WO2004106945A3 - 電子部品試験装置 - Google Patents

電子部品試験装置 Download PDF

Info

Publication number
WO2004106945A3
WO2004106945A3 PCT/JP2004/007363 JP2004007363W WO2004106945A3 WO 2004106945 A3 WO2004106945 A3 WO 2004106945A3 JP 2004007363 W JP2004007363 W JP 2004007363W WO 2004106945 A3 WO2004106945 A3 WO 2004106945A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
moving device
held
output terminal
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/007363
Other languages
English (en)
French (fr)
Other versions
WO2004106945A2 (ja
WO2004106945A1 (ja
Inventor
Akihiko Ito
Kazuyuki Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to US10/558,385 priority Critical patent/US7511522B2/en
Priority to JP2005506502A priority patent/JPWO2004106945A1/ja
Publication of WO2004106945A2 publication Critical patent/WO2004106945A2/ja
Publication of WO2004106945A1 publication Critical patent/WO2004106945A1/ja
Publication of WO2004106945A3 publication Critical patent/WO2004106945A3/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56016—Apparatus features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

　ＩＣチップ（ＩＣ）の入出力端子（ＨＢ）をテストヘッドのコンタクト部に押し付けて試験を行う電子部品試験装置であって、ＩＣチップ（ＩＣ）の入出力端子（ＨＢ）が導出している前面を把持部（４１４）により把持して移動させるＩＣ移動装置４１０と、把持される前のＩＣチップ（ＩＣ）の前面を撮像する第１のカメラ（４１５）と、把持されたＩＣチップ（ＩＣ）の背面を撮像する第２のカメラ（４２０）と、第１のカメラ（４１５）及び第２のカメラ（４２０）により撮像された画像情報から、ＩＣ移動装置（４１０）に把持されたＩＣチップ（ＩＣ）の入出力端子（ＨＢ）の位置を算出し、当該算出結果に基づいて、ＩＣ移動装置（４１０）に把持されたＩＣチップ（ＩＣ）の入出力端子（ＨＢ）のコンタクト部に対する相対的位置を特定する画像処理装置と備え、ＩＣ移動装置４１０は、画像処理装置により特定されたＩＣチップ（ＩＣ）の入出力端子（ＨＢ）のコンタクト部に対する相対的位置に基づいて、ＩＣチップの位置を補正する。
PCT/JP2004/007363 2003-05-30 2004-05-28 電子部品試験装置 Ceased WO2004106945A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/558,385 US7511522B2 (en) 2003-05-30 2004-05-28 Electronic device test apparatus
JP2005506502A JPWO2004106945A1 (ja) 2003-05-30 2004-05-28 電子部品試験装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP03/06835 2003-05-30
PCT/JP2003/006835 WO2004106954A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置

Publications (3)

Publication Number Publication Date
WO2004106945A2 WO2004106945A2 (ja) 2004-12-09
WO2004106945A1 WO2004106945A1 (ja) 2004-12-09
WO2004106945A3 true WO2004106945A3 (ja) 2005-02-17

Family

ID=

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06309436A (ja) * 1993-04-23 1994-11-04 Ando Electric Co Ltd Ｑｆｐ型ｉｃ用ｉｃソケットの位置検出方法
JPH09211067A (ja) * 1996-01-29 1997-08-15 Toshiba Corp 半導体装置の試験装置
JP2002257900A (ja) * 2001-02-28 2002-09-11 Advantest Corp 試験用電子部品搬送媒体、電子部品試験装置および試験方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06309436A (ja) * 1993-04-23 1994-11-04 Ando Electric Co Ltd Ｑｆｐ型ｉｃ用ｉｃソケットの位置検出方法
JPH09211067A (ja) * 1996-01-29 1997-08-15 Toshiba Corp 半導体装置の試験装置
JP2002257900A (ja) * 2001-02-28 2002-09-11 Advantest Corp 試験用電子部品搬送媒体、電子部品試験装置および試験方法

Also Published As

Publication number Publication date
KR100815490B1 (ko) 2008-03-24
KR20060003110A (ko) 2006-01-09
WO2004106954A1 (ja) 2004-12-09
US20070069752A1 (en) 2007-03-29
TW200504376A (en) 2005-02-01
CN1788205A (zh) 2006-06-14
WO2004106945A2 (ja) 2004-12-09
AU2003241977A1 (en) 2005-01-21
US7511522B2 (en) 2009-03-31
JPWO2004106945A1 (ja) 2006-07-20

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