WO1997047170A1 - Facility operating method - Google Patents
Facility operating method Download PDFInfo
- Publication number
- WO1997047170A1 WO1997047170A1 PCT/JP1997/001970 JP9701970W WO9747170A1 WO 1997047170 A1 WO1997047170 A1 WO 1997047170A1 JP 9701970 W JP9701970 W JP 9701970W WO 9747170 A1 WO9747170 A1 WO 9747170A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- equipment
- line
- mounting
- tact
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Definitions
- the present invention relates to a method of operating a facility for obtaining a line configuration that is equal to or less than an initially set line takt for manufacturing a specific printed circuit board from a plurality of mounting equipment assemblies capable of mounting electronic components on the printed circuit board. Things.
- printed circuit board mounting has been realized using a line configuration that takes advantage of the features of each mounting facility.
- components are mounted with surface mounting type high-speed equipment, and if the pitch between leads is narrow and mounting accuracy is required, such as QFP, robot type after the high speed mounting process
- the company operates components such as mounting components in high-precision equipment to improve the quality and availability of the entire line. It is also well-known to operate multiple units of the same type on the same line in order to increase the line length.
- equipment managers have required the following manual operations. First, from the list of components required for mounting a specific printed circuit board, information such as the number of components, the equipment that can be mounted on the components, the mounting cycle for each component device, and the maximum number of components that can be mounted on the equipment is obtained.
- line smoothing of the allocated equipment is performed. This is to re-allocate parts in the line so that the mounting tact of specific equipment does not become large, and various optimization simulation methods using computers have been known in the past. . After smoothing, if the line contact satisfies the desired result, the line consisting of this equipment will be the final mounting line. If the line takt is not satisfied, add the next line of equipment to the previous line so that the result of the optimization simulation is less than the desired line takt.
- ⁇ and procedures can only be performed by a specific person who is familiar with the equipment mounting conditions, such as the tact time for each part of all equipment.
- the present invention selects a plurality of equipment aggregates that can be used for processing a part, and selects equipment that is suitable for processing a specific product from the aggregate.
- This is a facility operation method in which equipment lines are arranged so that they are less than the initial line tact.
- the first process of managing the information on the tact of the parts that can be mounted on the equipment rows and the equipment specific to the equipment, and the information on the tact unique to the equipment using external storage means After adding the equipment selected from the equipment assembly according to the line configuration to the line configuration until it is completed, the second step of calculating the line tact based on the mismanagement dragon, Until the line tact of ⁇ or less, the line configuration of the second step It consists of a third step of calculating the line tact of the line configuration.
- FIG. 1 is a configuration diagram of hardware used for the facility operation method of the present invention.
- FIG. 2 is an explanatory diagram showing a management dragon construction method according to the embodiment of the present invention.
- FIG. 3 is a data configuration diagram of management 1 according to the embodiment of the present invention.
- FIG. 4 is a flowchart of a process for determining a line configuration according to the embodiment of the present invention.
- FIG. 5 is a flowchart of a process for determining a line configuration according to the embodiment of the present invention.
- FIG. 6 is a flowchart of a process for determining a line configuration according to the embodiment of the present invention.
- FIG. 7 is a flowchart of a process for determining a line configuration according to the embodiment of the present invention.
- equipment that is suitable for processing a specific product is selected from the aggregate, and an initial line is selected.
- This is an equipment operation method that operates equipment lines so that it is less than tact, and ⁇ JW of equipment to which each part is allocated is grouped into multiple groups from the self-assembly according to the characteristics of the equipment, and the priority among equipment within the group And priority between groups
- the second step of calculating the line tact based on liiia management, and the line configuration of the second step until the ia is less than the initial I ⁇ line, from the Tsurumi equipment assembly to Therefore it is the third process to add the selected equipment and calculate the line tact of the line configuration.
- This is a facility operation method in which the number of facilities is 2
- the invention described in claim 2 relates to an assembly of a plurality of mounting facilities capable of mounting electronic components on a printed circuit board, and a mounting facility for mounting components from the assembly to a specific printed circuit board.
- this is a facility operation method that operates the equipment line so that the line tact is less than the initial 13 ⁇ line tact, and ⁇ of the mounting equipment to which each electronic component is assigned is grouped into multiple groups from male and female mounting equipment aggregates by
- the first process in which external storage means manages the ⁇ JW between equipment within the group and between genorape, the mounting tact of electronic components that can be mounted on the mounting equipment, and the tact unique to the mounting equipment, and After adding the mounting equipment selected according to eran ⁇ from the ⁇ m self-mounting equipment assembly to the line configuration until all the electronic components are mounted, the second step of calculating the line tact based on the above, Until the line tact of ⁇ is reached, the equipment consisting of the third step is added to the line configuration of the second step from the self
- FIG. 1 is a configuration diagram of hardware used in the facility operation method of the present invention.
- the arithmetic processing unit 3 performs input / output and executes processing for management 1fffg2 managed by the external storage means 1 for managing 1TT.
- the external storage means 1 may be a known relational database system or a file format.
- the facility operation method of the present invention includes a first step, a second step, and a third step described below.
- Printed circuit board 5 Are mounted by electronic components 4 mounting equipment 8.
- Sequence table 6 is a part of the printed circuit board 1
- part B ⁇ iJ table 7 is a subset of sequence table 6. The procedure to determine the line configuration by grouping the assigned OTlls by the type of equipment is performed in the second step.
- the mounting equipment aggregate 9 is divided into an equipment group 10, an equipment type 11 included in each equipment group, and a mounting equipment 8 included in each equipment type.
- the equipment group is used to configure lines for each equipment group when the mounting process is different, and is classified into a surface mounting group, an insertion equipment group, a ⁇ mounting group, and so on. Allocate parts between groups ⁇ 1
- the equipment types are classified according to the characteristics of each equipment in the same equipment group, and are classified according to the characteristics of the equipment, such as high-speed crane and multi-function equipment. Assign ⁇ ⁇ ⁇ 3 ⁇ 4? To assign parts between groups.
- the configuration of the management dragon 2 including the grouping of will be described in detail.
- the management old 2 will be referred to the related IJ and managed for each table.
- the structure between the tables is such that the related items can be referenced as keys.
- Each table is composed of Table 21, 'Part Attributes 22, Equipment Master 23, Equipment Operation 24, User Equipment 25, Equipment Type 26, Equipment Group 27, Line Configuration 28.
- the table number is a number that identifies a subset of the table numbers
- the part number is a management number that uniquely identifies the electronic component
- the number is the number of parts mounted on the printed circuit board.
- the number is a number that specifies the equipment to which the component is assigned
- the component mounting tact is the mounting tact of the component in the iia equipment.
- the equipment number and component mounting tact are processed as a result of the arithmetic processing unit. However, if it is specified in advance that a specific electronic section is to be mounted on a specific facility, the facility number is calculated. Can be set before.
- the component attribute 22 is linked by using the component number as a key, and is the attribute of the electronic component.
- a component shape number that uniquely specifies the shape of the component is set, but it is also possible to use a component such as QFP or SOP as data.
- the component mounting tact time when the component corresponding to the component shape number is mounted on the equipment specified by the @ ⁇ number is mounted on the equipment specified by the @ ⁇ number.
- the equipment master 23 is an introduction to equipment.
- the translation number is a number that uniquely identifies the type of equipment, the type number is a number that groups the equipment, and the component board is the largest component board that can be mounted on the equipment. Is the time to transport the printed circuit board of the equipment.
- the tool switching tact is a general-purpose equipment such as a robot type, and when a component is mounted, a switching time is required when a chuck or a nozzle for transporting the component is used.
- the user equipment 25 manages equipment owned by a user at a factory or the like.
- the equipment number uniquely identifies the equipment, and the type number is linked to the equipment type managed by the equipment master.
- Assignment ⁇ ! ⁇ Is for assigning the same type of equipment to the line.
- ⁇ SS of the type number of the equipment master is ⁇ SS.
- the type number is combined with the equipment master type number.
- Assignment ⁇ ) W is the assignment type of the equipment type ⁇ ).
- the equipment group number is used when different lines are composed of one printed circuit board.
- Equipment group 27 manages equipment groups of equipment type.
- the equipment group number is combined with the equipment group number of the equipment type, and the allocation priority is the five-level allocation priority of the equipment group.
- the operation result is written in the line configuration 28.
- the line number is a number for specifying the calculation result, and the setting number is the equipment number of the line, and is combined with the equipment number of the user equipment 25.
- the equipment tact is the tact for each equipment of this line, in the order of configuration.
- the introduction is JlH ⁇ of the equipment that composes this line.
- FIGS. 4 to 7 are flowcharts of the processing.
- the second step is processed in S1 to S5
- the third step is processed in S6.
- Sequence table An arbitrary electronic component: p is fetched from the AR (S31), and the components are sequentially allocated from the equipment group with the highest power. Also, let the value of the equipment group with small n be large. If there is equipment that can be mounted (S32) belonging to this equipment group for this part, the electronic parts are assigned to the partial array table AR (n) corresponding to the equipment group. (S33)
- partial sequence table extract parts from AR (n) and apply to corresponding equipment group G (n
- Subsequence list An arbitrary electronic component is extracted from AR (n) (S51), and it is determined whether or not it can be mounted on equipment of equipment type: T (m) belonging to the corresponding component power equipment group: G (n) .
- S52 The equipment that satisfies the conditions of approval is an existing partial line: Equipment in L (m): M (S53).
- NUM (M ) the current number of mountable parts of the equipment: NUM (M ) If> 0 (S54), the part is assigned to the corresponding item.
- each equipment time is the total value of the loading tact of the equipment master 23 of management II S, the tool change tact, and the component mounting tact X number of equipment operation 24.
- the line tact is the maximum value of the equipment tact of each facility.
- a line configuration that is equal to or less than the initially set line tact for ⁇ it of a specific printed circuit board can be automatically determined from a plurality of mounting facility aggregates.
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Factory Administration (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Multi-Process Working Machines And Systems (AREA)
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP97924361A EP0843513B1 (en) | 1996-06-06 | 1997-06-06 | Facility operating method |
| DE69729051T DE69729051T2 (de) | 1996-06-06 | 1997-06-06 | Bearbeitungsbetriebsmethode |
| US09/000,234 US5980086A (en) | 1996-06-06 | 1997-06-06 | Facility operating method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8/143901 | 1996-06-06 | ||
| JP14390196A JP3537267B2 (ja) | 1996-06-06 | 1996-06-06 | 設備運用方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1997047170A1 true WO1997047170A1 (en) | 1997-12-11 |
Family
ID=15349708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1997/001970 Ceased WO1997047170A1 (en) | 1996-06-06 | 1997-06-06 | Facility operating method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5980086A (ja) |
| EP (1) | EP0843513B1 (ja) |
| JP (1) | JP3537267B2 (ja) |
| DE (1) | DE69729051T2 (ja) |
| WO (1) | WO1997047170A1 (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6027019A (en) * | 1997-09-10 | 2000-02-22 | Kou; Yuen-Foo Michael | Component feeder configuration monitoring |
| JP3548000B2 (ja) * | 1998-05-29 | 2004-07-28 | 矢崎総業株式会社 | ワイヤーハーネス製造装置及び該装置のタクトタイム制御方法 |
| US6198980B1 (en) * | 1998-11-06 | 2001-03-06 | John Costanza Institute Of Technology | System and method for designing a mixed-model manufacturing process |
| JP2001257141A (ja) * | 2000-03-10 | 2001-09-21 | Mitsubishi Electric Corp | プロセス制御装置およびプロセス制御方法 |
| CA2423806C (en) * | 2000-09-29 | 2009-12-22 | Molecular Probes, Inc. | Modified carbocyanine dyes and their conjugates |
| EP1357781A4 (en) * | 2001-01-10 | 2008-02-13 | Matsushita Electric Industrial Co Ltd | COMPONENT MOUNTING DEVICE, SERVICE PROVIDER, AND SERVICE DELIVERY METHOD |
| EP1849342B1 (en) * | 2005-02-17 | 2009-08-19 | Panasonic Corporation | Mounting condition determining method, mounting condition determining device, and mounting apparatus |
| JP4897392B2 (ja) * | 2006-08-21 | 2012-03-14 | パナソニック株式会社 | ライン選定方法、部品実装基板生産方法及びライン選定プログラム |
| US7617015B2 (en) * | 2006-12-21 | 2009-11-10 | Sap Ag | Generating planning-level time and capacity requirement formulas for manufacturing processes |
| JP5290818B2 (ja) * | 2009-03-17 | 2013-09-18 | 株式会社ブリヂストン | タイヤ成型命令割付方法 |
| US10489732B2 (en) | 2012-09-03 | 2019-11-26 | Fuji Corporation | Production line management method and production line management system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04257968A (ja) * | 1990-09-28 | 1992-09-14 | Hewlett Packard Co <Hp> | プリント回路基板製造における最適な作業割り当て方法 |
| JPH05138467A (ja) * | 1991-11-22 | 1993-06-01 | Toshiba Corp | 基板実装管理装置 |
| JPH06196899A (ja) * | 1992-12-25 | 1994-07-15 | Fujitsu Ltd | プリント基板の部品搭載システムにおけるncデータ生成装置 |
| JPH0818299A (ja) * | 1994-06-27 | 1996-01-19 | Matsushita Electric Ind Co Ltd | 実装工程最適化方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5189707A (en) * | 1985-10-11 | 1993-02-23 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
| JPS62114289A (ja) * | 1985-11-14 | 1987-05-26 | 松下電器産業株式会社 | 電子部品の装着方法および装置 |
| JPH02303100A (ja) * | 1989-05-17 | 1990-12-17 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
| JPH0795639B2 (ja) * | 1990-11-30 | 1995-10-11 | 松下電器産業株式会社 | 生産ラインにおける位置ずれ自動補正方法 |
| JPH056212A (ja) * | 1991-06-27 | 1993-01-14 | Mitsubishi Electric Corp | 部品搭載機用データ作成方法 |
| JPH05304396A (ja) * | 1991-07-12 | 1993-11-16 | Canon Inc | 部品の実装順序の決定方法及びその装置 |
| JP3196626B2 (ja) * | 1995-12-26 | 2001-08-06 | ソニー株式会社 | 部品実装方法 |
| JP3149782B2 (ja) * | 1996-05-07 | 2001-03-26 | 松下電器産業株式会社 | ダイボンディング装置およびダイボンディング方法 |
-
1996
- 1996-06-06 JP JP14390196A patent/JP3537267B2/ja not_active Expired - Fee Related
-
1997
- 1997-06-06 WO PCT/JP1997/001970 patent/WO1997047170A1/ja not_active Ceased
- 1997-06-06 EP EP97924361A patent/EP0843513B1/en not_active Expired - Lifetime
- 1997-06-06 DE DE69729051T patent/DE69729051T2/de not_active Expired - Fee Related
- 1997-06-06 US US09/000,234 patent/US5980086A/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04257968A (ja) * | 1990-09-28 | 1992-09-14 | Hewlett Packard Co <Hp> | プリント回路基板製造における最適な作業割り当て方法 |
| JPH05138467A (ja) * | 1991-11-22 | 1993-06-01 | Toshiba Corp | 基板実装管理装置 |
| JPH06196899A (ja) * | 1992-12-25 | 1994-07-15 | Fujitsu Ltd | プリント基板の部品搭載システムにおけるncデータ生成装置 |
| JPH0818299A (ja) * | 1994-06-27 | 1996-01-19 | Matsushita Electric Ind Co Ltd | 実装工程最適化方法 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP0843513A4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69729051D1 (de) | 2004-06-17 |
| JP3537267B2 (ja) | 2004-06-14 |
| US5980086A (en) | 1999-11-09 |
| EP0843513A1 (en) | 1998-05-20 |
| JPH09326589A (ja) | 1997-12-16 |
| DE69729051T2 (de) | 2004-09-09 |
| EP0843513B1 (en) | 2004-05-12 |
| EP0843513A4 (en) | 2000-12-06 |
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