WO2006136362A3 - Einrichtung zur behandlung von flachen und flächigen gegenständen - Google Patents

Einrichtung zur behandlung von flachen und flächigen gegenständen Download PDF

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Publication number
WO2006136362A3
WO2006136362A3 PCT/EP2006/005892 EP2006005892W WO2006136362A3 WO 2006136362 A3 WO2006136362 A3 WO 2006136362A3 EP 2006005892 W EP2006005892 W EP 2006005892W WO 2006136362 A3 WO2006136362 A3 WO 2006136362A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact
wheels
circuit board
treatment
boundary region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2006/005892
Other languages
English (en)
French (fr)
Other versions
WO2006136362A2 (de
Inventor
Werner Andreas Maurer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Priority to AT0900406U priority Critical patent/AT10276U1/de
Priority to EP06754450A priority patent/EP1899507A2/de
Priority to JP2008517394A priority patent/JP2008544086A/ja
Publication of WO2006136362A2 publication Critical patent/WO2006136362A2/de
Anticipated expiration legal-status Critical
Publication of WO2006136362A3 publication Critical patent/WO2006136362A3/de
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Bei einer Galvanisiereinrichtung (11) für Leiterplatten (16) sind im Randbereich (19) Kontakträder (28) für die elektrische Kontaktierung vorgesehen. Die Kontakträder (28) liegen in dem Randbereich (19) nur an der Unterseite (17) der Leiterplatte (16) an. An der Oberseite (18) der Leiterplatte (16) sind lediglich Transporträder (20) und Gegendruckräder (31) zur Sicherstellung des elektrischen Kontakts vorgesehen. Durch ausschließlich unten angeordnete Kontakträder (28) kann entstehender Kupferflitter odgl. bei einer Beschichtung der Leiterplatten (16) leicht herabfallen und somit entfernt werden.
PCT/EP2006/005892 2005-06-22 2006-06-20 Einrichtung zur behandlung von flachen und flächigen gegenständen Ceased WO2006136362A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT0900406U AT10276U1 (de) 2005-06-22 2006-06-20 Einrichtung zur behandlung von flachen und flächigen gegenständen
EP06754450A EP1899507A2 (de) 2005-06-22 2006-06-20 Einrichtung zur behandlung von flachen und flächigen gegenständen
JP2008517394A JP2008544086A (ja) 2005-06-22 2006-06-20 平坦且つ平面的な物体を処理する装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005030546A DE102005030546A1 (de) 2005-06-22 2005-06-22 Einrichtung zur Behandlung von flachen und flächigen Gegenständen
DE102005030546.6 2005-06-22

Publications (2)

Publication Number Publication Date
WO2006136362A2 WO2006136362A2 (de) 2006-12-28
WO2006136362A3 true WO2006136362A3 (de) 2008-02-28

Family

ID=36809626

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/005892 Ceased WO2006136362A2 (de) 2005-06-22 2006-06-20 Einrichtung zur behandlung von flachen und flächigen gegenständen

Country Status (7)

Country Link
EP (1) EP1899507A2 (de)
JP (1) JP2008544086A (de)
KR (1) KR20080039841A (de)
CN (1) CN101203632A (de)
AT (1) AT10276U1 (de)
DE (1) DE102005030546A1 (de)
WO (1) WO2006136362A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009049565A1 (de) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Verfahren und Anlage zur Metallisierung von Siliziumwafern
DE102009057463A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen
CN102808206B (zh) * 2012-05-04 2015-04-08 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
US4929323A (en) * 1987-12-18 1990-05-29 Nkk Corporation Apparatus for removing electroplating metal deposited onto surface of conductor roll
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
EP0819781A1 (de) * 1996-07-17 1998-01-21 Gebr. Schmid GmbH & Co. Einrichtung zur Behandlung von Gegenständen insbesondere Galvanisiereinrichtung für Leiterplatten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2543299Y2 (ja) * 1989-12-14 1997-08-06 富士重工業株式会社 ディーゼルエンジンの停止装置
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
US4929323A (en) * 1987-12-18 1990-05-29 Nkk Corporation Apparatus for removing electroplating metal deposited onto surface of conductor roll
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
EP0819781A1 (de) * 1996-07-17 1998-01-21 Gebr. Schmid GmbH & Co. Einrichtung zur Behandlung von Gegenständen insbesondere Galvanisiereinrichtung für Leiterplatten

Also Published As

Publication number Publication date
DE102005030546A1 (de) 2007-01-04
AT10276U1 (de) 2008-12-15
EP1899507A2 (de) 2008-03-19
WO2006136362A2 (de) 2006-12-28
CN101203632A (zh) 2008-06-18
KR20080039841A (ko) 2008-05-07
JP2008544086A (ja) 2008-12-04

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