WO1999009794A1 - Fabrication de plaquettes de circuits imprimes tridimensionnelles - Google Patents

Fabrication de plaquettes de circuits imprimes tridimensionnelles Download PDF

Info

Publication number
WO1999009794A1
WO1999009794A1 PCT/EP1998/005014 EP9805014W WO9909794A1 WO 1999009794 A1 WO1999009794 A1 WO 1999009794A1 EP 9805014 W EP9805014 W EP 9805014W WO 9909794 A1 WO9909794 A1 WO 9909794A1
Authority
WO
WIPO (PCT)
Prior art keywords
weight
primer
ribs
amount
amounts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1998/005014
Other languages
German (de)
English (en)
Inventor
Gerhard-Dieter Wolf
Friedrich Jonas
Rudolf Winghofer
Stefan Stampfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Priority to AU91620/98A priority Critical patent/AU9162098A/en
Publication of WO1999009794A1 publication Critical patent/WO1999009794A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Definitions

  • the present invention relates to a method for producing a three-dimensional plastic armature part metallized in the form of conductor tracks and the use thereof as a printed circuit board in the form of the housing of an electrical or electronic
  • housing parts in the three dimensions of their dimensions can be used directly as circuit carriers
  • housing parts with integrated circuit boards can be manufactured by various methods.
  • a process that is already used technically is two-component injection molding.
  • a metallizable plastic is injected in a first shot.
  • a plastic that cannot be metallized is injected around the first molded part in such a way that only the desired conductor tracks are exposed.
  • the molded parts are then metallized using conventional methods known to those skilled in the art, in which case only the exposed structures of the metallizable plastic are metallized.
  • a disadvantage of this method is the fact that the three-dimensional housings thus produced with integrated circuit boards always consist of different plastics and therefore cannot be simply recycled according to type.
  • Another method uses only one type of plastic.
  • the interconnect pattern is injected as above from a plastic into which a metallization activator, for example based on palladium, has previously been incorporated.
  • the same plastic, but without activator is injected around the first molded part in a second shot in such a way that only the interconnect pattern formed by the activator-containing plastic is exposed;
  • work is also carried out here in conventional metallizing baths known to those skilled in the art.
  • the proportion of plastic used in the activator is not just that
  • the invention relates to a method for producing a three-dimensional molded plastic part metallized in the form of conductor tracks, which is characterized by the
  • the invention further relates to the use of the metallized three-dimensional plastic molded part as a printed circuit board in the form of the housing or inner part of an electrical or electronic apparatus.
  • Plastic molded parts in the sense of the present invention are regularly or irregularly shaped molded parts which represent the housing or housing (inner) parts of an electrical or electronic apparatus. In any case, such housings or housing parts carry conductor tracks in the three dimensions of the dimensions
  • the conductor tracks can therefore follow the right angle, any other angle can take the place of the right angle.
  • the conductor tracks can follow any curvature and thus combine any fashionable design and technical applications.
  • Such conductor tracks serve as circuits or parts of circuits of the electrical or electronic apparatus accommodated in such housings or housing parts. Examples of such housings which simultaneously carry conductor tracks are housings of television or radio devices, of computers or, in the case of telephone devices, of both the hand-held device and the telephone base, and further analog possibilities known to those skilled in the art
  • a plastic molded part (housing or housing part) is produced with the aid of injection molding technology, which carries an interconnect image at the intended location in the form of raised ribs with recesses located between them
  • these ribs which represent the conductor track pattern, are covered with a primer suitable for electroless metallization, which contains an activator for electroless metallization.
  • the conductor pattern can be coated with the primer, for example by printing, stamping,
  • Dipping, painting, knife coating or spraying can be carried out
  • step c) the primer is dried
  • the plastic molded part is then chemically metallized wherever the activated conductor tracks have remained free. This chemical
  • metallization can subsequently be galvanically reinforced in step f).
  • plastics which can be processed by injection molding are suitable as plastics for the plastic parts to be metallized according to the invention.
  • plastics for example: acrylonitrile-butadiene-styrene (ABS) polymers, polycarbonate (PC), their mixtures and flame-retardant types, furthermore polyamide (PA), for example polyamide 6, polyamide 66, polyester types such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, aromatic, liquid crystalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polyphenylene sulfide,
  • ABS acrylonitrile-butadiene-styrene
  • PC polycarbonate
  • PA polyamide
  • PA polyamide 6
  • polyester types such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, aromatic, liquid crystalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polypheny
  • Polyphenylene oxide polyurethanes, polyimides, polyamideimides, polyetherimide, polysulfones, polyacetals, polystyrene and their copolymers or blends.
  • Preferred plastics for injection molding in the process according to the invention are arylnitrile-butadiene-styrene copolymers, polycarbonate, polyamide, polyetherimide, polysulfones, their copolymers and blends.
  • Plastics in the general range of 150 to 400 ° C in question Many of these plastics can also be used as matrix formers described below; It is now advantageous to match plastics for injection molding and those as matrix formers so that they have comparable thermal resistance.
  • the width of the ribs on the plastic molded parts is very variable and ranges from about 100 ⁇ m to a few centimeters (e.g. 5 cm), preferably from 200 ⁇ m to
  • the distance between the ribs is also very variable and ranges from 100 ⁇ m to a few centimeters (e.g. 5 cm), preferably from 200 ⁇ m to 1 cm, particularly preferably from 400 ⁇ m to 0.8 cm.
  • the depressions between the ribs measure from 200 ⁇ m to a few centimeters (e.g. 5 cm), preferably from 500 ⁇ m to 1 cm, particularly preferably from 1 mm to 0.8 cm.
  • the depressions can be completely filled, so that the ribs from the injection molding a) with the conductor tracks and the plastic from the injection molding d) lie completely in one plane. However, it is equally possible to fill up the depressions only partially, so that the ribs are still shown, but at a lower height than before.
  • the primer essentially consists of (i) a polymer as film or matrix former, (ii) a metallization catalyst (activator), (iii) optionally organic and / or inorganic fillers, (iv) optionally other constituents and (v) Solvents.
  • primers with an organic solvent system are: lacquer systems such as alkyd resins, unsaturated polyester resins, polyurethane resins, epoxy resins, modified fats and oils, polymers or copolymers based on vinyl chloride, vinyl ethers, vinyl esters, styrene, (meth) acrylic acid, acrylonitrile or acrylic esters, Cellulose derivatives or the stoving enamels which crosslink at a higher temperature, such as, for example, polyurethanes from hydroxyl-containing polyethers, polyesters or polyacrylates and masked polyisocyanates, melamine resins from etherified melamine-formaldehyde resins and hydroxyl-containing polyethers, polyesters or polyacrylates, epoxy resins from polyexpoxides and polycarboxylic acid-containing acrylic groups, carboxylates containing carboxylates, carboxylates made of polyesters
  • Film or matrix formers based on polyurethane systems that are made up of the following components are particularly well suited:
  • TDI 2,4- and 2,6-tolylene diisocyanate and mixtures of these isomers
  • MDI Polyphenyl polymethylene polyisocyanates such as those produced by aniline-formaldehyde condensation and subsequent phosgenation (MDI) and carbodiimide groups, urethane groups, allophanate groups, isocyanurate groups, urea groups or biuret groups containing polyisocyanates.
  • Compounds with at least two isocyanate-reactive hydrogen atoms with a molecular weight of generally from 400 to 10,000, preferably 1,000 to 6,000, particularly preferably 2,000 to 6,000.
  • Reactive hydrogen atoms are those from amino groups, thiol groups, carboxyl groups and preferably hydroxyl groups.
  • Polyacrylates, polybutadienes, polyesters and melamine resins in question.
  • Polyurethanes or polyurethane ureas such as those described in US Pat Angewandte Chemie 82, 1970, pp. 53-63, are described in DE-A 2 314 512 or DE-A 2 314 513.
  • Particularly preferred dispersible polyurethanes have essentially a linear molecular structure and are characterized by a) terminal polyalkylene oxide polyether chains with a content of ethylene oxide units of 0.5 to 10% by weight, based on the total polyurethane, and b) a content of quaternized nitrogen, tertiary sulfur, carboxyl groups or sulfonic acid groups from 0.1 to 15 milliequivalents per 100 g.
  • the composition of such preferred dispersible polyurethanes and their preparation are also known and are described, for example, in DE-A 2 651 506.
  • Ionic and / or colloidal noble metals or their organometallic covalent compounds or complex compounds with organic ligands are suitable as activators.
  • the precious metals come from subgroups I and VIII of the Periodic Table of the Elements (Mendeleev) and are, for example, Pd, Pt, Au and Ag.
  • Organic and / or inorganic fillers for such primers are, for example, the oxides of the elements Mn, Ti, Mg, Al, Bi, Cu, Ni, Sn, Cn and Si, and also silicates, bentonites, talc and chalk.
  • Individual examples are furthermore: Powdered high-melting plastics, disperse silica, Russian, other carbon powder,
  • Solvents for primers which can be used according to the invention are the substances known in printing or coating technology, such as aromatic and aliphatic hydrocarbons, for example toluene, xylene, gasoline; Glycerin; Ketones, for example
  • Water-miscible solvents are, for example, alcohols, such as methanol, ethanol, propanol, butanol; Ketones such as acetone, methyl ethyl ketone, cyclohexanone; Glycol ethers, such as ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether; water-soluble ethers such as tetrahydrofuran, dioxane.
  • alcohols such as methanol, ethanol, propanol, butanol
  • Ketones such as acetone, methyl ethyl ketone, cyclohexanone
  • Glycol ethers such as ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether
  • water-soluble ethers such as tetrahydrofuran, dioxane.
  • primers are, for example, surfactants, leveling agents, defoamers and dyes in small concentrations of up to 5% by weight, preferably up to 2% by weight, based on the total amount of primer.
  • surfactants for example, surfactants, leveling agents, defoamers and dyes in small concentrations of up to 5% by weight, preferably up to 2% by weight, based on the total amount of primer.
  • Preferred primers based on organic solvents consist essentially of, for example
  • organic solvents in an amount of 50-90% by weight, all based on the total amount of primer.
  • such primers are based on organic solvents due to an additional content of e) an organic polymeric or prepolymeric additive with a molecular weight of 500-20,000 from the group of polyoxazolines, polymethacrylic acid or their esters, polyacrylates, polyamides, polyesters, polyalcohols and polyamines in an amount of 0.1-15% by weight .-%, based on the total formulation of the primer.
  • Preferred primers based on aqueous formulations consist essentially of
  • a water-dispersible polymer preferably a polyurethane, in amounts of 5-60% by weight, preferably 15-45% by weight
  • a metallization catalyst in the form of an ionic or complex noble metal compound in amounts of 0.02-3.5% by weight, preferably 0.05-0.5% by weight,
  • Optionally used water-soluble organic solvents of the type mentioned replace a maximum of 1/3, preferably a maximum of 1/4, particularly preferably a maximum of 1/10 of the amount of water mentioned.
  • the layer thickness of the primer can be varied in a wide range from 0.1 to 200 ⁇ m, preferably in the range from 5 to 50 ⁇ m.
  • solvent-based primers there is a particularly preferred range from 5 to 30 ⁇ m; for aqueous primers there is a particularly preferred range of 10-50 ⁇ m.
  • the dry layer thickness of the primer is about half the layer thickness of the wet applied primer. Depending on the temperature used, the drying time is between a few minutes and several hours, preferably between 5 and 90 minutes.
  • the plastic molded part for leveling the raised conductor tracks is again treated by injection molding with the same plastic as in the first spraying in order to level the rib-shaped raised conductor tracks. This leaves the one applied to the highest points of the ribs
  • the metallization baths used for electroless metallization are commercially available and known to the person skilled in the art.
  • Metals suitable for producing the conductor tracks are, for example, Cu, Ni, Ag, Au, Pd, preferably Cu.
  • the metal layer thickness can be increased to up to 500 ⁇ m
  • a water-based primer solution I was prepared by combining
  • a water-dispersible polymer based on a substantially linear aliphatic, polyether group-containing polyurethane with carboxyl groups and sulfonic acid groups, 1% by weight AgN0 3 , 30% by weight talc and Ti0 2 and 43% by weight Water, all based on the total weight of the aqueous primer.
  • a primer solution II based on organic solvents was prepared by combining 5% by weight of a polyurethane made of poly [(butanediol adipate) -
  • a curved conductor track structure with raised ribs was produced from an acrylonitrile-butadiene-styrene copolymer by injection molding.
  • the metallizable primer solution I from Example 1 was sprayed onto the molded part thus produced.
  • the layer was dried at 70 ° C. for 60 minutes and gave a dry layer thickness of about 9 ⁇ m.
  • the molded part was then encapsulated with the same copolymer in such a way that only the desired conductor track structure with the metallizable primer layer I was exposed.
  • the mixture was then metallized at 43 ° C. for 1 hour using a chemical copper bath (Shipley, type CP 78).
  • Copper thickness of the conductor tracks was 2 ⁇ m; after galvanic reinforcement on 35 ⁇ m copper, the adhesive strength was 0.8 N / mm.
  • a curved conductor track structure with raised ribs was again produced from the copolymer used in Example 3 by injection molding.
  • the metallizable primer solution II was applied to the ribs of the molded part produced in this way
  • Example 2 sprayed on. After drying for 70 min at 70 ° C, a dry layer thickness of about 18 microns resulted.
  • the sprayed-on primer solution II was also in the recesses between the conductor ribs.
  • the molded part was then encapsulated with the same copolymer in such a way that only the desired conductor track structure with the primer solution II located on the surface was exposed. Thereafter, metallization was carried out for 1.5 hours with the same chemical copper plating bath as in Example 3 at 43 ° C. The thickness of the copper layer was 3 ⁇ m; after galvanic reinforcement on 35 ⁇ m copper, an adhesive strength of the conductor tracks of 0.8 N / mm was measured.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Des pistes de conducteurs sont appliquées sur une pièce moulée tridimensionnelle en matière plastique en préparant tout d'abord, par moulage par injection, une telle pièce moulée tridimensionnelle portant le réseau des pistes de conducteurs sous forme profilée, puis en appliquant sur ledit réseau, une couche d'amorçage renfermant un activateur, convenant pour la métallisation sans courant, en séchant la couche d'amorçage, en traitant le réseau profilé par nouveau moulage par injection avec remplissage des emplacements en creux de la pièce moulée en matière plastique de telle façon que seules les pistes de conducteurs activées soient dégagées, en métallisant chimiquement les pistes activées et en effectuant éventuellement un renforcement galvanique. De telles pièces moulées tridimensionnelles en matière plastique à réseaux de pistes de conducteurs sont utilisées sous forme de boîtiers intégrés d'appareils électriques ou électroniques renfermant les plaquettes de circuits imprimés.
PCT/EP1998/005014 1997-08-20 1998-08-07 Fabrication de plaquettes de circuits imprimes tridimensionnelles Ceased WO1999009794A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU91620/98A AU9162098A (en) 1997-08-20 1998-08-07 The production of three-dimensional printed-circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19736093.9 1997-08-20
DE19736093A DE19736093A1 (de) 1997-08-20 1997-08-20 Herstellung dreidimensionaler Leiterplatten

Publications (1)

Publication Number Publication Date
WO1999009794A1 true WO1999009794A1 (fr) 1999-02-25

Family

ID=7839539

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/005014 Ceased WO1999009794A1 (fr) 1997-08-20 1998-08-07 Fabrication de plaquettes de circuits imprimes tridimensionnelles

Country Status (4)

Country Link
AU (1) AU9162098A (fr)
DE (1) DE19736093A1 (fr)
TW (1) TW404152B (fr)
WO (1) WO1999009794A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19904217A1 (de) * 1999-02-03 2000-08-10 Bayer Ag Galvanisierbares Formteil
TWI417013B (zh) * 2010-05-14 2013-11-21 Kuang Hong Prec Co Ltd 立體電路元件及其製作方法
DE102012201014A1 (de) * 2012-01-24 2013-07-25 Robert Bosch Gmbh Getriebesteuermodul mit Öl-resistenten Leiterbahnen
CN114230966B (zh) * 2021-12-29 2023-11-28 上海普利特复合材料股份有限公司 一种具有耐化学性能优异高耐候abs复合材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0323685A1 (fr) * 1986-06-24 1989-07-12 Sankyo Kasei Kabushiki Kaisha Procédé de fabrication d'objets moulés partiellement métallisés
EP0485839A2 (fr) * 1990-11-16 1992-05-20 Bayer Ag Couche de base pour métallisation
EP0503351A2 (fr) * 1991-03-09 1992-09-16 Bayer Ag Couche d'accrochage pour métallisation
JPH06140743A (ja) * 1992-10-28 1994-05-20 Hitachi Cable Ltd プラスチック複合成形品の製造方法
DE19606862A1 (de) * 1995-02-23 1996-08-29 Hitachi Ltd Gedruckte Leiterplatten und Verfahren für ihre Herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0323685A1 (fr) * 1986-06-24 1989-07-12 Sankyo Kasei Kabushiki Kaisha Procédé de fabrication d'objets moulés partiellement métallisés
EP0485839A2 (fr) * 1990-11-16 1992-05-20 Bayer Ag Couche de base pour métallisation
EP0503351A2 (fr) * 1991-03-09 1992-09-16 Bayer Ag Couche d'accrochage pour métallisation
JPH06140743A (ja) * 1992-10-28 1994-05-20 Hitachi Cable Ltd プラスチック複合成形品の製造方法
DE19606862A1 (de) * 1995-02-23 1996-08-29 Hitachi Ltd Gedruckte Leiterplatten und Verfahren für ihre Herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 18, no. 447 (E - 1594) 19 August 1994 (1994-08-19) *

Also Published As

Publication number Publication date
TW404152B (en) 2000-09-01
AU9162098A (en) 1999-03-08
DE19736093A1 (de) 1999-02-25

Similar Documents

Publication Publication Date Title
EP0082438B1 (fr) Procédé d'activation des surfaces pour la métallisation sans courant
DE19812880A1 (de) Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
DE69935312T2 (de) Modifiziertes polyimidharz und diese enthaltende wärmehärtende harzzusammensetzung
DE60032005T2 (de) Leiterbahnenmaterial und methode, leiterplatten unter verwendung desselben herzustellen
EP0256395B1 (fr) Procédé pour améliorer l'adhérence des couches de métaux déposées par voie chimique sur des surfaces en matière plastique
EP0417037A2 (fr) Procédé de revêtement d'articles en matière plastique
EP0485839B1 (fr) Couche de base pour métallisation
DE4227836C2 (de) Verfahren zur Metallisierung von Nichtleitern
EP0503351B1 (fr) Couche d'accrochage pour métallisation
DE19624071A1 (de) Verfahren zur Herstellung von bahnförmigen metallbeschichteten Folien
EP0340513B1 (fr) Procédé de métallisation
DE2412709C3 (de) Verfahren zur Vorbehandlung der Oberfläche eines Formkörpers
EP0153683A2 (fr) Procédé de fabrication de plaques à circuit
EP0997061A1 (fr) Procede permettant la metallisation d'un substrat presentant des zones superficielles electriquement non conductrices
EP0132677A1 (fr) Procédé pour l'activation de surfaces de substrat pour la métallisation partielle directe de supports
DE112018003567T5 (de) Zusammensetzung zur bildung einer grundierung zum stromlosen plattieren
WO1999009794A1 (fr) Fabrication de plaquettes de circuits imprimes tridimensionnelles
DE2012533A1 (de) Gedruckte Schaltung und Verfahren zu deren Herstellung
EP0093279A2 (fr) Granulés métallisés polymères, leur fabrication et utilisation
EP0456908A1 (fr) Procédé d'activation de surfaces de substrats en vue d'une métallisation par voie chimique
DE10002102A1 (de) Primer für die Metallisierung von Substratoberflächen
EP0508265B1 (fr) Procédé d'activation des surfaces de substrats en vue d'une métallisation par voie chimique
DE4041472A1 (de) Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung
EP0150362A2 (fr) Plaquettes à circuit imprimé en stratifié
DE69920892T2 (de) Verfahren zum Plattieren von Kunstoffen unter Verwendung eines katalitischen Fuellstoffes

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
NENP Non-entry into the national phase

Ref country code: KR

NENP Non-entry into the national phase

Ref country code: CA

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase