for the insulation resistance value to drop to a reference value or lower when the above measurement of insulation resistance value is executed continuously. If DC 100 V is applied in an environment of 130° C. and 85% RH, the reference value is 10 7 ⁇ , and if DC 100 V is applied in an environment of 150° C., the reference value is 10 9 ⁇ .
  • the insulation resistance dropping time is preferably 50 hours or more, more preferably 100 hours or more, further more preferably 300 hours or more. If the time is shorter than 50 hours, the insulation reliability of the semiconductor device of the present invention unpreferably drops.
  • the insulation resistance value is lower while the insulation resistance dropping time is shorter since the ions in the adhesive migrate remarkably.
  • the insulation resistance value is high and the insulation resistance dropping time is long as peculiar features.
  • the mechanism is unknown, it can be considered that there is a structure to inhibit the migration of ions even though the softening temperature is so low as to make the adhesive layer soft.
  • the adhesive layer of the tape for TAB of the present invention contains a thermoplastic resin (D) and a thermosetting resin (E).
  • the thermoplastic resin (D) is effective for controlling the softening temperature and functions to improve the adhesive strength and flexibility, to ease the thermal stress and to enhance insulatability due to low water absorbability.
  • the thermosetting resin (E) is necessary to realize the balance of physical properties such as heat resistance, insulatability at high temperature, chemicals resistance and the strength of the adhesive layer.
  • the amount of the thermoplastic resin added is preferably 30 to 60 wt %, more preferably 35 to 55 wt % based on the weight of the adhesive layer.
  • thermoplastic resins which can be used here include those publicly known such as acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-styrene resin (ABS), styrene-butadiene-ethylene resin (SEBS), acrylic resin, polyvinyl butyral, polyamides, polyesters, polyimides, polyamideimides and polyurethanes.
  • These thermoplastic resins can also have functional groups capable of reacting with the thermosetting resins described later such as phenol resins and epoxy resins.
  • the functional groups can be, for example, amino groups, carboxyl groups, epoxy groups, hydroxyl groups, methylol groups, isocyanate groups, vinyl groups, silanol groups, etc. These functional groups intensify the bonding with the thermosetting resin and preferably improves heat resistance.
  • a polyamide resin is preferable, which can be selected from various polyamide resins.
  • a polyamide resin containing a dicarboxylic acid with 36 carbon atoms (a so-called dimer acid) which can make the adhesive layer flexible and is excellent in insulatability due to low coefficient of water absorption is especially suitable.
  • a polyamide resin containing a dimer acid can be obtained by polycondensation of a dimer acid and a diamine by a conventional method.
  • a dicarboxylic acid other than a dimer acid such as adipic acid, azelaic acid or sebacic acid can also be present as a comonomer.
  • the diamine can be selected from those publicly known such as ethylenediamine, hexamethylenediamine and piperazine, and having regard to moisture absorbability and solubility, a mixture of two or more diamines can also be used.
  • the adhesive strength can be preferably improved.
  • the epoxy resin is not especially limited as far as it has two or more epoxy groups in one molecule, and preferably contains at least one or more dicyclopentadiene skeleton-containing epoxy resins represented by the general formula (I), terpene skeleton-containing epoxy resins represented by the general formula (II), biphenyl skeleton-containing epoxy resins represented by the general formula (III) and naphthalene skeleton-containing epoxy resins represented by the general formula (IV).
  • the epoxy resin can also be used together with a glycidyl ether such as bisphenol F, bisphenol A, bisphenol S, resorcinol or trihydroxybenzene, or another epoxy resin, for example, an alicyclic epoxy resin such as epoxydated phenol novolak, epoxydated cresol novolak, epoxydated trisphenylolmethane, epoxydated tetraphenylolethane, epoxydated metaxylenediamine or cyclohexane epoxide, a copolymer type brominated epoxy resin of tetrabromobisphenol A and bisphenol A, brominated phenol novolak type epoxy resin, etc.
  • a glycidyl ether such as bisphenol F, bisphenol A, bisphenol S, resorcinol or trihydroxybenzene
  • another epoxy resin for example, an alicyclic epoxy resin such as epoxydated phenol novolak, epoxydated cresol novolak, epoxydated trisphenylolmethane
  • the amount of the epoxy resin added is preferably 2 to 20 wt %, more preferably 4 to 15 wt % based on the weight of the adhesive layer, and 3 to 70 parts by weight against 100 parts by weight of the thermoplastic resin.
  • any of publicly known phenol resins such as novolak type phenol resins and resol type phenol resins can be used. These include, for example, resins of phenol, alkyl substituted phenols such as cresol, p-t-butylphenol, nonylphenol and p-phenylphenol, of cyclic alkyl modified phenols such as terpene and dicyclopentadiene, resins with functional groups containing a hetero atom such as nitro groups, halogen groups, cyano groups or amino groups, resins with a skeleton of naphthalene or anthracene, etc., resins of a polyfunctional phenol such as bisphenol F, bisphenol A, bisphenol S, resorcinol or pyrogallol, etc.
  • a resol type phenol resin is suitable since it is effective for improving the insulation resistance dropping time.
  • the following compounds (F) and (G) are present as components of the resol type phenol resin, it is preferable because the softening temperature can be lowered very effectively for achieving the balance between adhesive strength and insulatability.
  • (F) A bifunctional or higher-functional phenol derivative with at least one or more alkyl groups with preferably 5 to 12 carbon atoms, more preferably 7 to 10 carbon atoms.
  • the functionality in this case refers to the sum of the numbers of the regions (ortho and para positions) where methylol groups and phenol nuclei can be bonded to each other when a resol phenol resin is self-crosslinked by addition condensation reaction.
  • orthocresol is bifunctional and metacresol is trifunctional.
  • (F) is an ingredient to improve the flexibility of the phenol resin, and any mononuclear to undecanuclear phenol derivative with a saturated or unsaturated alkyl group with 5 to 12 carbon atoms can be used.
  • a saturated alkylphenol is chemically stable preferably, and particularly, octylphenol, nonylphenol and decylphenol are more preferable since they provide a good balance between insulatability and flexibility after curing.
  • (G) is an ingredient to compensate for the shortage of crosslinking of (F), and is not especially limited as far as it can three-dimensionally crosslink by addition condensation, but considering the compatibility with the ingredient (F) and the solubility into a solvent in processing, phenol, metacresol, bisphenol A or bisphenol F, etc. can be used.
  • the phenol derivatives of (F) and (G) can be respectively made into resol resins, to be subsequently mixed, or a mixture of phenol derivatives can be made into a resol resin.
  • the amount of the phenol resins added is preferably more than 35 to less than 60 wt %, more preferably 40 to 50 wt % based on the weight of the adhesive layer, and 60 to 20 parts by weight against 100 parts by weight of the thermoplastic resin. If the amount is 35 wt % or less, insulatability unpreferably drops, and if 60 wt % or more, the adhesive strength unpreferably drops.
  • Adding a curing agent and a curing accelerator of the epoxy resin and the phenol resin to the adhesive layer of the present invention is not limited at all.
  • Those publicly known can be used, for example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine complex, imidazole derivatives such as 2-alkyl-4-methylimidazoles and 2-phenyl-4-alkylimidazoles, organic acids such as phthalic anhydride and trimellitic anhydride, dicyandiamide, triphenylphosphine, diazabicycloundecene, etc.
  • the amount thereof added is preferably 0.1 to 10 parts by weight against 100 parts by weight of the adhesive layer.
  • organic and inorganic ingredients such as a phenol based or amine based antioxidant and an ion absorbent such as hydrotalcite can be added without any limitation as far as the properties of the adhesive are not impaired.
  • the flexible insulating film in the present invention refers to a 25 to 125 ⁇ thick film made of a plastic material such as a polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate or polyarylate, or of a composite material such as epoxy resin impregnated glass cloth.
  • a laminate constituted by a plurality of films selected from the foregoing can also be used.
  • the film can be treated on either side or both sides by hydrolysis, corona discharge, low temperature plasma, physical surface roughening or adhesive coating, etc.
  • the protective film layer in the present invention is not especially limited as far as it can be removed from the adhesive face without impairing the form of the tape with the adhesive for connecting a semiconductor before thermally laminating the copper foil, and can be, for example, a polyester film or polyolefin film coated with silicone or fluorine compound, or paper laminated with any of them.
  • a flexible insulating film of a polyimide, etc. is coated with a paint with said adhesive composition dissolved in a solvent, and dried. It is preferable to achieve an adhesive layer thickness of 5 to 25 ⁇ by the coating.
  • the drying conditions are 100 to 200° C. for 1 to 5 minutes.
  • the solvent is not especially limited, but can be preferably a mixture constituted by an aromatic hydrocarbon such as toluene, xylene or chlorobenzene and an alcohol such as methanol, ethanol or propanol.
  • a protective film is laminated, and the laminate is finally slit to have a width of about 35 to 158 mm.
  • the protective film can be coated with said adhesive composition and dried, and the coated film can be slit to have a desired width and subsequently have an insulating film laminated on it.
  • the latter method is suitable when the adhesive layer and the insulating film are different in width.
  • the adhesive layer used in the tape for WB of the present invention is usually provided as uncured, and it must be able to be cured and crosslinked by heating after lamination with a copper foil, has a softening temperature of 120 to 200° C., a storage elastic modulus E′ of 20 to 100 MPa at 150° C., and has an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied, but is not limited in other properties or chemical structure.
  • the softening temperature and the storage elastic modulus at 150° C. are considered to have correlation with the WB property.
  • the softening point is preferably 120 to 200° C., more preferably 140 to 170° C.
  • the storage elastic modulus at 150° C. is preferably 20 to 100 MPa, more preferably 30 to 80 MPa. If the softening point is lower than 120° C. or if the storage elastic modulus is lower than 20 MPa, it is not preferable because the adhesive layer may be too soft at the time of WB, not allowing wire bonding. If the softening point is higher than 200° C. or if the storage elastic modulus is more than 100 MPa, the adhesive strength to the copper foil and flexibility unpreferably drop.
  • the insulation resistance value and the insulation resistance dropping time refer to those measured under accelerated evaluation conditions, i.e., conditions of evaluation methods (5) and (6) for the examples.
  • the insulation resistance value is preferably 5 ⁇ 10 8 ⁇ or more, more preferably 1 ⁇ 10 9 ⁇ or more. If the insulation resistance value is lower than 5 ⁇ 10 8 ⁇ , the insulation durability of the semiconductor device of the present invention unpreferably drops.
  • the insulation resistance dropping time is defined as the time taken for the insulation resistance value to drop to a reference value or lower when the above measurement of insulation resistance value is executed continuously. If DC 100 V is applied in an environment of 130° C. and 85% RH, the reference value is 10 7 ⁇ , and if DC 100 V is applied in an environment of 150° C., the reference value is 10 9 ⁇ .
  • the insulation resistance dropping time is preferably 50 hours or more, more preferably 100 hours or more, still more preferably 300 hours or more. If the time is shorter than 50 hours, the insulation reliability of the semiconductor device of the present invention unpreferably drops.
  • the WB property has been improved by raising the softening temperature or glass transition temperature and increasing the storage elastic modulus, and it has been general practice to use a thermoplastic resin high in crosslinking density.
  • a thermoplastic resin high in crosslinking density.
  • hard and fragile properties are caused at room temperature, and a drop of adhesive strength to the copper foil and the drop of flexibility occur.
  • mixing a thermoplastic resin has been examined, but the WB property is in contradictory relation with the adhesiveness and flexibility.
  • the reason is considered to be that the compatibility between the thermosetting resin and the thermoplastic resin is not appropriate.
  • the compatibility is a factor deciding the microphase separated structure of the cured adhesive, and it is known that the viscoelasticity depends on the microphase separated structure.
  • thermoplastic resin and the thermosetting resin of the adhesive layer under control of their compatibility is considered to optimize the microphase separated structure of the cured adhesive and realizes the balance between the WB property and the adhesiveness and flexibility.
  • the adhesive layer of the tape for WB of the present invention preferably contains a thermoplastic resin (D) and a thermosetting resin (E).
  • the thermoplastic resin (D) is effective for controlling the softening temperature and the storage elastic modulus, and functions to improve the adhesiveness and flexibility, to ease the thermal stress and to enhance insulatability due to low water absorbability.
  • the thermoplastic resin (e) is necessary to realize the balance of physical properties such as heat resistance, insulatability at high temperature, resistance to chemicals and the strength of the adhesive layer.
  • the amount of the thermoplastic resin (D) added is preferably 30 to 60 wt %, more preferably 35 to 55 wt % based on the weight of the adhesive layer.
  • thermoplastic resins which can be used here include those publicly known such as acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-styrene resin (ABS), styrene-butadiene-ethylene resin (SEBS), acrylic resin, polyvinyl butyral, polyamides, polyesters, polyimides, polyamideimides and polyurethanes.
  • these thermoplastic resins can have functional groups capable of reacting with the thermosetting resins described later such as phenol resins and epoxy resins, for example, amino groups, carboxyl groups, epoxy groups, hydroxyl groups, methylol groups, isocyanate groups, vinyl groups, silanol groups, etc. These functional groups intensify the bonding with the thermosetting resin, to preferably improve the heat resistance.
  • a polyamide resin in view of the adhesiveness to the copper foil, flexibility and insulatability, a polyamide resin can be preferably used, which can be selected from various polyamide resins.
  • a resin containing a dicarboxylic acid with 36 carbon atoms (a so-called dimer acid) is especially suitable since it makes the adhesive layer flexible and is low in coefficient of water absorption, hence excellent in insulatability.
  • a polyamide resin containing a dimer acid can be obtained by polycondensation of a dimer acid and a diamine according to a conventional method, but in this case, a dicarboxylic acid other than a dimer acid such as adipic acid, azelaic acid or sebacic acid may also be present as a comonomer.
  • the diamines which can be used here include those publicly known such as ethylenediamine, hexamethylenediamine and piperazine, and having regard to moisture absorbability and solubility, a mixture of two or more diamines can also
  • thermoplastic resin If a publicly known epoxy resin is added as the thermoplastic resin, the adhesive strength can be improved.
  • the epoxy resin is not especially limited, as far as it contains two or more epoxy groups in one molecule, but its compatibility with the thermoplastic resin is important. So, it is preferable to select an epoxy resin with proper compatibility.
  • the compatibility in this case is defined by the haze of the film prepared by mixing the thermoplastic resin and the epoxy resin at a ratio by weight of 1/1. A specific measuring method is shown in the evaluation method (17) for the examples.
  • the haze is preferably 8 to 45, more preferably 10 to 35. If the haze is less than 8, the compatibility is too good, and it is unpreferable because only average properties as a simple mixture can be obtained. If more than 45, the mixture is too heterogeneous, and the properties of either ingredient are unpreferably manifested too strongly.
  • the epoxy resins which can be used here include, for example, cyclopentadiene skeleton-containing epoxy resins, terpene skeleton-containing epoxy resins, biphenyl skeleton-containing epoxy resins, resorcinol diglycidyl ether, phthalic acid diglycidyl ester, ethylene oxide modified bisphenol A diglycidyl ether (e.g., BEO-60E produced by New Japan Chemical Co., Ltd.), etc.
  • dicyclopentadiene skeleton-containing epoxy resins represented by the general formula (I), terpene skeleton-containing epoxy resins represented by the general formula (II) and biphenyl skeleton-containing epoxy resins represented by the general formula (III) are especially preferably since they are good in heat resistance.
  • the epoxy resin can also be used together with a glycidyl ether such as bisphenol F, bisphenol A, bisphenol S, trihydroxybenzene or dihydroxynaphthalene, or another epoxy resin, for example, alicyclic epoxy resin such as epoxydated phenol novolak, epoxydated cresol novolak, epoxydated trisphenylolmethane, epoxydated tetraphenylolethane, epoxydated metaxylenediamine or cyclohexane epoxide, copolymer type brominated epoxy resin of tetrabromobisphenol A and bisphenol A, brominated phenol novolak type epoxy resin, etc.
  • a glycidyl ether such as bisphenol F, bisphenol A, bisphenol S, trihydroxybenzene or dihydroxynaphthalene
  • another epoxy resin for example, alicyclic epoxy resin such as epoxydated phenol novolak, epoxydated cresol novolak, epoxydated trisphenylolmethane, epoxy
  • the amount of the epoxy resin added is preferably 10 to 40%, more preferably 15 to 30 wt % based on the weight of the adhesive layer, and 15 to 140 parts by weight against 100 parts by weight of the thermoplastic resin. If the amount is less than 10 wt %, the softening point drops, to lower the WB property, and also to lower the adhesive strength. If more than 40 wt %, insulatability unpreferably drops.
  • thermoplastic resin Furthermore, if a publicly known phenol resin is added as the thermoplastic resin, insulatability, chemicals resistance and the strength of the adhesive layer can be further improved.
  • the phenol resins which can be used here include those publicly known such as novolak type phenol resins and resol type phenol resins, for example, resins of phenol, alkyl substituted phenols such as cresol, p-t-butylphenol, nonylphenol and p-phenylphenol, and of cyclic alkyl modified phenols such as terpene and dicyclopentadiene, resins with functional groups containing a hetero atom such as nitro groups, halogen groups, cyano groups and amino groups, resins with a skeleton of naphthalene, anthracene, etc., and resins of polyfunctional phenols such as bisphenol F, bisphenol A, bisphenol S, resorcinol and pyrogallol.
  • a resol type phenol resin is more suitable since it is effective in improving the insulation resistance dropping time.
  • the amount of the phenol resin added is preferably more than 35 to less than 60 wt %, more preferably 40 to 50 wt % based on the weight of the adhesive layer, and 60 to 200 parts by weight against 100 parts by weight of the thermoplastic resin. If the amount is 35 wt % or less, the insulatability unpreferably drops, and if 60 wt % or more, the adhesive strength unpreferably drops.
  • a curing agent and a curing accelerator of epoxy resins and phenol resins can be added without any limitation, which can be selected from those publicly known, for example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine, imidazole derivatives such as 2-alkyl-4-methylimidazoles and 2-phenyl-4-alkylimidazoles, organic acids such as phthalic anhydride and trimellitic anhydride, dicyandiamide, triphenylphosphine, diazabicycloundecene, etc.
  • the amount thereof added is preferably 0.1 to 10 parts by weight against 100 parts by weight of the adhesive layer.
  • organic and inorganic ingredients such as a phenol based or amine based antioxidant and ion absorbent such as hydrotalcite can be added without any limitation as far as the properties of the adhesive are not impaired.
  • the flexible insulating film in the present invention refers to a 25 to 125 ⁇ film made of a plastic material such as a polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate or polyarylate, or of a composite material such as epoxy resin impregnated glass cloth.
  • a laminate constituted by a plurality of films selected from the foregoing can also be used.
  • the film can be treated on either side or both sides by hydrolysis, corona discharge, low temperature plasma, physical surface roughening or adhesive coating, etc.
  • the protective film layer in the present invention is not especially limited as far as it can be removed from the adhesive face without impairing the form of the tape with the adhesive for connecting a semiconductor before thermally laminating the copper foil, and can be, for example, a polyester film or polyolefin film coated with silicone or fluorine compound, or paper laminated with any of them.
  • a flexible insulating film of a polyimide, etc. is coated with a paint in which said adhesive composition is dissolved in a solvent, and dried. It is preferable to achieve an adhesive layer thickness of 5 to 25 ⁇ by the coating.
  • the drying conditions are 100 to 200° C. for 1 to 5 minutes.
  • the solvent is not especially limited, but can be preferably a mixture constituted by an aromatic hydrocarbon such as toluene, xylene or chlorobenzene and an alcohol such as methanol, ethanol or propanol.
  • a protective film is laminated, and the laminate is finally slit to have a width of about 35 to 158 mm.
  • the protective film can be coated with said adhesive composition and dried, and the coated composition can be slit to have a desired width and subsequently have an insulating film laminated on it.
  • the latter method is suitable when the adhesive layer and the insulating film are different in width.
  • an adhesive-backed tape for TAB 31N0-00ES produced by Toray Industries, Inc.
  • a 18 ⁇ m thick electrolytic copper foil (3EC-VLP produced by Mitsui Mining & Smelting Co., Ltd.) was laminated at 140° C. and 0.1 MPa.
  • the laminate was heated to be cured in an air oven at 80° C. for 3 hours, at 100° C. for 5 hours and at 150° C. for 5 hours, to prepare a tape with a copper foil for TAB.
  • a photoresist layer was formed, being followed by etching and resist removal according to a conventional method, to prepare a pattern tape for evaluation.
  • a 100 ⁇ m thick adhesive sheet was laminated at 140° C. and 0.1 MPa, and formed into a 30 mm square.
  • the pure copper sheet with an adhesive of (2) was laminated at 130° C. and 0.1 MPa, and the laminate was heated to be cured in an air oven at 150° C. for 2 hours. It was immersed in an etchant mainly composed of ferric chloride, to dissolve said pure copper sheet. Finally the exposed adhesive layer was observed by a stereoscopic microscope of 30 times in magnification, to evaluate the foaming at the time of curing and the embeddability of the conductor pattern.
  • the pure copper sheet with an adhesive layer as described in (2) was laminated on a polyimide film (“Upilex” 75S produced by Ube Industries, Ltd.) at 130° C. and 0.1 MPa, and the laminate was heat to be cured in an air oven at 150° C. for 2 hours.
  • the polyimide film obtained as a sample was cut to have a width of 2 mm, and peeled at a speed of 50 mm/min at a 90° direction by a tensile tester (Model UCT-100 produced by K.K. Orientec), and the peeling force was measured.
  • the pure copper sheet with an adhesive layer as described in (2) was laminated at 130° C. and 0.1 MPa, and the laminate was heated to be cured in an air oven at 150° C. for 2 hours.
  • the obtained sample was placed in a thermo-hygrostat (Model IE-21 produced by Yamato Scientific Co. Ltd.) of 85° C. and 85% RH, and with a voltage of 100 V applied continuously, the resistance value was measured immediately and 200 hours later by a super insulation tester (Model DSM-8101 produced by Toa Electronics Co. Ltd.).
  • a 30 mm square sample prepared as described in (4) was conditioned in an atmosphere of 85° C. and 85% RH for 48 hours, and immediately floated on a solder bath for 60 seconds, to measure the maximum temperature at which neither swelling nor peeling occurred.
  • a 30 mm square sample prepared as described in (4) was placed in a heat cycle tester (Model PL-3 produced by Tabai Espec Corp.) to be treated for 600 cycles of maintenance at a minimum temperature of -20° C. and a maximum temperature of 100° C. for 1 hour each, to evaluate peeling.
  • a heat cycle tester Model PL-3 produced by Tabai Espec Corp.
  • An adhesive layer was laminated, to make a total thickness of about 500 ⁇ m, and the laminate was post-cured at 150° C. for 2 hours, to prepare a sample. It was measured using a dynamic viscoelasticity measuring instrument (RHEOVIBRON-DDV-II/III-EA produced by K.K. Orientec) in the tensile mode at a frequency of 35 Hz and a heating rate of 2° C. min ⁇ 1 .
  • a dynamic viscoelasticity measuring instrument RHEOVIBRON-DDV-II/III-EA produced by K.K. Orientec
  • An adhesive-backed tape for TAB and a tape for WB of the present invention were used, to prepare pattern tapes for evaluation respectively as described in (1).
  • the sample obtained in (11) was immersed in a borofluoric acid based electroless tin plating solution (LT-34 produced by Simplay Far East) at 70° C., to be plated with tin to a thickness of 0.5 ⁇ .
  • the sample for adhesive strength measurement was 50 ⁇ m in conductor width.
  • the sample for insulatability measurement was formed as shown in FIG. 7 .
  • symbol 48 denotes a conductor portion of a pattern for insulation measurement
  • 49 an adhesive layer of a TAB tape
  • 50 an organic insulating film.
  • a sample for wire bonding property measurement of (16) was obtained by electroplating a 0.1 ⁇ m thick nickel ground with gold to a thickness of 0.5 ⁇ m (Aurobel UP-24 produced by Japan Ronal K.K.).
  • a copper foil as a sample of 50 ⁇ m in conductor width obtained as described in (11) and (12) was peeled at a speed of 50 mm/min in a 90° direction using a tensile tester (UTM-11-5HR produced by K.K. Orientec), and the peeling force was measured.
  • thermo-hygrostat Model TPC-211D produced Tabai Espec Corp.
  • the resistance value was measured by a super insulation tester (Model DSM-8101 produced by Toa Electronics Co. Ltd.).
  • a sample for evaluation with the same form as that of (14) was placed in an air oven (Model ID-21 produced by Yamato Scientific Co. Ltd.) at 150° C. with a voltage of DC 100 V applied continuously, and the insulation resistance dropping time to reach a resistance value of 10 9 ⁇ or less was measured.
  • a tape for WB gold plated pattern tape prepared as described in (11) and (12) had gold wires bonded at 180° C. at a load of 60 g and at an ultrasonic frequency of 58 kHz.
  • a tensile strength test was carried out using a tensile strength tester (Model Microtester 22 produced by Dage).
  • thermoplastic resin and an epoxy resin were mixed at 1/1 by weight, and the mixture was dissolved into a solvent common to both to achieve a concentration of about 10 wt %.
  • the solution was cast to form a film of about 12 ⁇ m in dry thickness.
  • the sample obtained was used to measure the haze according to JIS K 7105.
  • a tape sample for TAB with a 12 ⁇ m thick adhesive layer on a 75 ⁇ m thick base polyimide film was cut into a specimen of 35 mm ⁇ 6 mm, and the cover film was removed. The remaining film was post-cured under the same conditions as described in (1). Since the film curled with the adhesive inside, it was placed on a flat sheet to form an arch, and the maximum height from the flat sheet was measured by a micrometer.
  • a dimer acid (PRIPOL1009 produced by Unichema) as an acid component and hexamethylenediamine (produced by Wako Pure Chemical Industries Ltd.) as an amine component were used with the acid/amine ratio changed in a range from 1.1 to 0.9, to produce an acid/amine reaction product.
  • the acid/amine reaction product, defoaming agent and 1% or less of phosphoric acid catalyst were mixed to prepare a polyamide reaction product.
  • the polyamide reaction product was stirred and heated at 140° C. for 1 hour, and heated to 205° C., being stirred at that temperature for about 1.5 hours. It was held in vacuum of about 15 mm Hg for 0.5 hour, and the temperature was lowered. Finally, an antioxidant was added, and a polyamide resin having an amine value of 2.5 was taken out.
  • a high molecular resol phenol (Bell Pearl S895 produced by Kanebo, Ltd.) was dissolved into chlorobenzene at 60° C. to achieve a concentration of about 10 wt %.
  • the solution was filtered by a 0.5 ⁇ m filter, and the soluble content was taken out. From the difference in solid concentration before and after filtration, the obtained soluble content was 96%.
  • Aluminum hydroxide (H-421 produced by Showa Denko K.K.) was mixed with toluene, and the mixture was treated by a sand mill, to prepare an aluminum hydroxide dispersion.
  • NBR-C PNR-1LH produced by Japan Synthetic Rubber Co., Ltd.
  • bisphenol A type epoxy resin (“Epikote” 834 produced by Yuka Shell Epoxy K.K., 250 in epoxy equivalent)
  • brominated epoxy resin (“Epikote” 5050 produced by Yuka Shell Epoxy K.K., 49% in bromine content and 395 in epoxy equivalent)
  • 4,4′-diaminodiphenylsulfone and methyl ethyl ketone equal in weight to the dispersion were added to the dispersion to achieve the composition ratio shown in Table 2, and the mixture was stirred at 30° C., to prepare an adhesive solution.
  • the adhesive solution was applied to a 25 ⁇ thick polyethylene terephthalate film with a silicone releasing agent (“Film Bina” GT produced by Fujimori Kogyo Co., Ltd.) by a bar coater to achieve a dry thickness of about 50 ⁇ , and dried at 170° C. for 5 minutes. Two sheets of the coated film were laminated with the adhesive faces kept to face each other, to prepare an adhesive sheet of 100 ⁇ in adhesive thickness. The adhesive sheet was laminated on a 0.1 mm thick pure copper sheet at 100° C. and 0.1 MPa, to obtain a pure copper sheet with an adhesive layer.
  • Table 3 how the storage elastic modulus and the linear expansion coefficient depend on the temperature is shown in FIGS. 8 and 9.
  • the pure copper sheet with an adhesive layer and with an external form of 30 mm square obtained according to the above procedure was punched to open a 20 mm square hole at the center.
  • a pattern tape shown in FIG. 7 was prepared.
  • the conductor pattern face was coated with a photosensitive solder resist (“Probimer” 71 produced by Ciba Geigy), and it was dried, exposed with a photo mask, developed and thermoset. On the pads for solder ball connection, the resist was removed.
  • the pure copper sheet and the pattern tape were thermally pressure-bonded to each other on the side opposite to the conductor pattern at 130° C. and 0.1 MPa, with the hole in the pure copper sheet kept in register with the device hole in the pattern tape, and the laminate was heated to be cured in an air oven at 150° C. for 2 hours, to prepare a semiconductor connecting substrate.
  • FIG. 1 is a sectional view showing the obtained semiconductor device.
  • Spherical silica (“Ecserica” produced by Tokuyama Corp.) was mixed with toluene, and the mixture was treated by a sand mill, to prepare a dispersion.
  • NBR-C PNR-1H produced by Japan Synthetic Rubber Co., Ltd.
  • SEBS-C MX-073 produced by Asahi Chemical Industry Co., Ltd.
  • naphthalene skeleton-containing epoxy resin (“Epiclon” HP4032 produced by Danippon Ink & Chemicals, Inc., 150 in epoxy equivalent), 4,4′-diaminodiphenylsulfone, and methyl ethyl ketone equal in weight to the dispersion were added to the dispersion to achieve the composition ratio shown in Table 1, and the mixture was stirred at 30° C. to prepare an adhesive solution.
  • the adhesive solution was used to obtain a pure copper sheet with an adhesive layer as described in EXAMPLE 1. The properties are shown in Table 3.
  • Adhesives prepared by using the raw materials shown in Table 1 at the composition ratios shown in Table 2 as described in EXAMPLE 1 were used to obtain adhesive sheets for semiconduction connecting substrates. The properties are also shown in Table 3.
  • Aluminum hydroxide (H-42I produced by Showa Denko K.K.) was mixed with toluene, and the mixture was treated by a sand mill, to prepare an aluminum hydroxide dispersion.
  • NBR-C PNR-1H produced by Japan Synthetic Rubber Co., Ltd.
  • methyl ethyl ketone equal in weight to the dispersion were added to the dispersion, to achieve the composition ratio shown in Table 2, and the mixture was stirred at 30° C., to prepare an adhesive solution.
  • the adhesive solution was used to obtain a pure copper sheet with an adhesive layer as described in EXAMPLE 1. The properties are shown in Table 3.
  • Aluminum hydroxide (H-421 produced by Showa Denko K.K.) was mixed with toluene, and the mixture was treated by a sand mill, to prepare an aluminum hydroxide dispersion.
  • a phenol novolak resin (PSM4261 produced by Gun-ei Chemical Industry Co., Ltd.), hexamethylenetetramine and methyl ethyl ketone equal in weight to the dispersion were added to the dispersion, to achieve the composition ratio shown in Table 2, and the mixture was stirred at 30° C., to prepare an adhesive solution.
  • the adhesive solution was used, to obtain a pure copper sheet with an adhesive layer as described in EXAMPLE 1.
  • Table 3 The properties are shown in Table 3.
  • the polyamide resin (2.5 in amine value) obtained in Reference EXAMPLE 1, epoxy resin (“Epiclon” HP4032 produced by Dainippon Ink & Chemicals, Inc., 150 in epoxy equivalent), nonylphenol type resol phenol resin (CRM0803 produced by Showa High polymer Co., Ltd.), straight type phenol resol resin (PR50087 produced by Sumitomo Durez Co., Ltd.), p-t-Bu/bisphenol A mixed type (p-t-Bu/bisphenol A 8/2) phenol resol resin (CKM935 produced by Showa High polymer Co., Ltd.) and DBU were mixed to achieve the composition ratio shown in Table 2, and the mixture was stirred in a mixed solvent of methanol and monochlorobenzene at 30° C., to achieve a concentration of 20 wt %, for preparing an adhesive solution.
  • epoxy resin (“Epiclon” HP4032 produced by Dainippon Ink & Chemicals, Inc., 150 in epoxy equivalent
  • the adhesive was applied by a bar coater, to a 25 ⁇ thick polyethylene terephthalate film (“Lumirror” produced by Toray Industries, Inc.) used as a protective film, to achieve a dry thickness of about 12 ⁇ , and the laminate was dried at 100° C. for 1 minute and at 160° C. for 5 minutes, to prepare an adhesive sheet.
  • the obtained adhesive sheet was laminated onto a 75 ⁇ thick polyimide film (“Upilex” 75S produced by Ube Industries, Ltd.) used as an organic insulating film at 120° C. and 1 kg/cm 2 , to prepare an adhesive-backed tape for TAB.
  • the properties are shown in Table 4.
  • FIG. 10 shows the measured results of temperature dependence of tan 67.
  • FIG. 11 shows the measured results of insulation resistance with DC 100 V applied at 130° C. and 85% RH.
  • a conductor circuit for IC connection was formed, to obtain a semiconductor connecting substrate (pattern tape) shown in FIG. 3 .
  • FIG. 1 is a sectional view showing the obtained semiconductor device.
  • the polyamide resin (2.5 in amine value) obtained in Reference EXAMPLE 1, epoxy resin (ZX1257 produced by Toto Kasei K.K., 260 in epoxy equivalent), p-t-Bu phenol type resol phenol resin (CKM1634G produced by Showa High polymer Co., Ltd.), p-t-Bu/bisphenol A mixed type (p-t-Bu/bisphenol A 8.2) phenol resol resin (CKM908 produced by Showa High polymer Co., Ltd.) and DBU were mixed, to achieve the composition ratio shown in Table 5, and the mixture was stirred in a mixed solvent of methanol and monochlorobenzene at 30° C., to achieve a concentration of 20 wt %, for preparing an adhesive solution.
  • epoxy resin ZX1257 produced by Toto Kasei K.K., 260 in epoxy equivalent
  • p-t-Bu phenol type resol phenol resin CKM1634G produced by Showa High polymer Co., Ltd.
  • the adhesive was applied by a bar coater, onto a 25 ⁇ thick polyethylene terephthalate film (“Lumirror” produced by Toray Industries, Inc.) used as a protective film, and dried at 100° C. for 1 minute and at 160° C. for 5 minutes, to obtain an adhesive sheet. Furthermore, the obtained adhesive sheet was laminated on a 75 ⁇ thick polyimide film (“Upilex” 75S produced by Ube Industries, Ltd.) used as an organic insulating film at 120° C. and 1 kg/cm 2 , to prepare an adhesive-backed tape for WB.
  • the properties are shown in Table 5.
  • FIG. 12 shows the measured results of the dependence of storage elastic modulus E′ upon temperature
  • FIG. 13 shows the measured results of the dependence of tan ⁇ upon temperature.
  • FIG. 5 a semiconductor connecting substrate (pattern tape) shown in FIG. 5 .
  • symbol 31 denotes an adhesive layer of a tape for WB; 32 , an organic insulating film; 33 , a sprocket hole; 34 , a conductor pattern; 35 , a conductor at a solder ball joint; and 36 , a conductor pad for WB.
  • FIG. 6 is a sectional view showing the obtained semiconductor device.
  • Chip Coat 1320-617 produced by Hokuriku Toryo K.K.
  • symbol 37 denotes an IC chip; 38 , an IC electrode; 39 , a gold wire; 40 , an organic insulating film: 41 , an adhesive layer of a tape for WB; 42 , a die bonded adhesive layer; 43 , a conductor at a solder ball joint; 44 , a solder ball; 45 , an adhesive layer of the semiconductor connecting substrate; 46 , a layer without any conductor pattern formed (reinforcing sheet); and 47 , a sealing resin.
  • the present invention industrially provides an adhesive sheet suitable for the adhesive layer of a semiconductor connecting substrate used to mount a semiconductor integrated circuit, an adhesive-backed tape used for tape automated bonding (TAB) (hereinafter called a tape for TAB), an adhesive-backed tape used for wire bonding (hereinafter called a tape for WB), and a semiconductor connecting substrate and a semiconductor device using the foregoing.
  • TAB tape automated bonding
  • WB wire bonding
  • the present invention can improve the reliability of a semiconductor device for high density packaging.

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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US08/945,221 1996-02-19 1997-02-19 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device Expired - Lifetime US6303219B1 (en)

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JP3050096 1996-02-19
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JP3178296 1996-02-20
JP8-31782 1996-02-20
PCT/JP1997/000453 WO1997030475A1 (fr) 1996-02-19 1997-02-19 Feuille adhesive pour substrat de connexions de semi-conducteurs, bande adhesive utilisee pour le soudage sur bande, bande adhesive pour microcablage, substrat de connexions de semi-conducteurs et dispositif semi-conducteur

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US09/940,513 Expired - Lifetime US6716529B2 (en) 1996-02-19 2001-08-29 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor device

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KR (1) KR100417776B1 (de)
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US20060194369A1 (en) * 1999-09-03 2006-08-31 Dickey Brenton L Carrier for substrate film
US6504240B2 (en) * 1999-12-20 2003-01-07 Nec Corporation Semiconductor device having reliable coupling between wiring substrate and semiconductor pellet
US6695200B2 (en) * 2000-01-13 2004-02-24 Hitachi, Ltd. Method of producing electronic part with bumps and method of producing electronic part
US20110187006A1 (en) * 2000-02-15 2011-08-04 Teiichi Inada Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
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US20070036971A1 (en) * 2000-02-15 2007-02-15 Teiichi Inada Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
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US6501264B2 (en) * 2000-03-13 2002-12-31 Mitutoyo Corporation Induction type transducer and electronic caliper
US20030031867A1 (en) * 2000-08-25 2003-02-13 Mikihiro Ogura Semiconductor joining substrate - use tape with adhesive and copper-clad laminate sheet using it
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US6531370B2 (en) * 2000-09-04 2003-03-11 Sanyo Electric Co., Ltd. Method for manufacturing circuit devices
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US6774496B2 (en) 2000-09-11 2004-08-10 Texas Instruments Incorporated Semiconductor package with a thermoset bond
US20030207574A1 (en) * 2000-12-12 2003-11-06 Fujitsu Limited Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
US6967399B2 (en) * 2000-12-12 2005-11-22 Fujitsu Limited Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
US7049687B2 (en) * 2001-05-16 2006-05-23 Oki Electric Industry Co., Ltd. Tape carrier package having stacked semiconductor elements, and short and long leads
US20040113271A1 (en) * 2001-05-16 2004-06-17 Yoshikazu Takahashi Tape carrier package having stacked semiconductor elements, and short and long leads
US20040232563A1 (en) * 2001-08-21 2004-11-25 Takaji Sumi Adhesive tape
US7135224B2 (en) 2001-08-21 2006-11-14 Lintec Corporation Adhesive tape
US20030190466A1 (en) * 2002-04-03 2003-10-09 Katsuji Nakaba Adhesive sheet for producing semiconductor devices
US6797376B2 (en) * 2002-05-09 2004-09-28 The Boeing Company Fiber-metal laminate adhesive coating
US20040178178A1 (en) * 2002-05-09 2004-09-16 Blohowiak Kay Y. Continuous surface preparation of metals
US20040024166A1 (en) * 2002-08-01 2004-02-05 Takayuki Hattori Conductive urethane composition, conductive roller composed of conductive urethane composition
US7145283B2 (en) * 2002-10-29 2006-12-05 Seiko Epson Corporation Piezoelectric device and method for manufacturing the same
US20040160145A1 (en) * 2002-10-29 2004-08-19 Manabu Takeuchi Piezoelectric device and method for manufacturing the same
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US7115989B2 (en) * 2003-08-26 2006-10-03 Nitto Denko Corporation Adhesive sheet for producing a semiconductor device
US20050046021A1 (en) * 2003-08-26 2005-03-03 Kazuhito Hosokawa Adhesive sheet for producing a semiconductor device
US20060251907A1 (en) * 2003-09-01 2006-11-09 Kiyoshi Shimizu Surface protection film and method for producing the same
US20050253234A1 (en) * 2004-05-12 2005-11-17 Dong-Han Kim Semiconductor package and method of fabricating the same
US9721865B2 (en) * 2004-09-28 2017-08-01 Rohm Co., Ltd. Semiconductor device with a semiconductor chip connected in a flip chip manner
US11842972B2 (en) 2004-09-28 2023-12-12 Rohm Co., Ltd. Semiconductor device with a semiconductor chip connected in a flip chip manner
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US10522494B2 (en) 2004-09-28 2019-12-31 Rohm Co., Ltd. Semiconductor device with a semiconductor chip connected in a flip chip manner
US9831204B2 (en) 2004-09-28 2017-11-28 Rohm Co., Ltd. Semiconductor device with a semiconductor chip connected in a flip chip manner
US20150348862A1 (en) * 2004-09-28 2015-12-03 Rohm Co., Ltd. Semiconductor device with a semiconductor chip connected in a flip chip manner
US8057894B2 (en) * 2004-10-22 2011-11-15 Toray Advanced Materials Korea, Inc. Adhesive tape for electronic components
US20060286375A1 (en) * 2004-10-22 2006-12-21 Toray Saehan Inc. Adhesive tape for electronic components
US20120189845A1 (en) * 2005-02-21 2012-07-26 Sadahito Misumi Semiconductor device manufacturing method
US8975759B2 (en) 2006-09-12 2015-03-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
US8217275B2 (en) 2006-12-04 2012-07-10 Panasonic Corporation Sealing material and mounting method using the sealing material
US20100084174A1 (en) * 2006-12-04 2010-04-08 Atsushi Yamaguchi Sealing material and mounting method using the sealing material
US20100096175A1 (en) * 2007-06-27 2010-04-22 Sony Chemical & Information Device Corporation Adhesive film, connecting method, and joined structure
US8796557B2 (en) * 2007-06-27 2014-08-05 Dexerials Corporation Adhesive film, connecting method, and joined structure
US20090170284A1 (en) * 2007-12-28 2009-07-02 Lintec Corporation Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
US8247503B2 (en) * 2007-12-28 2012-08-21 Lintec Corporation Adhesive composition and adhesive sheet
US20140097463A1 (en) * 2008-07-16 2014-04-10 Dexerials Corporation Anisotropic conductive adhesive
US9418958B2 (en) * 2008-07-16 2016-08-16 Dexerials Corporation Anisotropic conductive adhesive
TWI555814B (zh) * 2008-09-17 2016-11-01 Kimoto Kk Surface protection film and laminates
US20110318580A1 (en) * 2009-03-03 2011-12-29 Toray Advanced Materials Korea Inc. Adhesive Tape for Manufacturing Electronic Components
US9090800B2 (en) * 2009-03-03 2015-07-28 Toray Advanced Materials Korea, Inc. Adhesive tape for manufacturing electronic components
US20100330745A1 (en) * 2009-06-26 2010-12-30 Masami Oikawa Process for producing a semiconductor device
US8592260B2 (en) 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
US20110116242A1 (en) * 2009-11-18 2011-05-19 Seagate Technology Llc Tamper evident pcba film
US9911683B2 (en) * 2010-04-19 2018-03-06 Nitto Denko Corporation Film for back surface of flip-chip semiconductor
US8476111B2 (en) * 2011-06-16 2013-07-02 Stats Chippac Ltd. Integrated circuit packaging system with intra substrate die and method of manufacture thereof
US20120319263A1 (en) * 2011-06-16 2012-12-20 Cho Namju Integrated circuit packaging system with intra substrate die and method of manufacture thereof
US20210265193A1 (en) * 2018-06-26 2021-08-26 Lintec Corporation Semiconductor Processing Adhesive Tape and Method of Manufacturing Semiconductor Device
US11842916B2 (en) * 2018-06-26 2023-12-12 Lintec Corporation Semiconductor processing adhesive tape and method of manufacturing semiconductor device

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KR19990007859A (ko) 1999-01-25
WO1997030475A1 (fr) 1997-08-21
DE69732004D1 (de) 2005-01-27
EP0823729B1 (de) 2004-12-22
HK1064803A1 (en) 2005-02-04
EP1447843A2 (de) 2004-08-18
ATE432531T1 (de) 2009-06-15
EP1447843B1 (de) 2009-05-27
US6716529B2 (en) 2004-04-06
EP0823729A4 (de) 2000-05-03
EP1447843A3 (de) 2004-12-01
DE69732004T2 (de) 2006-01-19
US20020025431A1 (en) 2002-02-28
ATE285623T1 (de) 2005-01-15
KR100417776B1 (ko) 2004-03-19
EP0823729A1 (de) 1998-02-11
DE69739429D1 (de) 2009-07-09
TW340967B (en) 1998-09-21
HK1008913A1 (en) 1999-07-30

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