WO2004106945A1 - 電子部品試験装置 - Google Patents

電子部品試験装置

Info

Publication number
WO2004106945A1
WO2004106945A1 PCT/JP2004/007363 JP2004007363W WO2004106945A1 WO 2004106945 A1 WO2004106945 A1 WO 2004106945A1 JP 2004007363 W JP2004007363 W JP 2004007363W WO 2004106945 A1 WO2004106945 A1 WO 2004106945A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
moving device
held
output terminal
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/007363
Other languages
English (en)
French (fr)
Other versions
WO2004106945A3 (ja
WO2004106945A2 (ja
Inventor
Akihiko Ito
Kazuyuki Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2003/006835 external-priority patent/WO2004106954A1/ja
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to US10/558,385 priority Critical patent/US7511522B2/en
Priority to JP2005506502A priority patent/JPWO2004106945A1/ja
Publication of WO2004106945A1 publication Critical patent/WO2004106945A1/ja
Publication of WO2004106945A2 publication Critical patent/WO2004106945A2/ja
Publication of WO2004106945A3 publication Critical patent/WO2004106945A3/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Abstract

　ＩＣチップ（ＩＣ）の入出力端子（ＨＢ）をテストヘッドのコンタクト部に押し付けて試験を行う電子部品試験装置であって、ＩＣチップ（ＩＣ）の入出力端子（ＨＢ）が導出している前面を把持部（４１４）により把持して移動させるＩＣ移動装置４１０と、把持される前のＩＣチップ（ＩＣ）の前面を撮像する第１のカメラ（４１５）と、把持されたＩＣチップ（ＩＣ）の背面を撮像する第２のカメラ（４２０）と、第１のカメラ（４１５）及び第２のカメラ（４２０）により撮像された画像情報から、ＩＣ移動装置（４１０）に把持されたＩＣチップ（ＩＣ）の入出力端子（ＨＢ）の位置を算出し、当該算出結果に基づいて、ＩＣ移動装置（４１０）に把持されたＩＣチップ（ＩＣ）の入出力端子（ＨＢ）のコンタクト部に対する相対的位置を特定する画像処理装置と備え、ＩＣ移動装置４１０は、画像処理装置により特定されたＩＣチップ（ＩＣ）の入出力端子（ＨＢ）のコンタクト部に対する相対的位置に基づいて、ＩＣチップの位置を補正する。
PCT/JP2004/007363 2003-05-30 2004-05-28 電子部品試験装置 Ceased WO2004106945A2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/558,385 US7511522B2 (en) 2003-05-30 2004-05-28 Electronic device test apparatus
JP2005506502A JPWO2004106945A1 (ja) 2003-05-30 2004-05-28 電子部品試験装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2003/006835 WO2004106954A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置
JPPCT/JP03/06835 2003-05-30

Publications (3)

Publication Number Publication Date
WO2004106945A1 true WO2004106945A1 (ja) 2004-12-09
WO2004106945A2 WO2004106945A2 (ja) 2004-12-09
WO2004106945A3 WO2004106945A3 (ja) 2005-02-17

Family

ID=33485800

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2003/006835 Ceased WO2004106954A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置
PCT/JP2004/007363 Ceased WO2004106945A2 (ja) 2003-05-30 2004-05-28 電子部品試験装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/006835 Ceased WO2004106954A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置

Country Status (7)

Country Link
US (1) US7511522B2 (ja)
JP (1) JPWO2004106945A1 (ja)
KR (1) KR100815490B1 (ja)
CN (1) CN1788205A (ja)
AU (1) AU2003241977A1 (ja)
TW (1) TW200504376A (ja)
WO (2) WO2004106954A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10297043B2 (en) 2017-04-07 2019-05-21 Advantest Corporation Detector for detecting position of IC device and method for the same

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
JP5022375B2 (ja) * 2006-10-12 2012-09-12 株式会社アドバンテスト トレイ搬送装置及びそれを備えた電子部品試験装置
US8167523B2 (en) * 2007-07-12 2012-05-01 Asm Assembly Automation Ltd Singulation handler comprising vision system
ITUD20070239A1 (it) * 2007-12-18 2009-06-19 Baccini S P A Dispositivo di collaudo per collaudare piastre per circuiti elettronici e relativo procedimento
US7960992B2 (en) * 2009-02-25 2011-06-14 Kingston Technology Corp. Conveyor-based memory-module tester with elevators distributing moving test motherboards among parallel conveyors for testing
JP2011086880A (ja) * 2009-10-19 2011-04-28 Advantest Corp 電子部品実装装置および電子部品の実装方法
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
TWI418811B (zh) * 2011-02-14 2013-12-11 久元電子股份有限公司 封裝晶片檢測與分類裝置
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP2013053991A (ja) 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
US8807318B2 (en) * 2011-09-20 2014-08-19 International Business Machines Corporation Multi-generational carrier platform
JP2013145134A (ja) * 2012-01-13 2013-07-25 Advantest Corp ハンドラ装置および試験装置
KR101350214B1 (ko) * 2012-07-06 2014-01-16 주식회사 미르기술 비접촉식 발광다이오드 검사장치와 이를 이용한 검사방법
KR101362524B1 (ko) * 2012-07-27 2014-02-17 세메스 주식회사 전자 부품 수납 장치
TWI472778B (zh) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
KR101508433B1 (ko) * 2013-09-11 2015-04-07 주식회사 엘지씨엔에스 Ic칩 리더기 및 그것의 동작 방법
CN106959410B (zh) * 2013-11-11 2019-10-18 伊斯梅卡半导体控股公司 用于处理构件的组件和方法
JP2015232446A (ja) * 2014-06-09 2015-12-24 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20180033119A (ko) * 2015-07-31 2018-04-02 이스메카 세미컨덕터 홀딩 에스.아. 부품 취급 조립체 및 부품 취급 방법
CN106959409A (zh) * 2015-10-30 2017-07-18 精工爱普生株式会社 电子部件搬运装置以及电子部件检查装置
JP2017083373A (ja) * 2015-10-30 2017-05-18 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN107176450A (zh) * 2016-03-09 2017-09-19 精工爱普生株式会社 电子部件运送装置、以及电子部件检查装置
KR102656451B1 (ko) * 2016-03-18 2024-04-12 (주)테크윙 전자부품 테스트용 핸들러
TW201738577A (zh) * 2016-03-29 2017-11-01 三角設計公司 積體電路測試點視像對準系統
CN107632656A (zh) * 2016-07-19 2018-01-26 扬智科技股份有限公司 集成电路结构
CN107931154B (zh) * 2016-10-13 2019-07-26 泰克元有限公司 电子部件测试用分选机及其示教点调整方法
US10473714B2 (en) * 2017-03-06 2019-11-12 Asm Technology Singapore Pte Ltd Method and apparatus for aligning electronic components
JP6809978B2 (ja) * 2017-04-28 2021-01-06 株式会社アドバンテスト 電子部品試験装置用のキャリア
US10324127B2 (en) * 2017-06-08 2019-06-18 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
US11961220B2 (en) * 2018-01-23 2024-04-16 Texas Instruments Incorporated Handling integrated circuits in automated testing
TWI679428B (zh) * 2019-02-01 2019-12-11 迅得機械股份有限公司 訊號接通裝置及訊號接通方法
TWI729822B (zh) * 2020-05-22 2021-06-01 美商第一檢測有限公司 環境控制設備及晶片測試系統
JP7638723B2 (ja) * 2021-02-18 2025-03-04 東京エレクトロン株式会社 検査装置のセットアップ方法及び検査装置
CN113835019B (zh) * 2021-11-25 2022-02-18 河北圣昊光电科技有限公司 一种芯片自动对位装置及对位方法
CN116343213B (zh) * 2023-05-31 2023-08-25 成都数之联科技股份有限公司 模型训练及芯片的字符识别方法、装置、设备和介质
TWI918185B (zh) * 2023-10-19 2026-03-11 韓商泰克元股份有限公司 用於測試電子元件的處理機及用於測試電子元件的處理機的電子元件重新配置方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ｉｃ実装装置及びその方法
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
JPH0422150A (ja) * 1990-05-17 1992-01-27 Tokyo Electron Ltd プローブ方法
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
JPH06309436A (ja) 1993-04-23 1994-11-04 Ando Electric Co Ltd Ｑｆｐ型ｉｃ用ｉｃソケットの位置検出方法
US5481202A (en) * 1993-06-17 1996-01-02 Vlsi Technology, Inc. Optical scan and alignment of devices under test
DE69534124T2 (de) * 1994-04-18 2006-05-04 Micron Technology, Inc. Verfahren und Vorrichtung zum automatischen Positionieren elektronischer Würfel in Bauteilverpackungen
JPH08236594A (ja) * 1995-02-28 1996-09-13 Hitachi Ltd 半導体装置の検査装置
US5946409A (en) * 1995-05-31 1999-08-31 Nec Corporation Pick-up apparatus and method for semiconductor devices
KR0152879B1 (ko) * 1995-10-10 1998-12-15 이희종 표면실장기의 부품인식방법 및 장치
JPH09211067A (ja) 1996-01-29 1997-08-15 Toshiba Corp 半導体装置の試験装置
US5644979A (en) * 1996-04-30 1997-07-08 Preco Industries, Inc. Die cutting and stamping press having simultaneous X, Y, and .O slashed. axes die registration mechanism and method
JPH1022365A (ja) * 1996-07-04 1998-01-23 Mitsubishi Electric Corp 位置決め装置
JP3019005B2 (ja) * 1996-10-16 2000-03-13 日本電気株式会社 Ｌｓｉハンドラ
US5956134A (en) * 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
US6707552B2 (en) * 2000-12-18 2004-03-16 Triquint Technology Holding Co. High precision laser bar test fixture
JP4451992B2 (ja) * 2001-02-28 2010-04-14 株式会社アドバンテスト 試験用電子部品搬送媒体、電子部品試験装置および試験方法
SG129992A1 (en) * 2001-08-13 2007-03-20 Micron Technology Inc Method and apparatus for detecting topographical features of microelectronic substrates
WO2004106953A1 (ja) * 2003-05-30 2004-12-09 Advantest Corporation 電子部品試験装置
US6873169B1 (en) * 2004-03-11 2005-03-29 Mirae Corporation Carrier module for semiconductor device test handler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10297043B2 (en) 2017-04-07 2019-05-21 Advantest Corporation Detector for detecting position of IC device and method for the same

Similar Documents

Publication Publication Date Title
WO2004106945A3 (ja) 電子部品試験装置
EP1598775A4 (en) IMAGE PROCESSING DEVICE, METHOD, AND PROGRAM
WO2004061505A3 (en) Systems and methods for inspecting an optical interface
TWI267299B (en) Imaging apparatus and integrated circuit for imaging element
TW200718185A (en) Wafer based camera module and method of manufacture
WO2006012139A3 (en) System and method for mounting an image capture device on a flexible substrate
EP1098167A3 (en) Jig for use in measuring mounting accuracy of mounting device and method of measuring mounting accuracy of mounting device
EP1239719A3 (en) Method, apparatus, system, method and device for data creating, and program for mounting electronic component
AU2003297064A1 (en) Method for using an electronic imaging device to measure color
TW200725545A (en) An apparatus and method for adjusting display-related setting of an electronic device
WO2007077719A8 (ja) 撮像装置およびその画像処理方法
EP1814314A3 (en) Image sensing devices, image sensor modules, and associated methods
GB2436764A (en) Method for forming images,method for testing electronic devices;and test apparatus,test chamber and test system
TW200640689A (en) Screen printing method and apparatus thereof
AU2775301A (en) Image capture module for use on an electronic device
WO2003085456A3 (de) Verfahren und vorrichtung zum abbilden einer maske auf einem substrat
GB0308509D0 (en) Inspection apparatus and method
EP1494522A3 (en) Electronic component feeding device and electronic component mounting apparatus having the same
WO2005062029A3 (en) A tape manufacturing system
TW200641723A (en) Decreasing aliasing in electronic images
WO2002033959A3 (en) Cmos imaging apparatus
DE60204849D1 (de) Verfahren und einrichtung zur lageerfassung der anschlusskontakte elektronischer bauelemente
EP1408449A3 (en) Method and apparatus for identifying a photographic camera by correlating two images
TW200420117A (en) Image processing apparatus and image display apparatus
BRPI0513008A (pt) aparelho de formação de imagem, circuito integrado para um dispositivo de captação de imagem, e, método de processamento de dados de imagem