WO2008055708A3 - Mikroelektronische baugruppe und verfahren zum herstellen einer mikroelektronischen baugruppe - Google Patents

Mikroelektronische baugruppe und verfahren zum herstellen einer mikroelektronischen baugruppe Download PDF

Info

Publication number
WO2008055708A3
WO2008055708A3 PCT/EP2007/009854 EP2007009854W WO2008055708A3 WO 2008055708 A3 WO2008055708 A3 WO 2008055708A3 EP 2007009854 W EP2007009854 W EP 2007009854W WO 2008055708 A3 WO2008055708 A3 WO 2008055708A3
Authority
WO
WIPO (PCT)
Prior art keywords
microelectronic subassembly
production
support layers
circuit
microelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/009854
Other languages
English (en)
French (fr)
Other versions
WO2008055708A2 (de
Inventor
Dmitry David Polityko
Stephan Wenzel
Erik Jung
Jan Hefer
Michael Niedermayer
Stephan Guttowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of WO2008055708A2 publication Critical patent/WO2008055708A2/de
Publication of WO2008055708A3 publication Critical patent/WO2008055708A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Die vorliegende Erfindung betrifft eine mikroelektronische Baugruppe, umfassend mindestens zwei parallel übereinander angeordnete Schaltungsträgerlagen (1, 2, 3), die durch verschiedene Abschnitte eines zumindest bereichsweise flexiblen gefalteten Substrats gebildet und mit elektronischen Bauelementen bestückt sind, wobei die Schaltungsträgerlagen (1, 2, 3) durch mindestens ein oberflächenmontiertes Bauelement (4, 4'), das Bestandteil einer Schaltung auf zumindest einer der Schaltungsträgerlagen (1, 2, 3) ist, mechanisch miteinander verbunden sind. Die Erfindung betrifft ferner ein Verfahren zum Herstellen einer solchen mikroelektronischen Baugruppe.
PCT/EP2007/009854 2006-11-09 2007-11-09 Mikroelektronische baugruppe und verfahren zum herstellen einer mikroelektronischen baugruppe Ceased WO2008055708A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006053461.1 2006-11-09
DE102006053461A DE102006053461A1 (de) 2006-11-09 2006-11-09 Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe

Publications (2)

Publication Number Publication Date
WO2008055708A2 WO2008055708A2 (de) 2008-05-15
WO2008055708A3 true WO2008055708A3 (de) 2008-07-10

Family

ID=39276271

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/009854 Ceased WO2008055708A2 (de) 2006-11-09 2007-11-09 Mikroelektronische baugruppe und verfahren zum herstellen einer mikroelektronischen baugruppe

Country Status (3)

Country Link
DE (1) DE102006053461A1 (de)
TW (1) TW200845836A (de)
WO (1) WO2008055708A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8391018B2 (en) 2009-09-28 2013-03-05 Qualcomm Incorporated Semiconductor die-based packaging interconnect
DE102011119957A1 (de) 2011-12-02 2013-06-06 Micronas Gmbh Befestigungsvorrichtung
DE102013001006B4 (de) 2013-01-22 2015-01-22 Baumüller Nürnberg GmbH Leiterplattenanordnung
DE102013217301A1 (de) * 2013-08-30 2015-03-05 Robert Bosch Gmbh Bauteil
JP7015691B2 (ja) * 2017-12-27 2022-02-03 新光電気工業株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1306900A2 (de) * 2000-12-28 2003-05-02 Texas Instruments Incorporated Chipgrosse Gehäuse gestapelt auf Falt-Verbindung für Vertikalmontage auf Substraten
US20040238931A1 (en) * 2003-05-30 2004-12-02 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US20060033217A1 (en) * 2004-08-10 2006-02-16 Brian Taggart Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03184392A (ja) * 1989-12-13 1991-08-12 Mitsubishi Electric Corp 実装部品
US5426263A (en) * 1993-12-23 1995-06-20 Motorola, Inc. Electronic assembly having a double-sided leadless component
JP2000114686A (ja) * 1998-10-07 2000-04-21 Tdk Corp 表面実装部品
JP2006024900A (ja) * 2004-06-09 2006-01-26 Nippon Dempa Kogyo Co Ltd 複数の基板を備える構造、その構造の製造方法、および、その構造を用いた水晶発振器
JP2006147886A (ja) * 2004-11-19 2006-06-08 Fuji Photo Film Co Ltd 実装基板ユニット及びカメラモジュール
WO2006082620A1 (ja) * 2005-01-31 2006-08-10 Spansion Llc 積層型半導体装置及び積層型半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1306900A2 (de) * 2000-12-28 2003-05-02 Texas Instruments Incorporated Chipgrosse Gehäuse gestapelt auf Falt-Verbindung für Vertikalmontage auf Substraten
US20040238931A1 (en) * 2003-05-30 2004-12-02 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US20060033217A1 (en) * 2004-08-10 2006-02-16 Brian Taggart Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Also Published As

Publication number Publication date
WO2008055708A2 (de) 2008-05-15
TW200845836A (en) 2008-11-16
DE102006053461A1 (de) 2008-05-15

Similar Documents

Publication Publication Date Title
WO2006134216A3 (en) Circuit board structure and method for manufacturing a circuit board structure
WO2005125298A3 (en) Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
TW200633614A (en) Method of fabricating printed circuit board having embedded multi-layer passive devices
GB0714966D0 (en) Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device, and electronic device using multilayer wiring board
WO2007009767A3 (de) Kapazitiver regensensor
TW200625485A (en) Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
EP1884992A4 (de) Leiterplatte
WO2006039633A3 (en) Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
TWI372589B (en) Manufacturing method of multi-layered circuit board
WO2003030186A3 (en) Nickel coated copper as electrodes for embedded passive devices
WO2007122550A3 (en) Semiconductor light emitting device with integrated electronic components
TW200640325A (en) Wiring board manufacturing method
EP1811824A4 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
GB2441265A (en) Method for manufacturing a circuit board structure, and a circuit board structure
WO2012175207A3 (de) Elektronische baugruppe und verfahren zu deren herstellung
WO2008055708A3 (de) Mikroelektronische baugruppe und verfahren zum herstellen einer mikroelektronischen baugruppe
EP1768473A4 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
WO2010034597A3 (de) Ankergruppe für monolagen organischer verbindungen auf metall und damit hergestelltes bauelement auf basis organischer elektronik
TWI315648B (en) Circuit board structure with embeded adjustable passive components and method for fabricating the same
TW200613127A (en) Metallic laminate and method for preparing thereof
AU2002351666A1 (en) Molecular electronic component used to construct nanoelectronic circuits, molecular electronic component, electronic circuit and method for producing the same
WO2006004921A3 (en) Micro-castellated interposer
WO2009003464A3 (de) Flächenverkleidungsstruktur und verfahren zum herstellen einer flächenverkleidungsstruktur
WO2010045911A3 (de) Inlay für ein sicherheits- und/oder wertdokument und verfahren zur deren herstellung
WO2008135142A3 (de) Verfahren zur herstellung einer leiterplatte mit einer kavität für die integration von bauteilen und leiterplatte und anwendung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07819810

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07819810

Country of ref document: EP

Kind code of ref document: A2