WO2006096165A2 - Appareil et procede permettant d'enlever un substrat provisoire d'un disque optique - Google Patents

Appareil et procede permettant d'enlever un substrat provisoire d'un disque optique Download PDF

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Publication number
WO2006096165A2
WO2006096165A2 PCT/US2005/007080 US2005007080W WO2006096165A2 WO 2006096165 A2 WO2006096165 A2 WO 2006096165A2 US 2005007080 W US2005007080 W US 2005007080W WO 2006096165 A2 WO2006096165 A2 WO 2006096165A2
Authority
WO
WIPO (PCT)
Prior art keywords
optical disk
preassembly
force
temporary substrate
recited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2005/007080
Other languages
English (en)
Other versions
WO2006096165A3 (fr
Inventor
Dan Jay Sanocki
Bang Thai Dinh
Brandon Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Licensing SAS
Vantiva SA
Technicolor Inc
Original Assignee
Thomson Licensing SAS
Technicolor SA
Technicolor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing SAS, Technicolor SA, Technicolor Inc filed Critical Thomson Licensing SAS
Priority to US11/884,905 priority Critical patent/US8029643B2/en
Priority to PCT/US2005/007080 priority patent/WO2006096165A2/fr
Publication of WO2006096165A2 publication Critical patent/WO2006096165A2/fr
Publication of WO2006096165A3 publication Critical patent/WO2006096165A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00—Carriers for sound or information
    • B32B2429/02—Records or discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/2403—Layers; Shape, structure or physical properties thereof
    • G11B7/24035—Recording layers
    • G11B7/24038—Multiple laminated recording layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/919—Delaminating in preparation for post processing recycling step
    • Y10S156/926—Delaminating recording media, e.g. DVD, CD, HD, flash memory
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/919—Delaminating in preparation for post processing recycling step
    • Y10S156/927—Delaminating vehicle component, e.g. brake pad
    • Y10S156/928—Delaminating tire, e.g. tread from carcass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
    • Y10T156/1967—Cutting delaminating means
    • Y10T156/1972—Shearing delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y10T29/49824—Disassembling by applying force to elastically deform work part or connector

Definitions

  • the present invention generally relates to manufacturing optical disks such as compact disks (CDs) and digital video disks (DVDs) and, more particularly, to an apparatus and method for removing a temporary substrate from an optical disk to improve manufacturing yield and operating conditions.
  • optical disks such as compact disks (CDs) and digital video disks (DVDs)
  • CDs compact disks
  • DVDs digital video disks
  • Digital disks such as compact disks (CDs) or digital versatile disks (DVDs) may include a multiple layer process for manufacture.
  • the disk may include a substrate having a pattern of microscopic pits or readout information applied thereto.
  • the pattern of pits includes the digital readout information for the disk.
  • the substrate may have one or more layers applied to it.
  • the readout surface may have a metal applied to the surface using a surface transfer process (STP).
  • STP surface transfer process
  • the surface transfer process includes producing a single or dual-layer readout surface that includes a sputtered-on reflective (e.g., aluminum) layer on a temporary substrate.
  • the temporary substrate may include polymethylmethacralate (PMMA).
  • the metallized layer portion which includes the metal and the temporary substrate, is transferred to the already-molded readout layer (with the readout information) having a lacquer layer formed thereon.
  • the PMMA temporary substrate is bonded to the lacquer then, the PMMA temporary substrate is removed from the metallized portion.
  • Removal of the temporary substrate may be performed by a stripping procedure that typically includes three steps.
  • a mechanical device with a knife-edge is inserted between the two half disks at the inside diameter to force separation between the two disks.
  • air pressure is applied in the separation area to propagate the separation.
  • suction cups are employed on the top and bottom surfaces of the disk to pull the halves apart. The temporary substrate is then discarded.
  • An apparatus and method for removing a temporary substrate from an optical disk is disclosed.
  • a holding fixture provides an optical disk supporting surface.
  • a force-imparting tool imparts a force against an optical disk wherein a reaction force to the force-imparting tool is provided by the supporting surface.
  • a scoring device which allows for easier breakage of the temporary substrate may be employed.
  • the optical disk is flexed to break away and remove a temporary substrate of the optical disk.
  • FIG. 1 is a flow diagram showing a method for removing a temporary substrate from an optical disk in accordance with an illustrative embodiment
  • FIG. 2 is a cross-sectional view of a preassembly having a temporary substrate to be removed;
  • FIGS. 3 and 4 are diagrams showing positions for bending a preassembly in the apparatus for removing a temporary substrate from an optical disk in accordance with one illustrative embodiment
  • FIGS. 5, 6 and 7 are diagrams showing different force imparting tool configurations in accordance with illustrative embodiments.
  • FIGS. 8 and 9 are diagrams showing positions for bending a preassembly in the apparatus for removing a temporary substrate from an optical disk in accordance with another illustrative embodiment. It should be understood that the drawings are for purposes of illustrating the concepts of the invention and are not necessarily the only possible configuration for illustrating the invention.
  • the present invention provides a method and apparatus for removing a temporary substrate from a disk during a surface transfer process.
  • An assembled disk having a temporary substrate attached thereon is flexed with pressure being applied on an opposite side of the temporary substrate.
  • the pressure is preferably applied along a centerline of the disk until the temporary substrate breaks into two pieces. After breaking the temporary substrate, the temporary substrate can easily be removed and discarded.
  • the present invention is described in terms of a DVD manufacturing process and system; however, the present invention is much broader and may include any optical disk manufacturing process including compact disks, laser disks, etc. In addition, the present invention is applicable to any surface transfer process that employs a temporary substrate.
  • FIGS may be implemented in various forms of hardware, software or combinations thereof. Preferably, these elements are implemented in hardware controlled manually or by one or more appropriately programmed general-purpose devices, which may include a processor, memory and input/output interfaces.
  • general-purpose devices which may include a processor, memory and input/output interfaces.
  • upstream manufacturing provides a first half disk, which includes pits or data thereon or therein.
  • the first half disk includes a semi- reflective coating over the pits.
  • the first half-disk may include polycarbonate or other plastic material.
  • a second half disk includes a temporary substrate, which may include a fully-reflective coating over pits of data.
  • the fully reflective coating may include a metallic layer, such as, for example, aluminum.
  • the first and second halves are brought together and bonded.
  • the semi-reflective layer side of the first half and the reflective layer of the second half are bonded through use of an adhesive or bonding layer, such as, for example, lacquer.
  • the lacquer includes a thickness of between about 40 and 70 microns.
  • the adhesive of lacquer forms a spacer layer between the reflective and semi-reflective layers.
  • the spacer layer holds the first and second halves together and forms an optical path that permits data at the fully reflective layer to be read through the semi-reflective layer.
  • the first and second halves bonded together will be referred to as a preassembly.
  • FIG. 2 shows an illustrative layer stack in accordance with one useful embodiment.
  • Preassembly 70 includes a first half layer 72 formed from a plastic, such as polycarbonate.
  • Layer 72 includes a semi-reflective coating 74 over pits 76.
  • a lacquer coating 78 is formed over the semi-reflective coating 74. Lacquer 78 bonds coating 74 to a fully reflective coating 80.
  • Fully reflective coating 80 may include aluminum formed on a temporary substrate 82.
  • the preassembly is placed in a fixture or anvil for the removal of the temporary substrate portion of the second half.
  • the fixture may include a plurality of different features, which provide for a clean and predictable flexure of the preassembly.
  • the preassembly is held at an exterior periphery using suction cups of other non-marring securing devices. These securing devices are preferably located on a same side of the preassembly and diametrically opposed.
  • a force-imparting tool may include one or more end rods, or a rounded or pointed end plate that imparts a force against a portion of the preassembly, preferably along a line where a break is desired.
  • the force-imparting tool is preferably made of a material that includes the same or softer hardness than the disk material.
  • Force imparting tool may include polycarbonate, polytetraflouroethylene (PTFE) or other plastic material.
  • the force-imparting tool may include a more rigid material (e.g., aluminum) and be configured to include a lining or end portion having a same or softer material.
  • the force-imparting tool should be free from dirt or debris, as should the surface of the preassembly to prevent damage in block 18.
  • the force-imparting tool is aligned along the desired break line of the temporary substrate to be removed.
  • the force-imparting tool is advanced to cause a controlled bending in the preassembly. The force-imparting tool engages the first half disk side and forces the temporary substrate of the second half disk to break.
  • portions of the holding fixture or anvil, which secure the preassembly rotate in accordance with the bending force applied to the preassembly by the force-imparting tool.
  • portions of the anvil, which connect to the second half provide a motion that advances the temporary substrate toward the break line of the temporary substrate. This assists in the efficiency of the break, the transfer of the reflective surface to the lacquer and the removal of the temporary substrate from the remaining portions of the preassembly.
  • a cap layer or another preassembly may be applied to the fully reflective surface of the preassembly.
  • the cap layer provides a one layer data readout disk.
  • Apparatus 100 includes anvil portions 102, each including at least one securing mechanism 104.
  • Securing mechanisms 104 are illustratively shown having suctions cups 104 (see Iocations124 and 126 in FIGS. 5-7), which may include vacuum holes (not shown) to maintain suction therein.
  • Mechanisms 104 may include non-marring clamps or other devices as well. If suction cups are employed for mechanisms 104, the vacuum holes may communicate with vacuum lines, which are in turn in communication with a vacuum pump (not shown). Alternately, the suction cups may be employed without a vacuum connection.
  • Securing mechanisms 104 are preferably positioned on a same diametrical line on opposite sides of a centerline of a disk preassembly 108 or opposite sides of a center hole of a disk preassembly 108. Securing mechanisms 104 may be arranged in other operational configurations as well.
  • Anvil portions 102 may include a recess 112, which receives the thickness of a disk preassembly 108 and assists in proper alignment of the disk preassembly 108 on anvil 102.
  • anvil portions 102 preferably include a pivot 114 about which rotation of the anvil portion 102 is permitted.
  • these anvil portions 102 will accommodate flexure to provide a more severe bending, which in turn increases the amount of stress on a temporary substrate to ensure a crack forms and propagates across the preassembly 108.
  • a shear force/stress is developed between layers of preassembly 108. This shearing assists in the removal of the temporary substrate of the preassembly 108.
  • a force-imparting tool 118 includes a rod, plate or other structure for imparting a force against preassembly 108. The force is applied to a surface opposite the temporary substrate layer to be removed.
  • Tool 118 preferably includes a material that is softer than a surface material 119 of preassembly to which it contacts. Pads or other protective coverings may be employed between the tool 118 and the surface 119.
  • Anvil portions 102 are biased against the motion caused by tool 118. This may be provided by a spring or other biasing means (not shown).
  • the horizontal position (disk laying flat) is the default position for the anvil portions 102.
  • the temporary substrate (82) may be scored by a cutting tool or knife to provide a predetermined break line for the temporary substrate.
  • One or more rods having a diameter of, e.g., between about 4 mm to 10 mm in diameter and radiused at the end may be employed for tool 118.
  • FIGS. 5, 6 and 7 show different configurations for tool 118.
  • FIG. 4 shows tool 1 18 contacting preassembly 108 (or preassembly 70 in FIG. 2) at or near the center hole 110. Suction cup locations 124 and 126 are shown.
  • FIG. 5 provides for a plurality of tools 1 18 which are disposed along a break line 128.
  • FIG. 6 shows tool 1 18 as a plate disposed along break line 128.
  • the suction cup positions 124 and 126 may be disposed at different locations than those depicted. For example, the suction cup positions 124 and 126 may be located further from the center hole 1 10.
  • pressurized gas 120 may be provided by a nozzle 122 to cause delamination and move the temporary substrate out of the way. Once the temporary substrate 82 is broken away, tool 118 is retracted and the preassembly returns to its flat state for further processing. Tool 118 may be coupled to an actuator or other device, which provides an advancing and retracting motion for tool 118.
  • an alternate apparatus 200 includes a fixture 205, which provides arcuate surfaces 202. These surfaces 202 replace the need to include pivots 114. Instead, fixture 205 remains stationary during the removal of the temporary substrate 82.
  • Surfaces 202 may be provided by cylindrical rods or include elliptical cross-sections or the like. As preassembly 108 flexes, the preassembly engages a different portion of surface 202 until a crack develops and the temporary substrate 82 breaks away.
  • Surface 202 preferably provides a low coefficient of friction against the temporary substrate 82.
  • Surfaces 202 may include a material such as PTFE or other materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

L'invention concerne un appareil et un procédé permettant d'enlever un substrat provisoire d'un disque optique. Un accessoire de retenue (102) fournit une surface de support du disque optique. Lorsqu'un outil d'application de force (118) applique une force sur un disque optique, une force de réaction à l'outil d'application de force est produite par la surface de support. Le disque optique est plié afin de casser et d'enlever un substrat provisoire du disque optique.
PCT/US2005/007080 2005-03-04 2005-03-04 Appareil et procede permettant d'enlever un substrat provisoire d'un disque optique Ceased WO2006096165A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/884,905 US8029643B2 (en) 2005-03-04 2005-03-04 Apparatus and method for removing a temporary substrate from an optical disk
PCT/US2005/007080 WO2006096165A2 (fr) 2005-03-04 2005-03-04 Appareil et procede permettant d'enlever un substrat provisoire d'un disque optique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2005/007080 WO2006096165A2 (fr) 2005-03-04 2005-03-04 Appareil et procede permettant d'enlever un substrat provisoire d'un disque optique

Publications (2)

Publication Number Publication Date
WO2006096165A2 true WO2006096165A2 (fr) 2006-09-14
WO2006096165A3 WO2006096165A3 (fr) 2006-10-26

Family

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PCT/US2005/007080 Ceased WO2006096165A2 (fr) 2005-03-04 2005-03-04 Appareil et procede permettant d'enlever un substrat provisoire d'un disque optique

Country Status (2)

Country Link
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WO (1) WO2006096165A2 (fr)

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US10919280B2 (en) 2017-09-01 2021-02-16 The George Washington University Two-dimensional material printer and transfer system and method for atomically layered materials

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Also Published As

Publication number Publication date
WO2006096165A3 (fr) 2006-10-26
US8029643B2 (en) 2011-10-04
US20080156439A1 (en) 2008-07-03

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