WO2002053806A3 - Vorrichtung und verfahren zur elektrochemischen beschichtung - Google Patents

Vorrichtung und verfahren zur elektrochemischen beschichtung Download PDF

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Publication number
WO2002053806A3
WO2002053806A3 PCT/DE2001/003676 DE0103676W WO02053806A3 WO 2002053806 A3 WO2002053806 A3 WO 2002053806A3 DE 0103676 W DE0103676 W DE 0103676W WO 02053806 A3 WO02053806 A3 WO 02053806A3
Authority
WO
WIPO (PCT)
Prior art keywords
layers
coated
substrate
thin layers
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/003676
Other languages
English (en)
French (fr)
Other versions
WO2002053806A2 (de
Inventor
Alexander Kraft
Karl-Heinz Heckner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GESIMAT GmbH
Original Assignee
GESIMAT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GESIMAT GmbH filed Critical GESIMAT GmbH
Priority to EP01272605A priority Critical patent/EP1534880B1/de
Priority to AU2002223435A priority patent/AU2002223435A1/en
Priority to DE50112278T priority patent/DE50112278D1/de
Priority to DE10195773T priority patent/DE10195773D2/de
Publication of WO2002053806A2 publication Critical patent/WO2002053806A2/de
Anticipated expiration legal-status Critical
Publication of WO2002053806A3 publication Critical patent/WO2002053806A3/de
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Battery Mounting, Suspending (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Abstract

Die Erfindung betrifft eine Vorrichtung und ein Verfahren, mit deren Hilfe es möglich ist, dünne Schichten mit nahezu homogener Schichtdicke auf großflächigen Substraten mit relativ hohen Widerständen elektrochemisch abzuscheiden. Bei diesen dünnen Schichten handelt es sich beispielsweise um Metall-, Metalloxid- oder Halbeiterschichten sowie Schichten leitfähiger Polymerer die z.B. auf transparenten Elektroden oder Halbleitersubstraten abgeschieden werden. Die Gegenelektrode zum zu beschichtenden Substrat wird in mehrere Elektrodensegmente aufgeteilt und zwischen jedem einzelnen Elektrodensegment und dem zu beschichtenden Substrat können voneinander verschiedene Spannungen angelegt werden. Dadurch wird eine gute Homogenität der abgeschiedenen dünnen Schichten hinsichtlich Dicke und physikalischer Eigenschaften erreicht.
PCT/DE2001/003676 2001-01-04 2001-09-24 Vorrichtung und verfahren zur elektrochemischen beschichtung Ceased WO2002053806A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01272605A EP1534880B1 (de) 2001-01-04 2001-09-24 Vorrichtung und verfahren zur elektrochemischen beschichtung
AU2002223435A AU2002223435A1 (en) 2001-01-04 2001-09-24 Electrochemical coating device and method
DE50112278T DE50112278D1 (de) 2001-01-04 2001-09-24 Vorrichtung und verfahren zur elektrochemischen beschichtung
DE10195773T DE10195773D2 (de) 2001-01-04 2001-09-24 Vorrichtung und Verfahren zur elektrochemischen Beschichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10100297A DE10100297A1 (de) 2001-01-04 2001-01-04 Vorrichtung und Verahren zur elektrochemischen Beschichtung
DE10100297.1 2001-01-04

Publications (2)

Publication Number Publication Date
WO2002053806A2 WO2002053806A2 (de) 2002-07-11
WO2002053806A3 true WO2002053806A3 (de) 2005-03-24

Family

ID=7669816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/003676 Ceased WO2002053806A2 (de) 2001-01-04 2001-09-24 Vorrichtung und verfahren zur elektrochemischen beschichtung

Country Status (5)

Country Link
EP (1) EP1534880B1 (de)
AT (1) ATE358194T1 (de)
AU (1) AU2002223435A1 (de)
DE (3) DE10100297A1 (de)
WO (1) WO2002053806A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132408C2 (de) * 2001-07-04 2003-08-21 Fraunhofer Ges Forschung Elektrode mit veränderbarer Form
DE10141056C2 (de) 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
DE102004056158B3 (de) * 2004-11-17 2006-03-30 Siemens Ag Verfahren zum Überwachen eines elektrochemischen Behandlungsprozesses und für dieses Verfahren geeignete Elektrodenanordnung
JP6993288B2 (ja) * 2018-05-07 2022-01-13 株式会社荏原製作所 めっき装置
DE102018004841B9 (de) 2018-06-13 2020-12-03 Hooshiar Mahdjour Verfahren und Vorrichtung zur automatisierten Regelung der Ströme in einem Galvanikbad
CN121219442A (zh) 2023-04-25 2025-12-26 德国艾托特克有限两合公司 用于进行电解的设备与方法及用于此设备的电极单元

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818352A (en) * 1985-06-04 1989-04-04 Central Glass Company, Limited Electrodeposition of functional film on electrode plate relatively high in surface resistivity
JPH04143299A (ja) * 1990-10-03 1992-05-18 Fujitsu Ltd 電解メッキ方法
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
WO2001014618A2 (en) * 1999-08-26 2001-03-01 Cvc Products, Inc. Apparatus and method for electroplating a material layer onto a wafer
WO2001094656A2 (en) * 2000-06-05 2001-12-13 Applied Materials, Inc. Plating apparatus with individually controllable anode segments and associated method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207909B2 (ja) * 1992-02-07 2001-09-10 ティーディーケイ株式会社 電気めっき方法および電気めっき用分割型不溶性電極
DE19717489B4 (de) * 1997-04-25 2008-04-10 Sms Demag Ag Anordnung zur elektrogalvanischen Metallbeschichtung eines Bandes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818352A (en) * 1985-06-04 1989-04-04 Central Glass Company, Limited Electrodeposition of functional film on electrode plate relatively high in surface resistivity
JPH04143299A (ja) * 1990-10-03 1992-05-18 Fujitsu Ltd 電解メッキ方法
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
WO2001014618A2 (en) * 1999-08-26 2001-03-01 Cvc Products, Inc. Apparatus and method for electroplating a material layer onto a wafer
WO2001094656A2 (en) * 2000-06-05 2001-12-13 Applied Materials, Inc. Plating apparatus with individually controllable anode segments and associated method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199226, Derwent World Patents Index; Class A85, AN 1992-213863, XP002305508 *
PATENT ABSTRACTS OF JAPAN vol. 0164, no. 19 (C - 0981) 3 September 1992 (1992-09-03) *

Also Published As

Publication number Publication date
ATE358194T1 (de) 2007-04-15
DE10195773D2 (de) 2004-01-22
DE50112278D1 (de) 2007-05-10
EP1534880B1 (de) 2007-03-28
DE10100297A1 (de) 2002-07-18
WO2002053806A2 (de) 2002-07-11
AU2002223435A1 (en) 2002-07-16
EP1534880A2 (de) 2005-06-01

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