WO2008106913A2 - Dispositif de transport automatique pour des substrats, en particulier des tranches pour la fabrication de cellules solaires à base de silicium - Google Patents

Dispositif de transport automatique pour des substrats, en particulier des tranches pour la fabrication de cellules solaires à base de silicium Download PDF

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Publication number
WO2008106913A2
WO2008106913A2 PCT/DE2008/000083 DE2008000083W WO2008106913A2 WO 2008106913 A2 WO2008106913 A2 WO 2008106913A2 DE 2008000083 W DE2008000083 W DE 2008000083W WO 2008106913 A2 WO2008106913 A2 WO 2008106913A2
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
wafer
cover plate
automation
shaped base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2008/000083
Other languages
German (de)
English (en)
Other versions
WO2008106913A3 (fr
WO2008106913A4 (fr
Inventor
Stefan Jonas
Lutz Redmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jonas und Redmann Automationstechnik GmbH
Original Assignee
Jonas und Redmann Automationstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonas und Redmann Automationstechnik GmbH filed Critical Jonas und Redmann Automationstechnik GmbH
Publication of WO2008106913A2 publication Critical patent/WO2008106913A2/fr
Publication of WO2008106913A3 publication Critical patent/WO2008106913A3/fr
Publication of WO2008106913A4 publication Critical patent/WO2008106913A4/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Definitions

  • the invention relates to an automation carrier for substrates, in particular for wafers for producing silicon-based solar cells, with two opposing walls, a plurality of connecting elements connecting the walls and with a support structure for holding the wafer in the carrier in its loading and unloading vertically oriented and parallel to each other and equally spaced position.
  • a device for receiving wafers or silicon substrates for the production of photovoltaic elements wherein two opposing walls and at least two connecting the walls connecting rod-like support elements are provided, which are releasably secured to the walls.
  • the support members are provided with retaining means in the form of slot-like recesses or teeth for supporting substrates supported thereon in a vertical position oriented parallel to the walls.
  • the aim here is to avoid unwanted vertical movement of substrates e.g. to prevent in a treatment bath.
  • at least one rod-like support element connecting the two walls is arranged with respect to the other support elements so as to limit vertical movement of the substrates relative to the walls and allow loading or unloading of the substrates obliquely with respect to the vertical direction.
  • the aim of the invention is therefore to provide for an automation carrier for substrates, in particular for wafers for the production of silicon-based solar cells, which holds the wafer in the automated production process during transport between the various processing machines load-free.
  • the present invention is therefore based on the object of an automation carrier of to provide the aforementioned type, which satisfies these requirements satisfactorily and at the same time simple and flexible to adapt to different wafer formats.
  • the two walls are formed as identical U-shaped base and cover plate profiles, which are releasably connected to four perpendicular to the loading and unloading of the carrier oriented columns and form with these a frame of the carrier, on the each longitudinal side extending between the inner surfaces of the corresponding legs of the U-shaped base and cover plate profiles each two of the four columns, each equally spaced in a plane parallel to the loading and unloading of the carrier plane to each other, that the holding structure for holding the wafer in the carrier two identical, within the carrier rack spaced from each other arranged exchangeable wafer carrier units each having at least one releasably mounted on two mounting rails, perpendicular to the loading and unloading of the carrier oriented identical comb plate and each at a position which from a it is selected from a plurality of predetermined wafer formats associated fixing positions are detachably connected to the two U-shaped basic and cover plate profiles, wherein the distance between the two planes, in each of which the bottom of the comb is at
  • a safety flap By providing at least one safety flap, which is pivotally mounted on one of the two wafer carrier unit, slipping out of the wafer during a carrier transport via e.g. safely prevent long transport routes. If necessary, a safety flap can be provided on each wafer carrier unit.
  • the safety flap is designed in the form of an elongate torsion rocker, which via an actuating device in the release position in which the wafers can be removed or stacked, and after completion of loading or unloading of the carrier with wafer by an integrated torsion spring automatically in the closed position to move.
  • the automation carrier according to the invention offers the possibility of a simple, flexible and fast wafer format adjustment. This makes it possible to convert the automation carrier to the following wafer formats: 125 x 125 mm; 150 x 150 mm; 156 x 156 mm and 210 x 210 mm. At the U-shaped base and cover plate profiles thus four corresponding fixing positions are formed.
  • each comb plate is fastened to one another in an aligned manner on the two mounting strips of each exchangeable wafer carrier unit, each comb plate having in each case 51 bars with a spacing of 4.756 mm. This results in 50 combs per comb plate for receiving 50 wafers.
  • a loading capacity of the carrier of 100 wafers in the grid 4.756 mm.
  • the two mounting strips of each wafer carrier unit of the carrier can also be equipped only with a comb plate with the pitch of 6.341 mm. In such an embodiment, the loading capacity of the carrier is then 72 wafers.
  • the comb plates are preferably formed of polyoxymethylene.
  • the U-shape of the base and cover plate profiles advantageously allows a relative movement of the carrier and a wafer loading and unloading device, which is to be inserted into the opening of the carrier rack, to each other in the direction perpendicular to the loading and unloading of the carrier.
  • the U-shaped base and cover plate profiles are preferably formed from hard-coated aluminum.
  • the automation carrier can be equipped with RFID (Radio Frequency Identification) chips.
  • RFID Radio Frequency Identification
  • centering bores can be provided in the U-shaped base and cover plate profiles, by means of which the carrier can be clamped at any time in a reproducible manner for automation purposes.
  • a projection may be centrally provided on the inner edge of the base part of the U-shaped base plate profile, by serving to detect the orientation of the carrier.
  • FIG. 1 is a perspective view from above of the automation carrier in a horizontal position when the safety flap is arranged on a wafer carrier unit of the carrier rack in its release position,
  • FIG. 2 is a plan view of the horizontally arranged carrier as viewed in the loading direction, with a wafer held by wafer carrier units.
  • FIG. 2 is a plan view of the horizontally arranged carrier as viewed in the loading direction, with a wafer held by wafer carrier units.
  • Fig. 3 is a view of a detail of the carrier in the opening region of the carrier carrier in section in a plane in the loading and unloading of the carrier, wherein provided on a wafer carrier unit safety flap both in its release position and in its closed position is shown.
  • the automation carrier 1 has a U-shaped base plate profile 2 and an identically formed U-shaped cover plate profile 3, which are opposite to each other and preferably made of hard-coated aluminum.
  • the U-shaped base and cover plate profiles 2 and 3 are connected by means of four perpendicular to the loading and unloading direction B and E (see double arrow) of the carrier 1 oriented columns 4, which together with the U-shaped base and cover plate profiles 2 and 3 form a frame 5 of the carrier 1.
  • On each longitudinal side of the carrier frame 5 extending between the inner surfaces 7 of the corresponding legs 6 of the two U-shaped base and cover plate profiles 2 and 3 each two of the four columns 4, each to each other in a loading and unloading direction B and E. of the carrier parallel plane are equally spaced.
  • a holding structure for holding the wafers 10 in the carrier 1 which comprises two mutually spaced interchangeable wafer carrier units 11 and 12, which are formed identical.
  • Each wafer carrier unit 11 and 12 has two identical mounting strips 13 which extend parallel to the columns 4 in the carrier frame 5 and are each releasably supported in their aligned ends 14 in aligned holes 15 in the corresponding legs 6 of the U-shaped base - And cover plate profiles 2 and 3 of the carrier frame 5 are provided.
  • the mutually corresponding aligned bores 15 in the legs 6 of the U-shaped base and cover plate profiles 2 and 3 each form a first fixing position of each wafer carrier unit 11 and 12, which is assigned to a predetermined wafer format.
  • each comb plate 16 is mounted on the two mounting rails 13 of each wafer carrier unit 10 and aligned in a direction perpendicular to the loading and unloading direction B or E of the carrier 1.
  • Each comb plate 16 has 51 webs 17 at a distance of 4.756 mm, so that each comb plate 16 has fifty Aufhahmeschlitze 18.
  • the spacing of the planes, in each of which the comb bottom of the two comb plates 16 of each wafer carrier unit 11 or 12 lies, corresponds to the length of an end edge of the selected wafer format.
  • the loading capacity is 100 wafers.
  • a safety flap 20 is provided on the wafer carrier unit 11, which extends over the length of the wafer carrier unit 11.
  • Fig. 3 illustrates, is the Security flap 20 pivotally mounted on the wafer carrier unit 11 and to move in a closing and a release position S and F, in which the loading or unloading of the carrier 1 with wafers 10 is locked or released.
  • the safety flap 20 is designed in the form of an elongate torsion rocker, which is to be moved automatically via an actuator 21 in its release position F and after completion of loading or unloading of the carrier 1 with wafer 10 by an integrated torsion spring 22 in its closed position S.
  • the engaging edge 23 of the safety flap 20 is bordered by an elastic element 24 made of rubber or plastic, that in the closed position of the safety flap 20 shock-friendly with the facing in the discharge direction end edge 25 of the wafer 10 of the carrier 1 wafer stack is engaged.
  • the automation carrier 1 further comprises a between the respective inner surfaces 27 of the base parts 26 of the two opposing U-shaped base and cover plate profiles 2 and 3 of the carrier frame 5 perpendicular to the loading and unloading B and E extending stop 28 of two aluminum U-profiles 29 with bordered rubber elements 30 on.
  • the stop 28 facing this end edges 31 of the wafer 10, which are guided in the opposing comb plates 16 of the two wafer carrier units 11 and 13 with their lateral edge regions, impact-friendly to the plant and are by the rubber elements 30 during transport of the Automation Carriers 1 largely protected from damage.
  • a projection 33 is provided centrally on the inner edge 32 of the base part 26 of the U-shaped base plate profile 2, which serves to detect the orientation of the automation carrier 1 when passing through the process stages of solar cell production.
  • 2 and 3 centering holes 34 are provided in the U-shaped base and cover plate profiles, by which the carrier 1 is to be clamped reproducibly at any time for automation purposes.

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Dispositif de transport automatique (1) pour des substrats, en particulier des tranches (10) pour la fabrication de cellules solaires à base de silicium, qui comporte deux parois (2; 3) opposées, une pluralité d'éléments de liaison (4) reliant les parois (2; 3) et une structure de retenue destinée à retenir les tranches (10) dans une position verticale, parallèles les unes aux autres et à égale distance les unes des autres dans le dispositif de transport (1) pour le chargement et le déchargement (B et E) de ce dernier. L'objet de la présente invention est la mise au point d'un dispositif de retenue exempt de charges pour différents formats de tranches lors du transport. A cet effet, les deux parois (2; 3) sont conçues sous forme de profilés de plaque de fond et de plaque de couverture identiques en forme de U qui sont reliés amovibles à quatre montants (4) orientés verticalement par rapport au dispositif de chargement et de déchargement (E et B) du dispositif de transport (1) et qui forment avec lesdits montants un châssis (5) du dispositif de transport (1). Entre les deux faces internes (27) des parties de base (26) des deux profilés de plaque de fond et de plaque de couverture opposées en forme de U (2 et 3) du châssis (5) se trouve une butée (28) qui s'étend verticalement par rapport au dispositif de chargement et de déchargement (B et E) et qui est constituée de deux profilés en U (29) en aluminium pourvus d'éléments en caoutchouc (30) enchâssés sur lesquels viennent reposer à l'abri des chocs les arêtes frontales (31) orientées vers la butée (28) des tranches (10) guidées par leurs zones de bordure latérales dans les plaques nervurées (16) opposées lors du chargement du dispositif de transport (1).
PCT/DE2008/000083 2007-03-04 2008-01-15 Dispositif de transport automatique pour des substrats, en particulier des tranches pour la fabrication de cellules solaires à base de silicium Ceased WO2008106913A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202007003416U DE202007003416U1 (de) 2007-03-04 2007-03-04 Automatisierungscarrier für Substrate, insbesondere für Wafer zur Herstellung siliziumbasierter Solarzellen
DE202007003416.4 2007-03-04

Publications (3)

Publication Number Publication Date
WO2008106913A2 true WO2008106913A2 (fr) 2008-09-12
WO2008106913A3 WO2008106913A3 (fr) 2008-11-13
WO2008106913A4 WO2008106913A4 (fr) 2009-01-15

Family

ID=38136193

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/000083 Ceased WO2008106913A2 (fr) 2007-03-04 2008-01-15 Dispositif de transport automatique pour des substrats, en particulier des tranches pour la fabrication de cellules solaires à base de silicium

Country Status (3)

Country Link
DE (1) DE202007003416U1 (fr)
TW (1) TWI456678B (fr)
WO (1) WO2008106913A2 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8337134B2 (en) 2009-05-29 2012-12-25 Schmid Technology Systems Gmbh Device and method for stacking and/or conveying a plurality of flat substrates
EP2711978A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Méthode de fabrication de plaquettes
EP2711979A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Système de découpe de tranche
EP2720258A1 (fr) 2012-10-12 2014-04-16 Meyer Burger AG Système de manipulation de tranche
EP2944444A1 (fr) 2014-05-16 2015-11-18 Meyer Burger AG Procédé de traitement de plaque
FR3114437A1 (fr) 2020-09-21 2022-03-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif de maintien de plaquette, ensemble de traitement de plaquette et procédé de traitement de plaquette associés

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062123A1 (de) 2008-12-16 2010-06-17 Q-Cells Se Modularer Carrier
DE102013008100A1 (de) 2012-05-15 2013-11-21 Jonas & Redmann Automationstechnik Gmbh Vorrichtung zur Veränderung von Abständen zwischen einzelnen Substraten

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US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0100539A3 (fr) * 1982-07-30 1985-05-22 Tecnisco Ltd. Appareil assemblé pour supporter des pastilles semi-conductrices ou semblables
ATE147045T1 (de) * 1992-07-08 1997-01-15 Daifuku Kk Behälter für scheibenähnliche gegenstände
JP3148832B2 (ja) * 1993-01-11 2001-03-26 株式会社ダイフク 物品収納容器
JPH0853187A (ja) * 1994-08-09 1996-02-27 Sony Corp 板状物品収納用キャリア
JPH09107026A (ja) * 1995-10-12 1997-04-22 Shin Etsu Polymer Co Ltd ウェーハ収納容器のウェーハカセット
JPH09129718A (ja) * 1995-11-02 1997-05-16 Kawasaki Steel Corp 板状部品収容器
JPH11302481A (ja) * 1998-04-22 1999-11-02 Idemitsu Petrochem Co Ltd スチレン系樹脂組成物及び半導体搬送用治具
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
DE10215283B4 (de) * 2002-04-05 2004-06-03 Astec Halbleitertechnologie Gmbh Vorrichtung zur Aufnahme von Substraten
JP2004095942A (ja) * 2002-09-02 2004-03-25 Kokusai Electric Semiconductor Service Inc ウェーハカセット
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8337134B2 (en) 2009-05-29 2012-12-25 Schmid Technology Systems Gmbh Device and method for stacking and/or conveying a plurality of flat substrates
EP2711978A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Méthode de fabrication de plaquettes
EP2711979A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Système de découpe de tranche
WO2014045106A1 (fr) 2012-09-24 2014-03-27 Meyer Burger Ag Système de coupe de tranche
EP2720258A1 (fr) 2012-10-12 2014-04-16 Meyer Burger AG Système de manipulation de tranche
WO2014057327A1 (fr) 2012-10-12 2014-04-17 Meyer Burger Ag Système de gestion de tranche
EP2944444A1 (fr) 2014-05-16 2015-11-18 Meyer Burger AG Procédé de traitement de plaque
WO2015173739A1 (fr) 2014-05-16 2015-11-19 Meyer Burger Ag Procédé de traitement de tranche
FR3114437A1 (fr) 2020-09-21 2022-03-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif de maintien de plaquette, ensemble de traitement de plaquette et procédé de traitement de plaquette associés

Also Published As

Publication number Publication date
TW200847313A (en) 2008-12-01
WO2008106913A3 (fr) 2008-11-13
TWI456678B (zh) 2014-10-11
WO2008106913A4 (fr) 2009-01-15
DE202007003416U1 (de) 2007-05-31

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