WO2002015268A3 - Kühlvorrichtung - Google Patents

Kühlvorrichtung Download PDF

Info

Publication number
WO2002015268A3
WO2002015268A3 PCT/DE2001/002865 DE0102865W WO0215268A3 WO 2002015268 A3 WO2002015268 A3 WO 2002015268A3 DE 0102865 W DE0102865 W DE 0102865W WO 0215268 A3 WO0215268 A3 WO 0215268A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling device
heat sink
thermoconducting
enlarge
linked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/002865
Other languages
English (en)
French (fr)
Other versions
WO2002015268A2 (de
Inventor
Robert Plikat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to EP01956404A priority Critical patent/EP1366519A2/de
Publication of WO2002015268A2 publication Critical patent/WO2002015268A2/de
Anticipated expiration legal-status Critical
Publication of WO2002015268A3 publication Critical patent/WO2002015268A3/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Die Erfindung betrifft eine Kühlvorrichtung für zumindest einen Leistungshalbleiter und/oder zumindest eine integrierte elektronische Schaltung, der/die mit einem Wärmeleitelement verbindbar ist, mit einer mit dem Wärmeleitelement wärmeleitfähig verbindbaren Wärmesenke, wobei das Wärmeleitelement an seiner der Wärmesenke zugewandten Seite Oberflächen vergrössernde Strukturen aufweist, die sich dadurch auszeichnet, dass die Wärmesenke (W) an ihrer dem Wärmeleitelement (7) zugewandten Seite Oberflächen vergrössernde in die Strukturen (9) passend eingreifende Gegenstrukturen (10) aufweist.
PCT/DE2001/002865 2000-08-16 2001-07-28 Kühlvorrichtung Ceased WO2002015268A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01956404A EP1366519A2 (de) 2000-08-16 2001-07-28 Kühlvorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10039770A DE10039770A1 (de) 2000-08-16 2000-08-16 Kühlvorrichtung
DE10039770.0 2000-08-16

Publications (2)

Publication Number Publication Date
WO2002015268A2 WO2002015268A2 (de) 2002-02-21
WO2002015268A3 true WO2002015268A3 (de) 2003-10-09

Family

ID=7652437

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/002865 Ceased WO2002015268A2 (de) 2000-08-16 2001-07-28 Kühlvorrichtung

Country Status (3)

Country Link
EP (1) EP1366519A2 (de)
DE (1) DE10039770A1 (de)
WO (1) WO2002015268A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335197B4 (de) * 2003-07-30 2005-10-27 Kermi Gmbh Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
DE102004012026B3 (de) * 2004-03-11 2005-11-17 Hüttinger Elektronik GmbH & Co. KG Anordnung zum Kühlen
DE102005048492B4 (de) * 2005-10-07 2009-06-04 Curamik Electronics Gmbh Elektrisches Modul
DE102007021206A1 (de) * 2007-05-05 2008-11-06 Hella Kgaa Hueck & Co. Kühlkörper
US9064737B2 (en) 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
FR2951019B1 (fr) 2009-10-07 2012-06-08 Valeo Etudes Electroniques Module de puissance pour vehicule automobile
FR3128941B1 (fr) 2021-11-08 2024-03-08 Safran Systeme electrique a refroidissement par fluide caloporteur, aeronef comportant un tel systeme et procede de fabrication d’un tel systeme
US12075601B2 (en) * 2022-06-03 2024-08-27 Vitesco Technologies USA, LLC Heat dissipation structure for inverter ground screws of a belt starter generator

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167248A (ja) * 1984-09-10 1986-04-07 Hitachi Ltd モジユ−ル冷却体構造
EP0286876A2 (de) * 1987-04-14 1988-10-19 International Business Machines Corporation Modul mit Kühlsystem für integrierte Schaltungen
US5083373A (en) * 1986-04-25 1992-01-28 Hamburgen William R Method for providing a thermal transfer device for the removal of heat from packaged elements
EP0644593A2 (de) * 1993-09-20 1995-03-22 Hitachi, Ltd. Halbleiterbauelementmodul
US5424919A (en) * 1993-03-31 1995-06-13 Export-Contor Aussenhandlesgesellschaft Mbh Repairable electronic circuit package
US5461542A (en) * 1992-12-18 1995-10-24 Robert Bosch Gmbh Multi-board electrical control device
EP0717440A2 (de) * 1994-12-15 1996-06-19 Hitachi, Ltd. Kühlvorrichtung für Mehrchipmodul
US5787976A (en) * 1996-07-01 1998-08-04 Digital Equipment Corporation Interleaved-fin thermal connector
US5814535A (en) * 1994-04-22 1998-09-29 Nec Corporation Supporting member for cooling means, electronic package and method of making the same
US5969950A (en) * 1998-11-04 1999-10-19 Sun Microsystems, Inc. Enhanced heat sink attachment
US6034430A (en) * 1996-07-01 2000-03-07 Digital Equipment Corporation Integrated thermal coupling for a heat generating device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000228470A (ja) * 1999-01-29 2000-08-15 Hewlett Packard Co <Hp> 熱接触面が改善された現場交換可能モジュ―ル

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167248A (ja) * 1984-09-10 1986-04-07 Hitachi Ltd モジユ−ル冷却体構造
US5083373A (en) * 1986-04-25 1992-01-28 Hamburgen William R Method for providing a thermal transfer device for the removal of heat from packaged elements
EP0286876A2 (de) * 1987-04-14 1988-10-19 International Business Machines Corporation Modul mit Kühlsystem für integrierte Schaltungen
US5461542A (en) * 1992-12-18 1995-10-24 Robert Bosch Gmbh Multi-board electrical control device
US5424919A (en) * 1993-03-31 1995-06-13 Export-Contor Aussenhandlesgesellschaft Mbh Repairable electronic circuit package
EP0644593A2 (de) * 1993-09-20 1995-03-22 Hitachi, Ltd. Halbleiterbauelementmodul
US5814535A (en) * 1994-04-22 1998-09-29 Nec Corporation Supporting member for cooling means, electronic package and method of making the same
EP0717440A2 (de) * 1994-12-15 1996-06-19 Hitachi, Ltd. Kühlvorrichtung für Mehrchipmodul
US5787976A (en) * 1996-07-01 1998-08-04 Digital Equipment Corporation Interleaved-fin thermal connector
US6034430A (en) * 1996-07-01 2000-03-07 Digital Equipment Corporation Integrated thermal coupling for a heat generating device
US5969950A (en) * 1998-11-04 1999-10-19 Sun Microsystems, Inc. Enhanced heat sink attachment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 236 (E - 428) 15 August 1986 (1986-08-15) *

Also Published As

Publication number Publication date
WO2002015268A2 (de) 2002-02-21
EP1366519A2 (de) 2003-12-03
DE10039770A1 (de) 2002-02-28

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