WO2004103040A3 - Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb) - Google Patents

Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb) Download PDF

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Publication number
WO2004103040A3
WO2004103040A3 PCT/AT2004/000168 AT2004000168W WO2004103040A3 WO 2004103040 A3 WO2004103040 A3 WO 2004103040A3 AT 2004000168 W AT2004000168 W AT 2004000168W WO 2004103040 A3 WO2004103040 A3 WO 2004103040A3
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
production
printed circuit
circuit boards
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2004/000168
Other languages
English (en)
French (fr)
Other versions
WO2004103040A2 (de
Inventor
Guenther Leising
Johannes Stahr
Fritz Haring
Zhao Ping
Gerhard Nauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&S Austria Technologie und Systemtechnik AG filed Critical AT&S Austria Technologie und Systemtechnik AG
Priority to US10/556,514 priority Critical patent/US20080032109A1/en
Priority to EP04732543A priority patent/EP1623608A2/de
Priority to JP2006529421A priority patent/JP2007505506A/ja
Publication of WO2004103040A2 publication Critical patent/WO2004103040A2/de
Publication of WO2004103040A3 publication Critical patent/WO2004103040A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Die vorliegende Erfindung betrifft einen PCB-Rohling umfassend einen säurebeständigen Schutzfilm, wobei der säurebeständige Schutzfilm aus mindestens 2 Schichten aufgebaut ist, welche untereinander bzw. mit der metallischen Oberfläche des PCB-Rohlings chemisch verbunden sind. Weiters betrifft sie ein Verfahren zur Beschichtung eines PCB-Rohlings mit einem säurebeständigen Schutzfilm, der aus mindestens 2 Schichten aufgebaut ist.
PCT/AT2004/000168 2003-05-13 2004-05-13 Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb) Ceased WO2004103040A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/556,514 US20080032109A1 (en) 2003-05-13 2004-05-13 Method for Coating Blanks for the Production of Printed Circuit Boards (Pcb)
EP04732543A EP1623608A2 (de) 2003-05-13 2004-05-13 Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
JP2006529421A JP2007505506A (ja) 2003-05-13 2004-05-13 印刷回路板（ｐｃｂ）を製造するためのブランクの被覆方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0072603A AT412094B (de) 2003-05-13 2003-05-13 Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
ATA726/2003 2003-05-13

Publications (2)

Publication Number Publication Date
WO2004103040A2 WO2004103040A2 (de) 2004-11-25
WO2004103040A3 true WO2004103040A3 (de) 2005-06-09

Family

ID=31192768

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2004/000168 Ceased WO2004103040A2 (de) 2003-05-13 2004-05-13 Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)

Country Status (5)

Country Link
US (1) US20080032109A1 (de)
EP (1) EP1623608A2 (de)
JP (1) JP2007505506A (de)
AT (1) AT412094B (de)
WO (1) WO2004103040A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004003784B4 (de) * 2004-01-23 2011-01-13 Ormecon Gmbh Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung
US7524535B2 (en) * 2004-02-25 2009-04-28 Posco Method of protecting metals from corrosion using thiol compounds
DE102004030388A1 (de) * 2004-06-23 2006-01-26 Ormecon Gmbh Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung
DE102005032142B4 (de) 2005-07-07 2014-10-09 Infineon Technologies Ag Verfahren zum Kontaktieren von Halbleiterbauteilen mit einem Testkontakt
JP5114714B2 (ja) * 2006-09-13 2013-01-09 エントーネ ゲーエムベーハー 導電性重合体と貴金属／準貴金属の塗膜を持つ物品およびその製造方法
CA2702468A1 (en) 2007-10-12 2009-04-23 University Of Connecticut Therapeutic applications of fatty acid amide hydrolase inhibitors
WO2010085319A1 (en) * 2009-01-22 2010-07-29 Aculon, Inc. Lead frames with improved adhesion to plastic encapsulant
DE102009023350A1 (de) * 2009-05-29 2010-12-02 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
US8415252B2 (en) * 2010-01-07 2013-04-09 International Business Machines Corporation Selective copper encapsulation layer deposition
WO2012132970A1 (ja) * 2011-03-30 2012-10-04 富士フイルム株式会社 プリント配線基板およびその製造方法、並びに、金属表面処理液
CN104937694B (zh) * 2013-01-21 2018-12-28 卡姆特有限公司 在多组分表面上的表面预处理和液滴铺展控制
CN109252168B (zh) * 2018-11-29 2024-01-12 珠海市智宝化工有限公司 一种高效活化酸性蚀刻液的装置及其方法
CN114885510B (zh) * 2022-04-18 2023-07-04 安捷利美维电子(厦门)有限责任公司 一种减少铜面油墨黑点污染的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834921A (ja) * 1981-08-27 1983-03-01 Nec Corp 半導体装置の製造方法
US5281449A (en) * 1990-08-09 1994-01-25 Kansai Paint Company, Limited Method of forming pattern coatings based on a radiation curable composition which contains a resin having both thioether and carboxyl groups
JP2003066619A (ja) * 2001-08-30 2003-03-05 Fujitsu Ltd レジストパターンの形成方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6190492A (ja) * 1984-10-11 1986-05-08 四国化成工業株式会社 銅スル−ホ−ルプリント配線板の製造方法
EP0364132A1 (de) * 1988-09-29 1990-04-18 Shikoku Chemicals Corporation Verfahren zur Herstellung eines Konversionsüberzuges auf Oberflächen aus Kupfer oder Kupferlegierungen
EP0559119B1 (de) * 1992-03-02 2000-10-11 Matsushita Electric Industrial Co., Ltd. Chemisch adsorbierter Film und Verfahren zur Herstellung desselben
DE19944908A1 (de) * 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834921A (ja) * 1981-08-27 1983-03-01 Nec Corp 半導体装置の製造方法
US5281449A (en) * 1990-08-09 1994-01-25 Kansai Paint Company, Limited Method of forming pattern coatings based on a radiation curable composition which contains a resin having both thioether and carboxyl groups
JP2003066619A (ja) * 2001-08-30 2003-03-05 Fujitsu Ltd レジストパターンの形成方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 115 (E - 176) 19 May 1983 (1983-05-19) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 07 3 July 2003 (2003-07-03) *

Also Published As

Publication number Publication date
JP2007505506A (ja) 2007-03-08
WO2004103040A2 (de) 2004-11-25
ATA7262003A (de) 2004-02-15
US20080032109A1 (en) 2008-02-07
AT412094B (de) 2004-09-27
EP1623608A2 (de) 2006-02-08

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