WO2005101480A3 - Mit planarer verbindungstechnik auf einem insbesondere elektrisch leitendem substrat aufgebaute schaltung - Google Patents

Mit planarer verbindungstechnik auf einem insbesondere elektrisch leitendem substrat aufgebaute schaltung Download PDF

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Publication number
WO2005101480A3
WO2005101480A3 PCT/EP2005/051618 EP2005051618W WO2005101480A3 WO 2005101480 A3 WO2005101480 A3 WO 2005101480A3 EP 2005051618 W EP2005051618 W EP 2005051618W WO 2005101480 A3 WO2005101480 A3 WO 2005101480A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
circuit mounted
electroconductive substrate
connection technique
planar connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/051618
Other languages
English (en)
French (fr)
Other versions
WO2005101480A2 (de
Inventor
Eric Baudelot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2005101480A2 publication Critical patent/WO2005101480A2/de
Publication of WO2005101480A3 publication Critical patent/WO2005101480A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

Eine Vorrichtung weist ein über eine Isolationsschicht auf einem Substrat angeordnetes Bauelement und eine Verbindung des Bauelements mit dem Substrat und/oder einem weiteren Bauelement auf. Die Verbindung enthält eine Schicht aus elektrisch isolierendem Material, die an dem Bauelement sowie dem Substrat und/oder dem weiteren Bauelement angeordnet ist, und eine Schicht aus elektrisch leitendem Material, die an der Schicht aus elektrisch isolierendem Material angeordnet ist und das Bauelement mit dem Substrat und/oder dem weiteren Bauelement elektrisch verbindet.
PCT/EP2005/051618 2004-04-19 2005-04-13 Mit planarer verbindungstechnik auf einem insbesondere elektrisch leitendem substrat aufgebaute schaltung Ceased WO2005101480A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004019445A DE102004019445A1 (de) 2004-04-19 2004-04-19 Mit planarer Verbindungstechnik auf einem insbesondere elektrischleitendem Substrat aufgebaute Schaltung
DE102004019445.9 2004-04-19

Publications (2)

Publication Number Publication Date
WO2005101480A2 WO2005101480A2 (de) 2005-10-27
WO2005101480A3 true WO2005101480A3 (de) 2006-01-05

Family

ID=34967484

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/051618 Ceased WO2005101480A2 (de) 2004-04-19 2005-04-13 Mit planarer verbindungstechnik auf einem insbesondere elektrisch leitendem substrat aufgebaute schaltung

Country Status (2)

Country Link
DE (1) DE102004019445A1 (de)
WO (1) WO2005101480A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006015117A1 (de) * 2006-03-31 2007-10-04 Osram Opto Semiconductors Gmbh Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip
US7799614B2 (en) * 2007-12-21 2010-09-21 Infineon Technologies Ag Method of fabricating a power electronic device
DE102015015699A1 (de) * 2015-12-04 2017-06-08 Abb Schweiz Ag Elektronisches Leistungsmodul

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001037338A2 (de) * 1999-11-16 2001-05-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Verfahren zum integrieren eines chips innerhalb einer leiterplatte und integrierte schaltung
US20020053720A1 (en) * 2000-09-15 2002-05-09 Alstom Substrate for an electronic circuit, and an electronic module using such a substrate
WO2003030247A2 (de) * 2001-09-28 2003-04-10 Siemens Aktiengesellschaft Verfahren zum kontaktieren elektrischer kontaktflächen eines substrats und vorrichtung aus einem substrat mit elektrischen kontaktflächen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI946015A7 (fi) * 1994-07-08 1996-01-09 Picopak Oy Electroless-kontaktinystynmuodostusmenetelmä

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001037338A2 (de) * 1999-11-16 2001-05-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Verfahren zum integrieren eines chips innerhalb einer leiterplatte und integrierte schaltung
US20020053720A1 (en) * 2000-09-15 2002-05-09 Alstom Substrate for an electronic circuit, and an electronic module using such a substrate
WO2003030247A2 (de) * 2001-09-28 2003-04-10 Siemens Aktiengesellschaft Verfahren zum kontaktieren elektrischer kontaktflächen eines substrats und vorrichtung aus einem substrat mit elektrischen kontaktflächen

Also Published As

Publication number Publication date
DE102004019445A1 (de) 2005-11-03
WO2005101480A2 (de) 2005-10-27

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