USD1119829S1 - Seal for chemical mechanical polishing device - Google Patents

Seal for chemical mechanical polishing device

Info

Publication number
USD1119829S1
USD1119829S1 US35/355,224 US35522479F USD1119829S US D1119829 S1 USD1119829 S1 US D1119829S1 US 35522479 F US35522479 F US 35522479F US D1119829 S USD1119829 S US D1119829S
Authority
US
United States
Prior art keywords
seal
mechanical polishing
chemical mechanical
polishing device
reproduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,224
Other versions
USD1090690S1 (en
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USD1098609S1 (en
Inventor
Kazuhiro Tajima
Makoto Kashiwagi
Manato Furusawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of USD1119829S1 publication Critical patent/USD1119829S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

1. Seal for chemical mechanical polishing device
1.1 : Perspective
1.2 : Front
1.3 : Back
1.4 : Top
1.5 : Bottom
1.6 : Right
1.7 : Left
1.8 : Cross sectional
1.9 : Enlarged
1.10 : Reference view
The article is a seal for a top ring of a chemical mechanical polishing device. The feature of the design resides in the shape and configuration of the article as shown in the reproductions. Reproduction 1.8 is an enlarged cross-sectional view taken along the line 1.8 - 1.8 in Reproduction 1.4 . Reproduction 1.9 is an enlarged view of a portion 1.9 of the article in Reproduction 1.8. The broken lines shown in Reproduction 1.10 illustrate environmental subject matter and form no part of the claimed design. Additionally, the dash-dot broken lines are for the purpose of illustrating the enlarged views and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a seal for chemical mechanical polishing device as shown and described.
US35/355,224 2023-03-30 2023-09-26 Seal for chemical mechanical polishing device Active USD1119829S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023-006489D 2023-03-30

Publications (1)

Publication Number Publication Date
USD1119829S1 true USD1119829S1 (en) 2026-03-24

Family

ID=

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD450729S1 (en) * 1996-11-08 2001-11-20 Black & Decker Inc. Tables for a planer
USD621427S1 (en) * 2009-12-18 2010-08-10 3M Innovative Properties Company Adapter for a sanding tool
USD638380S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD674364S1 (en) * 2011-07-08 2013-01-15 Nihon Dempa Kogyo Co., Ltd. Crystal unit
USD685335S1 (en) * 2008-11-18 2013-07-02 Applied Materials, Inc. Substrate support
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD723596S1 (en) * 2013-09-26 2015-03-03 Casio Keisanki Kabushiki Kaisha Sheet holder for stamp making machine
USD784276S1 (en) * 2013-08-06 2017-04-18 Applied Materials, Inc. Susceptor assembly
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD920399S1 (en) * 2020-02-24 2021-05-25 Hk Co., Ltd. Laser processing machine
USD1003328S1 (en) * 2021-11-26 2023-10-31 Shenzhen Atomstack Technologies Co., Ltd Laser engraving machine
USD1051186S1 (en) * 2023-09-11 2024-11-12 Sprintray, Inc. 3D printer screen module
US20240416480A1 (en) * 2021-10-08 2024-12-19 Ebara Corporation Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus
USD1060281S1 (en) * 2020-01-14 2025-02-04 1000332602 Ontario Inc. Square extension form

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD450729S1 (en) * 1996-11-08 2001-11-20 Black & Decker Inc. Tables for a planer
USD456824S1 (en) * 1996-11-08 2002-05-07 Black & Decker, Inc. Tables for a planer
USD685335S1 (en) * 2008-11-18 2013-07-02 Applied Materials, Inc. Substrate support
USD621427S1 (en) * 2009-12-18 2010-08-10 3M Innovative Properties Company Adapter for a sanding tool
USD638380S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD674364S1 (en) * 2011-07-08 2013-01-15 Nihon Dempa Kogyo Co., Ltd. Crystal unit
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD784276S1 (en) * 2013-08-06 2017-04-18 Applied Materials, Inc. Susceptor assembly
USD723596S1 (en) * 2013-09-26 2015-03-03 Casio Keisanki Kabushiki Kaisha Sheet holder for stamp making machine
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD998827S1 (en) * 2017-10-06 2023-09-12 Laird Technologies, Inc. Material having edge shape
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933032S1 (en) * 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD1060281S1 (en) * 2020-01-14 2025-02-04 1000332602 Ontario Inc. Square extension form
USD920399S1 (en) * 2020-02-24 2021-05-25 Hk Co., Ltd. Laser processing machine
US20240416480A1 (en) * 2021-10-08 2024-12-19 Ebara Corporation Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus
USD1003328S1 (en) * 2021-11-26 2023-10-31 Shenzhen Atomstack Technologies Co., Ltd Laser engraving machine
USD1051186S1 (en) * 2023-09-11 2024-11-12 Sprintray, Inc. 3D printer screen module

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