WO2002000966A1 - Matrice pour galvanoplastie, procede de fabrication, utilisation et article forme par galvanoplastie - Google Patents

Matrice pour galvanoplastie, procede de fabrication, utilisation et article forme par galvanoplastie Download PDF

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Publication number
WO2002000966A1
WO2002000966A1 PCT/NL2001/000479 NL0100479W WO0200966A1 WO 2002000966 A1 WO2002000966 A1 WO 2002000966A1 NL 0100479 W NL0100479 W NL 0100479W WO 0200966 A1 WO0200966 A1 WO 0200966A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
electroforming
electrically conductive
random
dykes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/NL2001/000479
Other languages
English (en)
Inventor
Roger Josef Frederik Theunissen
Wilhelmus Gerardus Coenen
Peter Leerkamp
Wilhelmus Aloysius Pruijn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stork Screens BV
SPGPrints BV
Original Assignee
Stork Prints BV
Stork Screens BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stork Prints BV, Stork Screens BV filed Critical Stork Prints BV
Priority to AU2001269611A priority Critical patent/AU2001269611A1/en
Publication of WO2002000966A1 publication Critical patent/WO2002000966A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms

Definitions

  • the present application relates firstly to an electroforming die for the electroforming of metal products, which electroforming die comprises a structure of interconnected, electrically conductive die tracks .
  • An electroforming die of this type is generally known in the art and is used for the electroforming of metal products in electrodeposition baths, in which metal is deposited on the structure of electrically conductive die tracks, which die tracks are connected to a suitable current source.
  • An example of products which are electroformed in this way with openings separated by product dykes, the structure of the product dykes which are formed corresponding to the structure of the die tracks of the electroforming die, is printing screens, both flat and cylindrical, which are used for the screen-printing of substrates, such as textiles and paper.
  • the structure of the die tracks has a regular pattern on account of the way in which it is produced, including in general a photoresist layer which has been applied to an electrically conductive substrate being exposed and developed in pattern form and, depending on the type of photoresist - negative or positive - the exposed or unexposed parts being removed and the photoresist pattern which remains being stoved, after which the structure of electrically conductive die tracks, in this case die dykes which project above the main surface of the electrically conductive substrate, is deposited by galvanization to the desired thickness on the exposed, electrically conductive substrate parts between the islands of photoresist. Consequently, a product which is electroformed using a die produced in this way also has a regular pattern of openings separated by product dykes.
  • Moire effect One of the problems which may be caused by a printing screen with a regular pattern of printing openings separated by product dykes is the Moire effect. This effect may arise when two or more regular patterns are superimposed.
  • a photosensitive resist is applied thereto and is then exposed, developed and cured by a grid film which comprises a copy of the image to be printed in grid form, so that a regular pattern of openings in the region of the image to be printed is also present in the photoresist layer. Therefore, during printing there are two regular patterns, one comprising the screen-printing openings and one comprising the openings in the photoresist layer, resulting in the Moire effect, so that the quality of the printed image generally deteriorates.
  • the regular pattern of the screen-printing openings in combination with a regular pattern of the substrate to be printed, for example in the case of textiles, may give rise to the Moire effect, although the effect in the latter case is less pronounced than in the former case.
  • the broad object of the present invention is to reduce or even eliminate the occurrence of this effect.
  • the structure comprises a random, disordered network of electrically conductive die tracks.
  • the invention is based on the insight that the occurrence of the abovementioned Moire effect can be prevented by changing at least one of the two interacting patterns, either that of the screen- printing openings or that of the openings in the photoresist layer (or in the substrate), into a disordered collection of openings. Since the pattern in the photoresist layer corresponds to the grid film of a digitized image, it is difficult to randomize this pattern. However, it is possible to random, disordered (randomize) the pattern of openings in the printing screen by adapting the electroforming die used for the production of these screens, which according to the invention comprises a random, disordered network of die tracks.
  • the printing screen will comprise a corresponding random, disordered network of product dykes, which product dykes delimit the continuous printing openings .
  • the Moire effect consequently cannot occur, since there are no longer regular patterns which overlap one another. In this way, the printing quality is improved.
  • random, disordered network this is intended to mean an irregular grid which generally does not repeat itself but of which some parameters, such as its number of lines and thickness, can be controlled, but the direction cannot be controlled.
  • the random, disordered network of die tracks may comprise some regular elements, provided that the die overall can be considered to be a random, disordered network.
  • the network may comprise a rough pattern of lines of (reinforcing) die tracks which in each case delimit partial areas with a disordered network of die tracks.
  • the products produced using the electroforming die according to the invention can also be used for other purposes, such as electrodes in batteries, in which case electrolyte (paste) is situated in the openings and on the product dykes of the electrode, which therefore also functions as a carrier for electrolyte.
  • electrolyte paste
  • a further example of an electroformed product of this type is a die for the perforation of plastic sheets, in which the sheet is applied to one side of the die and, as a result of vacuum being applied to the other side of the die, is sucked into the openings in the die until holes are formed in the sheet at these locations.
  • the die tracks may comprise dykes which project above the surface, but may also be recesses in the surface or a mixture of the t o.
  • the electroforming die according to the invention preferably comprises a layered structure, comprising an electrically conductive base layer, advantageously made from a metal of good conductivity, such as solid copper, a top layer which comprises electrically conductive metal and has a random, disordered network of small cracks at least in the surface which is remote from the base layer, the random, disordered network of electrically conductive die dykes being present at least in the random, disordered network of cracks. It has been found that (micro) cracks in a surface of a first metal can be preferentially filled up with another metal under standard electroforming conditions.
  • Microcracks of this type are formed, for example, in electroplated chromium, varying in number from fewer than 4 to approximately 3200 per linear centimetre, depending, inter alia, on bath composition, current density and temperature. In general, the number of microcracks in hard chromium is approximately 1200 per linear centimetre. Incidentally, it should be noted at this point that the phenomenon of microcracking in chromium of this type and the factors which influence the number of cracks have long been known (cf. for example "Microcracks in hard chromium electrodeposits" by A.R. Jones and “Dekorative Chrom-Nickel- ⁇ berzuge", by W. Blum) .
  • a chromium layer is deposited by known methods for the production of an electroforming die, it is afterwards ground in order to activate the chromium by removal of the low-conductivity chromium oxide skin which is present, with the result that the possibility of preferential metal deposition as used in the production of the electroforming die according to the present invention is lost. Therefore, in the electroforming die according to the invention, it is preferable to use non-activated chromium as material for the top layer of the layered structure.
  • electrically conductive in the present application is a relative term; the material which surrounds the electrically conductive die tracks may also be electrically conductive, but should be considered a non-conductive material compared to the electrically conductive die tracks under the electroforming conditions employed.
  • a basic embodiment of the electroforming die therefore comprises an electrically conductive base layer, advantageously made from a metal of good conductivity, such as copper, with a top layer, of which the surface is relatively non-conductive, with a random, disordered network of electrically conductive die tracks in the form of die recesses in this layer.
  • This basic embodiment is suitable for making flat products, provided it is possible to remove these products from the die recesses, for example by peeling.
  • the thickness of the top layer is advantageously greater than the depth of the (micro) cracks, so as to limit the risk of a product which has been produced using the electroforming die "sticking" to the metal of the base layer, i.e. being impossible to remove.
  • the electrically conductive material which forms the die dykes in the cracks in the top layer in the electroforming die of layered structure advantageously consists of nickel. If the nickel of the die dykes is passivated in a way which is known per se in the prior art, for example with the aid of potassium permanganate or potassium bichromate, and those parts of the top layer which are exposed between the die dykes of the network are covered with photoresist or other electrically insulating material, the thickness of which is less than or equal to the height of the die dykes above the upper surface of the top layer, the result is a die which is suitable for the production of flat or cylindrical products, depending on the form of the base layer.
  • the present invention also relates to a method of manufacturing an electroforming die, which method comprises the steps of: (a) creating an electrically conductive base layer; (b) providing an electrically conductive top layer with a random, disordered network of cracks in at least the upper surface of the top layer; and, if desired,
  • an electrically conductive material in the cracks in the top layer, in order to form a random, disordered network of electrically conductive die dykes.
  • a top layer of an electrically conductive metal or metal alloy preferably a chromium layer
  • a solid conductor such as a copper layer
  • the cracks form electrically conductive die recesses, as explained above for the basic embodiment.
  • an electrically conductive material advantageously nickel
  • the method may comprise an additional step (d) of depositing an insulating material in the recesses between the electrically conductive die dykes prior to use, and the additional step (e) of passivating the nickel surface.
  • the invention also relates to the application of an electroforming die according to the invention in the electroforming the microcracks which have formed during the deposition of the top layer. This is because nickel is a better conductor than the surface of the top layer of chromium.
  • the method may comprise an additional step (d) of depositing an insulating material in the recesses between the electrically conductive die dykes prior to use, and the additional step (e) of passivating the nickel surface.
  • the invention also relates to the application of an electroforming die according to the invention in the electroforming of products, as defined in claim 13.
  • the invention also relates to an electroformed product obtainable using an electroforming die according to the invention, which product is characterized by a random, disordered network of product dykes which are separated by spaces, in particular a printing screen as defined in claim 15 and an electrode for use in a battery as defined in claim 14.
  • a (rotary) printing screen can be produced, for example, by allowing a thin skeleton to grow on the die according to the invention, and effecting preferential growth on this skeleton after it has been removed from the die, as described, for example, in EP-A-0 038 104, in the name of the applicant, or other methods which have been patented by the applicant.
  • Figure 1 diagrammatically depicts an embodiment of an electroforming die according to the invention
  • Figure 2 shows an example of a random, disordered network
  • Figure 3 illustrates the application of the electroforming die shown in Fig. 1;
  • Figures 4 - 10 show photographs of various electroformed products according to the invention.
  • Fig. 11 shows a basic embodiment of an electroforming die according to the invention.
  • Fig. 1 shows part of an electroforming die in section, in which the electroforming die is denoted overall by reference numeral 10.
  • the electroforming die 10 illustrated comprises a base layer 12 of copper.
  • the microcracks 18 form an irregular network 30.
  • the nickel die dykes 24 will form a corresponding network.
  • Fig. 2 likewise presents a network 32 of the die dykes 24.
  • a regular sub-pattern of parallel "recesses" (corresponding to reinforcement dykes 26 for the die) is applied by machining the chromium layer 16 (for example by knurling) .
  • the networks 30 and 32 are irregular and disordered.
  • the die dykes 24 will usually be passivated with the aid, for example, of potassium bichromate, and the spaces 28 between the die dykes will be filled with photoresist 40 in the usual way (cf. also Fig. 3) .
  • Fig. 3 illustrates the various steps of an embodiment of a method according to the invention for producing an electroforming die according to the invention, in which parts which correspond to components shown in Figs 1 and 2 are denoted by the same reference numerals .
  • Fig. 3 shows the same die as Fig. 1, with a solid copper layer 12, on which, after polishing, a chromium layer 16 in which there is a network 30 of microcracks 18 which extend a certain depth into the upper surface 20 is deposited.
  • nickel is preferentially deposited in the microcracks 18, likewise by electrodeposition, which nickel forms dykes 24 corresponding to the network 30 of the microcracks 18.
  • a thick layer of insulating material 40 is then applied to the entire surface of the chromium interlayer 16 and the nickel dykes 24, and this insulating material is then ground down as far as the upper surface of the dykes 24 (Fig. 3b) .
  • the electroforming die produced in this way can be used for electroforming numerous products, as shown in Fig. 4, in which, by way of example, nickel is deposited from an electrodeposition bath on the die 10, more particularly on the nickel die dykes 24, as a thin skeleton 42, which is then removed from the die, followed by further growth on this skeleton in a suitable bath.
  • the skeleton 42 will comprise the same random, disordered network of product dykes as the network 30 of the original microcracks 18.
  • nickel can be preferentially deposited in the cracks of a 40 ⁇ m thick Cr layer which was formed on a base layer of copper, with the nickel product being readily removable.
  • nickel is also preferentially deposited in scratches which have been formed in a Cr layer using a hard brush.
  • nickel was deposited over the entire surface of a scratched, oxidized copper roller.
  • Figs. 4 - 10 show photographs taken usi-ng a scanning electron microscope (SEM) of products which have been electroformed using various electroforming dies according to the invention, Fig. a showing the bath side of a product which has been in contact with the electrolyte, while Fig. b shows the die side.
  • SEM scanning electron microscope
  • Fig. 11 shows a basic embodiment of an electroforming die according to the invention, which in principle is identical to the embodiment shown in Fig. 1, except that the electrically conductive die dykes 24 are absent, and instead the cracks 18 function as die recesses 60, on which an electroformed product can be made to grow. These die recesses 60 are better conductors than the surface of the top layer 20.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

Cette invention a trait à une matrice pour galvanoplastie (10) permettant la formation d'articles produits par galvanoplastie. Cette matrice comporte une structure de tracés métalliques électro-conducteurs. Cette structure comprend un réseau aléatoire désordonné (32) de ces tracés métalliques électro-conducteurs. Il est possible de produire un réseau de ce type, par exemple, par électrodéposition préférentielle de (micro)fissures (18) dans une surface métallique produite par galvanoplastie (20), notamment une couche de chrome (16). L'invention concerne également un procédé de production de cette matrice, son utilisation ainsi que des articles (42) produits par galvanoplastie, tels que des trames pour impression et des électrodes d'accumulateurs.
PCT/NL2001/000479 2000-06-27 2001-06-27 Matrice pour galvanoplastie, procede de fabrication, utilisation et article forme par galvanoplastie Ceased WO2002000966A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001269611A AU2001269611A1 (en) 2000-06-27 2001-06-27 Electroforming die, method of manufacturing the same, application thereof and electroformed products

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1015535 2000-06-27
NL1015535A NL1015535C2 (nl) 2000-06-27 2000-06-27 Elektroformeringsmatrijs, werkwijze voor het vervaardigen daarvan, alsmede toepassing daarvan en geÙlektroformeerd product.

Publications (1)

Publication Number Publication Date
WO2002000966A1 true WO2002000966A1 (fr) 2002-01-03

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PCT/NL2001/000479 Ceased WO2002000966A1 (fr) 2000-06-27 2001-06-27 Matrice pour galvanoplastie, procede de fabrication, utilisation et article forme par galvanoplastie

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AU (1) AU2001269611A1 (fr)
NL (1) NL1015535C2 (fr)
WO (1) WO2002000966A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110318600A1 (en) * 2009-12-04 2011-12-29 Mitsui Mining & Smelting Co., Ltd. Porous metal foil and production method therefor
US20130216849A1 (en) * 2011-01-13 2013-08-22 Mitsui Mining & Smelting Co., Ltd. Reinforced porous metal foil and process for production thereof
US20130323602A1 (en) * 2011-04-08 2013-12-05 Mitsui Mining & Smelting Co., Ltd. Composite metal foil and production method therefor
US20130323527A1 (en) * 2011-04-08 2013-12-05 Mitsui Mining & Smelting Co., Ltd. Porous metal foil and production method therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3891514A (en) * 1972-11-28 1975-06-24 Buser Ag Maschf Fritz Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3891514A (en) * 1972-11-28 1975-06-24 Buser Ag Maschf Fritz Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104868128A (zh) * 2009-12-04 2015-08-26 三井金属矿业株式会社 多孔金属箔及其制备方法
CN102762777A (zh) * 2009-12-04 2012-10-31 三井金属矿业株式会社 多孔金属箔及其制备方法
US8497026B2 (en) * 2009-12-04 2013-07-30 Mitsui Mining & Smelting Co., Ltd. Porous metal foil and production method therefor
EP2508652A4 (fr) * 2009-12-04 2013-08-21 Mitsui Mining & Smelting Co Feuille métallique poreuse et procédé de fabrication de celle-ci
CN102762777B (zh) * 2009-12-04 2015-12-02 三井金属矿业株式会社 多孔金属箔及其制备方法
US20110318600A1 (en) * 2009-12-04 2011-12-29 Mitsui Mining & Smelting Co., Ltd. Porous metal foil and production method therefor
US20130216849A1 (en) * 2011-01-13 2013-08-22 Mitsui Mining & Smelting Co., Ltd. Reinforced porous metal foil and process for production thereof
US9512527B2 (en) * 2011-01-13 2016-12-06 Mitsui Mining & Smelting Co., Ltd. Reinforced porous metal foil and process for production thereof
TWI566459B (zh) * 2011-04-08 2017-01-11 Mitsui Mining & Smelting Co Porous metal foil and its manufacturing method
US8980438B2 (en) * 2011-04-08 2015-03-17 Mitsui Mining & Smelting Co., Ltd. Porous metal foil and production method therefor
US20130323602A1 (en) * 2011-04-08 2013-12-05 Mitsui Mining & Smelting Co., Ltd. Composite metal foil and production method therefor
US20130323527A1 (en) * 2011-04-08 2013-12-05 Mitsui Mining & Smelting Co., Ltd. Porous metal foil and production method therefor
CN103459676A (zh) * 2011-04-08 2013-12-18 三井金属矿业株式会社 多孔质金属箔及其制造方法
US9595719B2 (en) * 2011-04-08 2017-03-14 Mitsui Mining & Smelting Co., Ltd. Composite metal foil and production method therefor

Also Published As

Publication number Publication date
AU2001269611A1 (en) 2002-01-08
NL1015535C2 (nl) 2001-12-28

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