WO2008024446A2 - Interface permettant d'exploiter et de contrôler des systèmes de réduction de la pollution - Google Patents

Interface permettant d'exploiter et de contrôler des systèmes de réduction de la pollution Download PDF

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Publication number
WO2008024446A2
WO2008024446A2 PCT/US2007/018669 US2007018669W WO2008024446A2 WO 2008024446 A2 WO2008024446 A2 WO 2008024446A2 US 2007018669 W US2007018669 W US 2007018669W WO 2008024446 A2 WO2008024446 A2 WO 2008024446A2
Authority
WO
WIPO (PCT)
Prior art keywords
abatement
display
effluent
abatement systems
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/018669
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English (en)
Other versions
WO2008024446A3 (fr
WO2008024446A8 (fr
Inventor
Youssef A. Loldj
Shaun W. Crawford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2008024446A2 publication Critical patent/WO2008024446A2/fr
Publication of WO2008024446A3 publication Critical patent/WO2008024446A3/fr
Anticipated expiration legal-status Critical
Publication of WO2008024446A8 publication Critical patent/WO2008024446A8/fr
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0658—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a single flow from a plurality of converging flows
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Definitions

  • the present invention relates to semiconductor device manufacturing, and more particularly to methods and systems for monitoring multiple abatement systems.
  • the gaseous effluents from the manufacturing of semiconductor materials, devices, products and memory articles involve a wide variety of chemical compounds used and produced in the process facility. These compounds include inorganic and organic compounds, breakdown products of photo-resist and other reagents, and a wide variety of other gases that must be removed from the waste gas before being vented from the process facility into the atmosphere.
  • Semiconductor manufacturing processes utilize a variety of chemicals, many of which have extremely low human tolerance levels. During processing (e.g.
  • PFCs perfluorocompounds
  • PFCs perfluorocompounds
  • the abatement system may convert gases produced by the processing of substrates and flat panel display/LCD to less environmentally harmful versions to be emitted to the environment.
  • the abatement systems may be coupled to semiconductor manufacturing tools, and typically may abate the process gases from the tool as they are produced. A need exists for an interface for operating and monitoring the abatement systems.
  • a method for monitoring and controlling one or more abatement systems.
  • the method includes the steps of (1) representing on a display one or more abatement systems; (2) representing on the display one or more effluent flows from processing tools; (3) representing on the display a plurality of effluent flow configuration options; (4) receiving a selected effluent flow configuration; and (5) controlling an interface manifold to implement the selected effluent flow configuration .
  • a method for monitoring and controlling one or more abatement systems .
  • the method includes the steps of (1) representing on a display one or more abatement systems; (2) representing on the display one or more effluent flows from processing tools; (3) receiving a selection indicating a back-up effluent flow configuration, wherein a first subset of the one or more abatement systems is selected as a primary abatement system and a second subset of the one or more abatement systems is selected as a back-up abatement system; (4) directing one or more effluent flows to the one or more primary abatement systems; (5) placing one or more back-up abatement systems in a stand-by mode; and (6) configuring an interface manifold to redirect the effluent flow from the one or more primary abatement systems to the one or more back-up abatement systems based on a status of the primary abatement system.
  • a method for monitoring and controlling one or more abatement systems.
  • the method includes the steps of (1) representing on a display one or more abatement systems; (2) representing on the display one or more effluent flows from processing tools; (3) receiving a selection indicating a redundant effluent flow configuration, ' wherein at least a first abatement system of the one or more abatement systems receives one or more effluent flows from processing tools and at least a second abatement system of the one or more abatement systems receives one or more effluent flows from processing tools; and (4) configuring an interface manifold to redirect the one or more effluent flows from an off-line abatement system to an operational abatement system based on the status of the off-line abatement system.
  • a method for monitoring and controlling one or more abatement systems.
  • the method includes the steps of (1) representing on a display one or more abatement systems; (2) representing on the display one or more effluent flows from processing tools; (3) receiving a selection indicating a load-balancing effluent flow configuration; and (4) configuring an interface manifold to direct the effluent flows to the one or more abatement systems based on at least one efficiency criteria.
  • a method for monitoring and controlling one or more abatement systems .
  • the method includes the steps of
  • FIG. 1 is a schematic diagram of a system for monitoring and controlling one or more abatement systems in accordance with an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a system for monitoring and controlling One or more abatement systems in accordance with an embodiment of the present invention.
  • FIG. 3 is a flowchart illustrating an exemplary method for monitoring and controlling one or more abatement systems in accordance with an embodiment of the present invention.
  • FIG. 4 is a flowchart illustrating an exemplary method for monitoring and controlling one or more abatement systems in accordance with an embodiment of the present invention.
  • FIG. 5 is a flowchart illustrating an exemplary method for monitoring and controlling one or more abatement systems in accordance with an embodiment of the present invention.
  • FIG. 6 is a flowchart illustrating an exemplary method for monitoring and controlling one or more abatement systems in accordance with an embodiment of the present invention .
  • FIG. 7 is a flowchart illustrating an exemplary method for monitoring and controlling one or more abatement systems in accordance with an embodiment of the present invention .
  • the present invention provides systems and methods for monitoring and controlling one or more abatement systems as a single integrated system.
  • the invention enables automated monitoring, tracking and manipulation of the abatement systems as well as the flow of effluent streams from electronic manufacturing tools to the abatement systems.
  • an operator via a software interface to a system controller may review the effluent flowing into each of the abatement systems and determine that only one of the abatement systems is needed to accommodate the effluent flow at this time.
  • the operator may then enter the appropriate changes into the system using the interface such that the second abatement system is placed in a stand-by mode and the effluent originally flowing to this second abatement system is directed to the first abatement system.
  • the system controller may be configured to automatically use the abatement systems, e.g., in the most efficient manner possible.
  • the present invention enables the operator to manipulate flows to the abatement systems via an interface manifold that may include a series of electronically controlled valves adapted to open, close, and/or switch channels between one or more electronic device processing tools and one or more abatement systems.
  • the interface manifold may be coupled to and operated by a controller that receives information from the interface manifold, the operator, the processing tools and abatement systems.
  • the information may be reviewed by the operator, who then may send an instruction to the interface manifold via the controller.
  • the controller may automatically operate the interface manifold based on information received from the interface manifold, the operator, the processing tools and the abatement systems.
  • the system controller may permit the easy selection and implementation of a number of pre-defined or operator designed effluent flow configurations.
  • the pre-designed effluent flow configurations may include a back-up configuration, a redundancy configuration, a load balancing configuration and an application specific configuration. These flow configuration types are described in detail below.
  • FIG. 1 a schematic illustration of a user interface 100 is depicted.
  • the user interface may be implemented on a standard PC using standard operating systems.
  • the user interface may be implemented on a controller, as described in U.S. Patent Application Serial No. 60/823,292 filed August 23, 2006, entitled "ABATEMENT SYSTEM WITH BACK-UP FUNCTIONALITY AND METHOD OF USING THE SAME" (Attorney Docket No. 11469), hereby incorporated by reference in its entirety.
  • the user interface 100 may include a representation of one or more selectively interactive abatement systems 102 on a display 104.
  • Each abatement system 102 may have a specific (e.g., static) IP address and may be connected through a hub to the single integrated system at, for example, a PC, server, etc.
  • the user interface 100 may also include a representation of one or more effluent flow configurations 106 that may be applied to each of the abatement systems 102.
  • the effluent flow configurations may include, for example, a back-up effluent flow configuration, an application specific effluent flow configuration, a load balancing effluent flow configuration, a redundant effluent flow configuration and a user-defined effluent flow configuration.
  • the effluent flow configuration 106 applied to the displayed abatement systems 102A-C may be highlighted or indicated by some other means. The effluent flow configurations will be explained in more detail below.
  • An operator may use the user interface 100 to remotely monitor each of the abatement systems 102 installed in a fabrication system which are communicatively coupled to the system.
  • the operator may monitor and track different parameters (described in Figure 2), as well as manipulate the parameters of each of the abatement systems 102.
  • a display with information particular to that abatement system 102A is populated, as shown in Figure 2.
  • FIG 2 a schematic illustration of a display 200 representing the first abatement system 102A selected in Figure 1 is depicted.
  • a pictorial representation of the abatement system 202A is displayed.
  • Other representations may be used.
  • a plurality of parameter information 204 related to the abatement system 202A may be displayed.
  • the parameter information 204 may include, for example, the pressure at each of the inlets of the abatement system 202A, the CDA flow rate, the fuel flow rate, tank temperatures, pressure changes for each of the inlets, tank levels, scrubber exhaust pressures, etc.
  • the operator may selectively manipulate the plurality of parameters to alter the functioning of the abatement system 202A.
  • the display 200 may also include an alarm indicator 206.
  • the operator may view all existing alarms and warnings associated with the selected abatement system 202A.
  • the operator may view the alarms by type (e.g., alarms, warnings, etc.) or by abatement system 202A.
  • the operator may also view the alarm history of the given abatement system 202A.
  • the alarms, warnings, or other related events may be saved locally on a PC, for example as a text file, automatically saved on a remote server, or saved on the controller.
  • the display 200 may also include a trend indicator 208.
  • the trend indicator 208 the operator may view the history trending of the abatement system 202A. For example, all of the analog values from sensors located at the abatement systems 102A-C may be logged on a specific rate. The operator may select individual sensors and adjust both their minimum and maximum ranges such that trends may be scaled and plotted on a trend display.
  • the data for each of the abatement systems 202A may be exported as a common separated value file (e.g., CSV, etc.) which is compatible with the other tools (e.g., Excel, etc.) coupled with the integrated system.
  • a common separated value file e.g., CSV, etc.
  • the other tools e.g., Excel, etc.
  • step SlOO one or more abatement systems are represented on a display.
  • One or more effluent flows from process tools are represented on a display in step S102.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems may be represented on a display.
  • step S104 a plurality of effluent flow configuration options is represented on a display.
  • the effluent flow configurations may include a user-designed configuration, a back-up configuration, a redundant configuration, a load-balancing configuration and an application specific configuration.
  • step S106 a selection indicating an effluent flow configuration is received.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems reflecting the selected effluent flow configuration may be represented on a display.
  • a plurality of valves in an interface manifold are controlled to implement the selected effluent flow configuration in step S108.
  • step S200 one or more abatement systems are represented on a display.
  • One or more effluent flows from process tools are represented on a display in step S202.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems may be represented on a display.
  • step S204 a selection indicating a back-up effluent flow configuration is received.
  • One or more abatement systems are selected as primary abatement systems and one or more abatement systems are selected as back-up abatement systems.
  • the selection of the one or more abatement systems as primary or back-up may be based on a plurality of parameters. These primary and back-up abatement systems may also be represented on the display.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems reflecting the selected effluent flow configuration may be represented on a display.
  • one or more effluent flows are directed to one or more primary abatement systems.
  • One or more back-up abatement systems are placed in a stand-by mode in step S208.
  • an interface manifold is configured to redirect the effluent flow from the one or more primary abatement systems to the one or more back-up abatement systems based on a status of the primary abatement system.
  • the status may indicate that the primary abatement system has gone offline.
  • the updated status of the primary and back-up abatement systems may also be represented on a display.
  • step S300 one or more abatement systems are represented on a display.
  • One or more effluent flows from process tools are represented on a display in step S302.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems may be represented on a display.
  • step S304 a selection indicating a redundant effluent flow configuration is received.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems reflecting the selected effluent flow configuration may be represented on a display.
  • At least a first abatement system of one or more abatement systems receives one or more effluent flows from processing tools and at least a second abatement system of one or more abatement systems receives one or more effluent flows from processing tools. At least one of the first and second abatement systems may go offline. The updated status of the operational and off-line abatement systems may be represented on a display.
  • an interface manifold is configured to redirect one or more effluent flows from an off-line abatement system to an operational abatement system based on the status of the offline abatement system.
  • step S400 one or more abatement systems are represented on a display.
  • One or more effluent flows from process tools are represented on a display in step S402.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems may be represented on a display.
  • step S404 a selection indicating a load-balancing effluent flow configuration is received.
  • one or more channels to deliver one or more effluent flows to one or more abatement systems reflecting the selected effluent flow configuration may be represented on a display.
  • an interface manifold is configured to direct the effluent flows to one or more abatement systems based on an efficiency criteria.
  • Each abatement system may have an associated operational cost, and the efficiency criteria may include for example, a least cost for abating a given effluent flow, a least amount of resources for abating a given effluent flow and a least amount of time for abating a given effluent flow.
  • One or more abatement systems receiving the effluent flow may be represented on the display. [0036] Turning to Figure 7, a flowchart illustrating an exemplary method for monitoring and controlling one or more abatement systems is depicted. In step S500 one or more abatement systems are represented on a display.
  • One or more effluent flows from process tools are- represented on a display in step S502. Additionally, one or more channels to deliver one or more effluent flows to one or more abatement systems may be represented on a display.
  • a selection indicating an application specific effluent flow configuration is received.
  • An interface manifold is configured to direct a first effluent flow to a first abatement system in step S506. The first effluent flow may be from a first process.
  • the interface manifold is configured to direct a second effluent flow to a second abatement system.
  • the second effluent flow may be from a second process.
  • the first and second process may be similar or different.
  • the first process may be a substrate manufacturing process
  • the second process may be a process chamber cleaning process
  • one or more channels to deliver one or more effluent flows to one or more abatement systems reflecting the selected effluent flow configuration may be represented on a display.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Treating Waste Gases (AREA)

Abstract

L'invention concerne un procédé et des systèmes permettant de contrôler et de commander un ou plusieurs systèmes de réduction de la pollution. Le procédé selon l'invention consiste : à représenter, sur un même écran d'affichage, un ou plusieurs systèmes de réduction de la pollution et un ou plusieurs flux d'effluents issus d'outils de traitement; à recevoir une configuration de flux d'effluents sélectionnée; et à commander un collecteur d'interface afin de mettre en oeuvre la configuration de flux d'effluents sélectionnée. L'invention concerne également de nombreux autres aspects.
PCT/US2007/018669 2006-08-23 2007-08-23 Interface permettant d'exploiter et de contrôler des systèmes de réduction de la pollution Ceased WO2008024446A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82329406P 2006-08-23 2006-08-23
US60/823,294 2006-08-23

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WO2008024446A2 true WO2008024446A2 (fr) 2008-02-28
WO2008024446A3 WO2008024446A3 (fr) 2008-09-25
WO2008024446A8 WO2008024446A8 (fr) 2009-04-09

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113167470A (zh) * 2018-12-13 2021-07-23 爱德华兹有限公司 减排方法和装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160521B2 (en) * 2001-07-11 2007-01-09 Applied Materials, Inc. Treatment of effluent from a substrate processing chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113167470A (zh) * 2018-12-13 2021-07-23 爱德华兹有限公司 减排方法和装置
US12447438B2 (en) 2018-12-13 2025-10-21 Edwards Limited Abatement method and apparatus

Also Published As

Publication number Publication date
TWI444797B (zh) 2014-07-11
WO2008024446A3 (fr) 2008-09-25
WO2008024446A8 (fr) 2009-04-09
TW200827963A (en) 2008-07-01

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