WO2004017697A1 - Procede de dissipation thermique dans des appareils de communication mobiles et appareil de communication mobile - Google Patents

Procede de dissipation thermique dans des appareils de communication mobiles et appareil de communication mobile Download PDF

Info

Publication number
WO2004017697A1
WO2004017697A1 PCT/DE2003/002441 DE0302441W WO2004017697A1 WO 2004017697 A1 WO2004017697 A1 WO 2004017697A1 DE 0302441 W DE0302441 W DE 0302441W WO 2004017697 A1 WO2004017697 A1 WO 2004017697A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
mobile radio
metal foil
heat sink
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2003/002441
Other languages
German (de)
English (en)
Inventor
Jörg Romahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to JP2004528399A priority Critical patent/JP2005534197A/ja
Priority to EP03787694A priority patent/EP1523870A1/fr
Priority to AU2003250308A priority patent/AU2003250308A1/en
Priority to US10/522,349 priority patent/US20050199367A1/en
Publication of WO2004017697A1 publication Critical patent/WO2004017697A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Definitions

  • the present invention relates to a method for heat dissipation in mobile radio devices and a corresponding mobile radio device.
  • mobile telecommunications terminal devices or in mobile radio devices such as, for example, cell phones, PDAs and laptops
  • an operating range with an ambient temperature of + 55 ° C. is generally specified.
  • These mobile radio devices are constructed like a shell to the electronic components and the temperature rises from shell to shell right down to the components.
  • the maximum temperature is functionally limited.
  • the temperature can be 82 ° C for individual components in the ambient temperature and up to 100 ° C for the component itself.
  • the electronic components convert a large part of the energy / power supplied into heat, which heats the component itself as well as its immediate surroundings. The power converted into heat is therefore a power loss.
  • heat sinks or fans were mounted on the temperature-critical components.
  • heat sinks make sure that there is good heat coupling between the heat sink and the electrical component, which heats up due to the power loss.
  • gaps between the corresponding component and the heat sink are filled with heat-conducting foils or heat-conducting pastes.
  • the distribution of heat in electrical components can be influenced by an adapted structure.
  • Thermally conductive foils and pastes are better heat conductors than air, but they are also not sufficient to ensure satisfactory heat dissipation in electrical components.
  • a method for heat dissipation in mobile radio devices with heat-radiating, electrical components in which the heat-radiating components are brought into heat-dissipating operative contact with a metal foil.
  • the metal foil is corrugated and / or honeycomb-structured.
  • a corrugated and / or honeycomb-structured metal foil By using a corrugated and / or honeycomb-structured metal foil, the resistance to heat dissipation is minimized. Due to the deformability of the corrugated and / or honeycomb structured metal foil Any gaps that occur are completely filled so that optimal heat dissipation is guaranteed.
  • the honeycomb and / or corrugated metal foil can be arranged in a form-fitting manner on the surfaces to be brought into contact for heat dissipation.
  • the metal foil is brought into active contact with a heat sink or a heat sink.
  • a metallic body can be used as the heat sink, for example, which is either large-area for radiation and / or large-volume as a heat sink.
  • the metal foil itself is used as a heat sink. Whether the metal foil itself is sufficient as a heat sink depends in particular on the amount of heat loss to be dissipated.
  • the honeycomb and / or wave structure provided according to the invention offers a very large heat-radiating surface.
  • the invention comprises a mobile radio device with heat-radiating electrical components, in which the components are each brought into heat-dissipating operative contact with a metal foil.
  • the metal foil is preferably corrugated and / or has a honeycomb structure.
  • the radiating surface is increased by using a corrugated or honeycomb-structured metal foil.
  • the heat dissipation resistance is minimized on the one hand by the use of a metallic foil as well as by its corrugated or honeycomb structure.
  • the metal foil is in heat-dissipating operative contact with a heat sink.
  • the metal foil itself functions as a heat sink. Due to its honeycomb and / or wave structure, it has a very large heat-radiating surface.
  • the present invention includes the use of a corrugated and / or honeycomb-structured metal foil for heat dissipation in the case of heat-radiating electrical components in mobile radio devices.
  • FIG. 1 Schematic representation of an embodiment of the method according to the invention
  • Fig. 2 shows a schematic representation of another embodiment of the method according to the invention.
  • FIG. 3 Schematic representation of a further embodiment of the method according to the invention.
  • a circuit board 1 which is equipped on one side with components 2 which have a large amount of heat.
  • a cooling element 4 in the form of a cooling plate is arranged on the other side of the printed circuit board 1 by means of suitable connecting elements 3, which can be screws or rivets, for example.
  • suitable connecting elements 3 which can be screws or rivets, for example.
  • FIG. 2 shows another possibility of carrying out the method according to the invention.
  • a printed circuit board 1 is shown, which is equipped on one side with a component 2 with heat loss.
  • a shield cover 6 is also provided for shielding above the component 2.
  • a heat sink 4 is arranged on the other side of the printed circuit board 1. It can be a heat sink, a battery or a chassis.
  • a metal foil 5 is arranged according to the invention, which is corrugated and / or honeycomb-structured. The deformability of the corrugated and / or honeycomb-structured metal foil 5 enables very good contact of heat transfer.
  • the metal foil 5 can only produce the transition to a heat sink 4, as here in the space between the heat sink 4 and the circuit board 1. Furthermore, the metal foil 5 itself could function as a heat sink. By using a metal foil 5 with a wave or honeycomb structure, the radiating area is increased considerably.
  • FIG. 3 shows a further possibility of executing the method according to the invention.
  • a circuit board 1 with lossy component 2 arranged on one side of the circuit board 1 is also shown here.
  • a plastic part 7 is arranged on the other side of the circuit board 1.
  • a honeycomb and / or corrugated metal foil 5 is provided between the plastic part 7 and the printed circuit board 1 and can adapt to the respective surfaces due to its good deformability. Due to its structure, the metal foil 5 itself has a very large heat-radiating surface, which is also important.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

La présente invention concerne un procédé de dissipation thermique dans des appareils de communication mobiles comportant des composants électriques (2) dégageant de la chaleur, lesdits composants électriques dégageant de la chaleur étant amenés en contact avec une feuille métallique (5) de manière que leur chaleur soit dissipée. L'invention concerne également un appareil de communication mobile comportant des composants électriques (2) dégageant de la chaleur, lesdits composants électriques étant chacun amenés en contact avec une feuille métallique de manière que leur chaleur soit dissipée.
PCT/DE2003/002441 2002-07-23 2003-07-16 Procede de dissipation thermique dans des appareils de communication mobiles et appareil de communication mobile Ceased WO2004017697A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004528399A JP2005534197A (ja) 2002-07-23 2003-07-16 携帯電話装置の熱放散方法
EP03787694A EP1523870A1 (fr) 2002-07-23 2003-07-16 Procede de dissipation thermique dans des appareils de communication mobiles et appareil de communication mobile
AU2003250308A AU2003250308A1 (en) 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices and a corresponding mobile radio device
US10/522,349 US20050199367A1 (en) 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10234500.7 2002-07-23
DE10234500A DE10234500A1 (de) 2002-07-23 2002-07-23 Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät

Publications (1)

Publication Number Publication Date
WO2004017697A1 true WO2004017697A1 (fr) 2004-02-26

Family

ID=30469148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/002441 Ceased WO2004017697A1 (fr) 2002-07-23 2003-07-16 Procede de dissipation thermique dans des appareils de communication mobiles et appareil de communication mobile

Country Status (7)

Country Link
US (1) US20050199367A1 (fr)
EP (1) EP1523870A1 (fr)
JP (1) JP2005534197A (fr)
CN (1) CN1669376A (fr)
AU (1) AU2003250308A1 (fr)
DE (1) DE10234500A1 (fr)
WO (1) WO2004017697A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8325483B2 (en) 2006-04-27 2012-12-04 Kyocera Corporation Electronic device including a heat conduction member

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4155749B2 (ja) * 2002-03-20 2008-09-24 日本碍子株式会社 ハニカム構造体の熱伝導率の測定方法
JP2007300222A (ja) * 2006-04-27 2007-11-15 Kyocera Corp 電子機器
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
KR101390082B1 (ko) 2007-08-01 2014-05-28 삼성전자주식회사 프로젝터를 구비하는 이동통신 단말기
US9426930B2 (en) * 2010-12-07 2016-08-23 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
DE102015207893B3 (de) * 2015-04-29 2016-10-13 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
CN105141727A (zh) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 一种手机外壳
JP2017195514A (ja) 2016-04-20 2017-10-26 キヤノン株式会社 頭部装着装置および把持装置
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units
DE102020005527A1 (de) * 2020-09-10 2022-03-10 Daimler Ag Kühlanordnung sowie Batterieanordnung mit einem von Wärmeleitpaste umgebenen Flachgebilde zur thermischen Kopplung

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US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
US5567986A (en) * 1993-06-04 1996-10-22 Diamond Electric Mfg. Co., Ltd. Heat sink
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
EP0930231A2 (fr) * 1998-01-19 1999-07-21 TRW Inc. Matériel d'interface conductrice de chaleur amélioré
US6031727A (en) * 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
US6094349A (en) * 1997-08-07 2000-07-25 Robert Bosch Gmbh Electrical device having a printed-circuit board and method for assembling the device
US6169657B1 (en) * 1998-03-06 2001-01-02 Lg Electronics Inc. Radiating device for electronic appliances
WO2001041522A1 (fr) * 1999-12-01 2001-06-07 Chip Coolers, Inc. Cadre structurel de materiau thermoconducteur

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US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
JP2897246B2 (ja) * 1989-04-03 1999-05-31 ソニー株式会社 移動無線電話装置
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5030793A (en) * 1990-05-07 1991-07-09 Motorola Inc. Integrated EMI filter and thermal heat sink
JP3201868B2 (ja) * 1992-03-20 2001-08-27 アジレント・テクノロジーズ・インク 導電性熱インターフェース及びその方法
US5283467A (en) * 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
US5548090A (en) * 1995-08-21 1996-08-20 Northern Telecom Limited Heat sink and printed circuit board combination
WO1999019908A1 (fr) * 1997-10-14 1999-04-22 Matsushita Electric Industrial Co., Ltd. Unite de conduction thermique et structure de connexion thermique utilisant cette unite
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6545352B1 (en) * 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
US5567986A (en) * 1993-06-04 1996-10-22 Diamond Electric Mfg. Co., Ltd. Heat sink
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
US6094349A (en) * 1997-08-07 2000-07-25 Robert Bosch Gmbh Electrical device having a printed-circuit board and method for assembling the device
EP0930231A2 (fr) * 1998-01-19 1999-07-21 TRW Inc. Matériel d'interface conductrice de chaleur amélioré
US6169657B1 (en) * 1998-03-06 2001-01-02 Lg Electronics Inc. Radiating device for electronic appliances
US6031727A (en) * 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
WO2001041522A1 (fr) * 1999-12-01 2001-06-07 Chip Coolers, Inc. Cadre structurel de materiau thermoconducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8325483B2 (en) 2006-04-27 2012-12-04 Kyocera Corporation Electronic device including a heat conduction member

Also Published As

Publication number Publication date
CN1669376A (zh) 2005-09-14
US20050199367A1 (en) 2005-09-15
EP1523870A1 (fr) 2005-04-20
AU2003250308A1 (en) 2004-03-03
JP2005534197A (ja) 2005-11-10
DE10234500A1 (de) 2004-02-19

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