WO1994016460A1 - Microcircuit integre - Google Patents

Microcircuit integre Download PDF

Info

Publication number
WO1994016460A1
WO1994016460A1 PCT/RU1993/000007 RU9300007W WO9416460A1 WO 1994016460 A1 WO1994016460 A1 WO 1994016460A1 RU 9300007 W RU9300007 W RU 9300007W WO 9416460 A1 WO9416460 A1 WO 9416460A1
Authority
WO
WIPO (PCT)
Prior art keywords
πlοschadκi
meρe
κοnτaκτnοy
ποveρχnοsτi
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/RU1993/000007
Other languages
English (en)
Russian (ru)
Inventor
Vilyam Lazarevich Sanderov
Viktor Nikolaevich Tsarev
Jury Nikolaevich Dyakov
Alexandr Anatolievich Popov
Mikhail Petrovich Eremeev
Vyacheslav Viktorovich Morozov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/RU1993/000007 priority Critical patent/WO1994016460A1/fr
Publication of WO1994016460A1 publication Critical patent/WO1994016460A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/271—Configurations of stacked chips the chips having passive surfaces facing each other, i.e. in a back-to-back arrangement

Definitions

  • the invention has posed the task of creating an ideal world, which would have a high reliability due to the exclusion of costs due to the exclusion of
  • FIG. ⁇ illustrates an integral world according to the invention in a cut; - 3 - Fig. 2 - at the same time, according to the invention, immediately after the line ⁇ - ⁇ on Fig. ⁇ ; Fig. 3 - an integral world according to the invention, with two semi-integrated crystals; 5, FIG. 4 - another variant of the system, as agreed on with the invention, with two integrated crystals of FIG. 5 - an integral, according to the invention; Fig. b - another version of the performance of the integrated world - 10 systems with a consumable element, as agreed on by the invention.
  • the frame 5 is also accelerated with metallic outputs 6, one end 7 (Fig.), Each of the consumables is connected to the unit 2 in the vicinity of the unit
  • the housing on Part 3 is equipped with a separate operating element 15 (Fig. 5), which is directly connected to the receiver in a direct disengaged mode.
  • One element 15 may also have a good contact with Crystal 3 (fig. B).
  • Elemen ⁇ vy ⁇ lnyayu ⁇ 15 in the form of ⁇ las ⁇ iny me ⁇ alla 15 na ⁇ ime ⁇ from an ⁇ di ⁇ vann ⁇ y copper or aluminum an ⁇ di ⁇ vann ⁇ g ⁇ Nia and ⁇ e ⁇ l ⁇ v ⁇ y ⁇ n ⁇ a ⁇ with ⁇ v ⁇ dni ⁇ ami 10 and ⁇ is ⁇ al- l ⁇ m 3 ⁇ bes ⁇ echivae ⁇ sya on account ⁇ n ⁇ g ⁇ sl ⁇ ya 17 s ⁇ etsialn ⁇ y ⁇ e ⁇ l ⁇ v ⁇ dyaschey ⁇ as ⁇ y, ⁇ aya nan ⁇ si ⁇ sya on ⁇ is ⁇ all 3 and za ⁇ lnyae ⁇ gap 16. 20 Integrated by the manufacturing process by the next.
  • the 3-part is removed in part 2 of the housing, then a film of 10 is deposited by the method of vacuuming, and then the room is turned on (25).

Landscapes

  • Junction Field-Effect Transistors (AREA)

Abstract

L'invention concerne un microcircuit intégré comprenant un boîtier composite en deux parties (1, 2), ainsi qu'un cristal semiconducteur (3) monté dans une partie (2) du boîtier et présentant des surfaces de contact (4) reliées chacune à une borne (6) de sortie en métal correspondante par un conducteur pelliculaire. La partie (2) du boîtier présente un surplomb (9) s'étendant autour du cristal (3), le long de la périphérie de la surface sur laquelle les surfaces de contact (4) sont réparties; le conducteur pelliculaire (10) est agencé de manière à être en contact au moins avec une partie de la borne de sortie (6), et au moins avec une partie de la surface de contact (4), et il recouvre la surface correspondante du surplomb (9).
PCT/RU1993/000007 1993-01-15 1993-01-15 Microcircuit integre Ceased WO1994016460A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/RU1993/000007 WO1994016460A1 (fr) 1993-01-15 1993-01-15 Microcircuit integre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1993/000007 WO1994016460A1 (fr) 1993-01-15 1993-01-15 Microcircuit integre

Publications (1)

Publication Number Publication Date
WO1994016460A1 true WO1994016460A1 (fr) 1994-07-21

Family

ID=20129750

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU1993/000007 Ceased WO1994016460A1 (fr) 1993-01-15 1993-01-15 Microcircuit integre

Country Status (1)

Country Link
WO (1) WO1994016460A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179845A3 (fr) * 2000-08-10 2004-11-03 NEC Compound Semiconductor Devices, Ltd. Dispositif semiconducteur et procédé de fabrication

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0036671A1 (fr) * 1980-03-26 1981-09-30 Siemens Aktiengesellschaft Boîtier pour composants électriques, groupe de composants ou circuits intégrés
DE3805130A1 (de) * 1987-02-20 1988-09-01 Mitsubishi Electric Corp Gehaeuse fuer eine halbleiteranordnung
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device
US5072284A (en) * 1988-11-25 1991-12-10 Fuji Photo Film Co., Ltd. Solid state image pickup device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0036671A1 (fr) * 1980-03-26 1981-09-30 Siemens Aktiengesellschaft Boîtier pour composants électriques, groupe de composants ou circuits intégrés
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device
DE3805130A1 (de) * 1987-02-20 1988-09-01 Mitsubishi Electric Corp Gehaeuse fuer eine halbleiteranordnung
US5072284A (en) * 1988-11-25 1991-12-10 Fuji Photo Film Co., Ltd. Solid state image pickup device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179845A3 (fr) * 2000-08-10 2004-11-03 NEC Compound Semiconductor Devices, Ltd. Dispositif semiconducteur et procédé de fabrication

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