WO2009001752A1 - Structure de montage d'un dispositif électrique - Google Patents

Structure de montage d'un dispositif électrique Download PDF

Info

Publication number
WO2009001752A1
WO2009001752A1 PCT/JP2008/061238 JP2008061238W WO2009001752A1 WO 2009001752 A1 WO2009001752 A1 WO 2009001752A1 JP 2008061238 W JP2008061238 W JP 2008061238W WO 2009001752 A1 WO2009001752 A1 WO 2009001752A1
Authority
WO
WIPO (PCT)
Prior art keywords
ecu
mounting structure
metallic base
device mounting
electric device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/061238
Other languages
English (en)
Japanese (ja)
Inventor
Seiji Imoto
Takeshi Hongo
Takayuki Onodera
Eiji Michigami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yanmar Co Ltd
Original Assignee
Yanmar Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yanmar Co Ltd filed Critical Yanmar Co Ltd
Publication of WO2009001752A1 publication Critical patent/WO2009001752A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239Electronic boxes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Cette invention a pour objet d'améliorer une fonction anti-immission sonore dans une structure de montage d'un dispositif électronique intercalée entre des métaux électriquement isolés. Cette invention décrit une structure de montage d'une unité de commande électronique (10) constituée par l'assemblage d'une unité de commande électronique, qui comprend une base métallique en forme de boîte (13) dotée d'une face ouverte, un substrat d'unité de commande électronique (11) logé dans la base métallique (13) et un moule en résine (12) recouvrant la périphérie du substrat d'unité de commande électronique (11), par l'intermédiaire d'œillets en caoutchouc (15), la face ouverte étant face à un moteur séparé (17). Ce côté de face ouverte est recouvert d'un élément de protection métallique (16) en contact avec la base métallique (13).
PCT/JP2008/061238 2007-06-26 2008-06-19 Structure de montage d'un dispositif électrique Ceased WO2009001752A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-167701 2007-06-26
JP2007167701A JP2009010014A (ja) 2007-06-26 2007-06-26 電子制御装置の取り付け構成

Publications (1)

Publication Number Publication Date
WO2009001752A1 true WO2009001752A1 (fr) 2008-12-31

Family

ID=40185570

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061238 Ceased WO2009001752A1 (fr) 2007-06-26 2008-06-19 Structure de montage d'un dispositif électrique

Country Status (2)

Country Link
JP (1) JP2009010014A (fr)
WO (1) WO2009001752A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5621217B2 (ja) * 2009-06-11 2014-11-12 シンフォニアテクノロジー株式会社 電子モジュールの製造方法及び電子モジュール並びに車両
JP6077928B2 (ja) * 2013-05-20 2017-02-08 富士重工業株式会社 電子機器の収容ケース
KR102469658B1 (ko) * 2016-08-29 2022-11-22 엘에스엠트론 주식회사 전장품 지지장치
WO2023127079A1 (fr) * 2021-12-28 2023-07-06 日立Astemo株式会社 Dispositif de commande électronique

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169644A (en) * 1981-04-14 1982-10-19 Nippon Denso Co Ltd Semiconductor type pressure sensor
JPS6185900A (ja) * 1984-10-04 1986-05-01 株式会社デンソー 耐電磁波電子機器
JPS63150484U (fr) * 1987-03-24 1988-10-04
JPH05315775A (ja) * 1992-05-08 1993-11-26 Fujitsu Ltd 通信装置のロッカー構造
JPH0946080A (ja) * 1995-07-28 1997-02-14 Aichi Corp 電子装置のシールド装置
JPH09107191A (ja) * 1995-05-12 1997-04-22 Schlegel Corp シールド体及び、シールド体とシールドされた回路素子の組み合わせ物
JP2006108398A (ja) * 2004-10-06 2006-04-20 Hitachi Ltd 制御装置およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169644A (en) * 1981-04-14 1982-10-19 Nippon Denso Co Ltd Semiconductor type pressure sensor
JPS6185900A (ja) * 1984-10-04 1986-05-01 株式会社デンソー 耐電磁波電子機器
JPS63150484U (fr) * 1987-03-24 1988-10-04
JPH05315775A (ja) * 1992-05-08 1993-11-26 Fujitsu Ltd 通信装置のロッカー構造
JPH09107191A (ja) * 1995-05-12 1997-04-22 Schlegel Corp シールド体及び、シールド体とシールドされた回路素子の組み合わせ物
JPH0946080A (ja) * 1995-07-28 1997-02-14 Aichi Corp 電子装置のシールド装置
JP2006108398A (ja) * 2004-10-06 2006-04-20 Hitachi Ltd 制御装置およびその製造方法

Also Published As

Publication number Publication date
JP2009010014A (ja) 2009-01-15

Similar Documents

Publication Publication Date Title
WO2008024761A3 (fr) Dispositif électrique comportant un système de montage de composants électriques sans carte
EP2191506A4 (fr) Surmoulage enveloppant pour assemblage électronique
ATE478221T1 (de) Betätigungsvorrichtung
PL1711673T3 (pl) Zatrzask do szybkiego montażu w wycięciach cienkiej ścianki osprzętu, takiego jak obrotowe dźwignie zamka lub części zawiasu
PL1868243T3 (pl) Półprzewodnikowy moduł mocy z wzajemnie elektrycznie izolowanymi elementami przyłączeniowymi
WO2009004875A1 (fr) Unité d'appareil électrique
WO2009001752A1 (fr) Structure de montage d'un dispositif électrique
EP1946696A4 (fr) Dispositif electrique
WO2007046720A3 (fr) Dispositif de connecteur de cable pour batterie
TW200802740A (en) Electronic device
TW200733866A (en) Shield structure for information technology equipments
EP1978792A4 (fr) Structure de substrat et dispositif electronique
TW200735759A (en) Metal insert molding plastic of shielding case structure for hand hold device
JP2012041727A (ja) 車両用ドアハンドル装置
WO2011057619A3 (fr) Procédé de fabrication d'une serrure de porte de véhicule automobile et serrure de porte de véhicule automobile associée
WO2012000485A3 (fr) Support de composant, en particulier pour une serrure de porte de véhicule à moteur
WO2014106502A3 (fr) Support de composant
TW200735296A (en) Microelectromechanical microphone packaging system
JP2002057483A5 (fr)
WO2012139545A3 (fr) Boîtier de serrure de portière de véhicule à moteur
WO2014101914A3 (fr) Support pour composants électriques ou électroniques
WO2011069712A3 (fr) Capteur de position
MY148778A (en) Electronic device mounting structure
TW200740331A (en) Hybrid multilayer circuit board and method of manufacturing the same
TW200632512A (en) Electrical device with translatable lens cover

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08777399

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08777399

Country of ref document: EP

Kind code of ref document: A1