WO2003019209A1 - Instrument d'inspection du cablage des circuits et procede d'inspection du cablage des circuits - Google Patents

Instrument d'inspection du cablage des circuits et procede d'inspection du cablage des circuits Download PDF

Info

Publication number
WO2003019209A1
WO2003019209A1 PCT/JP2002/008598 JP0208598W WO03019209A1 WO 2003019209 A1 WO2003019209 A1 WO 2003019209A1 JP 0208598 W JP0208598 W JP 0208598W WO 03019209 A1 WO03019209 A1 WO 03019209A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit wiring
instrument
inspetion
inspecting
inspecting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/008598
Other languages
English (en)
French (fr)
Inventor
Tatsuhisa Fujii
Kazuhiro Monden
Mikiya Kasai
Shogo Ishioka
Shuji Yamaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OHT Inc
Original Assignee
OHT Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OHT Inc filed Critical OHT Inc
Priority to US10/487,831 priority Critical patent/US20040234121A1/en
Priority to KR10-2004-7002813A priority patent/KR20040029049A/ko
Priority to JP2003524023A priority patent/JPWO2003019209A1/ja
Publication of WO2003019209A1 publication Critical patent/WO2003019209A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
PCT/JP2002/008598 2001-08-27 2002-08-27 Instrument d'inspection du cablage des circuits et procede d'inspection du cablage des circuits Ceased WO2003019209A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/487,831 US20040234121A1 (en) 2001-08-27 2002-08-27 Circuit wiring inspetion instrument and circuit wiring inspecting method
KR10-2004-7002813A KR20040029049A (ko) 2001-08-27 2002-08-27 회로 배선 검사 장치 및 회로 배선 검사 방법
JP2003524023A JPWO2003019209A1 (ja) 2001-08-27 2002-08-27 回路配線検査装置並びに回路配線検査方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-255620 2001-08-27
JP2001255620 2001-08-27

Publications (1)

Publication Number Publication Date
WO2003019209A1 true WO2003019209A1 (fr) 2003-03-06

Family

ID=19083558

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008598 Ceased WO2003019209A1 (fr) 2001-08-27 2002-08-27 Instrument d'inspection du cablage des circuits et procede d'inspection du cablage des circuits

Country Status (6)

Country Link
US (1) US20040234121A1 (ja)
JP (1) JPWO2003019209A1 (ja)
KR (1) KR20040029049A (ja)
CN (1) CN1549932A (ja)
TW (1) TWI223089B (ja)
WO (1) WO2003019209A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5312227B2 (ja) * 2009-06-29 2013-10-09 株式会社日本マイクロニクス プローブカード及び検査装置
CN104636279B (zh) * 2015-02-10 2017-11-28 华为技术有限公司 地址分配识别方法和地址分配识别电路
JP7009814B2 (ja) * 2017-07-27 2022-02-10 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
FR3088124A1 (fr) * 2018-11-06 2020-05-08 Stmicroelectronics (Rousset) Sas Procede d'elaboration de signaux declencheurs pour une commande d'une interface multimedia, et circuit integre correspondant
FR3088125A1 (fr) 2018-11-06 2020-05-08 Stmicroelectronics (Rousset) Sas Procede de surveillance d'une tache, en particulier une tache graphique, pour un module electronique, en particulier d'interface multimedia, et dispositif correspondant.
CN121231955B (zh) * 2025-11-06 2026-04-10 北京中煤煤炭洗选技术有限公司 一种配电系统在线绝缘检测装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11153638A (ja) * 1997-11-25 1999-06-08 Nihon Densan Riido Kk 基板検査装置および基板検査方法
JP2001221824A (ja) * 2000-02-10 2001-08-17 Oht Inc 検査装置及び検査方法、検査ユニット
WO2001063307A1 (fr) * 2000-02-22 2001-08-30 Oht, Inc. Capteur et appareil d'inspection
JP2001272430A (ja) * 2000-03-24 2001-10-05 Oht Inc 検査装置及び検査方法
JP2002022789A (ja) * 2000-07-05 2002-01-23 Oht Inc 検査装置及び検査方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868508A (en) * 1973-10-30 1975-02-25 Westinghouse Electric Corp Contactless infrared diagnostic test system
JP3080595B2 (ja) * 1997-02-28 2000-08-28 日本電産リード株式会社 基板検査装置および基板検査方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11153638A (ja) * 1997-11-25 1999-06-08 Nihon Densan Riido Kk 基板検査装置および基板検査方法
JP2001221824A (ja) * 2000-02-10 2001-08-17 Oht Inc 検査装置及び検査方法、検査ユニット
WO2001063307A1 (fr) * 2000-02-22 2001-08-30 Oht, Inc. Capteur et appareil d'inspection
JP2001272430A (ja) * 2000-03-24 2001-10-05 Oht Inc 検査装置及び検査方法
JP2002022789A (ja) * 2000-07-05 2002-01-23 Oht Inc 検査装置及び検査方法

Also Published As

Publication number Publication date
US20040234121A1 (en) 2004-11-25
TWI223089B (en) 2004-11-01
CN1549932A (zh) 2004-11-24
JPWO2003019209A1 (ja) 2004-12-16
KR20040029049A (ko) 2004-04-03

Similar Documents

Publication Publication Date Title
WO2002041102A3 (en) Processing web editor for data processing in a digital oscilloscope or similar instrument
WO2003040852A3 (de) Konzept zur kompensation der einflüsse externer störgrössen auf physikalische funktionsparameter von integrierten schaltungen
EP1329402A3 (en) Two dimensional object position sensor
WO2004008245A3 (en) Method and system for context-specific mask inspection
WO2004032715A3 (en) Method and apparatus for auto journaling of continuous or discrete body states utilizing physiological and/or contextual parameters
WO2003007139A3 (en) Control indicators for data processing systems
WO2004008487A3 (en) Test system and methodology
WO2003023363A3 (en) Microcantilever apparatus and methods for detection of enzymes
DE69602432D1 (de) Fabrikationsfehleranalysator mit verbesserter fehlererfassung
DE69620751D1 (de) Steganographisches Einbetten von Zusatzdaten und Kalibrierdaten in Bilddaten
WO2002007617A3 (en) Cutting instrument having integrated sensors
WO2006068937A3 (en) A method and system for producing signals to test semiconductor devices
WO2003015456A3 (en) Sound pollution surveillance system and method
CA2260436A1 (en) Automated method of circuit analysis
ES2178619T3 (es) Llave dinamometrica.
WO2002029390A3 (en) Method and apparatus to provide for automated process verification and hierarchical substrate examination
DE60021129D1 (de) Verfahren und Vorrichtung zur Prüfung einer elektronischen Vorrichtung
AU2001277593A1 (en) Method and device for classifying vehicles
DE50213775D1 (de) Positionsmesseinrichtung
EP0398816A3 (en) Testing method, testing circuit and semiconductor integrated circuit having testing circuit
EP1424276A3 (en) Electronic control unit for bicycle
WO2004023125A3 (en) Impedance spectroscopy based systems and methods
WO2003027687A1 (fr) Testeur et procede de test
WO2003073285A3 (en) Memory subsystem including an error detection mechanism for address and control signals
EP0709785A3 (en) Internal state determining apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR US

Kind code of ref document: A1

Designated state(s): CN JP KR

WWE Wipo information: entry into national phase

Ref document number: 1020047002813

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20028168038

Country of ref document: CN

Ref document number: 10487831

Country of ref document: US

Ref document number: 2003524023

Country of ref document: JP