USD879046S1 - Material having edging - Google Patents

Material having edging Download PDF

Info

Publication number
USD879046S1
USD879046S1 US29/621,364 US201729621364F USD879046S US D879046 S1 USD879046 S1 US D879046S1 US 201729621364 F US201729621364 F US 201729621364F US D879046 S USD879046 S US D879046S
Authority
US
United States
Prior art keywords
edging
view
side plan
edging shown
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/621,364
Inventor
Michael S. WLADYKA
Keith David JOHNSON
Jason L. Strader
Mark D. Kittel
Jingting YANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Priority to US29/621,364 priority Critical patent/USD879046S1/en
Assigned to LAIRD TECHNOLOGIES, INC. reassignment LAIRD TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STRADER, JASON L., KITTEL, MARK D., YANG, JINGTING, JOHNSON, KEITH DAVID, WLADYKA, MICHAEL S.
Priority to US29/728,991 priority patent/USD999405S1/en
Application granted granted Critical
Publication of USD879046S1 publication Critical patent/USD879046S1/en
Priority to US29/901,768 priority patent/USD1101702S1/en
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT SECURITY INTEREST Assignors: QNITY ELECTRONICS, INC.
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST Assignors: QNITY ELECTRONICS, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of a first embodiment of a material having edging, showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having the edging, taken along lines 2-2 in FIG. 1;
FIG. 3 is a top plan view of the material having the edging shown in FIG. 1;
FIG. 4 is a front elevation view of the material having the edging shown in FIG. 1;
FIG. 5 is a back elevation view of the material having the edging shown in FIG. 1;
FIG. 6 is a right side plan view of the material having the edging shown in FIG. 1;
FIG. 7 is a left side plan view of the material having the edging shown in FIG. 1;
FIG. 8 is a perspective view of a second embodiment of the material having edging, showing our new design;
FIG. 9 is a cross-sectional perspective view of the material having the edging, taken along lines 9-9 in FIG. 8;
FIG. 10 is a top plan view of the material having the edging shown in FIG. 8;
FIG. 11 is a front elevation view of the material having the edging shown in FIG. 8;
FIG. 12 is a back elevation view of the material having the edging shown in FIG. 8;
FIG. 13 is a right side plan view of the material having the edging shown in FIG. 8; and,
FIG. 14 is a left side plan view of the material having the edging shown in FIG. 8.
The broken lines in FIGS. 1-14 illustrate portions of the material having edging that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a material having edging, as shown and described.
US29/621,364 2017-10-06 2017-10-06 Material having edging Active USD879046S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/621,364 USD879046S1 (en) 2017-10-06 2017-10-06 Material having edging
US29/728,991 USD999405S1 (en) 2017-10-06 2020-03-23 Material having edging
US29/901,768 USD1101702S1 (en) 2017-10-06 2023-09-05 Edging for materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/621,364 USD879046S1 (en) 2017-10-06 2017-10-06 Material having edging

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/728,991 Continuation-In-Part USD999405S1 (en) 2017-10-06 2020-03-23 Material having edging

Publications (1)

Publication Number Publication Date
USD879046S1 true USD879046S1 (en) 2020-03-24

Family

ID=69806999

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/621,364 Active USD879046S1 (en) 2017-10-06 2017-10-06 Material having edging

Country Status (1)

Country Link
US (1) USD879046S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11731224B2 (en) 2018-04-28 2023-08-22 Laird Technologies, Inc. Systems and methods of applying materials to components
USD998827S1 (en) * 2017-10-06 2023-09-12 Laird Technologies, Inc. Material having edge shape
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
US12040306B2 (en) 2016-07-11 2024-07-16 Laird Technologies, Inc. Systems of applying materials to components
USD1066445S1 (en) 2022-09-08 2025-03-11 DuraPlas, LP Equipment support pad
USD1102398S1 (en) * 2023-03-30 2025-11-18 Ebara Corporation Seal for chemical mechanical polishing device
USD1119829S1 (en) * 2023-03-30 2026-03-24 Ebara Corporation Seal for chemical mechanical polishing device

Citations (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058537A (en) 1976-01-05 1977-11-15 Ciba-Geigy Corporation Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols
US4199490A (en) 1974-05-07 1980-04-22 Asahi Kasei Kogyo Kabushiki Kaisha Block copolymer latex composition
US4678115A (en) 1985-04-15 1987-07-07 Ontario Technologies Corporation Method for making layered foil structure
US4863551A (en) 1987-08-10 1989-09-05 Yoshido Kogyo K.K. Marking apparatus
USD344489S (en) * 1991-11-04 1994-02-22 Texstar, Inc. Fairing seal for aircraft canopy
USD348387S (en) * 1990-09-21 1994-07-05 The Serco Corporation Loading dock seal
WO1997041599A1 (en) 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5700340A (en) 1993-10-22 1997-12-23 Ykk Corporation Method of manufacturing a tape having a succession of surface-type fastener pieces
US5943557A (en) 1996-09-25 1999-08-24 Micron Technology, Inc. Method and structure for attaching a semiconductor die to a lead frame
US6391686B1 (en) 1999-06-14 2002-05-21 Seiko Epson Corporation Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument
US20030037866A1 (en) 2001-08-22 2003-02-27 Shin-Etsu Chemical Co., Ltd. Method of bonding a heat radiating sheet
US20030234322A1 (en) * 2002-06-25 2003-12-25 Ralph Bladt Aircraft windows and associated methods for installation
US20040180474A1 (en) 2003-03-10 2004-09-16 Oman Todd P. Electronic assembly having electrically-isolated heat-conductive structure and method therefor
US20040188814A1 (en) 2003-03-31 2004-09-30 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US20040262372A1 (en) 2003-06-26 2004-12-30 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20040262743A1 (en) 2003-06-26 2004-12-30 Intel Corporation Thermal interface structure with integrated liquid cooling and methods
US20040261980A1 (en) 2003-06-30 2004-12-30 Dani Ashay A. Heat dissipating device with preselected designed interface for thermal interface materials
JP2005327923A (en) 2004-05-14 2005-11-24 Alps Electric Co Ltd Conductive bonding film sticking method and conductive bonding film sticking apparatus
US6987671B2 (en) 2003-06-26 2006-01-17 Intel Corporation Composite thermal interface devices and methods for integrated circuit heat transfer
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US20070193672A1 (en) 2006-02-22 2007-08-23 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
KR100827725B1 (en) 2007-05-02 2008-05-08 티티엠주식회사 Method of attaching phase change interface material and apparatus
US7906845B1 (en) 2008-04-23 2011-03-15 Amkor Technology, Inc. Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
USD644757S1 (en) * 2009-10-06 2011-09-06 Elematic Group Oy Chamfer strip
JP2012084688A (en) 2010-10-12 2012-04-26 Nitto Denko Corp Double-sided adhesive tape application method and double-sided adhesive tape application device
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
EP2814057A2 (en) 2013-06-14 2014-12-17 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
US8916419B2 (en) 2012-03-29 2014-12-23 Taiwan Semiconductor Manufacturing Company, Ltd. Lid attach process and apparatus for fabrication of semiconductor packages
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
US9016629B1 (en) * 2011-11-28 2015-04-28 The Boeing Company Combined pressure and thermal window system for space vehicles
USD731078S1 (en) * 2013-07-25 2015-06-02 Chad Marcus Frenette Transition strip
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
US9257364B2 (en) 2012-06-27 2016-02-09 Intel Corporation Integrated heat spreader that maximizes heat transfer from a multi-chip package
US9316447B2 (en) 2012-03-22 2016-04-19 Koninklijke Philips N.V. Thermal interface material
US9330998B2 (en) 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods
US20160160104A1 (en) 2010-02-23 2016-06-09 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US20160185074A1 (en) 2013-08-12 2016-06-30 Seiji Kagawa Heat-dissipating film, and its production method and apparatus
US9418912B2 (en) 2012-12-21 2016-08-16 Intel Corporation Methods of forming serpentine thermal interface material and structures formed thereby
US9472485B2 (en) 2012-08-29 2016-10-18 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US20160315030A1 (en) 2015-04-24 2016-10-27 Laird Technologies, Inc. Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
US20160326419A1 (en) 2013-12-31 2016-11-10 The Regents Of The University Of California Thermal interface materials with alligned fillers
WO2016182996A1 (en) 2015-05-11 2016-11-17 Laird Technologies, Inc. Board level shields with adjustable covers
US20160355249A1 (en) * 2015-06-05 2016-12-08 Airbus Helicopters Deutschland GmbH Jettisonable emergency exit for a vehicle
US20160362169A1 (en) * 2015-06-09 2016-12-15 Gentex Corporation Multi-piece bezel for electro-optic window assembly
USD807531S1 (en) * 2014-01-21 2018-01-09 Yuseal Limited Flexible seal
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus

Patent Citations (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199490A (en) 1974-05-07 1980-04-22 Asahi Kasei Kogyo Kabushiki Kaisha Block copolymer latex composition
US4058537A (en) 1976-01-05 1977-11-15 Ciba-Geigy Corporation Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols
US4678115A (en) 1985-04-15 1987-07-07 Ontario Technologies Corporation Method for making layered foil structure
US4863551A (en) 1987-08-10 1989-09-05 Yoshido Kogyo K.K. Marking apparatus
USD348387S (en) * 1990-09-21 1994-07-05 The Serco Corporation Loading dock seal
USD344489S (en) * 1991-11-04 1994-02-22 Texstar, Inc. Fairing seal for aircraft canopy
US5700340A (en) 1993-10-22 1997-12-23 Ykk Corporation Method of manufacturing a tape having a succession of surface-type fastener pieces
WO1997041599A1 (en) 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5943557A (en) 1996-09-25 1999-08-24 Micron Technology, Inc. Method and structure for attaching a semiconductor die to a lead frame
US6391686B1 (en) 1999-06-14 2002-05-21 Seiko Epson Corporation Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same
US20030037866A1 (en) 2001-08-22 2003-02-27 Shin-Etsu Chemical Co., Ltd. Method of bonding a heat radiating sheet
US20030234322A1 (en) * 2002-06-25 2003-12-25 Ralph Bladt Aircraft windows and associated methods for installation
US20040180474A1 (en) 2003-03-10 2004-09-16 Oman Todd P. Electronic assembly having electrically-isolated heat-conductive structure and method therefor
US20040188814A1 (en) 2003-03-31 2004-09-30 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7821126B2 (en) 2003-03-31 2010-10-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US20040262372A1 (en) 2003-06-26 2004-12-30 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20040262743A1 (en) 2003-06-26 2004-12-30 Intel Corporation Thermal interface structure with integrated liquid cooling and methods
US6987671B2 (en) 2003-06-26 2006-01-17 Intel Corporation Composite thermal interface devices and methods for integrated circuit heat transfer
US20040261980A1 (en) 2003-06-30 2004-12-30 Dani Ashay A. Heat dissipating device with preselected designed interface for thermal interface materials
JP2005327923A (en) 2004-05-14 2005-11-24 Alps Electric Co Ltd Conductive bonding film sticking method and conductive bonding film sticking apparatus
US20070193672A1 (en) 2006-02-22 2007-08-23 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
KR100827725B1 (en) 2007-05-02 2008-05-08 티티엠주식회사 Method of attaching phase change interface material and apparatus
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US7906845B1 (en) 2008-04-23 2011-03-15 Amkor Technology, Inc. Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
USD644757S1 (en) * 2009-10-06 2011-09-06 Elematic Group Oy Chamfer strip
US20160160104A1 (en) 2010-02-23 2016-06-09 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
JP2012084688A (en) 2010-10-12 2012-04-26 Nitto Denko Corp Double-sided adhesive tape application method and double-sided adhesive tape application device
US9016629B1 (en) * 2011-11-28 2015-04-28 The Boeing Company Combined pressure and thermal window system for space vehicles
US9316447B2 (en) 2012-03-22 2016-04-19 Koninklijke Philips N.V. Thermal interface material
US8916419B2 (en) 2012-03-29 2014-12-23 Taiwan Semiconductor Manufacturing Company, Ltd. Lid attach process and apparatus for fabrication of semiconductor packages
US9257364B2 (en) 2012-06-27 2016-02-09 Intel Corporation Integrated heat spreader that maximizes heat transfer from a multi-chip package
US9472485B2 (en) 2012-08-29 2016-10-18 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
US9418912B2 (en) 2012-12-21 2016-08-16 Intel Corporation Methods of forming serpentine thermal interface material and structures formed thereby
EP2814057A2 (en) 2013-06-14 2014-12-17 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
US20140367847A1 (en) 2013-06-14 2014-12-18 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD731078S1 (en) * 2013-07-25 2015-06-02 Chad Marcus Frenette Transition strip
US20160185074A1 (en) 2013-08-12 2016-06-30 Seiji Kagawa Heat-dissipating film, and its production method and apparatus
US20160326419A1 (en) 2013-12-31 2016-11-10 The Regents Of The University Of California Thermal interface materials with alligned fillers
USD807531S1 (en) * 2014-01-21 2018-01-09 Yuseal Limited Flexible seal
US9330998B2 (en) 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods
US20160315030A1 (en) 2015-04-24 2016-10-27 Laird Technologies, Inc. Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
WO2016182996A1 (en) 2015-05-11 2016-11-17 Laird Technologies, Inc. Board level shields with adjustable covers
US20160355249A1 (en) * 2015-06-05 2016-12-08 Airbus Helicopters Deutschland GmbH Jettisonable emergency exit for a vehicle
US20160362169A1 (en) * 2015-06-09 2016-12-15 Gentex Corporation Multi-piece bezel for electro-optic window assembly
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
Basics of Processing for Fabricated Films and Pads—Dow Corning; Thermal Interface—Wet Dispensed; http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutoria113.asp> accessed Jul. 11, 2016; 1 page.
European Search Report for EP17178138.8 filed Jun. 27, 2017 which names 2 of the same inventors but is not related through a priority claim, dated Dec. 13, 2017, 6 pages.
Final Office Action for U.S. Appl. No. 15/207,444, filed Jul. 11, 2016 which names two of the same inventors, and the same assignee, but is not related through a priority claim, dated Apr. 19, 2019, 13 pages.
Hirschi, David; Dow Corning Case Study; Understanding Differences Between Thermal Interface Materials: Improve your ability to specify the optimum TIM; Copyright 2008, 4 pages.
Korean Office Action dated Oct. 22, 2018 issued in Application No. 10-2017-0085269 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 15 pages. An English language translation of the Korean Office Action is not available at this time.
Non-Final Office Action dated Sep. 24, 2018 issued by the United States Patent and Trademark Office for U.S. Appl. No. 15/207,444 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 12 pages.
Packaging and Storage Considerations—Dow Corning; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial14.asp> accessed Jul. 11, 2016.
Types of Fabricated Films and Pad Thermal Interface Materials—Dow Corning; Thermal Interface—Wet Dispensed; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial5.asp>; accessed Jul. 11, 2016.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12040306B2 (en) 2016-07-11 2024-07-16 Laird Technologies, Inc. Systems of applying materials to components
USD998827S1 (en) * 2017-10-06 2023-09-12 Laird Technologies, Inc. Material having edge shape
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD1101702S1 (en) 2017-10-06 2025-11-11 Laird Technologies, Inc. Edging for materials
US11731224B2 (en) 2018-04-28 2023-08-22 Laird Technologies, Inc. Systems and methods of applying materials to components
USD1066445S1 (en) 2022-09-08 2025-03-11 DuraPlas, LP Equipment support pad
USD1102398S1 (en) * 2023-03-30 2025-11-18 Ebara Corporation Seal for chemical mechanical polishing device
USD1119829S1 (en) * 2023-03-30 2026-03-24 Ebara Corporation Seal for chemical mechanical polishing device

Similar Documents

Publication Publication Date Title
USD922569S1 (en) Absorbent article
USD873932S1 (en) Robot
USD881533S1 (en) Footwear
USD844242S1 (en) Razor
USD831732S1 (en) Eyewear
USD932047S1 (en) Coverslipper
USD827280S1 (en) Shoe
USD835178S1 (en) Eyewear
USD833322S1 (en) Pendant
USD906743S1 (en) Table
USD852573S1 (en) Induction warmer
USD854760S1 (en) Charm
USD879046S1 (en) Material having edging
USD881822S1 (en) Material having an edge shape
USD837967S1 (en) Tablet
USD853030S1 (en) Hand dryer
USD769622S1 (en) Bin
USD850151S1 (en) Bath mat
USD832035S1 (en) Cup bottom
USD810192S1 (en) Copier
USD958007S1 (en) Electromobile
USD881733S1 (en) Barrier
USD860584S1 (en) Pad for a girdle
USD810818S1 (en) Copier
USD862043S1 (en) Blouson

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY