WO2006018267A3 - Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung - Google Patents

Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung Download PDF

Info

Publication number
WO2006018267A3
WO2006018267A3 PCT/EP2005/008853 EP2005008853W WO2006018267A3 WO 2006018267 A3 WO2006018267 A3 WO 2006018267A3 EP 2005008853 W EP2005008853 W EP 2005008853W WO 2006018267 A3 WO2006018267 A3 WO 2006018267A3
Authority
WO
WIPO (PCT)
Prior art keywords
rectifier circuit
power dissipation
coupling capacitor
optimized high
frequency coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/008853
Other languages
English (en)
French (fr)
Other versions
WO2006018267A2 (de
Inventor
Martin Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atmel Germany GmbH
Original Assignee
Atmel Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Germany GmbH filed Critical Atmel Germany GmbH
Priority to EP05774668A priority Critical patent/EP1779414A2/de
Publication of WO2006018267A2 publication Critical patent/WO2006018267A2/de
Publication of WO2006018267A3 publication Critical patent/WO2006018267A3/de
Anticipated expiration legal-status Critical
Priority to US11/707,996 priority patent/US20070145528A1/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/206—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of combinations of capacitors and resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Rectifiers (AREA)

Abstract

Die Erfindung betrifft einen verlustleistungsoptimierten Hochfrequenz-Koppelkondensator fur eine Gleichrichterschaltung sowie eine verlustleistungsoptimierte Hochfrequenz-Gleichrichterschaltung. Bei der erfindungsgemaRen Hochfrequenz-Gleichrichterschaltung sind die Elemente der Gleichrichterstufen derart platzoptimiert angeordnet, dass die Koppelkapazitaten unter Berücksichtigung der Anschlussleitungen jeweils direkt an der Kontaktfläche für den Antennenanschluss angeschlossen sind und um die Kontaktfläche herum angeordnet sind.
PCT/EP2005/008853 2004-08-19 2005-08-16 Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung Ceased WO2006018267A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05774668A EP1779414A2 (de) 2004-08-19 2005-08-16 Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung
US11/707,996 US20070145528A1 (en) 2004-08-19 2007-02-20 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004040182.9 2004-08-19
DE102004040182 2004-08-19
DE102005035346A DE102005035346A1 (de) 2004-08-19 2005-07-28 Verlustleistungsoptimierter Hochfrequenz-Koppelkondensator und Gleichrichterschaltung
DE102005035346.0 2005-07-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/707,996 Continuation US20070145528A1 (en) 2004-08-19 2007-02-20 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit

Publications (2)

Publication Number Publication Date
WO2006018267A2 WO2006018267A2 (de) 2006-02-23
WO2006018267A3 true WO2006018267A3 (de) 2006-04-27

Family

ID=35482316

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/008853 Ceased WO2006018267A2 (de) 2004-08-19 2005-08-16 Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung

Country Status (4)

Country Link
US (1) US20070145528A1 (de)
EP (1) EP1779414A2 (de)
DE (1) DE102005035346A1 (de)
WO (1) WO2006018267A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2579683B1 (de) * 2010-06-04 2020-06-03 Konica Minolta, Inc. Beleuchtungsvorrichtung
FR3080948B1 (fr) * 2018-05-02 2025-01-17 St Microelectronics Rousset Circuit integre comprenant un element capacitif, et procede de fabrication
CN112563030B (zh) * 2020-12-01 2022-02-15 上海上电电容器有限公司 无感均压阻尼分压电容器
AU2023458144A1 (en) * 2023-06-30 2026-02-12 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Circuit board, transformer, microwave generation device, and household appliance

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786512A (ja) * 1993-09-10 1995-03-31 Toshiba Corp 半導体装置
US5854480A (en) * 1995-07-18 1998-12-29 Oki Electric Indusry Co., Ltd. Tag with IC capacitively coupled to antenna
JP2002009574A (ja) * 2000-06-23 2002-01-11 Matsushita Electric Ind Co Ltd 移相器
US6400274B1 (en) * 1995-08-31 2002-06-04 Intermec Ip Corp. High-performance mobile power antennas
US6472942B1 (en) * 2000-08-21 2002-10-29 Em (Us) Design, Inc. Parasitically compensated resistor for integrated circuits
US20030085447A1 (en) * 1999-01-04 2003-05-08 International Business Machines Corporation Beol decoupling capacitor
US20040065899A1 (en) * 2002-09-13 2004-04-08 Yasutaka Takabayashi Semiconductor device
EP1437816A2 (de) * 2003-01-10 2004-07-14 ATMEL Germany GmbH Schaltungsanordnung zur Bereitstellung elektrischer Leistung aus einem elektromagnetischen Feld

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153583A (en) * 1987-11-18 1992-10-06 Uniscan Ltd. Transponder
US5445974A (en) * 1993-03-31 1995-08-29 Siemens Components, Inc. Method of fabricating a high-voltage, vertical-trench semiconductor device
US5622886A (en) * 1994-03-31 1997-04-22 Atmel Corporation Method of making a high voltage rectifier for an integrated circuit chip
US6347121B1 (en) * 1997-03-11 2002-02-12 Erkka Sointula Transmitting and receiving radio signals
US6054925A (en) * 1997-08-27 2000-04-25 Data Investments Limited High impedance transponder with improved backscatter modulator for electronic identification system
EP1018692B1 (de) * 1999-01-08 2006-06-28 Anatoli Stobbe Sicherungssystem, Transponder und Empfangsvorrichtung
US6650226B1 (en) * 1999-04-07 2003-11-18 Stmicroelectronics S.A. Detection, by an electromagnetic transponder reader, of the distance separating it from a transponder
JP2002290246A (ja) * 2001-03-28 2002-10-04 Hitachi Kokusai Electric Inc 送受信機
KR100505658B1 (ko) * 2002-12-11 2005-08-03 삼성전자주식회사 ＭＩＭ(Ｍｅｔａｌ-Ｉｎｓｕｌａｔｏｒ-Ｍｅｔａｌ)커패시터를 갖는 반도체 소자
DE10301451A1 (de) * 2003-01-10 2004-07-22 Atmel Germany Gmbh Verfahren sowie Sende- und Empfangseinrichtung zur drahtlosen Datenübertragung und Modulationseinrichtung
DE10306689A1 (de) * 2003-02-11 2004-08-19 Atmel Germany Gmbh Schaltungsanordnung zur Signaldetektion
DE10322888A1 (de) * 2003-05-21 2004-12-16 Atmel Germany Gmbh Intergrierter Schaltkreis mit Transponder
DE10356259B4 (de) * 2003-12-03 2010-07-22 Atmel Automotive Gmbh Verfahren und Schaltungsanordnung zum Vergrößern einer Funktionsreichweite bei einer aus einem elektromagnetischen Feld mit Energie versorgten Vorrichtung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786512A (ja) * 1993-09-10 1995-03-31 Toshiba Corp 半導体装置
US5854480A (en) * 1995-07-18 1998-12-29 Oki Electric Indusry Co., Ltd. Tag with IC capacitively coupled to antenna
US6400274B1 (en) * 1995-08-31 2002-06-04 Intermec Ip Corp. High-performance mobile power antennas
US20030085447A1 (en) * 1999-01-04 2003-05-08 International Business Machines Corporation Beol decoupling capacitor
JP2002009574A (ja) * 2000-06-23 2002-01-11 Matsushita Electric Ind Co Ltd 移相器
US6472942B1 (en) * 2000-08-21 2002-10-29 Em (Us) Design, Inc. Parasitically compensated resistor for integrated circuits
US20040065899A1 (en) * 2002-09-13 2004-04-08 Yasutaka Takabayashi Semiconductor device
EP1437816A2 (de) * 2003-01-10 2004-07-14 ATMEL Germany GmbH Schaltungsanordnung zur Bereitstellung elektrischer Leistung aus einem elektromagnetischen Feld

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06 31 July 1995 (1995-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03) *

Also Published As

Publication number Publication date
DE102005035346A1 (de) 2006-03-09
US20070145528A1 (en) 2007-06-28
WO2006018267A2 (de) 2006-02-23
EP1779414A2 (de) 2007-05-02

Similar Documents

Publication Publication Date Title
EP1170929A3 (de) Klappbares und tragbares Funkgerät
WO2010066799A3 (fr) Circuit d'antenne rfid
WO2003021667A3 (en) Package with integrated inductor and/or capacitor
TW200629521A (en) Semiconductor device
WO2009075157A1 (ja) インバータ一体型電動圧縮機
WO2008087781A1 (ja) Ｄｃ－ｄｃコンバータモジュール
WO2008146525A1 (ja) デュプレクサ及び弾性波装置
WO2009052517A3 (en) Surge suppression device having one or more rings
AU2003214513A1 (en) Mobile terminal featuring smart card interrupt
WO2009032465A3 (en) Redistribution structures for microfeature workpieces
TW200518123A (en) Coplanar transformer
WO2008080787A3 (de) Funkentstörung für einen elektrischen antrieb
WO2006007321A3 (en) Electrical filter assembly having idc connection
WO2002103789A3 (en) Electronic assembly with laterally connected capacitors and manufacturing method
WO2006018267A3 (de) Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung
WO2004073116A3 (en) Filtered electrical connector
WO2009000833A3 (de) Elektrisches speichermodul mit kühlkörpern
TW563936U (en) Electronic card connector having power contacts
WO2003073814A3 (en) Laminated socket contacts
TW200711096A (en) Surge absorbing circuit
TW200802794A (en) Design of low inductance embedded capacitor layer connections
TW496594U (en) Electrical connector having compression terminal module therein
WO2009103447A8 (de) Verfahren zur aufnahme eines elektrischen/elektronischen bauteils und entsprechendes montageverfahren sowie abdeckung für eine solche vorrichtung
TW200731305A (en) Multilayer capacitor
AU2002359750A1 (en) On-chip impedance matching circuit using bond wire inductors

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005774668

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 11707996

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 2005774668

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 11707996

Country of ref document: US