WO2006077804A1 - Appareil de serrage et appareil de formation d'image - Google Patents

Appareil de serrage et appareil de formation d'image Download PDF

Info

Publication number
WO2006077804A1
WO2006077804A1 PCT/JP2006/300478 JP2006300478W WO2006077804A1 WO 2006077804 A1 WO2006077804 A1 WO 2006077804A1 JP 2006300478 W JP2006300478 W JP 2006300478W WO 2006077804 A1 WO2006077804 A1 WO 2006077804A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
clamp
stage
workpiece
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/300478
Other languages
English (en)
Japanese (ja)
Inventor
Akihiro Hashiguchi
Takashi Fukui
Kazuhiro Terada
Hiroki Sudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Fujifilm Corp
Original Assignee
Fujifilm Corp
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp, Fuji Photo Film Co Ltd filed Critical Fujifilm Corp
Publication of WO2006077804A1 publication Critical patent/WO2006077804A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards

Definitions

  • the present invention relates to a clamp device for clamping a workpiece such as a printed wiring board mounted on a stage, and further, the clamped printed wiring by a light beam modulated based on image information.
  • the present invention relates to an image forming apparatus that forms an image by exposing a drawing area of a workpiece such as a substrate.
  • the laser exposure apparatus includes a stage member on which a printed wiring board to be subjected to image exposure is placed (loaded), and the stage member is moved along a predetermined conveyance path. It has become.
  • the printed wiring board is sucked onto the stage member by sucking air from a plurality of (many) holes provided on the upper surface of the stage member. Is positioned and mounted.
  • the stage member positioned and mounted on the stage member and attracted and held moves at a predetermined speed in the sub-running direction, and is positioned at a predetermined measurement position and aligned on the printed wiring board.
  • a hole (hereinafter referred to as “alignment mark”) is imaged by a CCD camera.
  • alignment processing is performed on the image information by performing coordinate conversion of the drawing target area in the drawing coordinate system in accordance with the position of the printed wiring board obtained by the imaging.
  • the printed circuit board on the stage member is modulated on the basis of the image information at a predetermined exposure position, and the upper surface of the printed circuit board is deflected in the main scanning direction by a polygon mirror.
  • the photosensitive coating film formed on is scanned and exposed.
  • an image (latent image) based on the image information (corresponding to the wiring pattern) is formed in a predetermined area (drawing area) on the printed wiring board.
  • the printed wiring board on which the image (latent image) is formed has the stage member at the initial position. After returning, the stage member taken out (unloaded) from the stage member and removed from the printed wiring board is transferred to a process for exposing the next printed wiring board (for example, Patent Document 1). reference).
  • Patent Document 1 JP 2000-338432 A
  • the substrate When the thickness of the printed circuit board is thin, for example, 1.5 mm or less, the substrate can be sufficiently adsorbed and held on the stage member by the air suction force. 3. If it is thicker than Omm, the substrate itself may be warped. Therefore, the substrate can be sufficiently sucked and held (fixed) on the stage member only by the air suction force. There was a problem that became difficult.
  • the present invention provides a clamping device capable of securely fixing a workpiece (processing object) having a thickness that can be attached to and detached from the stage and warps, on the stage.
  • An image forming apparatus including a clamp device is provided.
  • the clamping device includes a base on which a plate-shaped workpiece is placed and detachably mounted on a stage, and the edge of the workpiece is provided on the base. And a clamp part for clamping, wherein the base is provided with a plurality of communication holes for communicating between the base upper surface side and the stage side.
  • At least a part of the communication hole is a plurality of suction holes provided in the stage. It is characterized by being the same arrangement as at least a part of.
  • the clamp portion can be attached to and detached from the stage, the clamp portion can be attached to and detached from the stage, and ⁇ ⁇ Since the base on which the workpiece is placed has a plurality of communication holes that communicate with the suction holes on the stage, even workpieces with a thickness that would cause warping are securely fixed on the stage via the base. The power to do S. In addition, it is not necessary to clamp the workpiece on the stage (since it is only necessary to clamp the workpiece on the base), the clamping operation can be performed easily.
  • the clamping device according to the third aspect of the present invention is the clamping device according to the first or second aspect of the present invention, wherein a plurality of the clamp portions are provided for one side of the base. It is characterized by comprising a clamp member.
  • the clamping device is the clamping device according to any one of the four aspects according to the first aspect to the third aspect of the present invention, wherein the clamp portion is provided on the base.
  • a support portion is the clamping device according to any one of the four aspects according to the first aspect to the third aspect of the present invention, wherein the clamp portion is provided on the base.
  • the clamping device is the clamping device according to any one of the first aspect to the third aspect of the present invention, wherein the clamping portion is provided on the base.
  • a locking plate that engages with the flange and prevents the clamp member from falling off the support column, and a through hole formed in a base portion on the opposite side of the claw portion of the clamp member.
  • the force S for easily mounting the clamp member to the base can be achieved.
  • the contact part (claw part) provided on the opposite side of the base part is configured to clamp (press) the workpiece. Can be achieved.
  • the image forming apparatus of the sixth aspect of the present invention is configured so that the stage on which the base in any of the four clamping devices of the first aspect to the fifth aspect of the present invention is mounted has a predetermined conveying path.
  • the stage on which the base in one clamp device is mounted is transported in a predetermined manner.
  • Image information indicating a conveyance mechanism that conveys along the path, a measurement unit that detects the alignment mark of the workpiece on the stage conveyed by the conveyance mechanism, and a drawing area of the workpiece after alignment based on the detection result of the measurement unit
  • an exposure unit that performs exposure with a light beam modulated based on the above, and forms an image in the drawing region.
  • a clamping device that can be securely fixed on a stage even if the workpiece is detachable from the stage and has a thickness that causes warping. It is possible to provide an image forming apparatus provided with the clamping device.
  • FIG. 1 is a schematic perspective view showing a laser exposure apparatus.
  • FIG. 2 is a schematic plan view showing a clamp device.
  • FIG. 3 is a schematic perspective view showing a slide member and a clamp member provided on the base member.
  • FIG. 4 is a schematic plan view showing a slide member provided on the base member.
  • FIG. 5 (A) is a schematic plan view showing the clamp member before the locking plate slides.
  • FIG. 5 (B) is a schematic plan view showing the clamp member after sliding the locking plate.
  • FIG. 6 (A) is a schematic perspective view showing a configuration of a positioning portion.
  • FIG. 6 (B) is a schematic perspective view showing the configuration of the positioning portion.
  • FIG. 7 (A) is a schematic plan view for explaining a positioning method by a positioning unit.
  • FIG. 7 (B) is a schematic plan view for explaining a positioning method by a positioning unit.
  • FIG. 7C is a schematic plan view for explaining a positioning method by the positioning unit.
  • FIG. 7 (D) is a schematic plan view for explaining a positioning method by a positioning unit.
  • FIG. 8 (A) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
  • FIG. 8 (B) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
  • FIG. 8 (C) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
  • FIG. 9 (A) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
  • FIG. 9 (B) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
  • FIG. 9 (C) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
  • FIG. 10 (A) is a schematic plan view showing an exposure area by an exposure head.
  • FIG. 10 (B) is a schematic plan view showing an arrangement pattern of exposure heads.
  • FIG. 1 is a schematic perspective view of a laser exposure apparatus 10 showing an example of an image forming apparatus according to the present invention
  • FIGS. It is. 1 and 2, arrow A is the transport direction, arrow B is the width direction, arrow FR is “front”, arrow RE is “back”, arrow RI is “right”, and arrow LE is “left”. In some cases, the position of each part is described using front / rear / right / left expressions.
  • the laser one exposure apparatus 10 includes a rectangular thick plate-shaped installation base 14 supported by six legs 12.
  • Two guide rails 16 are arranged on the upper surface of the installation table 14 along the longitudinal direction (conveying direction).
  • a rectangular flat plate shape is provided via a guide portion 19.
  • the stage member 20 is provided.
  • the stage member 20 is disposed such that the longitudinal direction thereof faces the extending direction (conveying direction) of the guide rail 16, and is supported by the guide rail 16 and the guide portion 19 so as to be capable of reciprocating on the installation table 14. . That is, for example, it is configured to reciprocate at a predetermined speed along the guide rail 16 by a transport mechanism such as a motor 18 and a ball screw 22.
  • a rectangular flat substrate material 100 as an exposure object is placed in a state of being positioned at a predetermined position by a positioning unit (not shown).
  • a plurality of (many) holes 20A are formed on the upper surface of the stage member 20, and the inside of the stage member 20 is made negative by a negative pressure supply source (not shown), so that Air is sucked from the portion 20A, and the suction force causes the substrate material 100 to be sucked and held on the upper surface of the stage member 20.
  • the clamping device 30 When the substrate material 100 has a predetermined thickness or more and is warped, it cannot be sufficiently adsorbed and held only by the air suction force (it is difficult to securely fix it). Therefore, the clamping device 30 described later assists the substrate material 100 to be securely attracted and held (fixed) on the upper surface of the stage member 20.
  • the substrate material 100 is provided with a plurality of alignment marks (not shown) indicating the reference of the exposure position in the drawing region on the exposed surface.
  • the alignment marks are formed by, for example, circular through-holes, and a total of four alignment marks are disposed in the vicinity of the four corners (hereinafter referred to as “corner portions”) of the substrate material 100.
  • a substantially “U” -shaped gate 24 is provided at the center of the installation table 14 so as to straddle the movement path of the stage member 20. Both ends of the gate 24 are fixed to the installation base 14, and an exposure part (drawing) for exposing the substrate material 100 is exposed on one side (rear side) across the gate 24.
  • An exposure head 28 is provided as an image section, and a plurality of (for example, two) CCD cameras 26 as measurement sections for photographing alignment marks provided on the substrate material 100 are provided on the other side (front side). Is provided.
  • each CCD camera 26 causes the strobe light source to emit light at the timing when the alignment mark of the substrate material 100 reaches a predetermined photographing position, and the strobe light irradiated to the substrate material 100 is reflected on the upper surface of the substrate material 100.
  • the alignment mark is photographed by inputting light into the camera body through the lens.
  • a transport mechanism (motor 18 and ball screw 22) for moving the stage member 20, a CCD camera 26, an exposure head 28, and the like are connected to a controller (not shown) that controls them.
  • the stage member 20 is controlled to move at a predetermined speed
  • the CCD camera 26 is controlled to photograph the alignment mark of the substrate material 100 at a predetermined timing
  • the exposure head 28 is controlled to the substrate at a predetermined timing. Controlled to expose material 100.
  • the exposure heads 28 are arranged in an approximate matrix of m rows and n columns (for example, 2 rows 4 mm IJ). Then, as shown in FIGS. 10A and 10B, an exposure area 28A by the exposure head 28 is configured in a rectangular shape having a short side in the transport direction, for example. Therefore, a strip-shaped exposed region 102 is formed for each exposure head 28 in the substrate material 100 in accordance with the movement operation in the transport direction (front side to rear side).
  • each of the exposure heads 28 of each row arranged in a line is predetermined in the arrangement direction so that the strip-shaped exposed regions 102 are arranged without gaps in the width direction (left-right direction) orthogonal to the transport direction. Arranged at intervals (natural number times the long side of the exposure area 28A). For this reason, for example, a portion that cannot be exposed between the exposure area 28A in the first row and the exposure area 28A in the second row can be exposed in the exposure area 28A in the second row.
  • Each exposure head 28 includes a digital 'micromirror device (DM D) (not shown) as a spatial light modulation element that modulates the incident laser beam for each pixel in accordance with image data. Yes.
  • This DMD has a data processor and mirror drive controller. Connected to the above controller.
  • the data processing unit of the controller generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD for each exposure head 28 based on the input image data.
  • the mirror drive control unit controls the angle of the reflection surface of each micromirror in the DMD for each exposure head 28 based on the control signal generated by the data processing unit.
  • a bundle-shaped optical fiber drawn from an illumination device that emits multi-beams as laser light is connected to the light incident side of the DMD in each exposure head 28.
  • the illumination device has a plurality of multiplexing modules that multiplex laser beams emitted from a plurality of semiconductor laser chips and input them to the optical fiber.
  • Each optical module that extends is an optical fiber that propagates the combined laser light.
  • a plurality of optical fibers are bundled into one to form a bundle of optical fibers. Yes.
  • the substrate material 100 for image exposure by the laser exposure apparatus 10 includes a substrate as a material for forming a pattern (image exposure) such as a printed wiring board and a liquid crystal display element, and a photosensitive epoxy resin on the surface of a glass plate or the like. In the case of a dry film, it may be laminated.
  • the substrate material 100 is placed on the upper surface of the stage member 20 by a loader (not shown) and positioned by a positioning unit (not shown), the substrate material 100 is sucked by air from the hole 20A. Adsorbed 'held on the top surface of 20.
  • the substrate material 100 is a thick substrate of 3 mm or more, for example, and warping has occurred, it cannot be sufficiently adsorbed and held only by the air suction force (can be securely fixed). For this reason, the substrate material 100 is placed on the base member 32 of the clamping device 30 to be described later, and the substrate material 100 is clamped by the clamp portion 34 provided on the base member 32. Attach to stage member 20. At this time, the base member 32 is provided with a plurality of (a large number of) holes 32A similar to the stage member 20. The substrate material 100 is sucked and held (fixed) on the stage member 20 through the member 32.
  • the stage member 20 starts to move in the transport direction (from the rear side to the front side), and the substrate material 100 is moved by the CCD camera 26. It is conveyed to the alignment detection process. That is, the exposure operation of the laser exposure apparatus 10 is started by the operator performing an exposure start input operation from the instruction input unit of the controller.
  • the transport mechanism (the motor 18 and the ball screw 22) is controlled by the controller, and the stage member 20 holding the substrate material 100 on the upper surface is held along the guide rail 16 in the transport direction (from the rear side to the front side). Start moving at a constant speed. In synchronism with the start of movement of the stage member 20 or at a timing just before the tip of the substrate material 100 reaches just below each CCD camera 26, each CCD camera 26 is controlled by the controller and starts operating. .
  • the CCD camera 26 emits a strobe light source at a predetermined timing, and photographs each alignment mark.
  • the captured image data (reference position data) is output to the data processing unit of the controller.
  • the data processing unit inputs the image data (reference position data) of each alignment mark.
  • From the position of the stage member 20 at the time of shooting and the position of the CCD camera 26, the positional deviation of the substrate material 100 on the stage member 20, the inclination with respect to the moving direction, the dimensional accuracy error, etc. are ascertained by calculation processing. Calculate the appropriate exposure position for the exposed surface.
  • the image data corresponding to the exposure pattern is temporarily stored in the memory in the controller. Therefore, during image exposure by the exposure head 28, correction control (alignment) for aligning the control signal generated based on the image data of the exposure pattern stored in the memory with the appropriate exposure position described above (alignment). Execute.
  • this image data the density of each pixel constituting the image is expressed in binary (whether or not dots are recorded). Data.
  • the stage member 20 is transported to the exposure process by the exposure head 28 by driving the transport mechanism (motor 18 and ball screw 22). Is done. That is, the stage member 20 starts to move along the guide rail 16 in the opposite direction (from the front side to the rear side).
  • the drawing area on the exposed surface of the substrate material 100 reaches the exposure start position below the exposure head 28, each exposure head 28 irradiates a laser beam to the exposed surface (drawing area) of the substrate material 100. Start image exposure.
  • the image data stored in the memory of the controller is sequentially read out for a plurality of lines, and a control signal is generated for each exposure head 28 based on the image data read out by the data processing unit.
  • the This control signal is subjected to correction of exposure position deviation with respect to the substrate material 100 measured by alignment by correction control (alignment).
  • the mirror drive control unit performs on / off control of each micromirror of the DMD for each exposure head 28 based on the generated and corrected control signals.
  • the laser beam emitted from the optical fiber of the illuminating device is irradiated onto the DMD, the laser light force reflected when the micromirror of the DMD is turned on.
  • the substrate material 100 is moved together with the stage member 20 at a constant speed, so that the substrate material 100 is moved by the exposure head 28 in the direction opposite to the moving direction of the stage member 20 (in FIG. A strip-shaped exposed region 102 is formed for each exposure head 28 (see FIG. 10A).
  • the stage member 20 returns to the initial position where the substrate material 100 is placed, so that suction by air suction and further clamping are performed.
  • the clamp by the apparatus 30 is released, and the substrate material 100 is removed from the stage member 20 (base member 32) by an unloader (not shown).
  • the substrate material 100 removed from the stage member 20 is transported outside the machine (not shown). It is conveyed to the conveyor and conveyed to the next process.
  • the clamp apparatus 30 used in the image forming apparatus such as the laser exposure apparatus 10 will be described in detail with reference to FIGS. 2 to 9A, 9B, and 9C.
  • the clamping device 30 is placed on the stage member 20 and is rectangular plate-shaped (which naturally has a surface area larger than that of the substrate material 100, which is positioned by a positioning portion not shown). ) and the base member 3 2, and a clamp portion 34 provided on the base member 32 Les, Ru.
  • the base member 32 is provided with a plurality of (many) holes 32A that are in communication with the holes 20A when placed on the stage member 20 and positioned.
  • the substrate member 100 placed thereon can be sucked and held (fixed) by the stage member 20 via the base member 32 (for each base member 32).
  • the clamp part 34 is provided in two types, a fixed type clamp part 34A and a movable type clamp part 34B.
  • a fixed type clamp part 34A For example, the front side and the left side of the stage member 20 are fixed type clamp parts 34A, and the right side and the rear side. The side is the movable clamp part 34B.
  • the fixed type clamp portion 34A has a slide member 36, which will be described later, as a fixed member 38. Therefore, the positioning portion 70 shown in detail in FIGS. 6A and 6B is not provided.
  • a plurality of positioning portions for example, positioning pins 33, which are positioned first, are arranged in the vicinity of the inner side of the fixing plate 46 described later (the one shown in the figure is on the front side). This is different from the movable type clamp part 34 B in that it is erected.
  • the movable type clamp part 34B will be mainly described below, and the fixed type clamp part 34A is denoted by the same reference numerals in the drawings with the same functions as those of the movable type clamp part 34B. The detailed explanation is omitted.
  • the movable type clamp portion 34B is provided so as to be slidable and fixable so as to approach and separate from the substrate material 100 placed on the base member 32.
  • a plurality of clamp members 40 are detachably attached to the fixing member 38 (three in the figure are attached to each side of the substrate material 100).
  • the slide member 36 At both ends of the slide member 36, long elongated holes 36A are formed in a direction perpendicular to the longitudinal direction, and fixing screws 90 that can be screwed with fingers are passed through the elongated holes 36A. Screwed to base member 32. Therefore, the slide member 36 is configured to be manually slidable and fixable in a direction in which the base member 32 approaches and separates from the base material 100. Note that the fixing member 38 is fixed to the base member 32 by mounting screws 94.
  • a substantially columnar column 44 for mounting the clamp member 40 is erected via the mounting plate 42.
  • the mounting plate 42 has a bifurcated base portion 42A side attached to the slide member 36 with mounting screws 96, and a column 44 is erected at a predetermined position on the tip 42B side.
  • a plurality of the support poles 44 are erected via a mounting plate 42 at a predetermined interval in the longitudinal direction of the slide member 36 (three clamp members 40 are shown in the figure).
  • a substantially disc-shaped flange 44A having a larger diameter than that of the support 44 is formed on the upper portion of each support 44. Then, as shown in FIGS. 8 (A), (B), and (C), a mounting screw 92 is screwed onto the lower end portion of the column 44.
  • a fixing plate 46 is attached by mounting screws 94 in parallel to the slide member 36 and at a predetermined interval.
  • This fixed plate 46 has a long hole 46A that is long in the direction perpendicular to the longitudinal direction (the direction in which it is close to or away from the substrate material 100) so that the lower end portion including the mounting screw 92 of the column 44 can be inserted.
  • the lower end portion of the support 44 is configured to move along the long hole 46A.
  • the same fixing plate 46 is also provided on the fixing member 38 side in parallel with the fixing member 38 and at a predetermined interval by a mounting screw 94.
  • the fixing plate 46 has a long hole 46A. Not drilled. That is, the mounting plate 42 is not attached to the fixing member 38 side, and the support 44 is directly attached to the fixing plate 46 (see FIGS. 9A, 9B, and 9C).
  • the substrate material 100 is disposed on the inner side of the fixed plate 46, and the slide member 36 slides toward and away from the fixed plate 46 on the outer side of the fixed plate 46.
  • the movable type clamp part 34B has an edge part that is outside the drawing region of the substrate material 100 arranged inside the fixed plate 46 when the slide member 36 approaches and separates from the fixed plate 46.
  • the clamp member 40 can be adjusted with respect to 100A.
  • the support 44 (including the flange 44A) can be loosely mounted in the substantially central portion of the clamp member 40 in the width direction (indicated by arrow D).
  • a plurality of holes 40A are formed along the longitudinal direction with a predetermined interval (three in the figure), and the clamp member 40 is slidable in the longitudinal direction at the substantially central portion of the upper surface.
  • the configured locking plate 50 is provided with a length slightly shorter than the length in the longitudinal direction of the clamp member 40 (a length that does not protrude from the clamp member 40 even if it is slid in the longitudinal direction).
  • two long holes 50A that are long in the longitudinal direction (sliding direction) are formed in the locking plate 50 at predetermined intervals, and mounting screws 94 are respectively inserted through the long holes 50A.
  • Clamp member 40 is attached to the upper surface.
  • the locking plate 50 can slide in the longitudinal direction within the range of the long hole 50A.
  • the locking plate 50 has the same diameter as the flange 44A or a slightly larger diameter than the flange 44A and a smaller diameter than the mounting hole 40A, and the same diameter as the support 44.
  • two locking holes 52 formed so as to communicate with the small-diameter portion 52B, which has a long hole shape in the sliding direction, can be communicated with the mounting hole 40A. ing.
  • a notch 53 that is substantially the same as the small diameter portion 52B is formed at the left end of the locking plate 50.
  • the lower surface of one long side portion of the clamp member 40 In addition, a claw portion 54 that protrudes in a substantially arc shape in cross-section and comes into contact with the edge portion 100A of the substrate material 100 from above is formed. And the clamping member 40 The other long side portion is defined as a base portion 56, and a plurality of the base portions 56 are arranged along the longitudinal direction of the through hole 56A corresponding to (in parallel with) the mounting hole 40A (with a predetermined interval). 3) Drilled.
  • a substantially cylindrical support rod 58 whose lower end protrudes in a substantially hemispherical shape is passed through the through-hole 56A, and the support rod 58 is provided near the upper end and the lower end thereof.
  • the flanges 62A and 62B larger in diameter than the support rod 58 are fitted.
  • the support rod 58 is prevented from falling off from the clamp member 40.
  • the support rod 58 is provided on the lower surface side of the clamp member 40 (base portion 56).
  • the coil spring 60 is fitted. That is, the coil spring 60 is fitted between the lower surface of the clamp member 40 (base 56) and the lower flange 62B of the support rod 58.
  • the support rod 58 is urged so as to always protrude downward from the lower surface of the clamp member 40.
  • a support portion 48 for supporting the lower end portion of the support rod 58 is formed between the base portions 42A of the mounting plate 42 having a bifurcated shape. It has been done.
  • the support 48 is recessed in a substantially hemispherical shape having a smaller curvature than the lower end of the support rod 58, and is configured so that the lower end of the support rod 58 is slidably contacted.
  • a plurality of positioning portions 70 for the substrate material 100 are provided on the inner side (substrate material 100 side) end surface of the slide member 36 (the illustrated one is spaced apart from each slide member 36 by a predetermined interval). 2 each). Then, the fixing plate 46 in the portion where the positioning portion 70 is provided is appropriately cut out to allow the positioning portion 70 to be attached.
  • the positioning portion 70 has a pin shape provided so as to be able to enter and exit the slide member 36.
  • the positioning member 72 is brought into contact with the end surface 100B of the substrate material 100, and the slide member 36 (clamp member 40) is positioned with respect to the substrate material 100. .
  • a substantially rectangular flat casing 64 is attached to the inner side (substrate material 100 side) end face of the slide member 36 by means of a mounting screw 96, and the top slit 64A of the casing 64 has a first slit.
  • 66A force Slide member 36 parallel to the longitudinal direction of the top plate 64A It is drilled to the center.
  • one side wall 64B of the casing 64 has a second slit 66B force communicating with the first slit 66A, and a predetermined length is drilled in a direction away from the substrate material 100 (sliding member 36 side).
  • the positioning member 72 is formed by bending a cylindrical pin having a predetermined length into a substantially "L" shape, and a short end (hereinafter referred to as an "operation part") 72A is formed by the first slit 66A or the first 2 Projects outward from slit 66B.
  • the front wall 64C of the casing 64 facing the substrate material 100 is provided with a circular opening 68 having the same force as the diameter of the positioning member 72 and a slightly larger diameter than the positioning member 72.
  • the other end portion (hereinafter referred to as “contact portion”) 72B can enter and exit through the opening 68.
  • a coin spring 74 is fitted into the contact portion 72B side of the bending member 72C of the positioning member 72.
  • One end of the coil spring 74 abuts on a locking flange 76 fitted approximately in the middle between the bent portion 72C and the abutting portion 72B, and the other end of the coil spring 74 is fixed to the inner surface of the front wall 64C.
  • the contact portion 72B is in contact with a locking flange 78 that can be inserted. Accordingly, the positioning member 72 is constantly biased in the direction away from the substrate material 100 (sliding member 36 side) by the biasing force of the coil spring 74.
  • the positioning method by the positioning unit 70 will be described mainly based on FIGS. 7 (A), (B), (C), and (D).
  • the substrate material 100 is placed on the base member 32, and the positioning pin 33 provided near the inner side (substrate material 100 side) of the fixed plate 46 in the fixed type clamp portion 34A is placed on the positioning pin 33.
  • the front end face 100B and the left end face 100B are brought into contact with each other.
  • the second slit 66B protrudes from the end of the slide member 36 side and is locked and held in a state of being biased by the biasing force of the coil spring 74.
  • Each operating portion 72A is moved to the substrate material 100 side against the biasing force of the coil spring 74 (see FIG. 7A).
  • each positioning member 72 is connected to the end of the first slit 66A on the top plate 64A side (the abbreviation of the top plate 64A). In the center), the urging force of the coil spring 74 is brought into contact with and locked to the top plate 64A, and the contact portion 72B of each positioning member 72 protrudes from the opening 68 by a predetermined length.
  • each slide member 36 is elongated until each contact portion 72B contacts the right end surface 100B and the rear end surface 100B of the substrate material 100. 3 Approach (slide) the substrate material 100 side along 6A and the long hole 46A (see Fig. 7 (C)). Then, when the respective contact portions 72B are brought into contact with the right end surface 100B and the rear end surface 100B of the substrate material 100, the respective slide members 36 are fixed by the fixing screws 90 at the positions.
  • each operation portion 72A is placed in the first slit 66A as described above. Rotate in the opposite direction and release your finger after turning it into the second slit 66B.
  • each positioning member 72 is automatically moved in the direction away from the substrate material 100 (sliding member 36 side) by the urging force of the coil spring 74, and each abutting portion protruding from the opening 68. 72B retracts into the casing 64 (see Fig. 7 (D)). Thereby, the positioning operation of the slide member 36 with respect to the substrate material 100 is completed.
  • each clamp member 40 abuts the lower end portion of the support rod 58 on the support portion 48 provided on each slide member 36 and each fixing member 38. At the same time, the flange 44A of the support 44 is inserted into the mounting hole 40A.
  • the clamp member 40 can be attached to the slide member 36. In other words, if the operation part 72A of the positioning member 72 protrudes from the top plate 64A, the clamp member 40 cannot be attached. Forgetting the operation after positioning the member 72 can be prevented.
  • the flange 44A of the support 44 has a force of the large diameter portion 52A of the mounting hole 40A and the locking hole 52 only by the weight of the clamp member 40, Le which does not protrude upwards. Therefore, the upper surface of the clamp member 40 is manually pressed, and the flange 44A of the support pole 44 is protruded upward from the large diameter portion 52A of the mounting hole 40A and the locking hole 52. Then, with this state maintained, the locking plate 50 is slid in the left direction in FIGS. 5A and 5B within the range of the long hole 50A.
  • each clamp member 40 can be attached to the column 44 in a state in which the drop-off is prevented. In this way, each clamp member 40 is attached to the slide member 36 and the fixed member 38, whereby the edge portion 100 A of the substrate material 100 is clamped by each clamp member 40.
  • the clamp member 40 is pushed upward (from the base member 32) upward by the biasing force of the base 56 side force coil spring 60, and between the column 44 and the mounting hole 40A. Since the predetermined gap is formed, the claw portion 54 side is rotated downward with the vicinity of the mounting hole 40A into which the support 44 is inserted as a fulcrum. Accordingly, the claw 54 can press and hold the edge 100A of the substrate material 100 by the biasing force of the coil spring 60, and the clamp member 40 clamps the edge 100A of the substrate material 100. That force becomes S positive.
  • the front end surface 100B and the left end surface 100B of the substrate material 100 are brought into contact with the positioning pin 33, whereby the positioning of the clamp member 40 with respect to each edge 100A is already completed. is doing. Further, since the positioning of the clamp member 40 with respect to each edge 100A of the substrate material 100 is completed by the positioning unit 70 on the slide member 36 side, even if the substrate material 100 is warped (deformed), the drawing region The outer edge 100A can be securely clamped. That is, when the substrate material 100 with warp is clamped by the clamp member 40, the force that deforms the substrate material 100 so that it slightly expands.
  • a predetermined gap is formed by the positioning member 72.
  • the positioning member 72 is positioned in consideration of the elongation of the base material 100 that occurs when the warp is corrected. Even if such deformation occurs, it can be sufficiently tolerated.
  • the clamp member 40 is configured such that the claw portion 54 on the opposite side is pressed from the top to the bottom by the base 56 side being pushed up from the bottom to the top.
  • the thickness of the substrate material 100 is different. (Even if it gets thicker) can be clamped correspondingly enough.
  • this clamping device 30 it is possible to clamp the substrate material 100 having a thickness of up to 7 mm.
  • the clamp portion 34 is configured so that each corner portion of the substrate material 100 can be reliably clamped. That is, as shown in FIG. 2 and FIG. 4, the clamp part 34A, which is a fixed type on the front side, and the claw part 54 of the clamp part 34B, which is a movable type on the rear side, are each a fixed type on the left side.
  • the clamp part 34A and the clamp part 34B of the right movable type are clamped on the extension line (indicated by the phantom line K in FIG. 4) so as to overlap the extension line in the longitudinal direction of the claw part 54 of the clamp part 34B. It is constructed so that a support 44 for mounting the member 40 is provided.
  • the base member 32 is placed on the stage member 20 and is positioned by a positioning portion (not shown). At this time, the base member 32 is perforated. Since the hole portion 32A communicates with the hole portion 20A formed in the stage member 20, the air is sucked from the hole portions 20A and 32A, thereby The substrate material 100 clamped by the lamp device 30 can be securely adsorbed and held on the stage member 20.
  • the clamp device 30 can also be applied to a device such as a laser processing machine that forms a hole for conduction in a substrate material 100.
  • the base member 32 provided with the clamp portion 34 can be attached to and detached from the stage member 20, and the substrate material 100 is placed on the base member 32. Since it is configured, the clamp part 34 can be attached to and detached from the stage member 20, and even when the substrate material 100 having a thickness that causes warping is exposed, the stage member 20 is interposed via the base member 32. It can be securely adsorbed and held (fixed) on the top. Further, since this clamping operation does not need to be performed on the stage member 20 which is sufficient to be performed on the base member 32, there is an advantage that it can be easily performed.
  • the clamp member 40 is configured to be attached to the column 44 by sliding the locking plate 50, so that the attaching / detaching operation can be easily performed.
  • a plurality of clamp members 40 are provided and clamped on each side of the substrate material 100, that is, on the slide member 36 and the fixing member 38 (in other words, on each slide member 36 and each fixing member 38). Therefore, even if the size of the substrate material 100 is changed, the structure can be flexibly accommodated. However, when the size of the substrate material 100 is greatly changed, the base member 32 is replaced according to the size of the substrate material 100.
  • a hole (communication hole)
  • Locking plate Locking member
  • Support rod support part
  • Coil spring biasing member

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention décrit un appareil de serrage qui peut être posé, de manière amovible, sur un étage et peut s'y fixer de manière sûre, même pour une pièce dont l'épaisseur peut entraîner un gauchissement, ainsi qu'un appareil de formation d'image doté dudit appareil de serrage. L'appareil de serrage (30) est muni d'une base (32), fixée de manière amovible sur l'étage (20), la pièce en forme de panneau (100) étant placée sur la base, et d'une section de serrage (34) agencée sur la base (32) pour serrer une section en bordure (100A) de la pièce (100). Une pluralité d'orifices de communication (32A) pénètre dans la base (32) pour communiquer entre un plan supérieur de la base (32) et un côté d'un étage (20). L'appareil de formation d'image (10) est muni de l'appareil de serrage (30).
PCT/JP2006/300478 2005-01-20 2006-01-17 Appareil de serrage et appareil de formation d'image Ceased WO2006077804A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-013372 2005-01-20
JP2005013372A JP2006198725A (ja) 2005-01-20 2005-01-20 クランプ装置及び画像形成装置

Publications (1)

Publication Number Publication Date
WO2006077804A1 true WO2006077804A1 (fr) 2006-07-27

Family

ID=36692194

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/300478 Ceased WO2006077804A1 (fr) 2005-01-20 2006-01-17 Appareil de serrage et appareil de formation d'image

Country Status (4)

Country Link
JP (1) JP2006198725A (fr)
KR (1) KR20070094926A (fr)
CN (1) CN101124859A (fr)
WO (1) WO2006077804A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103091997A (zh) * 2012-09-27 2013-05-08 上海现代先进超精密制造中心有限公司 楔形板组的胶合方法和夹具
CN110977189A (zh) * 2019-11-18 2020-04-10 济南邦德激光股份有限公司 一种激光切割系统及其切割方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4866782B2 (ja) * 2007-04-27 2012-02-01 富士フイルム株式会社 基板クランプ機構及び描画システム
JP4881965B2 (ja) * 2009-02-16 2012-02-22 株式会社日立ハイテクノロジーズ 液晶露光装置
CN102034732B (zh) * 2009-09-30 2015-01-21 京瓷株式会社 吸附用构件、使用其的吸附装置及带电粒子线装置
JP5593912B2 (ja) * 2010-07-22 2014-09-24 ソニー株式会社 表示装置
JP5813555B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
TWI507267B (zh) * 2013-04-11 2015-11-11 Chao Shen Chou 加工工具機
JP6543061B2 (ja) * 2015-03-20 2019-07-10 株式会社オーク製作所 基板矯正治具を用いる露光装置、及び基板矯正治具
JP6669481B2 (ja) * 2015-12-04 2020-03-18 株式会社ブイ・テクノロジー 検査装置
CN109143793B (zh) * 2018-09-06 2023-06-06 重庆科技学院 一种可调式芯片卡具的使用方法
CN114290178B (zh) * 2021-12-28 2023-03-28 苏州慧博光学科技有限公司 一种加工棱镜的工装夹具及其使用方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130524A (ja) * 1987-11-16 1989-05-23 Mitsubishi Electric Corp 電子ビーム描画装置
JPH03282473A (ja) * 1990-03-30 1991-12-12 Ushio Inc フィルム露光装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217276A (ja) * 2001-01-17 2002-08-02 Ushio Inc ステージ装置
JP2003039222A (ja) * 2001-07-26 2003-02-12 Matsushita Electric Works Ltd 積層板端面加工装置及びクランプヘッド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130524A (ja) * 1987-11-16 1989-05-23 Mitsubishi Electric Corp 電子ビーム描画装置
JPH03282473A (ja) * 1990-03-30 1991-12-12 Ushio Inc フィルム露光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103091997A (zh) * 2012-09-27 2013-05-08 上海现代先进超精密制造中心有限公司 楔形板组的胶合方法和夹具
CN110977189A (zh) * 2019-11-18 2020-04-10 济南邦德激光股份有限公司 一种激光切割系统及其切割方法

Also Published As

Publication number Publication date
KR20070094926A (ko) 2007-09-27
CN101124859A (zh) 2008-02-13
JP2006198725A (ja) 2006-08-03

Similar Documents

Publication Publication Date Title
JP4866782B2 (ja) 基板クランプ機構及び描画システム
JP4589198B2 (ja) ワーク搬送装置とそれを備えた画像形成装置並びにワーク搬送方法
US8223319B2 (en) Exposure device
KR102032807B1 (ko) 노광 묘화 장치 및 노광 묘화 방법
WO2006077804A1 (fr) Appareil de serrage et appareil de formation d'image
CN104185817B (zh) 曝光描绘装置和曝光描绘方法
JP4606968B2 (ja) ワーク固定装置及びその位置決め方法並びに画像形成装置
JP4760752B2 (ja) 部品搭載装置および部品搭載装置における搭載位置精度測定方法
CN104977811A (zh) 曝光装置及其固定方法
JP4629449B2 (ja) クランプ装置及び画像形成装置並びにクランプ方法
JP2006227278A (ja) クランプ部材検出方法と画像形成方法及び画像形成装置
JP2006192520A (ja) クランプ装置及び画像形成装置並びにクランプ方法及び画像形成方法
JP2007010736A (ja) 画像位置計測装置及び露光装置
JP4942188B2 (ja) 基板クランプ機構及び描画システム
JP2006195062A (ja) クランプ装置及び画像形成装置
JP2006237340A (ja) クランプ装置及び画像形成装置並びにクランプ位置決め方法
JP2006192521A (ja) クランプ装置及び画像形成装置
JP4472451B2 (ja) 基板搬送装置及びそれを備えた画像形成装置並びに基板搬送方法
JP2006058496A (ja) 基板測定装置及び基板搬送装置並びに基板測定装置を備えた画像形成装置と基板測定方法
JP4959271B2 (ja) 露光システムおよびワーク搬送方法
JP2006227277A (ja) 画像形成方法及び画像形成装置
TW202105066A (zh) 曝光裝置及曝光方法
JP2004233608A (ja) 露光装置
JP2006234959A (ja) 露光方法および露光装置
JP2007017763A (ja) 画像位置計測装置及び露光装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 200680002822.7

Country of ref document: CN

Ref document number: 1020077016651

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06711758

Country of ref document: EP

Kind code of ref document: A1

WWW Wipo information: withdrawn in national office

Ref document number: 6711758

Country of ref document: EP