WO1998057111A1 - Dispositif de regulation de temperature comprenant un caloduc - Google Patents

Dispositif de regulation de temperature comprenant un caloduc Download PDF

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Publication number
WO1998057111A1
WO1998057111A1 PCT/JP1998/002423 JP9802423W WO9857111A1 WO 1998057111 A1 WO1998057111 A1 WO 1998057111A1 JP 9802423 W JP9802423 W JP 9802423W WO 9857111 A1 WO9857111 A1 WO 9857111A1
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WO
WIPO (PCT)
Prior art keywords
plate
heat pipe
fluid
temperature control
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1998/002423
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English (en)
Japanese (ja)
Inventor
Kanichi Kadotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9152705A external-priority patent/JPH10339591A/ja
Priority claimed from JP35225197A external-priority patent/JPH11173774A/ja
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Publication of WO1998057111A1 publication Critical patent/WO1998057111A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates to a ⁇ l willow device for harboring a flat book such as a semiconductor wafer or a flat surface such as a wall using a heat pipe.
  • the apparatus includes a substrate mounting plate on which a processing substrate is mounted, and a bent cooling pipe arranged in contact with a lower surface of the substrate mounting plate.
  • a number of independent heat pipes penetrating the plate up and down are laid all over the plate.
  • both heating and cooling of the substrate can be performed efficiently and at high speed.
  • the above prior art is aimed at cooling, and it is difficult to perform both heating and cooling efficiently.
  • an object of the present invention is to provide a temperature control device using a heat pipe that can achieve high heat uniformity.
  • Another object of the present invention is to provide a temperature control device using a heat pipe capable of performing heating and cooling at high speed. Disclosure of the invention
  • a temperature control device includes a plate-shaped heat pipe having a front surface and a back surface, and a heat control device that is disposed away from the back surface of the heat pipe and injects a heat medium to the back surface of the heat pipe. And at least one type of non-contact type heat source device.
  • the non-contact type heat source device includes, for example, a fluid ejection mechanism for ejecting a cooling or heating fluid (for example, a liquid, a gas, or a mixture of a liquid and a gas) to the back of a heat pipe, and a heating electromagnetic wave.
  • a cooling or heating fluid for example, a liquid, a gas, or a mixture of a liquid and a gas
  • a lamp that irradiates for example, infrared light
  • the plate-type heat pipe has higher uniformity.
  • the non-contact type heat source device can uniformly heat or cool the back surface of the heat pipe, so that both advantages are exhibited and an excellent soaking effect can be exhibited.
  • one of the cooling and the heating may be a non-contact type heat source device and the other may be a contact type heat source device (for example, a heating wire or a cooling pipe joined to the back of a heat pipe), Both cooling and heating can be a non-contact heat source device.
  • the heat source for cooling and the heat source for heating both of which are non-contact types, can be provided without interfering with each other, which is coupled with the high heat transfer speed of the plate-type heat pipe. Thus, both cooling and heating can be performed at high speed.
  • the plate-type heat pipe has a large number of pipes filled with a working fluid, and the large number of pipes communicate with each other to form a pipe network. It is desirable that they are arranged at a substantially uniform density over almost the entire surface of the substrate. In that case, it is also preferable that each of the multiple pipes is a regular polygon or a circle. It is also preferred that the mesh of the pipe network is arranged at a substantially uniform density over substantially the entire area of the pipe network.
  • the back surface of the plate-type heat pipe has moderate irregularities.
  • the front surface of the plate heat pipe on which the object is placed is flat.
  • a temperature control device in which a turbulent flow of a thermal fluid is applied to a back surface or a side surface of a plate-shaped heat pipe. Due to the turbulence effect, heat exchange between the heat fluid and the plate-type heat pipe is efficiently performed, and high-speed heating or cooling can be performed. In addition, compared with the case of using a laminar flow, the use of turbulent flow reduces the temperature unevenness and achieves higher uniformity. From the viewpoint of heat uniformity, it is desirable to apply the turbulent flow of the thermal fluid over almost the entire back or side surface of the plate-type heat pipe.
  • One method for directing the turbulent flow of a thermal fluid onto a plate-type heat pipe is to inject a thermal fluid (or a mixture of thermal fluid and gas) from a fluid ejection mechanism such as a nozzle into the plate-type heat pipe. It is.
  • Another method is to form a flow path for flowing the thermal fluid on the back or side of the plate-type heat pipe, and to make the thermal fluid flow as a turbulent flow in this flow path.
  • a method of forming a turbulent flow in a flow path there is a method of bending the flow path in a meandering or spiral shape, but another effective method is to use a large number of heat exchange fins (for example, pins) in the flow path.
  • heat exchange fins for example, pins
  • Type or needle type Many fins disturb the flow of the fluid to form turbulence and efficiently exchange heat with the fluid.
  • the flow path has a circular shape that spreads so as to cover almost the entire back surface of the plate-shaped heat pipe, and a thermal fluid inlet is provided at a peripheral portion of the circular flow path. (Or outlet), and has a discharge (or inlet) for hot fluid at the center of the flow path.
  • the hot fluid ie, the heating fluid or the cooling fluid, flows in the circular flow path from the periphery to the center (and in the opposite direction).
  • Such a flow of the fluid is one of the suitable flow methods for making the inside of the wide flow channel have a uniform temperature, but the other flow method, for example, having a large number of inlets in a wide flow channel at various places. It is also considered effective to provide a large number of outlets for the flow.
  • the side wall of this wide channel is the back (or side) of the plate-shaped heat pipe, where a number of heat exchange fins (for example, pin type or needle type) are set up over the whole area. I have. By the action of the fins, high heat uniformity and high heat exchange efficiency can be obtained.
  • the height of the flow path is larger near the center than in the vicinity of the periphery, thereby reducing the difference in flow velocity between the vicinity of the periphery and the vicinity of the center to increase the uniformity of heat.
  • a mechanism is provided to control the flow of the fluid that has flowed in from the fluid inlet so that it is almost parallel to the surface of the plate-type heat pipe, thereby suppressing local temperature unevenness near the fluid inlet.
  • a heat fluid for heating and a heat fluid for cooling are selectively supplied to the flow path.
  • the mechanism for supplying the hot fluid includes a pump for sending the hot fluid, and a heating device and a cooling device for heating and cooling the hot fluid, respectively.
  • a bypass passage for circulating the heating fluid through the pump and each of the heating device and the cooling device by bypassing the flow channel when the hot fluid is not supplied to the flow channel is provided. Is provided. Due to the presence of this bypass, the pump can always be operated at a constant rotation speed even when hot fluid is not supplied to the flow path, and the hot fluid is always controlled to the target temperature.
  • the thermal fluid at the target temperature can be immediately supplied at an appropriate flow rate, and thus the temperature controllability is good.
  • Either heating or cooling may be performed with a heat fluid, or only one of them, especially cooling, may be performed with a heat fluid, and heating may be performed with a heating wire or an infrared lamp.
  • a thermal fluid is ejected from a nozzle or the like to a panel-type heat pipe
  • a heat fluid is applied to the panel-type heat pipe through the channel, it is relatively easy to arrange the heating wire on the front or back of the panel-type heat pipe, or on the surface, inside, or in the gap of the channel. .
  • FIG. 1 is a configuration diagram showing a first embodiment of the present invention.
  • FIG. 2 is a plan view showing a planar arrangement of a fluid ejection nozzle and a halogen lamp.
  • FIG. 3 is a plan view of the heat panel 2 according to the first configuration example as viewed from the lower surface side.
  • FIG. 4 is a cross-sectional view of the heat panel 2 taken along line A—A in FIG.
  • FIG. 5 is a cross-sectional plan view of the heat panel 2 according to the second configuration example.
  • FIG. 6 is a cross-sectional view of the heat panel 2 taken along line A—A and line B—B in FIG.
  • FIG. 7 is a plan view of the heat panel 2 according to the third configuration example as viewed from the lower surface side.
  • FIG. 8 is a cross-sectional view taken along line AA in FIG.
  • FIG. 9 is a plan view of a heat panel 2 according to a fourth configuration example.
  • FIG. 10 is a cross-sectional view taken along line AA of FIG.
  • FIG. 11 is a configuration diagram showing a second embodiment of the present invention.
  • FIG. 12 is a partial cross-sectional view of the third embodiment of the present invention as viewed from above.
  • FIG. 13 is a partial cross-sectional view of the same embodiment as viewed from below.
  • FIG. 14 is a perspective view showing a typical example of a fin.
  • FIG. 15 is a fluid circuit diagram showing a piping structure for flowing a fluid into the temperature control chamber 81.
  • FIG. 16 is a cross-sectional view showing a first modification of the structure of the temperature control chamber 81 for improving the temperature uniformity.
  • FIG. 17 is a cross-sectional view showing a second modification of the structure of the temperature control chamber 81 for improving the heat uniformity.
  • FIG. 18 is a cross-sectional view showing a third modification of the structure of the temperature control chamber 81 for improving the heat uniformity.
  • FIG. 19 is a cross-sectional view taken along line A-A of Fig. 18 (a plan view of the bottom wall 85 of the temperature control chamber 81).
  • FIG. 20 is a cross-sectional view showing a fourth modification of the structure of the temperature control chamber 81 for improving the thermal uniformity.
  • FIG. 21 is a cross-sectional view showing a fifth modification of the structure of the temperature control chamber 81 for improving the heat uniformity.
  • FIG. 22 is a cross-sectional view showing a sixth modification of the structure of the temperature control chamber 81 for improving the temperature uniformity.
  • Fig. 23 shows a seventh modification of the structure of the temperature control chamber 81 for improving the temperature uniformity.
  • FIG. 24 is a cross-sectional view showing an eighth modified example manufactured by another method.
  • FIG. 25 is a partial cross-sectional view showing a ninth modified example using the heating wire.
  • FIG. 26 is a partial cross-sectional view showing a tenth modification using a heating wire.
  • FIG. 27 is a partial cross-sectional view showing a first modified example using a heating wire.
  • FIG. 28 is a partial cross-sectional view showing a 12th modified example using a heating wire.
  • FIG. 29 is a partial cross-sectional view showing a thirteenth modification using a heating wire.
  • FIG. 30 is a partial cross-sectional view showing a 14th modified example using a heating wire.
  • FIG. 31 is a cross-sectional view showing a fifteenth modification example in which heating and cooling channels are separated.
  • FIG. 32 is a cross-sectional view taken along line AA of FIG.
  • FIG. 33 is a sectional view showing a sixteenth modification.
  • FIG. 34 is a cross-sectional view taken along line A—A of FIG.
  • FIG. 35 is a cross-sectional view showing a 16th modified example in which the temperature control chamber 81 is provided on the side surface of the heat panel 2.
  • a resist film is usually formed on a wafer surface through the following process.
  • the baking temperature is set to 90 to 200 degrees Celsius (depending on the process), and in the cooling subsequent to this pre-baking, the target temperature is about 20 degrees Celsius. Is set to room temperature.
  • the baking temperature is set at 100 to 250 degrees Celsius (depending on the process), and the cooling temperature following the host bake is set at 20 degrees Celsius. Room temperature is set.
  • the next step after the pre-bake + cooling step is exposure, and the next step after the bot-bake + cooling step is etching. Quite severe conditions are required for the temperature distribution of the wafer so that the process can be immediately shifted to the next step.
  • the embodiment described below is used in a pre-bake + cooling step or a post-bake + cooling step, in which a wafer is first heated to a high temperature (baking), and then the wafer is brought to room temperature.
  • the cycle of cooling (cooling) is repeated at intervals of several tens of seconds for each wafer. Therefore, heating and cooling are alternately repeated with two target temperatures, the target temperature for heating and the target for cooling.
  • FIG. 1 shows the overall configuration of this embodiment.
  • a wafer 1 is placed on the upper surface of a plate-shaped heat pipe (hereinafter referred to as a heat panel) 2.
  • a heat panel a plate-shaped heat pipe
  • a plurality of vertically movable thin pins 3 are provided so as to penetrate the heat panel 2 from the lower surface to the upper surface (the drive mechanism is not shown).
  • the wafer 1 is placed on the tips of the pins 3.
  • the pins 3 have descended to positions where the tips slightly protrude from the upper surface of the heat panel 2, so that the wafer 1 is placed on the upper surface of the heat panel 2 with a small air gap. I have.
  • the basic structure of the heat panel 2 is composed of a number of series containing a predetermined working fluid. It is a plate with a space through which it passes, and has extremely high thermal conductivity, small size, and heat capacity.
  • the role of the heat panel 2 is to perform heat exchange between the wafer 1 and a heat medium (fluid or light), which will be applied to the lower surface of the heat panel 2, uniformly and at high speed over the entire surface of the wafer 1.
  • a heat medium fluid or light
  • a temperature control room 4 is provided below the heat panel 2, and the heat panel 2 forms a ceiling wall of the temperature control room 4.
  • the wall 5 other than the heat panel 2 of the temperature control room 4 is made of a material having poor heat conductivity.
  • a number of fluid ejection nozzles 6 are provided upright. As shown in the plan view of FIG. 2, these fluid ejection nozzles 6 are arranged vertically and horizontally at a substantially uniform density over the entire two-dimensional area covering the lower surface of the heat panel 2.
  • a low-temperature (that is, wafer cooling) liquid 8 is supplied to these fluid ejection nozzles 6 through a fluid storage pipe 7.
  • the fluid ejection nozzle 6 has one or many small ejection holes at its tip, and blows a high-speed shower of liquid 8 as indicated by an arrow from the ejection holes to the heat panel 2 on the ceiling. be able to. Since the liquid shear is turbulent, heat can be effectively exchanged with the heat panel 2. To ensure that the liquid shower is applied to the entire lower surface of the heat panel 2 as uniformly as possible, the pitch of the array of fluid ejection nozzles 6, the number and shape of the ejection holes, and the distance from the ejection holes to the lower surface of the heat panel 2 are optimal. Designed for
  • the distal end of the liquid supply path 10 is connected to the fluid storage pipe 7, and the base end of the liquid supply path 10 is connected to the liquid discharge port 14 on the bottom wall of the temperature control chamber 4, in the middle of the liquid supply path 10.
  • the liquid 8 that has fallen to the bottom of the temperature control chamber 4 is sent to the chiller 12, where it is adjusted to a predetermined low temperature, and then supplied to the fluid ejection nozzle 6 with the pressure of the pump 11, and the high-speed shower and As a result, it is blown to the lower surface of the heat panel 2 and again falls to the bottom of the temperature control chamber 4 to be circulated in the same manner.
  • the liquid 8 is a liquid having a light transmitting property and an insulating property, such as Florina Toga. Ruden (both registered trademarks) can be used. Water and ethylene glycol, which are easy to handle, can also be used if they meet the required temperature conditions.
  • the temperature control chamber 4 can be a closed type or an open type having an opening 13 to the outside air.
  • the liquid jet flow is ejected from the ejection nozzle 6 in the room filled with liquid, so that the fluid ejection nozzle 6 enters the room and the forced convection flows through the ceiling heat panel 2 ⁇ discharge port 14 Is generated, and the heat panel 2 can be cooled by the forced convection. Since this forced convection is turbulent, heat can be effectively exchanged with the heat panel 2. Further, in the open type temperature control room 4, since the liquid shear collides with the ceiling heat panel 2 through the space, only the new liquid always collides with the heat panel 2 and heat exchange can be performed promptly. it can.
  • the temperature control room 4 further includes a plurality of long cylindrical infrared lamps 23 for heating arranged between the arrays 15 of the jet nozzles 6 (see FIG. 2).
  • the lamp 23 is, for example, a halogen lamp and emits much near-infrared light.
  • Each of the halogen lamps 23 is housed in a reflection mirror 20 having an opening at an upper portion, and the upper opening of the reflection mirror 20 is closed with a cover 25 made of a light transmitting material.
  • a water cooling tube 24 for cooling the lamp 23 and the reflection mirror 20 is provided below each of the halogen lamps 23. Instead of the water cooling tube 24, a liquid storage tube 7 is provided. May be used as a cooling means for the lamp 23 and the reflection mirror 20. Further, depending on the conditions, the cooling means for the lamp 23 and the reflection mirror 20 may not be provided.
  • each of the halogen lamps 23 irradiates the lower surface of the heat panel 2 on the ceiling while spreading in a fan shape by the action of the reflection mirror 20, and gives radiant heat to the heat panel 2.
  • the distance to is designed optimally I have.
  • a heating means instead of the halogen lamp 23 or in combination with the halogen lamp 23, a number of fluid ejection nozzles for ejecting a high-temperature liquid are provided in the same manner as the cooling fluid ejection nozzle 6. It may be provided. When the halogen lamp, 23 and the heating fluid injection nozzle are used in combination, a larger heating capacity can be obtained.
  • the heat panel 2 may have various configurations. The following are some examples of suitable configurations.
  • FIG. 3 is a plan view of the heat panel 2 according to the first configuration example viewed from the lower surface side
  • FIG. 4 is a cross-sectional view of the heat panel 2 taken along line AA in FIG.
  • the outer shell of the heat panel 2 is roughly composed of, for example, two thin plates 31 and 32 made of a material having high thermal conductivity, such as aluminum and copper, superposed on each other, and a hydraulic fluid is provided in a predetermined region between the two plates.
  • a space (that is, a pipe) 33 in which is enclosed is formed, and the two plates 31 and 32 are joined in an area other than the pipe 33.
  • the hatched area is the joined portion
  • the unhatched area is the pipe 33.
  • the pipe 33 protrudes to one side of the heat panel as shown in FIG. 4A or to both sides as shown in FIG. 4B.
  • the ridge of the protruded pipe 33 is shown in FIG. This is indicated by a dashed line.
  • a predetermined amount of hydraulic fluid is sealed in the pipe 33 in an appropriate amount, and a wick 36 for transporting the hydraulic fluid by utilizing capillary action is provided on the inner wall of the pipe.
  • the external shape of the heat panel 2 in a plan view is circular in conformity with that of the semiconductor wafer, but it is not necessarily required to be circular, as in other configuration examples described later. It may be square.
  • the planar shape of the heat panel 2 may be any shape that is convenient for design and manufacture and suitable for equalizing the temperature of the entire wafer.
  • the pipes 33 of the heat panel 2 constitute a pipe network 35 formed by connecting a number of small regular hexagonal pipes like a honeycomb section.
  • the heat panels 2 are arranged at a constant density over almost the entire surface.
  • the eye of the Eve network 35 (the junction of the regular hexagons) 3 4 is only partially shown in FIG.
  • the eye 3 4 increases the mechanical strength of the heat panel 2, so the plates 3 1 and 3 2 are thinned to reduce the heat capacity of the heat panel 2 while maintaining the required mechanical strength. Contribute to enhance the effect.
  • a heat panel of the type in which the pipe 33 protrudes only on one side as shown in Fig. 4A or a heat panel of the type protruding on both sides as shown in Fig. B can be used.
  • This is a single-sided swelling type shown in 4A.
  • the one-sided swelling type has better mechanical strength and also has better soaking degree for the following reasons. That is, in this embodiment, the single-sided swelling type heat panel 2 has a flat surface as an upper surface (a surface on which the wafer 1 is placed) and a pipe swelling surface as a lower surface (a surface to which a liquid shower or radiation is applied). To use.
  • the distance between the upper surface of the heat panel 2 and the wafer 1 is constant, and the heat diffusion along the upper surface of the heat panel 2 is uniform regardless of the direction and location. Heat exchange between wafers 1 tends to be uniform.
  • the high strength of the heat panel 2 also contributes to suppressing the heat deformation of the heat panel 2 and keeping the distance from the wafer 1 constant.
  • the pipe 33 protrudes from the lower surface of the heat panel 2, the contact area with liquid or light is larger than the flat surface, and the same liquid is in contact with the liquid shower.
  • the shape of the mesh 34 of the pipe network 35 of the heat panel 2 does not necessarily have to be a regular hexagon as shown in the figure, but may be a square, a regular triangle, a circle, or the like. However, in order to obtain a high soaking effect, it is desirable that the density of the pipes 33 and the meshes 34 be constant over the entire area of the pipe net 35 regardless of the direction and location.
  • FIG. 5 is a cross-sectional plan view of the heat panel 2 according to the second configuration example
  • FIGS. 6A and 6B are cross-sectional views of the same heat panel 2 taken along lines A-A and B-B in FIG. .
  • the heat panel 2 is formed by laminating and joining two plates 41 and 42 made of aluminum or copper.
  • the upper plate 41 constituting the upper surface of the heat panel 2 is thicker than the lower plate 42, and the lower surface thereof is formed with a wide area concave portion 44 except for the peripheral edge thereof.
  • a large number of thin pillars 43 are erected inside the recess 44. Although only some pillars 43 are shown in FIG. 5, the pillars 43 are actually arranged at a constant pitch over the entire area of the recess 44.
  • the lower plate 42 is superimposed on the upper plate 41 so as to cover the concave portion 44, and the two plates 41, 42 are formed by the peripheral edge hatched in Fig. 5 and the tip of the pillar 43. Are joined.
  • a net of fine pipes 45 having a uniform density and having the columns 43 as eyes is formed in the recesses 44.
  • the pillars 4 3 contribute to increasing the mechanical strength of the heat panel 2.
  • a wick 46 is provided in the pipe 45, and the working fluid is sealed therein.
  • the cross-sectional area of the pillars 4 3, which are the meshes of the pipe network, can be designed to be very small as compared with the structures shown in FIGS. Can be increased. Therefore, it is possible to realize a heat panel having a high heat diffusion rate and exhibiting an excellent soaking effect.
  • the cross-sectional shape of the pillar 43 is rectangular in FIG. 5, but may be other shapes such as a circle.
  • FIG. 7 is a plan view of the heat panel 2 according to the third configuration example viewed from the lower surface side
  • FIG. 8 is a cross-sectional view taken along line AA of FIG.
  • the heat panel 2 has two plates 51 and 52 made of aluminum or copper which are superimposed on each other, the peripheral portions of the plates 51 and 52 are sealed with a sealing member 53, and a constant pitch is applied over the entire surface.
  • the two plates 51 and 52 are joined together at a number of small points (spots) 54 arranged in.
  • the upper plate 51 is a flat plate thicker than the lower plate 51, and the lower plate 52 is a spot 5 as shown in FIG. It is preformed into a shape that protrudes only in four places. Therefore, when the two plates 51 and 52 are joined, a net of fine-grained pipes 56 with a uniform density is formed over almost the entire surface, with the small spots 54 as eyes.
  • a wick 57 is provided in the pipe 56, and the working fluid is sealed therein.
  • the spots 54 serve to increase the mechanical strength of the heat panel 2. Since the area of the spot 54, which is the mesh of the pipe network, is small, the area ratio of the pipe 56 is large, so that heat diffusion is fast and an excellent
  • FIG. 9 is a plan view of the heat panel 2 according to the fourth configuration example
  • FIG. 10 is a cross-sectional view taken along line AA of FIG.
  • This heat panel 2 is a type of application called a loop-shaped meandering thin tube heat pipe (LCHP), and no wick is required.
  • LCHP loop-shaped meandering thin tube heat pipe
  • two plates 61 and 62 made of aluminum or copper are joined with a thin partition plate 63 interposed therebetween.
  • a number of extremely narrow grooves 64, 65 running parallel to each other at a constant small pitch over almost the entire surface are cut. It is rare.
  • the many grooves 64 of the plate 61 are adjacent to each other and are sequentially connected at different ends, thereby forming one meandering groove 68 as a whole.
  • a large number of grooves 65 of the plate 62 are similarly connected to form one meandering groove 69 as a whole.
  • the two plates 61 and 62 are joined in a direction in which the meandering grooves 68 and 69 are orthogonal. Since the openings of the meandering grooves 68 and 69 are covered by the partition plate 63, each forms an extremely fine meandering pipe.
  • the two meandering pipes 68 and 69 pass through the partition plate 63 at both ends 66 and 67 and are connected to each other to form a closed loop meandering pipe as a whole.
  • the meandering pipes 68 and 69 that are orthogonal and communicate with each other can also be referred to as a kind of pipe network. As can be seen from FIG. 9, pipes are arranged at a uniform density over the entire panel surface.
  • the hydraulic fluid is sealed in the meandering pipes 68 and 69.
  • the inner diameter of the meandering pipes 68, 69 (grooves 64, 65) is such that the hydraulic fluid closes the meandering pipes 68, 69 like a plug due to its surface tension. As thin as possible (about 0.1 mm to several mm Degrees).
  • the heat panel 2 of the LCHP type has a different principle from the heat panels of the types shown in Fig. 3 to Fig. 8, that is, heat is transferred at high speed by circulating hydraulic fluid and its vapor bubbles in meandering pipes or by axial vibration. I do.
  • two meandering pipes 68, 69 with a small arrangement pitch are overlapped so as to be orthogonal to each other, and the pipes are finely arranged at a uniform density over the entire panel surface.
  • the pipe network is formed and heat transport can be performed in both directions perpendicular to each other, so that an excellent soaking effect can be exhibited.
  • Baking at a temperature of the wafer 1 of, for example, 150 degrees Celsius and cooling for cooling the temperature of the wafer 1 to, for example, 20 degrees Celsius are alternately performed.
  • the wafer 1 coated with the resist is placed on the pins 3 from the upper surface of the heat panel 2 via a minute gap, and the halogen lamp 23 is turned on to start baking.
  • the radiant heat from each lamp 23 is absorbed by the lower surface of the heat panel 2, transported at high speed from the lower surface to the upper surface in the pipe 33 of the heat panel 2, and transmitted to the wafer 1 from the upper surface of the heat panel 2.
  • the temperature of the heat panel 2 is detected by a temperature sensor (not shown), and the light amount of the lamp 23 is adjusted based on the detected temperature, and the temperature of the wafer 1 is controlled to the target temperature of 150 degrees Celsius.
  • both heating and cooling of the wafer 1 can be performed at high speed with a high degree of uniformity. The reason is as follows.
  • the heat source devices for heating and cooling are the lamps 23 and the liquid jet nozzles 6.Each of them is a shower of heat medium such as infrared light or low-temperature liquid from a location far away from the lower surface of the heat panel 2. Is a non-contact type heat source. Therefore, as compared with the cooling pipe disclosed in Japanese Patent Application Laid-Open No. Hei 7-226713, the heat medium is transferred to the lower surface of the heat pipe as compared with a contact-type heat source such as a Peltier element disclosed in Japanese Patent Application Laid-Open No. 5-218308. It is easy to perform uniform heating and cooling by applying a uniform density to the whole.
  • both the heating heat source and the cooling heat source are non-contact types, one does not interfere with the other.
  • a contact-type cooling heat source such as the cooling pipe of Japanese Patent Application Laid-Open No. Hei 7-222671
  • heating needs to be performed including the cooling pipe, and the heat capacity increases. Decrease.
  • heating and cooling can be performed at high speed.
  • the pipes filled with the hydraulic fluid are arranged with a substantially uniform density and a fine grain throughout almost the entire surface of the panel, and are connected to each other to form a pipe net. . Therefore, thermal diffusivity in the surface direction is good, and a good soaking effect can be exhibited.
  • the fine mesh distribution of the pipe mesh of the heat panel 2 also contributes to reducing the thermal deformation of the heat panel 2 and increasing the soaking effect.
  • the upper surface of the heat panel 2 may be flat, and the gap between the wafer 1 and the heat panel 2 may be kept constant, and the heat diffusion on the upper surface may be improved to enhance the soaking effect.
  • FIG. 11 shows another embodiment of the present invention. Note that components having the same functions as those of the above-described embodiment are denoted by the same reference numerals, and redundant description will be omitted.
  • the liquid in which the gas is mixed is formed into a mist and is sprayed on the lower surface of the heat panel 2.
  • the high-temperature liquid is supplied to a number of heating mist nozzles 71 via a high-temperature liquid supply path 70.
  • High temperature gas such as N2 or He It is supplied from the body supply source 72 and mixed with the high-temperature liquid in the middle of the high-temperature liquid supply path 70 by the pump 73.
  • the low-temperature liquid is supplied to many cooling mist nozzles 75 through the low-temperature liquid supply path 74.
  • a low-temperature gas such as air or N2 is supplied from a low-temperature gas supply source 76 and is mixed with the low-temperature liquid in the middle of the low-temperature liquid supply path 74 by a pump 77.
  • a perforated plate 79 is provided above the mist nozzles 71 and 75 in the temperature control chamber 4 to improve the turbulent flow effect.
  • the mist-like fluid jetted from the mist nozzles 71 and 75 obtains a turbulent flow effect to increase the heat transfer capability, and uniformly hits the lower surface of the heat panel 2.
  • a protector may be applied to the area excluding the ejection holes of the nozzles 71 and 79 so that the fluid flowing down from the lower surface of the heat panel 2 does not remove the heat of the nozzles 71 and 75.
  • FIG. 12 is a partial cross-sectional view of the third embodiment of the present invention as viewed from above
  • FIG. 13 is a partial cross-sectional view of the same embodiment as viewed from below. Note that components having the same functions as those of the above-described embodiment are denoted by the same reference numerals, and redundant description will be omitted.
  • a circular temperature control room 81 is provided below the disk-shaped heat panel 2, and the heat panel 2 forms a ceiling wall of the temperature control room 81.
  • the peripheral wall 83 and the bottom wall 85 of the temperature control room 81 may be made of the same material as the heat panel 2 (typically, aluminum), or may be made of a material having a lower thermal conductivity than the heat panel 2 (for example, , Stainless steel and ceramics).
  • the temperature control chamber 81 is of a closed type, and functions as a flow path through which a high-temperature heating fluid or a low-temperature cooling fluid is filled.
  • the bottom wall 85 of the temperature control chamber 81 has a plurality of fluid inlets 87 at regular intervals along its periphery, to which a plurality of external fluid supply pipes 89 are connected. Has been done.
  • One fluid discharge port 91 is open in the center of the bottom wall 85, and one fluid discharge pipe 93 from the outside is connected to it. Flow to multiple fluid inlets 8 7 Since there is one body outlet 91, the diameter of the fluid outlet 91 is larger than the diameter of each fluid inlet 87.
  • a large number of heat exchange fins 95 are erected throughout the entire surface thereof, and the heat exchange fins 95 extend over almost the entire flow path in the temperature control chamber 81. Are distributed. Fins 95 are made of a material with good heat conductivity (aluminum or copper). These fins 95 are joined to the lower surface 2A of the heat panel 2 by brazing or the like, but do not need to be in contact with the bottom wall 85 and are separated from the bottom wall 85 by a small distance. May be.
  • the fins 95 are pin-shaped fins, but this is not necessary, and various other types of fins can be used.
  • Fig. 14 shows a typical example of such a fin, as shown in Figs. (A) to (F), of a thin plate bent type, a pin-shaped fin as shown in (G), and (H).
  • needle-shaped fins closely planted like a brush can also be used.
  • porous aluminum materials such as those used in the moisture absorbing and releasing members shown in FIGS. 6, 7, 9 and 11 of Japanese Utility Model Application No. 1-501
  • aluminum foam Materials such as materials, metal fibers and metal membranes can also be used as fins in the present invention. Further, not only one type of fin but also a combination of plural types of fins can be used.
  • FIG. 15 shows a piping structure for flowing a fluid into the temperature control chamber 81.
  • the plurality of fluid supply pipes 89 are connected to the fluid outlet of the fluid heating device 105 via the solenoid valve 101 and the pump 103, and via the solenoid valve 109 and the pump 111. It is connected to the fluid outlet of the fluid cooling device 113. Further, the fluid discharge pipe 93 is connected to the fluid inlet of the fluid heating device 105 via the solenoid valve 119, and to the fluid inlet of the fluid cooling device 113 via the solenoid valve 117. It is connected. The fluid outlet and fluid inlet of the fluid heating device 105 are connected via a bypass solenoid valve 107, and similarly, the fluid outlet and fluid inlet of the fluid cooling device 113 are connected to the bypass solenoid valve 111. Connected via 5 You.
  • the pumps 103 and 111 always send fluid at a constant speed.
  • the bypass solenoid valves 107 and 115 are open.
  • the fluid is circulated through it.
  • the solenoid valves 101 and 119 are opened and the bypass solenoid valve 107 is closed from this state, the heating fluid from the fluid heating device 105 is supplied to the temperature control chamber 81 and heating is performed. Be started.
  • the solenoid valve 101 is closed and the bypass solenoid valve 107 is opened, and at the same time, the solenoid valve 109 is opened and the bypass solenoid valve 115 is closed.
  • the supply of the heating fluid to the temperature control chamber 81 is stopped, and the supply of the cooling fluid from the fluid cooling device 113 is started instead, and the cooling is started.
  • the solenoid valve 1 19 opens on the side of the fluid discharge pipe 93 for a short period of time during which the heating fluid remaining in the temperature control chamber 81 comes out of the fluid discharge pipe 93.
  • solenoid valve 1 1 9 is closed and solenoid valve 1 1 7 is opened, and full-scale cooling is started .
  • When switching from cooling to heating perform the opposite valve opening and closing operation. In this way, the heating fluid and the cooling fluid are selectively supplied to the temperature control chamber 81.
  • the fluid flowing from the fluid inlet 87 at the peripheral part flows toward the fluid outlet 91 at the center.
  • Heat exchange In addition, the flow of the fluid is mixed and disturbed by a large number of fins 95 everywhere and becomes a turbulent flow, so that the heat exchange can be performed with higher efficiency as compared with the case where the fluid flows as a simple laminar flow, And the temperature of the heat panel 2 becomes more uniform.
  • the fins 95 contribute to both the purpose of increasing the heat exchange efficiency to achieve high-speed heating and cooling, and the purpose of reducing unevenness in the temperature distribution to achieve uniform heating and cooling.
  • the temperature of the heat panel 2 can be made more uniform. That is, without the fins 9 5 In other words, the heat exchange efficiency is inevitably different between the vicinity of the fluid inlet 87 and the vicinity of the fluid outlet 91 because the fluid temperature and flow velocity are different. Therefore, by changing the arrangement position, density, shape, and the like of the fins 95 depending on the location so as to compensate for this difference, heat exchange can be performed more uniformly at all locations. Thus, the fins 95 play an important role in achieving high heat uniformity.
  • the fluid is supplied from the peripheral portion into the temperature control chamber 81 and flows toward the central portion.
  • the fluid is supplied from the central portion and flows to the peripheral portion. It is also possible.
  • it is considered preferable to flow from the periphery to the center as in the present embodiment. Since the flow velocity is higher in the central part than in the peripheral part, the heat exchange efficiency is higher accordingly. This is because the distribution of the heat exchange efficiency due to the difference in the temperature and the distribution of the heat exchange efficiency due to the difference in the flow velocity are reduced and uniformized.
  • FIG. 16 and FIG. 17 show two modifications of the structure of the temperature control chamber 81 for improving the temperature uniformity.
  • the bottom wall 85 is inclined so that the height 81H of the temperature control chamber 81 becomes larger as approaching the center.
  • the bottom wall 85 is stepped down at a place somewhat near the center, and again, the height 81H of the temperature control chamber 81 is larger than the periphery at the center. ing.
  • the cross-sectional area of the fluid flow path near the center is increased by the height 81 1 H of the temperature control chamber 81 near the center, so the flow velocity at the center is increased. Increase is suppressed, and as a result, the temperature uniformity is increased.
  • FIG. 18 shows a third modification of the structure of the temperature control chamber 81 for improving the temperature uniformity.
  • FIG. 19 is a cross-sectional view taken along line A_A of FIG. 1 is a plan view of the bottom wall 85 of FIG. In FIGS. 18 and 19, the fins 95 in the temperature control chamber 81 are The illustration is omitted.
  • the diameter of the temperature control chamber 81 is larger than the diameter of the heat panel 2, and the temperature control chamber 81 is located at the portion protruding to the outer peripheral side from the heat panel 2, and the upper and lower partition plates on the inner side thereof It has a ring-shaped small room 1 2 1 separated from a region inside the temperature control room 8 1 by 1 2 3 and 1 2 5.
  • a fluid inlet 87 is formed in the bottom wall of the ring-shaped small room 1 2 1, and between the upper and lower partition plates 1 2 3 and 1 2 5 inside the ring-shaped small room 1 2 1 In this case, a slit is vacant because the fluid flows from the small chamber 122 to the area inside the temperature control chamber 81.
  • the fluid flowing into the small room 1 2 1 from the fluid inlet 8 7 changes its direction of flow upon hitting the ceiling of the small room 1 2 1, and becomes a flow almost parallel to the lower surface 2 A of the heat panel 2. It flows into the area inside the temperature control chamber 81 through the slit between the partition plates 1 2 3 and 1 2 5. If the fluid flowing in from the fluid inlet 87 directly hits the lower surface 2A of the heat panel 2 at right angles, only the portion of the heat panel 2 corresponding to the fluid inlet 87 will locally increase the heat exchange efficiency. However, in this modification, such a problem is solved.
  • FIG. 20 shows a further modification of the modification shown in FIGS. Also in FIG. 20, the fins 95 in the temperature control chamber 81 are not shown.
  • FIGS. 21 and 22 show yet another two modifications of the fluid inlet 87 of the temperature control chamber 81 for improving the heat uniformity.
  • the fluid inlet 87 is formed in a direction perpendicular to the side wall 83 of the temperature control chamber 81, and the fluid flows in the temperature control chamber 81 parallel to the lower surface 2A of the heat panel 2.
  • the fluid inlet 87 is formed in the bottom wall 85 of the temperature control chamber 81 in an oblique direction, and the fluid is temperature-controlled in a direction parallel to the lower surface 2A of the heat panel 2. It flows into room 81.
  • the problem of local temperature unevenness caused by the fluid flowing from the fluid inlet 87 directly hit the lower surface 2A of the heat panel 2 at right angles is reduced.
  • FIG. 23 is a plan view of a bottom wall showing still another modified example of the fluid inlet 87 of the temperature control chamber 81 for improving the heat uniformity.
  • the fluid inlet 87 is an elongated slit, which is formed around the periphery of the bottom wall 85 over one circumference. Therefore, the fluid can be made to flow uniformly around the periphery of the bottom wall 85 over the entire circumference, and temperature unevenness depending on the location in the circumferential direction is eliminated.
  • FIG. 24 shows an example of the structure of the heat panel 2 and the temperature control chamber 81 manufactured by a method different from the above-described embodiment.
  • the structure described in FIGS. 12 to 23 is generally manufactured by joining the side wall 83 and the bottom wall 85 of the temperature control chamber 81 to the lower surface 2A of the heat panel 2 manufactured in advance.
  • the structure shown in Fig. 24 was manufactured by the following method. First, a plate material 1 3 1 to be the bottom plate of the heat panel 2 is prepared, and for example, a number of columns 43 of the heat panel 2 shown in FIG. Many fins 95 are erected.
  • a plate 1 3 3 serving as a ceiling wall and a side wall of the heat panel 2 is joined, and on the lower surface, a plate 1 serving as a ceiling wall and a side wall of the temperature control room 81 1 3 Join 5
  • this manufacturing method is easier than the manufacturing method of the structure described with reference to FIGS.
  • FIG. 25 is a partial cross-sectional view of yet another modified example of the third embodiment viewed from below.
  • a heating wire heater 141 wrapped like a maze is joined to the lower surface of the bottom wall 85 of the temperature control room 81 over the entire lower surface. Heating is performed exclusively with heating wire 14 1 or heating wire 14 1 and heating fluid, and cooling is performed exclusively with cooling fluid Do with.
  • FIG. 26, FIG. 27 and FIG. 28 show another two modifications using the heating wire.
  • the heating wire 144 is joined to the upper surface 2 B of the heat panel 2. Heating efficiency is very good because the heating wire is closest to the wafer not shown.
  • a drip-proof heating wire 144 is joined to the lower surface 2 A of the heat panel 2. The heating efficiency is much better than that of Fig. 25 because the heating wire is directly in contact with the heat panel 2.
  • the peripheral portion 151 of the heat panel 2 is formed thicker than the other portions, and the heating peripheral portion 1C extends over the wide outer peripheral surface 2C of the thick peripheral portion 151. 4 7 are joined.
  • FIG. 29 and FIG. 30 show two further modified examples.
  • a heating wire 150 is embedded in the bottom wall 153 of the heat panel over the entire surface.
  • a coil-shaped heating wire 157 is packed in the temperature control room 81 over the entire area.
  • the coiled heating wire 157 also functions as a heat exchange fin.
  • fins (which may be of various types as illustrated in FIG. 14) provided in the temperature control room 81 have a function of heating and heating. You may let it.
  • FIGS. 25 to 30 It is also possible to combine multiple types of heating wire heaters shown in FIGS. 25 to 30.
  • a heating wire is provided on the bottom of the temperature control room 81, and the heating wire is also provided on the upper surface 2B of the heat panel 2 as shown in Fig. 26. Heater 1 4 3 and so on.
  • FIG. 31 shows still another modification.
  • Fig. 32 is a sectional view taken along the line A-A in Fig. 31.
  • a flow path 16 1 for the heating fluid and a flow path 16 3 for the cooling fluid are formed in the temperature control chamber 81 independently of each other.
  • the bottom surface 2 A of the heat panel 2 forms a ceiling surface of the heating fluid channel 16 1 and the cooling fluid channel 16 3.
  • These two channels 1 Numerals 61 and 163 are arranged in a spiral shape over the entire surface of the heat panel 2 as shown in FIG. 32, for example. Then, for example, the fluids are supplied from the outer peripheral ports 16 9, 17 1 of the spiral flow paths 16 1, 16 3, respectively, from the central ports 16 5, 16 7. Its fluid is drained.
  • the material of the temperature control chamber 81 is preferably a material having high thermal conductivity.
  • the channels 16 1 and 16 3 may have a shape other than the spiral shape, for example, a meandering shape.
  • FIG. 33 shows still another modification
  • FIG. 34 is a cross-sectional view taken along line AA of FIG.
  • a heating wire heater 173 is embedded or inserted in the temperature control chamber 81 in place of the heating fluid flow path 161 shown in FIG.
  • a cooling fluid flow path 16 3 is arranged in a meandering manner in the temperature control chamber 81, and a rod-shaped heating wire heater 1-3 is inserted in the gap. Since 163 is meandering, the fluid flowing therethrough is somewhat turbulent.
  • the flow path 163 may be formed in a spiral shape as shown in FIG. 32, and a spiral heating wire 173 may be inserted into the gap.
  • FIG. 35 shows another modification.
  • the heat panel 2 has a peripheral portion 151 formed thicker than the other portions, and extends over a wide outer peripheral surface 2C of the thick peripheral portion 151.
  • a ring-shaped temperature control chamber 81 is formed.
  • An outer peripheral surface 2C of the heat panel 2 constitutes an inner peripheral surface of the temperature control chamber 81, and a number of heat exchange fins 95 are erected outward on the inner peripheral surface.
  • one fluid inlet 87 and one fluid outlet 91 are formed at positions symmetrical with respect to the central axis of the heat panel 2.
  • the present invention is not limited to the above-described embodiments, and can be implemented in other various forms.
  • cooling is performed from the bottom of the heat pipe as in the embodiment, but heating is performed on the wafer.
  • heat pipes only for heating or cooling, for example, by using an infrared lamp located on the side without using a heat pipe.
  • the present invention can be applied not only to the semiconductor wafer processing apparatus as in the above-described embodiment, but also to various other substrate processing apparatuses and wall and table surface temperature control apparatuses.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un dispositif de régulation de température pouvant chauffer ou refroidir des plaques plates, telles que des tranches pour semiconducteurs, de façon uniforme et efficace. Un passage d'écoulement circulaire (81) est relié à la surface inférieure (2A) d'un caloduc circulaire (2) en forme de plaque, sur la surface supérieure duquel est montée une tranche pour semiconducteurs (1). La surface inférieure (2A) du caloduc circulaire (2) en forme de plaque constitue la plaque supérieure du passage d'écoulement circulaire (81), et un grand nombre d'ailettes verticales en forme de broches (95) est installé sur l'ensemble de ladite surface inférieure. Une pluralité d'orifices d'entrée de fluide (87) est placée sur la périphérie du passage d'écoulement circulaire (81), sur la partie centrale duquel est placé un orifice de sortie de fluide (93). Un fluide de chauffage et un fluide de refroidissement sont acheminés de façon sélective dans le passage d'écoulement circulaire (81) à travers les orifices d'entrée de fluide (87). A l'intérieur du passage d'écoulement circulaire (81), le fluide s'écoulant en contact avec les ailettes (95) et le caloduc circulaire (2) en forme de plaque échangent de la chaleur de façon efficace avec les ailettes (95). L'écoulement de fluide est turbulent en raison des ailettes (95), ce qui accroît l'efficacité de l'échange de chaleur, réduit les irrégularités de température et accroît l'homogénéité de la distribution de chaleur.
PCT/JP1998/002423 1997-06-10 1998-06-02 Dispositif de regulation de temperature comprenant un caloduc Ceased WO1998057111A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9/152705 1997-06-10
JP9152705A JPH10339591A (ja) 1997-06-10 1997-06-10 ヒートパイプを利用した温度制御装置
JP9/352251 1997-12-05
JP35225197A JPH11173774A (ja) 1997-12-05 1997-12-05 プレート形ヒートパイプ及びこれを用いた温度制御装置

Publications (1)

Publication Number Publication Date
WO1998057111A1 true WO1998057111A1 (fr) 1998-12-17

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9618858B2 (en) 2010-01-22 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method involving thermal conditioning of a table
CN106894002A (zh) * 2017-03-31 2017-06-27 昆山国显光电有限公司 一种pecvd成膜装置及其成膜方法
CN111707117A (zh) * 2020-05-29 2020-09-25 上海交通大学 平板型蒸发器优化散热装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591994A (ja) * 1982-06-25 1984-01-07 Toshiba Corp 温度制御用ヒ−トパイプ
JPS6338245A (ja) * 1986-08-01 1988-02-18 Ishikawajima Harima Heavy Ind Co Ltd コ−ルドプレ−ト
JPS6390769U (fr) * 1986-11-29 1988-06-13
JPH0763487A (ja) * 1993-08-24 1995-03-10 Akutoronikusu Kk プレート形ヒートパイプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591994A (ja) * 1982-06-25 1984-01-07 Toshiba Corp 温度制御用ヒ−トパイプ
JPS6338245A (ja) * 1986-08-01 1988-02-18 Ishikawajima Harima Heavy Ind Co Ltd コ−ルドプレ−ト
JPS6390769U (fr) * 1986-11-29 1988-06-13
JPH0763487A (ja) * 1993-08-24 1995-03-10 Akutoronikusu Kk プレート形ヒートパイプ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9618858B2 (en) 2010-01-22 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method involving thermal conditioning of a table
US10191377B2 (en) 2010-01-22 2019-01-29 Asml Netherlands, B.V. Lithographic apparatus and a device manufacturing method
USRE49297E1 (en) 2010-01-22 2022-11-15 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method
CN106894002A (zh) * 2017-03-31 2017-06-27 昆山国显光电有限公司 一种pecvd成膜装置及其成膜方法
CN111707117A (zh) * 2020-05-29 2020-09-25 上海交通大学 平板型蒸发器优化散热装置

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