WO2008038573A1 - Connecteur conducteur anisotrope et procédé d'inspection d'un article inspecté à l'aide de ce connecteur conducteur anisotrope - Google Patents
Connecteur conducteur anisotrope et procédé d'inspection d'un article inspecté à l'aide de ce connecteur conducteur anisotrope Download PDFInfo
- Publication number
- WO2008038573A1 WO2008038573A1 PCT/JP2007/068289 JP2007068289W WO2008038573A1 WO 2008038573 A1 WO2008038573 A1 WO 2008038573A1 JP 2007068289 W JP2007068289 W JP 2007068289W WO 2008038573 A1 WO2008038573 A1 WO 2008038573A1
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- WIPO (PCT)
- Prior art keywords
- anisotropic conductive
- sheet
- spacer
- sheet layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
Definitions
- the present invention relates to an anisotropic conductive connector preferably used as an electrical connection between circuit elements such as a wafer and an IC substrate and a connector in an inspection apparatus for a printed board, and the anisotropic conductive connector.
- the present invention relates to a method for inspecting a used object.
- an anisotropic conductive sheet for example, a sheet that exhibits conductivity only in the thickness direction, or a pressure-conductive conductive portion that exhibits conductivity only in the thickness direction when pressed in the thickness direction. It has been known. They can achieve a compact electrical connection without using means such as soldering or mechanical fitting, and if the sheet material is an elastic body such as an elastomer, It has features such as absorbing strain and making soft connections.
- circuit elements such as a printed circuit board and a leadless chip carrier, a liquid crystal panel It is widely used as a connector to achieve electrical connection with each other.
- an electrode to be inspected formed on one surface of the circuit board to be inspected, and a connection formed on the surface of the circuit board for inspection
- an anisotropic conductive sheet should be interposed as a connector between the electrode area to be inspected on the circuit board and the electrode area for connection on the circuit board for inspection. Has been done.
- an anisotropic conductive connector 10 is arranged between an inspection object 1 such as a wafer to be inspected, an IC substrate, etc., and an inspection circuit board 5, and the object to be inspected.
- an inspection object 1 such as a wafer to be inspected, an IC substrate, etc.
- an inspection circuit board 5 By pressurizing the test object 1, the test object 1 is brought into contact with the anisotropic conductive connector 10 and an electric signal is supplied from this state to the test circuit board 5 to inspect the test circuit board 5 6 electrodes Then, the electric signal is sent back to the inspection circuit board 5 through the anisotropic conductive connector 10 to inspect the circuit of the object 1 to be inspected. ing.
- Patent Document 1 Japanese Patent Laid-Open No. 51-93393
- Patent Document 2 Patent Document 2 (Kaisho 53-1477 72)) distributes conductive magnetic particles non-uniformly in the elastomer so that a number of conductive path forming portions extending in the thickness direction can be insulated from each other.
- An anisotropic conductive sheet (hereinafter referred to as “unevenly-distributed anisotropic conductive sheet”) is disclosed, and Patent Document 3 (Japanese Patent Laid-Open No. 61-250906) and the like are further disclosed.
- Patent Document 3 Japanese Patent Laid-Open No. 61-250906 and the like are further disclosed.
- An unevenly anisotropic anisotropic conductive sheet in which a step is formed between the surface of the conductive path forming part and the insulating part. Door has been disclosed.
- the unevenly distributed anisotropic conductive sheet has a conductive path forming portion formed in accordance with the pattern of the electrode pattern of the circuit board or the like and the opposite pattern, it is connected in comparison with the distributed anisotropic conductive sheet. This is advantageous in that the electrical connection between the electrodes can be achieved with high reliability even for a circuit board or the like in which the electrodes to be arranged are arranged at a small pitch.
- the bump shape of the electrode 2 to be inspected 1 in contact with the anisotropic conductive sheet also varies to some extent with respect to the height direction. For this reason, depending on the bump shape, there is a portion that is partially subjected to high strain, and it is preferable that the anisotropic conductive sheet has elasticity that can sufficiently absorb variations in the height of the bump shape.
- the conventional unevenly distributed anisotropic conductive sheet is based on silicone rubber or the like.
- the circuit boards and semiconductor elements connected to this are glass fiber-containing epoxy resin, metal plates such as copper, silicon, etc., and the thermal expansion coefficients of the two are different. Deviation occurs, and electrical continuity may not be obtained especially when the pressing force is small. Such a problem becomes more prominent as the electrode pattern becomes finer with a narrower electrode interval.
- Patent Document 4 Japanese Patent Laid-Open No. 2001-93599
- Patent Document 2 Japanese Patent Laid-Open No. 53-147772
- Patent Document 3 Japanese Patent Application Laid-Open No. 61-250906
- Patent Document 4 Japanese Patent Laid-Open No. 2001-93599
- the present invention when inspecting the electrical characteristics of the inspection object, the inter-electrode dimension has become finer and the load load per area supported by the elastic body has increased. Therefore, the elasticity does not decrease, and the variation in bump shape height of the object to be inspected can be sufficiently absorbed, and the electrode position and anisotropic conductivity of the object to be inspected have been further miniaturized.
- the electrode position on the sheet can be accurately aligned, and in addition, the pressing force is small
- the present invention is to provide a method for inspecting an object to be inspected using the anisotropic conductive connector.
- An anisotropic conductive connector according to the present invention includes:
- An anisotropic conductive connector for inspecting the electrical characteristics of an object to be inspected comprising a first anisotropic conductive sheet layer disposed on the inspected object side to be inspected and an inspection circuit board side A second anisotropic conductive sheet layer disposed; and an insulating sheet-like spacer disposed between the first anisotropic conductive sheet layer and the second anisotropic conductive sheet layer.
- Each of the first anisotropic conductive sheet layer and the second anisotropic conductive sheet layer is formed such that an elastic conductive path protrudes in the thickness direction, and the protruding portion of each elastic conductive path is
- the first anisotropic conductive sheet layer, the second anisotropic conductive sheet layer, and the sheet spacer are integrated with each other while being inserted into the through hole of the sheet spacer. It is characterized by being assembled! /!
- the force S can be selected appropriately for the thickness of the spacer, and therefore the force S can be secured to ensure a sufficient thickness.
- an anisotropic conductive connector for inspecting electrical characteristics of an object to be inspected is:
- An anisotropic conductive connector for inspecting the electrical characteristics of an object to be inspected, the first anisotropic conductive sheet layer disposed on the inspected object side to be inspected, and the inspection circuit board side A second anisotropically conductive sheet layer, an insulating sheet-like spacer disposed between the first anisotropically conductive sheet layer and the second anisotropically conductive sheet layer, and the sheet A conductive contact member fixed on the back side of the spacer, and the first anisotropic conductive sheet layer and the second anisotropic conductive sheet layer have a thickness respectively.
- the force S can be selected as appropriate for the thickness of the spacer, and the conductive contact portion can be used even when the pressing load from the inspection object side is small. Realizes stable electrical connection between the elastic conductive path protruding from the first anisotropic conductive sheet layer and the elastic conductive path protruding from the second anisotropic conductive sheet layer through the material This ensures that the contact stability between the elastic conductors is sufficiently high and prevents small deformations that can cause buckling, damage, collapse or permanent deformation of the elastic conductors. Can obtain high strength and durability.
- the conductive contact member fixed on the back side of the sheet-like spacer is made of a metal plate.
- a support region portion of the sheet-shaped spacer that supports the conductive contact member is formed to be displaceable in a thickness direction of the sheet-shaped spacer. That's right.
- a slit is formed in the support region portion of the sheet-like spacer so that the periphery of the slit can be displaced in the thickness direction.
- the sheet-like spacer is composed of two plate members, and the conductive contact member is disposed between the first plate member and the second plate member, and V, OK!
- the elastic conductive path on the first anisotropic conductive sheet side and the second anisotropic conductive path Since the elastic conductive path on the conductive sheet side can be arranged at the center position of the two plates, positioning can be performed accurately.
- the inspection method for an object to be inspected using the anisotropic conductive connector according to the present invention includes a first anisotropic conductive material that is arranged on the object side and has an elastic conductive path protruding in the thickness direction.
- a first anisotropic conductive material that is arranged on the object side and has an elastic conductive path protruding in the thickness direction.
- An insulating sheet-like spacer having a through hole is disposed between the second anisotropic conductive sheet layer that is disposed on the inspected object side and has an elastic conductive path protruding in the thickness direction.
- An elastic conductive path protruding from the anisotropic conductive sheet layer is inserted into the through hole of the sheet-shaped spacer so as to abut on both sides, and the thickness of the sheet-shaped spacer and the It is a special feature that the amount of deformation of the elastic conductive path is adjusted by appropriately adjusting the length of the elastic conductive path.
- the amount of deformation of the elastic conductive path can be set as appropriate, so that it is possible to contribute to improvement in durability while performing an accurate inspection.
- the overall thickness can be set sufficiently thick by interposing a spacer.
- the amount of deformation during pressurization can be adjusted by adjusting the thickness of the spacer.
- the deformation amount of the elastic conductive path can be regulated by the inner wall surface of the through hole of the spacer. As a result, the durability when repeatedly used can be improved.
- a conductive contact member is fixed to the back of the through hole of the sheet spacer, electrical connection will be easy even if the test is performed with a small applied pressure. Can do.
- the anisotropic conductive connector can be adjusted to the most preferable thickness, so that a correct inspection is performed. Not only can the force S be applied, but also the amount of deformation of the elastic conductive path can be regulated, so the durability of repeated use is improved.
- FIG. 1 is a plan view of an anisotropic conductive connector according to an embodiment of the present invention.
- FIG. 2 is a partially enlarged cross-sectional view of the anisotropic conductive connector shown in FIG.
- FIG. 3 is a cross-sectional view when the enlarged portions shown in FIG. 2 are assembled together.
- FIG. 4 shows another embodiment of the present invention, in which a sheet-like spacer is composed of two plates, and a conductive contact member is installed on one of the plates. It is the expanded sectional view shown.
- FIG. 5 is an enlarged cross-sectional view showing a state in which the sheet-like spacer composed of the two plates shown in FIG. 4 is assembled together with the conductive contact member.
- FIG. 6 is a plan view of the first plate shown in FIG.
- FIG. 7 is an assembled cross-sectional view of the sheet-like spacer member shown in FIG.
- FIG. 8 is a cross-sectional view of an anisotropic conductive connector according to still another embodiment of the present invention.
- FIG. 9 inspects an object to be inspected such as a circuit board using the anisotropic conductive connector. It is a schematic sectional drawing of the conventional inspection apparatus.
- Fig. 10 is a cross-sectional view of a conventional inspection apparatus disclosed in Japanese Patent Laid-Open No. 2001-93599.
- FIG. 1 is a plan view of an anisotropic conductive connector 20 according to an embodiment of the present invention
- FIG. 2 is a partially enlarged sectional view in the direction of the line AA in FIG.
- the anisotropic conductive connector 20 of the present embodiment includes a first anisotropic conductive sheet layer 20A, a second anisotropic conductive sheet layer 20B, and the like.
- the insulating sheet-like spacer 20C is disposed between the first and second anisotropic conductive sheet layers.
- first anisotropic conductive sheet layer 20A and the second anisotropic conductive sheet 20B are formed in the same manner, the first anisotropic conductive sheet layer 20A will be described below as an example. Explained.
- the anisotropic conductive sheet 20A includes a plurality of cylindrical elastic conductive paths 21 extending in the thickness direction, and an insulating portion 15 that insulates the elastic conductive paths 21 from each other. And a plate-like support 17 that supports the insulating portion 15, and is formed in a rectangular sheet shape as a whole.
- the elastic conductive path 21 contains conductive particles P exhibiting magnetism, and the elastic conductive path 21 exhibits conductivity when pressed in the thickness direction.
- a range electrically connected to an electrode to be inspected such as a wafer to be inspected or an IC substrate is defined as an effective conductive path 12.
- the portion not connected to the target electrode is the ineffective conductive path 13.
- the effective conductive path 12 is arranged corresponding to the pattern of the electrode to be inspected to be connected, and the elastic conductive path 21 has protrusions 21a on both sides in the thickness direction, as shown in FIG. Is formed.
- the insulating portion 15 is integrally formed so as to surround the periphery of each elastic conductive path 21, so that all the elastic conductive paths 21 are insulated from each other by the insulating portion 15. Yes.
- Various materials can be used as a material for forming the base material and the insulating portion 15 containing the conductive particles P.
- Specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene.
- Conjugated rubbers such as rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, block copolymers such as styrene butadiene-gen block copolymer rubber, styrene isoprene block copolymer, etc.
- Examples include polymer rubber and hydrogenated products thereof, black-prene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene copolymer copolymer rubber. .
- a material other than the conjugated-gen rubber S, particularly from the viewpoint of molding processability and electrical properties, silicone rubber Is preferably used.
- the conductive particles P particles of metal such as iron, cobalt, nickel or the like, particles of these alloys, particles containing these metals, or these particles as core particles
- the surface of the core particle is coated with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particle or inorganic substance particle such as glass beads or polymer particle is used as the core particle.
- a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particle or inorganic substance particle such as glass beads or polymer particle is used as the core particle.
- examples include those obtained by coating the surface of the core particles with a conductive magnetic material such as nickel or cobalt, or those obtained by coating the core particles with both a conductive magnetic material and a metal having good conductivity.
- nickel particles as core particles, and the surface of which is coated with a metal with good conductivity such as gold or silver.
- a metal with good conductivity such as gold or silver.
- gold and silver are coated.
- the means for coating the surface of the core particles with the conductive metal is not particularly limited, but can be performed by, for example, chemical plating or electroless plating.
- the first anisotropic conductive sheet 20A and the second anisotropic conductive sheet 20B are formed as described above.
- the sheet-like spacer 20C is positioned at the position corresponding to the pattern of the electrode 2 to be inspected, that is, the elastic conductivity of the anisotropic conductive sheet layers 20A and 20B.
- a through hole 23 is formed at a position corresponding to the paths 21, 21.
- the corresponding projecting portions 21a and 21a of the anisotropic conductive sheet layers 20A and 20B are inserted from both directions.
- the shape of the through hole 23 of the sheet-like spacer 20C is not particularly limited, but the shape of the conductive path 21 and the shape of the protruding portion 21a of the anisotropic conductive sheet layers 20A and 20B For example, it is formed in a columnar shape.
- the inner diameter of the through hole 23 may be larger than the protruding portion 21a so that the protruding portion 21a of the anisotropic conductive sheets 20A and 20B is inserted, It is preferable that there is room.
- the inner diameter of the through hole 23 is preferably such that the ratio to the diameter of the protruding portion 21a is, for example, 1.05 to 2 times, preferably 1.;! To 1.8 times.
- the sheet-like spacer 20C is preferably positioned so that the tips of the protruding portions 21a inserted from both directions are close to the intermediate portion of the through hole 31.
- the material of the sheet-like spacer 20C is made of a heat-resistant insulating material having high dimensional stability. S is preferable. Specifically, thermosetting such as glass fiber reinforced epoxy resin and polyimide resin. The ability to use thermoplastic resins such as conductive resin, polyethylene terephthalate resin, butyl chloride resin, polystyrene resin, polyacrylonitrile resin, polyethylene resin, acrylic resin, polybutadiene resin, and other various insulating resins Especially glass fiber reinforcement A type epoxy resin is most suitable.
- a sheet-shaped spacer 20 C force S can be obtained by forming the through hole 23 using, for example, a numerical drilling device or a laser processing device. .
- the thickness d of the sheet-like spacer 20C is smaller than the sum of the protruding height H of one protruding portion 21a and the height H of the other protruding portion 21a. Then, by controlling the thickness d of the sheet-like spacer 20C and the size and height of the protruding portion 21a, when the object 1 shown in FIG. The other protruding portion 21a is brought into contact with an appropriate force to ensure the electrical connection between them. Further, by appropriately adjusting the thickness of the sheet-like spacer 20C and the height of the protruding portion 21a of the elastic conductive path 21, the conductive path forming portion 21 including the protruding portions 21a of the anisotropic conductive sheets 20A and 20B can be adjusted.
- the first anisotropic conductive sheet layer 20A, the second anisotropic conductive sheet layer 20B, and the sheet-like spacer 20C according to the present embodiment are configured as described above. However, these are assembled as shown in FIG. 3, and are arranged between the first anisotropic conductive sheet layer 20A and the sheet-like spacer 20 C, and the second anisotropic conductive sheet layer 20B and the sheet. Between the spacers 20C, the insulating portion 15 is integrally fixed by an adhesive such as silicon.
- the anisotropically conductive connector 20 formed in this way is arranged between an inspected object 1 such as an IC substrate and an inspection circuit board 5 as in the case shown in FIG. Used for electrical inspection of device under test 1.
- reference numeral 19 denotes a guide hole into which the guide pin is inserted.
- the thickness of the protruding portion 21a of the elastic conductive path 21 and the thickness of the sheet-like spacer 20C can be appropriately adjusted. Accurate inspection of the object to be inspected 1 such as IC substrate and wafer. Further, since the protruding portions 21a, 21a having low heights are inserted from both sides of the through hole 23 and face each other at the central portion of the through hole 23, the electrode position is not easily displaced. Therefore, even if an inspection is performed with a small pressure or an inspection with a slightly large applied pressure, electrical continuity can be obtained. Further, it is determined by the force that absorbs the variation in the height direction of the electrode 2 to be inspected due to the deformation caused by the pressing of the protruding portion 21a.
- a good electrical inspection can be performed when inspecting the inspection object 1 on which a fine electrode pattern with a narrow electrode interval is formed.
- the deformation amount of the elastic conductive path 21 can be appropriately set, so that an accurate inspection is performed. It can be strong and has good durability.
- the sheet-like spacer 20C is composed of one plate material, but may be composed of two plate materials instead. Further, when two sheet materials are used as the sheet-like spacer, a conductive contact member made of a material harder than the elastic conductive path 21 may be interposed between them. [0055] In the following, the force for explaining another embodiment of the present invention in which the sheet-like spacer 20C is composed of two plate members and a conductive contact member is interposed between them is the same as the above-described embodiment. Are denoted by the same reference numerals, and detailed description thereof is omitted.
- This anisotropically conductive connector 30 includes a first anisotropically conductive sheet 20A, a second anisotropically conductive sheet 20B, and a sheet-like spacer 20C made of two plates. ! /
- the first anisotropic conductive sheet layer 20A and the second anisotropic conductive sheet layer 20B are formed in the same manner as in the above embodiment. That is, the protruding portions 21a are formed on both sides of the insulating portion. Further, the sheet-like spacer 20C has a first plate member 25 and a second plate member 27 that are approximately half the thickness. These plate members 25 and 27 are similar to the above embodiment in that predetermined through holes 23 and 23 are formed.
- the through hole 23 is provided on the back surface side (second plate material 27 side) of the first plate material 25 constituting the sheet-like spacer 20C.
- a conductive contact member 29 is fixed so as to cover the body.
- the material of the conductive contact member 29 various metals, conductive inorganic materials, and conductive organic materials are used as long as they are conductive. Of these, metals are preferable, such as copper, gold, silver, palladium, rhodium, nickel, iron, sus, aluminum, cobalt, tin, and zinc.
- Electrode a laminate thereof, or an alloy containing these.
- copper, gold, silver, palladium, rhodium, nickel, iron or a laminate thereof or an alloy containing these is preferred, and particularly, a copper or gold laminate is preferred. Is preferable as an alloy containing these.
- the conductive contact member 29 has, for example, a square shape or a circular shape in plan view.
- the conductive contact member 29 is formed on the elastic conductive portion 21 of the first and second anisotropic conductive sheet layers 20A and 20B so as to withstand the pressure when pressed to obtain electrical continuity. It is preferably a rigid body rather than a material.
- FIG. 6 is a plan view showing a part of the first plate member 25.
- through-holes 23 are arranged vertically and horizontally corresponding to the respective positions of the protruding electrodes of the object to be inspected such as an IC substrate (corresponding to the protruding electrode 3a of the inspected object 3 in FIG. 10). It is formed in a state of being arranged in a shape.
- slits 22a extending in a U-shape are continuously formed in a region surrounding each through hole 23.
- linear slits 22b are formed in the open portions of the U-shaped slits 22a.
- the peripheral region of the through hole 23 is formed to be displaceable in the front-rear direction, that is, in the thickness direction of the sheet-like spacer 20C, on the paper surface of FIG.
- the support region portion 28 of the conductive contact member 29 disposed so as to close the through hole 23 is formed to be displaceable in the thickness direction by these slits 22a and 22b. Thereby, deformation of the conductive contact member 29 is facilitated.
- the shape of the support region portion 28 of the conductive contact member 29 is not particularly limited as long as it can be displaced in the thickness direction.
- the linear slit 22b reduces resistance to displacement of the support region portion 28, and is not essential.
- the shape of the slit that facilitates deformation is not limited to the embodiment.
- reference numeral 19 indicates a hole 19 for passing the positioning pin (see FIG. 1).
- the shape of the through-hole 23 is not particularly limited, but it is preferable that the through-hole 23 is, for example, widened in a columnar shape in that it can receive the electrode 2 to be inspected 1.
- the diameter of the through hole 21 is, for example, 1.05 to 2 times, preferably 1.;! To 1.6 times the maximum diameter of the electrode 2 to be inspected formed in a spherical shape, for example. More preferably, it is 1.2 to 1.4.
- the sheet-like spacer 20C is constituted by the two plate members 25 and 27 as described above, and the conductive contact member 29 is further provided. These are shown in FIG. Assemble each other to insulate between the first anisotropic conductive sheet layer 20A and the first plate member 25 and between the second anisotropic conductive sheet layer 20B and the second plate member 27. Adhesion may be performed with an appropriate adhesive.
- the protruding portion 21a formed in the elastic conductive path 21 of the first anisotropic conductive sheet layer 20A is inserted into the through hole 23 of the first plate member 25, the protruding portion 21a
- the heights of the first plate member 25, the second plate member 27, and the protruding portion 21a are adjusted in advance so that the tip portion is arranged slightly apart so as to be close to the conductive contact member 29.
- the protruding portion 21a of the elastic conductive path 21 of the second anisotropic conductive sheet layer 20B is also arranged slightly apart so as to be close to the conductive contact member 29.
- the relatively flexible elastic conductive path 21 comes into contact with the relatively hard conductive contact member 29, thereby making contact. Even if a test is performed with a small applied pressure in the same usage state as in Fig. 9, an electrical test can be performed.
- a sheet-like spacer can be constituted by two plate materials, and the overall thickness can be increased or decreased by using such a plate material.
- the present invention can be variously modified.
- one projecting portion 21a of the second anisotropic conductive sheet 20B ′ corresponding to the conductive contact member 29 may be eliminated, and the entire end face may be formed substantially flat.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
L'invention concerne un connecteur conducteur anisotrope et un procédé d'inspection d'un article inspecte a l'aide de ce connecteur conducteur anisotrope[PROBLÈMES] Proposer un connecteur conducteur anisotrope excellent en durabilité dans lequel l'élasticité ne descend pas même si la mise à une échelle inférieure des dimensions entre les électrodes progresse pour augmenter la charge par zone portée par un corps élastique, une variation en hauteur du profil de bossage d'un article inspecté peut être suffisamment absorbée, la position d'électrode de l'article inspecté peut être amenée à progresser dans la mise à une échelle inférieure et la position de l'électrode d'une feuille conductrice anisotrope peut être appariée de façon précise, une conduction électrique peut être obtenue même lorsque la force de pression est faible, et une occurrence de flambage provoquant une déformation permanente est éliminée. [MOYENS POUR RÉSOUDRE LES PROBLÈMES] L'invention concerne un connecteur conducteur anisotrope caractérisé par le fait qu'une première couche de feuille conductrice anisotrope (20A) et une seconde couche de feuille conductrice anisotrope (20B) sont formées avec des trajets conducteurs élastiques (21) se projetant respectivement dans la direction de l'épaisseur et, dans un état où la partie de projection (21a) de chaque trajet conducteur élastique est introduit à l'intérieur du trou traversant (23) d'un espaceur de type feuille (20C), la première couche de feuille conductrice anisotrope (20A), la seconde couche de feuille conductrice anisotrope (20B), et l'espaceur de type feuille (20C) sont assemblés d'un seul tenant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006266037A JP4793203B2 (ja) | 2006-09-28 | 2006-09-28 | 異方導電性コネクターおよびこの異方導電性コネクターを用いた被検査体の検査方法 |
| JP2006-266037 | 2006-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008038573A1 true WO2008038573A1 (fr) | 2008-04-03 |
Family
ID=39230007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/068289 Ceased WO2008038573A1 (fr) | 2006-09-28 | 2007-09-20 | Connecteur conducteur anisotrope et procédé d'inspection d'un article inspecté à l'aide de ce connecteur conducteur anisotrope |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4793203B2 (fr) |
| TW (1) | TW200816565A (fr) |
| WO (1) | WO2008038573A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015117579A1 (fr) * | 2014-02-04 | 2015-08-13 | Schaeffler Technologies AG & Co. KG | Fiche, élément de machine et procédé de mise en contact de plots de contact d'un élément de machine |
| JP2015159016A (ja) * | 2014-02-24 | 2015-09-03 | 富士通株式会社 | コネクタ、電子装置及びその製造方法 |
| CN110325866A (zh) * | 2017-02-24 | 2019-10-11 | 泰克诺探头公司 | 具有改进的频率性能的垂直探针测试头 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5018625B2 (ja) * | 2008-05-08 | 2012-09-05 | 株式会社デンソー | 半導体装置の製造方法 |
| KR100969482B1 (ko) | 2008-07-07 | 2010-07-14 | 이용준 | 반도체 소자 테스트용 콘택터 및 그 제조방법 |
| KR101573450B1 (ko) * | 2014-07-17 | 2015-12-11 | 주식회사 아이에스시 | 테스트용 소켓 |
| KR101606284B1 (ko) * | 2014-10-29 | 2016-03-25 | 주식회사 아이에스시 | 관통 홀이 형성된 다공성 절연시트를 갖는 전기적 접속체 및 테스트 소켓 |
| JP7042037B2 (ja) * | 2017-04-24 | 2022-03-25 | デクセリアルズ株式会社 | 検査冶具の製造方法 |
| KR102361639B1 (ko) | 2017-07-10 | 2022-02-10 | 삼성전자주식회사 | 유니버설 테스트 소켓, 반도체 테스트 장비, 및 반도체 장치의 테스트 방법 |
| KR101985445B1 (ko) * | 2018-07-25 | 2019-06-04 | 주식회사 아이에스시 | 검사용 도전 시트 |
| KR102090961B1 (ko) * | 2018-10-25 | 2020-03-19 | 주식회사 오킨스전자 | 다수의 러버 소켓이 수직으로 적층되는 테스트 소켓 |
| KR102734171B1 (ko) * | 2018-12-20 | 2024-11-25 | 주식회사 아이에스시 | 검사용 소켓 |
| KR102732165B1 (ko) * | 2019-03-15 | 2024-11-22 | 주식회사 아이에스시 | 전기접속용 커넥터 |
| KR102813353B1 (ko) * | 2019-03-18 | 2025-05-28 | 주식회사 아이에스시 | 테스트 소켓 |
| KR102388678B1 (ko) * | 2020-08-28 | 2022-04-20 | 주식회사 스노우 | 검사용 소켓 |
| KR102558862B1 (ko) * | 2021-06-01 | 2023-07-24 | 주식회사 아이에스시 | 검사용 소켓 |
| TWI845865B (zh) * | 2021-10-08 | 2024-06-21 | 韓商斯諾有限公司 | 檢查用插座 |
| KR102836430B1 (ko) * | 2023-02-10 | 2025-07-23 | 주식회사 아이에스시 | 검사용 커넥터 |
| KR102607955B1 (ko) * | 2023-07-14 | 2023-12-01 | 미르텍알앤디 주식회사 | 메쉬형 핀 및 다양한 크기의 블레이드 핀을 포함하는 하이브리드형 테스트 소켓 |
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| JP2001083209A (ja) * | 1999-09-14 | 2001-03-30 | Jsr Corp | 半導体装置接続装置、半導体装置検査装置および検査方法 |
| JP2002139541A (ja) * | 2000-10-30 | 2002-05-17 | Jsr Corp | 電気回路部品の検査治具および電気回路部品の検査方法 |
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2006
- 2006-09-28 JP JP2006266037A patent/JP4793203B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-20 WO PCT/JP2007/068289 patent/WO2008038573A1/fr not_active Ceased
- 2007-09-28 TW TW96136328A patent/TW200816565A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001083209A (ja) * | 1999-09-14 | 2001-03-30 | Jsr Corp | 半導体装置接続装置、半導体装置検査装置および検査方法 |
| JP2002139541A (ja) * | 2000-10-30 | 2002-05-17 | Jsr Corp | 電気回路部品の検査治具および電気回路部品の検査方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015117579A1 (fr) * | 2014-02-04 | 2015-08-13 | Schaeffler Technologies AG & Co. KG | Fiche, élément de machine et procédé de mise en contact de plots de contact d'un élément de machine |
| JP2015159016A (ja) * | 2014-02-24 | 2015-09-03 | 富士通株式会社 | コネクタ、電子装置及びその製造方法 |
| CN110325866A (zh) * | 2017-02-24 | 2019-10-11 | 泰克诺探头公司 | 具有改进的频率性能的垂直探针测试头 |
| CN110325866B (zh) * | 2017-02-24 | 2022-04-08 | 泰克诺探头公司 | 具有改进的频率性能的垂直探针测试头 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200816565A (en) | 2008-04-01 |
| JP4793203B2 (ja) | 2011-10-12 |
| JP2008082983A (ja) | 2008-04-10 |
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