WO1987006864A3 - Dispositif pour la connexion manuelle de conducteurs - Google Patents

Dispositif pour la connexion manuelle de conducteurs Download PDF

Info

Publication number
WO1987006864A3
WO1987006864A3 PCT/EP1987/000258 EP8700258W WO8706864A3 WO 1987006864 A3 WO1987006864 A3 WO 1987006864A3 EP 8700258 W EP8700258 W EP 8700258W WO 8706864 A3 WO8706864 A3 WO 8706864A3
Authority
WO
WIPO (PCT)
Prior art keywords
bonding head
contact surface
movement
drive
wedge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1987/000258
Other languages
German (de)
English (en)
Other versions
WO1987006864A2 (fr
Inventor
Farassat Farhad
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1019880700040A priority Critical patent/KR880701152A/ko
Application filed by Individual filed Critical Individual
Priority to DE8787903304T priority patent/DE3786880D1/de
Priority to AT87903304T priority patent/ATE92385T1/de
Publication of WO1987006864A2 publication Critical patent/WO1987006864A2/fr
Publication of WO1987006864A3 publication Critical patent/WO1987006864A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

Dispositif pour la connexion manuelle de conducteurs à l'aide d'un poinçon (11) du type à excitation ultrasonique et/ou à thermocompression permettant de presser le conducteur (34) contre une surface de contact, le poinçon (11) faisant partie d'une tête de connexion (10) qui peut être amenée sur la surface de contact et retirée de cette dernière et en particulier qui peut être élevée et abaissée. La surface de contact doit être disposée sur un support qui se déplace à peu près transversalement par rapport au sens de déplacement de la tête de connexion (10), la surface de contact étant positionnée par rapport au poinçon (11). En outre, un dispositif est prévu pour commander l'entraînement (20) de la tête de connexion. De préférence, ledit entraînement (20) est assuré par un servo-moteur c.c., chaque mouvement partiel et chaque pause de la tête de connexion (10) étant individuellement réglables du point de vue de la course et de la vitesse de déplacement ou du temps de pause, et étant vérifiables au niveau de l'exécution. A cet effet, l'entraînement (20) est pourvu d'une unité de commande (44-51) et d'une unité de signalisation (28) de la course et de la vitesse.
PCT/EP1987/000258 1986-05-16 1987-05-15 Dispositif pour la connexion manuelle de conducteurs Ceased WO1987006864A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019880700040A KR880701152A (ko) 1986-05-16 1986-05-15 수동와이어 본딩장치
DE8787903304T DE3786880D1 (de) 1986-05-16 1987-05-15 Vorrichtung zum manuellen drahtbonden.
AT87903304T ATE92385T1 (de) 1986-05-16 1987-05-15 Vorrichtung zum manuellen drahtbonden.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863616651 DE3616651A1 (de) 1986-05-16 1986-05-16 Vorrichtung zum manuellen drahtbonden
DEP3616651.0 1986-05-16

Publications (2)

Publication Number Publication Date
WO1987006864A2 WO1987006864A2 (fr) 1987-11-19
WO1987006864A3 true WO1987006864A3 (fr) 1988-02-25

Family

ID=6301040

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1987/000258 Ceased WO1987006864A2 (fr) 1986-05-16 1987-05-15 Dispositif pour la connexion manuelle de conducteurs

Country Status (7)

Country Link
US (1) US4878609A (fr)
EP (1) EP0267249B1 (fr)
JP (1) JPH01500549A (fr)
KR (1) KR880701152A (fr)
AT (1) ATE92385T1 (fr)
DE (2) DE3616651A1 (fr)
WO (1) WO1987006864A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4024687C2 (de) * 1990-08-03 2001-02-22 Daimlerchrysler Aerospace Ag Beam-Lead-Bondvorrichtung
DE4335468A1 (de) * 1993-10-18 1995-04-20 F&K Delvotec Bondtechnik Gmbh Vorrichtung und Verfahren zum Drahtbonden
US5813590A (en) 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
JPH11191568A (ja) * 1997-12-25 1999-07-13 Shinkawa Ltd ワイヤボンディング方法及び装置
DE50110953D1 (de) 2001-11-07 2006-10-19 F & K Delvotec Bondtech Gmbh Prüfverfahren für Bondverbindungen und Drahtbonder
EP1625911B1 (fr) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Appareil de microcablage avec une caméra, un dispositif de traitement d'images, des mémoires et des moyens de comparaison et méthode pour faire fonctionner un tel appareil
DE602006015192D1 (de) 2006-09-05 2010-08-12 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen
CN112828440B (zh) * 2021-03-29 2022-06-28 上海骄成超声波技术股份有限公司 一种超声波焊机的焊接方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2047596A (en) * 1979-04-23 1980-12-03 Hitachi Ltd Method of wire-bonding and wire-bonder
WO1983004201A1 (fr) * 1982-05-24 1983-12-08 The Micromanipulator Co., Inc. Appareil de liaison

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3776447A (en) * 1969-06-30 1973-12-04 Texas Instruments Inc Automatic semiconductor bonding machine
US3596050A (en) * 1970-05-05 1971-07-27 Union Carbide Corp Automatic torch height control
US3727822A (en) * 1970-10-05 1973-04-17 Gen Electric Electromagnetic force system for integrated circuit fabrication
US4073424A (en) * 1976-08-17 1978-02-14 Kulicke And Soffa Industries Inc. Second bond positioning wire bonder
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
JPS5698900A (en) * 1980-01-07 1981-08-08 Hitachi Ltd Device for automatically wiring printed circuit board
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
US4555052A (en) * 1983-02-28 1985-11-26 Fairchild Camera & Instrument Corporation Lead wire bond attempt detection
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
DE3417649A1 (de) * 1984-05-12 1985-11-14 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von kristallinen natriumsilikaten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2047596A (en) * 1979-04-23 1980-12-03 Hitachi Ltd Method of wire-bonding and wire-bonder
WO1983004201A1 (fr) * 1982-05-24 1983-12-08 The Micromanipulator Co., Inc. Appareil de liaison

Also Published As

Publication number Publication date
US4878609A (en) 1989-11-07
DE3616651C2 (fr) 1988-06-01
KR880701152A (ko) 1988-07-25
ATE92385T1 (de) 1993-08-15
EP0267249A1 (fr) 1988-05-18
JPH01500549A (ja) 1989-02-23
DE3786880D1 (de) 1993-09-09
WO1987006864A2 (fr) 1987-11-19
DE3616651A1 (de) 1987-11-19
EP0267249B1 (fr) 1993-08-04

Similar Documents

Publication Publication Date Title
ATE147672T1 (de) Steuerungssystem
AU3055489A (en) Head loading velocity control
IT9048334A0 (it) Dispositivo di azionamento per il comando di un servomotore per la regolazione del sedile di un autoveicolo.
EP0421353A3 (en) Drive control device for thermal printers
IT8948129A0 (it) Dispositivo di regolazione per un elemento di comando, in particolare per la valvola a farfalla di un autoveicolo
DE68916862D1 (de) Regler eines Abtastmotors zum Regeln der Drehgeschwindigkeit eines Abtastmotors.
EP0187247A3 (en) Method and device for controlling the braking of a drive motor in a printing press
EP0318207A3 (fr) Support de couteau pour un dispositif de coupe de passe-partout
WO1987006864A3 (fr) Dispositif pour la connexion manuelle de conducteurs
IT8803481A0 (it) Metodo e dispositivo per l'avanzamento, in successione, di prodotti appiattiti
FR2568805B1 (fr) Procede et dispositif de commande de l'electrode dans une machine-outil a electro-erosion
EP0516854A4 (en) Device for controlling positioning of head of disc drive and method of controlling the same
FI863606A7 (fi) Menetelmä ja laite hitsaustapahtuman säätämiseksi vastushitsauskoneessa.
IT8448253A0 (it) Dispositivo di accoppiamento per azionamento meccanico, in particolare a velocita' costante
FI895169A0 (fi) Pappersbestrykning.
AU579356B2 (en) Signal transducing head moving apparatus
EP0370258A3 (en) Device for oscillatingly driving at least one shaft, and device for intermittently advancing a work piece with the device
GB8812931D0 (en) Biasing force adjusting apparatus for electromagnetically driven reciprocating pump
EP0223101A3 (en) Control device for a separately excited d.c. drive motor and method for controlling a d.c. drive motor of a printing machine or the like
DE3468949D1 (en) Device for controlling the drive of the movement of tools, especially of the mould parts of an injection moulding machine
DE3677378D1 (de) Spritzgiessvorrichtung und verfahren zum steuern des gegendrucks davon.
SG86791G (en) Drive for a waxing device and method for driving such a device
JPS57159034A (en) Wire clamping device
JPS6464770A (en) Device for finishing edge part of electroplated strip
IT1182068B (it) Unita' motrice e dispositivo di comando per essa

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE FR GB IT LU NL SE

WWE Wipo information: entry into national phase

Ref document number: 1987903304

Country of ref document: EP

AK Designated states

Kind code of ref document: A3

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE FR GB IT LU NL SE

WWP Wipo information: published in national office

Ref document number: 1987903304

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 1987903304

Country of ref document: EP