WO2009006213A2 - Tuiles photovoltaïques et procédés de fabrication associés - Google Patents

Tuiles photovoltaïques et procédés de fabrication associés Download PDF

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Publication number
WO2009006213A2
WO2009006213A2 PCT/US2008/068373 US2008068373W WO2009006213A2 WO 2009006213 A2 WO2009006213 A2 WO 2009006213A2 US 2008068373 W US2008068373 W US 2008068373W WO 2009006213 A2 WO2009006213 A2 WO 2009006213A2
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WO
WIPO (PCT)
Prior art keywords
tile
photovoltaic
top surface
polymeric
polymeric carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/068373
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English (en)
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WO2009006213A3 (fr
Inventor
Husnu M. Kalkanoglu
Wayne E. Shaw
Ming-Liang Shiao
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Individual
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Individual
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Application filed by Individual filed Critical Individual
Priority to EP08772049A priority Critical patent/EP2171769A2/fr
Priority to CA 2693049 priority patent/CA2693049A1/fr
Publication of WO2009006213A2 publication Critical patent/WO2009006213A2/fr
Publication of WO2009006213A3 publication Critical patent/WO2009006213A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/20—Supporting structures directly fixed to an immovable object
    • H02S20/22—Supporting structures directly fixed to an immovable object specially adapted for buildings
    • H02S20/23—Supporting structures directly fixed to an immovable object specially adapted for buildings specially adapted for roof structures
    • H02S20/25—Roof tile elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/10—Photovoltaic [PV]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates generally to photovoltaic power generation.
  • the present invention relates more particularly to photovoltaic roofing tiles.
  • photovoltaic cells are often made from semiconductor- type materials such as doped silicon in either single crystalline, polycrystalline, or amorphous form.
  • semiconductor- type materials such as doped silicon in either single crystalline, polycrystalline, or amorphous form.
  • the use of photovoltaic cells on roofs is becoming increasingly common, especially as device performance has improved. They can be used, for example, to provide at least a fraction of the electrical energy needed for a building's overall function, or can be used to power one or more particular devices, such as exterior lighting systems.
  • Photovoltaic cells are often provided on a roof in array form. [0005] Often perched on an existing roof in panel form, these photovoltaic arrays can be quite visible and generally not aesthetically pleasant.
  • One aspect of the present invention is a photovoltaic roofing tile comprising: a polymeric carrier tile having a top surface and a bottom surface; and a photovoltaic element affixed to the polymeric carrier tile, the photovoltaic element having a bottom surface and a top surface having an active area.
  • a photovoltaic roofing tile comprising: a polymeric carrier tile having a top surface and a bottom surface; and a photovoltaic element affixed to the polymeric carrier tile, the photovoltaic element having a bottom surface and a top surface having an active area, the bottom surface of the photovoltaic element being affixed to the top surface of the polymeric carrier tile, wherein the polymeric carrier tile has an indentation formed in its top surface, wherein the photovoltaic element is disposed in the indentation, and wherein the lateral gap between each edge of the indentation and an edge of the photovoltaic element is less than 100 ⁇ m.
  • a photovoltaic roofing tile comprising: a polymeric carrier tile having a top surface and a bottom surface and an opening formed therein; and a photovoltaic element affixed to the polymeric carrier tile, the photovoltaic element having a bottom surface and a top surface having an inactive area which is affixed to the bottom surface of the polymeric carrier tile, and an active area which is substantially aligned with the opening formed in the polymeric carrier tile.
  • a photovoltaic roofing tile comprising: a polymeric overlay having a top surface and a bottom surface and an opening formed therein; a polymeric carrier tile having a top surface and a bottom surface; and a photovoltaic element affixed to the polymeric carrier tile, the photovoltaic element having a bottom surface which is affixed to the top surface of the polymeric carrier tile, a top surface having an inactive area which is affixed to the bottom surface of the polymeric overlay, and an active area which is substantially aligned with the opening formed in the polymeric overlay.
  • Another aspect of the present invention is method of making a photovoltaic roofing tile comprising: a polymeric carrier tile having a top surface and a bottom surface; and a photovoltaic element having a top surface and a bottom surface, the top surface having an active area, the photovoltaic element being affixed to the polymeric carrier tile, [0012] the method comprising: inserting into a compression mold a polymeric tile preform having a top surface and a bottom surface, and the photovoltaic element, a surface of the photovoltaic element being disposed adjacent to a surface of the polymeric tile preform; compression molding the polymeric tile preform and the photovoltaic element together to form an unfinished photovoltaic roofing tile; and finishing the unfinished photovoltaic roofing tile to provide the photovoltaic roofing tile.
  • Another aspect of the present invention is a method of making a photovoltaic roofing tile a polymeric carrier tile having a top surface and a bottom surface, one of the surfaces having an indentation formed therein; and a photovoltaic element having a top surface and a bottom surface, the top surface having an active area, the photovoltaic element being affixed to the polymeric carrier tile and disposed in the indentation therein, the method comprising: inserting into a compression mold a polymeric tile preform having a top surface and a bottom surface; compression molding the polymeric tile preform to form a polymeric carrier tile having the indentation disposed in one of the surfaces; disposing the photovoltaic element in the indentation; and affixing the photovoltaic element to the polymeric carrier tile to provide the photovoltaic roofing tile.
  • FIG. 1. is a schematic top perspective view of a photovoltaic roofing tile according to one embodiment of the invention.
  • FIG. 2 is a schematic cross-sectional view of the photovoltaic roofing tile of FIG. 1;
  • FIG. 3 is a schematic cross-sectional view of a photovoltaic roofing tile according to another embodiment of the invention.
  • FIG. 4 is a schematic cross-sectional view of a photovoltaic roofing tile according to another embodiment of the invention.
  • FIG. 5 is a top perspective view of a photovoltaic roofing tile according to another embodiment of the invention.
  • FIG. 6 is a schematic cross-sectional view of a polymeric carrier tile according to one embodiment of the invention.
  • FIG. 7 is schematic cross-sectional view of a photovoltaic roofing tile according to another embodiment of the invention.
  • FIG. 8 is schematic cross-sectional view of a photovoltaic roofing tile according to another embodiment of the invention.
  • FIG. 10 is schematic cross-sectional view of a photovoltaic roofing tile according to another embodiment of the invention.
  • FIG. 11 is a vertical, sectional view of a process and apparatus for extruding a polymeric material and serially severing the extrudate into a plurality of polymeric tile preforms for delivery to a compression molding station, with the delivery mechanism being fragmentally illustrated at the right end thereof;
  • FIG. 12 is a top plan view of the process and apparatus shown in FIG. 11;
  • FIG. 13 is an illustration similar to that of FIG. 11, but in which the extruding operation includes both core material and capstock material being co-extruded prior to the serial severing step, with the delivery mechanism being fragmentally illustrated at the right end thereof;
  • FIG. 14 is a top plan view of one embodiment of the process and apparatus shown in FIG. 13, in which the capstock material covers a portion of the top surface of the polymeric carrier tile;
  • FIG. 15 is a schematic vertical elevational view of a compression molding station adapted to receive preliminary polymeric tile preform shapes delivered from the right-most end of the apparatus shown in FIGS. 11 or 13, for compression molding the polymer carrier tiles together with the photovoltaic elements to form unfinished photovoltaic roofing tiles;
  • FIG. 16 is a top view of the compression molding station of FIG. 15, taken generally along the line VI-VI of FIG. 15, and with an indexable mold handling table shown at the right end thereof, with a robot and robot arm being schematically illustrated for removal of photovoltaic roofing tiles from molds carried by the indexable table;
  • FIG. 18 is an enlarged generally plan view of an upper mold component, taken generally along the line of VIII-VIII of FIG. 15;
  • FIG. 22 is a schematic side elevational view of a preheater for preheating carrier plates being delivered along a conveyor, for return to an extruder at the left end of FIG. 21, for receiving extruded polymeric tile preforms thereon, with a portion of the preheater being broken away to illustrate a heating element therein;
  • FIG. 23 is a view somewhat similar to that of FIG. 22, but of an alternative embodiment of a preheater;
  • FIG. 24 is a top view of a carrier plate for receiving extruded polymeric tile preform material thereon for carrying the polymeric tile preform material to and during a compression molding of the polymeric tile preform material into a polymeric carrier tile;
  • FIG. 25 is a side elevational view of the carrier plate of FIG. 24, with portions broken away and illustrated in section, to illustrate positioning holes for receiving positioning pins therein for aligning each carrier plate in a compression mold;
  • FIG. 27 is a side perspective view of the extruder for extruding polymeric tile preform- forming material and applying the same onto carrier plates that are delivered along a conveyor, fragmentally illustrating a portion of the left end of FIG. 21;
  • FIG. 28 is a schematic side elevational view of the two single screw extruders of FIGS. 21 and 27;
  • FIG. 29 is an enlarged fragmentary schematic illustration of the mechanism for severing polymeric tile preform material being extruded onto carrier plates, and a mechanism for thereafter separating the individual carrier plates with polymeric tile preform material thereon, from each other.
  • FIG. 30 is an enlarged fragmentary schematic illustration of a mechanism of the walking beam type for receiving carrier plates with polymeric tile preform material thereon and delivering them to a compression mold;
  • FIG. 31 is an enlarged fragmentary schematic illustration of a portion of the walking beam mechanism of FIG. 21 taken from the opposite side of the illustration of FIG. 21 for receiving carrier plates with polymeric carrier tiles (optionally in the form of photovoltaic roofing tiles) thereon that are received from the compression mold and with hold-downs being illustrated for the movement with the carrier plates via the walking beam, and with the carrier plates with polymeric carrier tiles thereon having flashing shown along edges thereof, and with the downward discharge of the carrier plates to the return conveyor of FIG. 22;
  • FIG. 32 is an enlarged fragmentary schematic illustration of the cutting mechanism for simultaneously cutting flashing from the molded polymeric carrier tiles (optionally in the form of photovoltaic roofing tiles) that are situated on secondary plates in the cutting mechanism;
  • FIG. 33 is a fragmentary schematic view of a cooling tower for receiving a plurality of polymeric carrier tiles (optionally in the form of photovoltaic roofing tiles) therein at a station in which the polymeric carrier tiles are loaded into a polymeric carrier tile retention mechanism for applying curvature thereto, and wherein the polymeric carrier tiles in the mechanism are then delivered up one (left) portion of the cooling tower, and down another (right) portion of the cooling tower, back to the loading station, from which they are unloaded, with a portion of one of the tower portions being broken away for clarity;
  • polymeric carrier tiles optionally in the form of photovoltaic roofing tiles
  • FIG. 34 is a schematic perspective rear view of the polymeric carrier tile cooling tower partially illustrated in FIG. 30, taken from the opposite side illustrated in FIG. 21;
  • FIG. 35 is a perspective view of one form of a lower component of the retention mechanism, adapted to receive a polymeric carrier tile therein, on its curved upper surface, and with the cooling grooves being shown in that lower component of the retention mechanism;
  • FIG. 36 is a longitudinal sectional view, taken through the lower component of the polymeric carrier tile retention member illustrated in FIG. 35, generally along the line 12A-12A ofFIG. 35;
  • FIGS. 38 and 39 are end views of the polymeric carrier tile retention components of FIGS. 36 and 37 respectively;
  • FIG. 40 is a schematic top perspective view of an alternative embodiment of an arcuately configured lower polymeric carrier tile retention component;
  • FIG. 41 is a sectional view of the lower polymeric carrier tile component of FIG. 40, taken generally along the line 13A-13A of FIG. 40;
  • FIG. 42 is a schematic top perspective view of another embodiment of a lower polymeric carrier tile retention component, having a fan type cooling mechanism disposed for blowing cooling fluid through grooves of the component of FIG. 42;
  • FIG. 43 is a schematic top perspective view similar to that of FIG. 42, but wherein the fan device for cooling is provided with a refrigerant or like cooling device for cooling ambient air for the fan type cooling mechanism;
  • FIG. 44 is a schematic top perspective view of yet another alternative embodiment of a lower polymeric carrier tile retention component in which a coolant other than ambient air is used to cool polymeric carrier tiles via grooves therein;
  • FIG. 45 is a schematic side elevational view of a polymeric carrier tile that is disposed on a secondary plate, following the cutting or flashing trimming operation of FIG. 32;
  • FIG. 46 is a side elevation view of a polymeric carrier tile shown disposed between upper and lower retention components, after cooling of the polymeric carrier tile, while it is still disposed between the upper and lower retention components, just prior to it being removed from the unloading station illustrated in FIG. 34;
  • FIG. 47 is a side elevational view of a polymeric carrier tile being applied to a roof, prior to fastening the same against the roof, showing the curvature that has been applied to the polymeric carrier tile in the retention mechanism, with the roof being fragmentally illustrated;
  • FIG. 48 is a view taken of the polymeric carrier tile and a fragmentary portion of a roof as shown in FIG. 47, but along the line generally shown as 19A-19A of FIG.
  • FIG. 49 is an illustration similar to that of FIG. 47, but wherein the polymeric carrier tile is shown being fastened down tightly against the roof by a fastener;
  • FIG. 51 is a schematic cross-sectional view of a photovoltaic device according to one embodiment of the invention.
  • FIG. 52 is an exploded layer of a photovoltaic element having a laminate structure
  • FIG. 53 is a photograph showing the photovoltaic roofing tile made in Example l;
  • FIG. 54 is a photograph showing a photovoltaic element being placed in an indentation in a polymeric carrier tile in Example 2.
  • FIG. 55 is a photograph of a photovoltaic roofing tile made in Example 2, both before and after affixation of the photovoltaic element to the polymeric carrier tile.
  • Photovoltaic element 110 includes one or more photovoltaic cells that can be individually electrically connected so as to operate as a single unit.
  • Photovoltaic element 110 can be based on any desirable photovoltaic material system, such as monocrystalline silicon; polycrystalline silicon; amorphous silicon; III-V materials such as indium gallium nitride; II-VI materials such as cadmium telluride; and more complex chalcogenides (group VI) and pnicogenides (group V) such as copper indium diselenide.
  • photovoltaic element 110 includes an n-type silicon layer (doped with an electron donor such as phosphorus) oriented toward incident solar radiation on top of a p-type silicon layer (doped with an electron acceptor, such as boron), sandwiched between a pair of electrically-conductive electrode layers.
  • Photovoltaic element 110 can also include structural elements such as a substrate such as an ETFE or polyester backing; a glass plate; or an asphalt non- woven glass reinforced laminate such as those used in the manufacture of asphalt roofing shingles; one or more protectant or encapsulant materials such as EVA; one or more covering materials such as glass or plastic; mounting structures such as clips, openings, or tabs; and one or more optionally connectorized electrical leads.
  • the photovoltaic element is a monocrystalline silicon photovoltaic element or a polycrystalline silicon photovoltaic element.
  • Photovoltaic element 110 can include at least one antireflection coating, disposed on, for example, the very top surface of the photoelectric element or between individual protectant, encapsulant or cover elements.
  • Suitable photovoltaic elements can be obtained, for example, from China Electric Equipment Group of Nanjing, China and Fuji Electric System of Tokyo, Japan as well as from several domestic suppliers such as Uni-Solar, Sharp, Shell Solar, BP Solar, USFC, FirstSolar, General Electric, Schott Solar, Evergreen Solar and Global Solar.
  • Top surface 114 of photovoltaic element 110 is the face presenting the photoelectrically-active areas of its one or more photoelectric cells.
  • the top surface can be the top surface of the one or more photovoltaic cells themselves, or alternatively can be the top surface of a series of one or more protectant, encapsulant and/or covering materials disposed thereon.
  • top surface 114 should be oriented so that it is illuminated by solar radiation.
  • the top surface has on it an active area 116, which is the area over which radiation striking the active face will be received by the photovoltaic cell(s) of the photovoltaic element 110.
  • the photovoltaic element 110 also has an operating wavelength range.
  • Solar radiation includes light of wavelengths spanning the near UV, the visible, and the near infrared spectra. As used herein, when the term "solar radiation” is used without further elaboration, it is meant to span the wavelength range of 300 nm to 1500 nm. Different photovoltaic elements have different power generation efficiencies with respect to different parts of the solar spectrum.
  • FIG. 50 is a graph showing the relative spectral response of three commonly-used photovoltaic materials as well as the spectral distribution of solar radiation. Amorphous doped silicon is most efficient at visible wavelengths, and polycrystalline doped silicon and monocrystalline doped silicon are most efficient at near-infrared wavelengths.
  • the operating wavelength range of a photovoltaic element is the wavelength range over which the relative spectral response is at least 10% of the maximal spectral response.
  • the operating wavelength range of the photovoltaic element falls within the range of about 300 nm to about 2000 nm.
  • the operating wavelength range of the photovoltaic element falls within the range of about 300 nm to about 1200 nm.
  • the operating wavelength range is between about 375 nm and about 775 nm; for typical polycrystalline silicon materials the operating wavelength range is between about 600 nm and about 1050 nm; and for typical monocrystalline silicon materials the operating wavelength range is between about 425 nm and about 1175 nm.
  • the bottom surface of the photovoltaic element is affixed to the top surface of the polymeric carrier tile.
  • the bottom surface 112 of the photovoltaic element 110 is affixed to the top surface 104 of the polymeric carrier tile.
  • the polymeric carrier tile has an indentation formed in its top surface, and the photovoltaic element is disposed in the indentation.
  • the polymeric carrier tile 302 of photovoltaic roofing tile 300 has an indentation 308 formed in its top surface, in which the photovoltaic element 310 is disposed.
  • the lateral gap between each edge of the indentation and an edge of the photovoltaic element is less than about 100 ⁇ m.
  • the lateral gap 320a between the edge 309a of the indentation 308 and the edge 316a of the photovoltaic element 310 is less than about 100 ⁇ m.
  • the lateral gap 320b between the edge 309b of the indentation 308 and the edge 316b of the photovoltaic element 310 is less than about 100 ⁇ m.
  • the lateral gap between each edge of the indentation and an edge of the photovoltaic element is less than about 50 ⁇ m, or even less than about 25 ⁇ m.
  • each edge of the indentation is in substantial contact with an edge of the photovoltaic element.
  • the top surface of the photovoltaic element can be substantially flush (i.e., within about 2 mm or less, within about 1 mm or less, or even within about 0.5 mm or less) with the top surface of the polymeric carrier tile.
  • the top surface 414 of the photovoltaic element 410 is substantially flush with the top surface 404 of the polymeric carrier tile 402.
  • the top surface of the photovoltaic element can protrude from the top surface of the polymeric carrier tile (e.g., as shown in FIG. 3), or even be recessed from the top surface of the polymeric carrier tile.
  • Photovoltaic roofing tiles having a photovoltaic element disposed within an indentation formed in the top surface of a polymeric carrier tile can be made, for example, using the molding methods described below.
  • a photovoltaic roofing tile further includes a cover element substantially covering the photovoltaic element.
  • the cover element overlaps and is affixed to at least part of the top surface of the polymeric carrier tile.
  • photovoltaic roofing tile 400 includes a cover element 430, which substantially covers photovoltaic element 410 and overlaps and is affixed to the top surface 404 of the polymeric carrier tile 402.
  • the cover element can perform any of a number of functions in the photovoltaic roofing tiles of the present invention.
  • the cover element can provide physical protection and/or weatherproofmg for the photovoltaic element.
  • the cover element can perform an aesthetic function, such as providing an apparent color or texture to the exposed face of the photovoltaic roofing tile.
  • the cover element has an energy transmissivity to solar radiation of at least about 50% over the operating wavelength range of the photovoltaic element.
  • an "energy transmissivity to solar radiation of at least about 50% over the operating wavelength range of [a] photovoltaic element” means that at least about 50% of the total energy is transmitted when solar radiation within the operating wavelength range illuminates the polymer structure; the energy transmissivity at each wavelength in the operating wavelength range need not be at least about 50%.
  • the cover element has at least about 75% energy transmissivity to solar radiation over the operating wavelength range of the photovoltaic element.
  • the cover element has at least about 90% energy transmissivity to solar radiation over the operating wavelength range of the photovoltaic element.
  • the cover element has a thickness from about 25 ⁇ m to about 2 mm. In certain embodiments of the invention, the cover element has a thickness from about 75 ⁇ m to about 1 mm. Cover elements are described, for example, in U.S. Provisional Patent Application serial no. 60/946,881, filed June 21, 2008, which is hereby incorporated herein by reference in its entirety.
  • the cover element is a polymer structure.
  • the polymer structure can be formed from, for example, a single layer of a polymeric material, or multiple layers of polymeric materials.
  • the polymer structure can include two layers, including a structural supporting layer (e.g., a 6-7 mil (-150- 175 ⁇ m) thick PET film); and an adhesive layer formed between the structural supporting layer and the top surface of the photovoltaic element.
  • the polymer structure may have other numbers of layers.
  • the cover element can also be made from other materials, such as glass or glass-ceramic materials.
  • the cover element has a substantially flat top surface.
  • the top surface of the cover element is not substantially flat.
  • the top surface of the cover element may have a patterned surface relief, or may have a roughened surface relief.
  • the surface relief of the top surface of the cover element can be chosen to match, for example, the surface relief of the top surface of the polymeric carrier tile.
  • Surface relief on the top surface of the polymer structure may be formed using standard techniques such as embossing or casting.
  • the cover element has granules affixed to its top surface, as described in detail in U.S. Patent Application serial no.
  • the cover element includes an electrochromic material, as described in U.S. Provisional Patent Application serial no. 60/946,881, which is hereby incorporated herein by reference in its entirety.
  • the cover element includes a light-directing feature to more efficiently direct solar radiation to the active areas of the photovoltaic element, for example as described in International Patent Application Publication no. WO 2007/085721 Al, which is hereby incorporated by reference in its entirety.
  • the cover element is colored, but has at least about 50% energy transmissivity to radiation over the 750-1150 nm wavelength range.
  • an item that is "colored” is one that appears colored (including white, black or grey, but not colorless) to a human observer. The color can be monochromatic or polychromatic.
  • the cover element includes (either at one of its surfaces or within it) a near infrared transmissive multilayer interference coating designed to reflect radiation within a desired portion of the visible spectrum.
  • the cover element includes (either at one of its surfaces or within it) one or more colorants (e.g., dyes or pigments) that absorb at least some visible radiation but substantially transmit near-infrared radiation.
  • the color(s) and distribution of the colorants may be selected so that the photovoltaic device has an appearance that matches, harmonizes with and/or complements the top surface of the polymeric carrier tile.
  • the pattern of colorant may be, for example, uniform, or may be mottled in appearance. InkJet printing, lithography, or similar technologies can be used to provide the desired pattern of colorant.
  • the cover element may include a pattern of colorant at, for example, the bottom surface of the cover element, the top surface of the cover element, or formed within the cover element.
  • the cover element when the cover element is colored, the majority of the operating range of the photovoltaic element is not within the 400-700 nm wavelength range.
  • Embodiments of the present invention having colored cover elements can be used, for example, with photovoltaic elements having a substantial portion of their photovoltaic activity in the near infrared, such as those based on polycrystalline silicon and monocrystalline silicon materials. Photovoltaic devices made with colored polymer structures are described in further detail in U.S. Patent Application serial no. 11/456,200, filed on July 8, 2006 and entitled "Photovoltaic Module," (published as U.S. Patent Application Publication no. 2008/0006323), which is hereby incorporated herein by reference in its entirety.
  • the affixation or sealing of the cover element to the polymeric carrier tile can be achieved in many ways.
  • an adhesive material can be used to affix or seal the cover element to the polymeric carrier tile.
  • the skilled artisan can use a two-part epoxy, a hot-melt thermoplastic, or a heat- or UV-curable material as the adhesive material.
  • the cover element can also be affixed to the polymeric carrier tile by molding them together under conditions such that the material of the polymeric carrier tile, the affixed surface of the photovoltaic element, or both become adhesive.
  • Other techniques such as vacuum lamination, ultrasonic welding, laser welding, IR welding, or vibration welding, can also be used to affix and/or seal the cover element to the polymeric carrier tile.
  • the photovoltaic element is affixed to the polymeric carrier tile.
  • This affixation can be achieved in a variety of ways.
  • an adhesive material can be used to affix the photovoltaic element to the polymeric carrier tile.
  • an adhesive material is disposed between a surface of the photovoltaic element and a surface of the polymeric carrier tile.
  • the skilled artisan can use, for example, a two-part epoxy (or other multicomponent reactive adhesive system), a hot-melt thermoplastic, or a heat-curable material as the adhesive material.
  • the photovoltaic element can be formed with an adhesive tie layer at its bottom surface, as described in more detail below.
  • the photovoltaic element can also be affixed to the polymeric carrier tile by molding them together under conditions such that the material of the polymeric carrier tile, the affixed surface of the photovoltaic element, or both become adhesive or fuse or melt together.
  • a pressure-sensitive adhesive can also be used to affix the photovoltaic element to the polymeric carrier tile.
  • a cover element formed over the indentation in the polymeric carrier tile affixes the photovoltaic element to its top surface.
  • a polymeric adhesive is the cured product of a formulation comprising (e.g., consisting essentially of) an acrylated urethane oligomer (e.g., EBECRYL 270, available from UCB Chemicals) with 1 wt% initiator.
  • Suitable adhesive materials include ethylene-acrylic acid and ethylene -methacrylic acid copolymers, polyolef ⁇ ns, PET, polyamides and polyimides. Examples of suitable materials are described in U.S. Patents 4,648,932, 5,194,113, 5,491,021 and 7,125,601, each of which is hereby incorporated herein by reference in its entirety.
  • PBT Polybutyleneterephthalate
  • PEN Polyethylenenaphthalate
  • EPDM Ethylene-Propylene- Diene Monomer Copolymers
  • SBS Styrene Butadiene Styrene
  • SIS Styrene Isoprene Styrene
  • ABS Acrylonitrile Butadiene Styrene
  • Nitrile Rubber their copolymers, binary and ternary blends of the above.
  • the polymeric carrier tile comprises a core material with a layer of capstock material formed on the core material.
  • the layer of capstock material desirably covers the core material in all areas that are exposed to the environment and subject to weathering during use.
  • the core material is desirably a relatively inexpensive material, while the capstock material is desirably a polymer having a high weather resistance and desirable resistance to sunlight.
  • the polymeric carrier tile comprises a core that is made of a low molecular weight material such as polypropylene filled with 40-80% by weight of filler with suitable functional additives, encapsulated in a capstock material.
  • Fillers for the core material can vary considerably and can include, for example, treated and untreated ashes (e.g., from incinerators of power stations), mineral fillers and their waste, pulp and paper waste materials, oil shale, reclaimed acrylic automotive paint and its waste and/or mixtures of any of these, or the like.
  • the capstock material can be chemically cross-linked to increase its mechanical properties and weather resistance and/or flame resistance and can contain functional additives such as pigments, UV light stabilizers and absorbers, photosensitizers, photoinitiators etc.
  • the cross-linking may occur during or after processing of the material. Such cross-linking can be effected by methods which include, but are not limited to, thermal treatment or exposure to actinic radiation, e.g. ultraviolet radiation, electron beam radiation, gamma radiation. Chemical cross-linking can also be used. For example, in one embodiment of the invention vapor permeation is used to effect the cure or cross-linking of the capstock material, e.g., as described in U.S. Patent 4,368,222, which is hereby incorporated herein by reference in its entirety.
  • the capstock material is a thermoplastic olefin, a polyacrylate or a fluoropolymer.
  • the capstock material can be a polyolefin such as Polyethylene (PE), Polypropylene (PP), Polymethylpentene (PMP), Ethylene Acrylic Acid (EAA), Ethylene Methacrylic Acid (EMAA), Acrylonitrile Styrene Acrylate (ASA), Acrylonitrile Ethylene Styrene (AES) and Polybutene (PB-I), their copolymers, blends, and filled formulations, or another polymer having high weather resistance such as polyacrylates, polyurethanes and fluoropolymers and/or their copolymers blends and filled formulations.
  • PE Polyethylene
  • PP Polypropylene
  • PMP Polymethylpentene
  • EAA Ethylene Acrylic Acid
  • EEMAA Ethylene Methacrylic Acid
  • ASA Acrylonitrile Styrene Acrylate
  • AES
  • the capstock material is polypropylene.
  • the capstock material can be stabilized for UV-light and weathering resistance by using additives and additive packages known in the art.
  • the capstock materials can also contain various additives such as thermal and UV-light stabilizers, pigments, compatibilizers, processing aids, flame retardant additives, and other functional chemicals capable of improving processing of the materials and performance of the product.
  • Foaming agents such as azodicarbonamide can be used to reduce the density of the capstock material.
  • the top surface of the capstock layer can be modified or functionalized to improve adhesion between it and a photovoltaic element or adhesive layer, to aid in heat dissipation, or to provide beneficial dielectric properties.
  • Useful methods to functionalize the top surface can include flame treatment, plasma treatment, corona treatment, ozone treatment, sodium treatment, etching, ion implantation, electron beam treatment, or a combination thereof.
  • the core material can be, for example, a virgin thermoplastic polymer material, elastomer or rubber including but not limited to Polyvinylchloride (PVC), Polyethylene (PE), Polypropylene (PP), Polybutene (PB-I), Polymethylpentene (PMP), Polyacrylates (PAC), Polyethyleneterephthalate (PET), Polybutyleneterephthalate (PBT), Polyethylenenaphthalate (PEN), Ethylene-Propylene-Diene Monomer Copolymers (EPDM), Styrene Butadiene Styrene (SBS), Styrene Isoprene Styrene (SIS), Acrylonitrile Butadiene Styrene (ABS), Polyurethane (PU) or Nitrile Rubber, their copolymers, binary and ternary blends of the above.
  • PVC Polyvinylchloride
  • PE Polyethylene
  • PP Polypropylene
  • PB-I Polymethylpentene
  • PMP Polyacrylates
  • the core material is made from polypropylene.
  • the core material is a filled polymer.
  • the core material can be a filled formulation based on the above or other thermoplastic materials and elastomers filled with mineral, organic fillers, nanofillers, reinforcing fillers or fibers as well as recycled materials of the above polymers. Recycled and highly filled thermoplastic materials and recycled rubber (for example from tires) can be used to decrease cost.
  • the content of mineral fillers can be, for example, in the weight range from 5% to 80%.
  • a capstock material with a core material allows an economic advantage in that a greater amount of filler may be used to make up the core, which will be of less expense than the material that comprises the capstock, without providing undesirable surface properties for the capstock, and without limiting the aesthetics of the product, because the core is, at least partially, encapsulated in an aesthetically pleasing and weatherable capstock.
  • the core can be comprised of a foam or microcellular foam material where reduced weight for the product is desired.
  • the polymeric roofing tile comprises a headlap portion and a butt portion disposed lengthwise with respect to the headlap portion.
  • the butt portion has a length in the range of, for example, 0.5-10, 0.5-5, or even 0.5-2 times the length of the headlap portion.
  • the photovoltaic element is affixed to the polymeric carrier tile in the butt portion of the polymeric roofing tile.
  • a photovoltaic roofing tile according to this embodiment of the invention is shown in FIG. 5.
  • the photovoltaic roofing tile 500 has a headlap portion 560 and a butt portion 562.
  • the photovoltaic element 510 is affixed to the polymeric carrier tile 502 in the butt portion 562 of the roofing tile.
  • the butt portion 562 of the polymeric carrier tile 502 has features 566 molded into its surface, in order to provide a desired appearance to the polymeric carrier tile.
  • the polymeric carrier tile 502 has a pair of recessed nailing areas 568 formed in its headlap portion 560, for example as described in International Patent Application Publication no. WO 08/052029, which is hereby incorporated herein by reference in its entirety.
  • the photovoltaic element 510 has coupled to it at least one electrical lead 578. The electrical lead can be disposed in a channel 580 formed in the top surface 504 of the polymeric carrier tile 502.
  • the polymeric carrier tile can be substantially solid, as shown in FIG. 2.
  • the polymeric carrier tile has a hollowed out bottom surface.
  • polymeric carrier tile 402 has a bottom surface 406 that is hollowed out.
  • the bottom surface 406 has molded into it ribs 492 to provide strength.
  • Ribs 492 can, for example (and as shown in FIG. 4), extend to be nearly (e.g., within 2 mm or even 1 mm) or substantially flush with the bottom edges of the polymeric carrier tile, as shown in International Patent Application no. PCT/US07/85900, filed November 29, 2007, which is hereby incorporated herein by reference in its entirety.
  • Suitable polymeric carrier tiles are disclosed in, for example, International Patent Application no. PCT/US07/85900, U.S. Patent Application publication US 2006/0029775 and U.S. Patent 7,141,200, each of which is hereby incorporated herein by reference in its entirety.
  • FIG. 7 Another embodiment of the invention is shown in cross-sectional schematic view in FIG. 7.
  • polymeric carrier tile 702 has an opening 736 formed in it.
  • the top surface 714 of the photovoltaic element 710 includes an inactive area 717, which is affixed to the bottom surface 706 of the polymeric carrier tile 702.
  • the active area 716 of the photovoltaic element 710 is substantially aligned with the opening 736, allowing it to be illuminated by solar radiation.
  • the inactive area can include parts of the photovoltaic element which might otherwise be photo voltaically active, but instead provide an attachment area for the polymeric carrier tile.
  • the polymeric carrier tile can hide from view all parts of the photovoltaic element except for the active area.
  • This embodiment of the invention can provide the overall photovoltaic roofing tile with a more aesthetically pleasing appearance and/or allow non- weather-resistant components to be protected from the elements.
  • the polymeric carrier tile used in this embodiment of the invention can be similar to those described above with respect to FIGS. 1-6.
  • the polymeric carrier tile can include a core material and a layer of capstock material formed on the core material, and can have a hollowed-out bottom surface.
  • the polymeric carrier tile comprises a headlap portion and a butt portion disposed lengthwise with respect to the headlap portion and having a length in the range of 0.5-2 times the length of the headlap portion, as described above with reference to FIG. 5.
  • the opening in which the photovoltaic element is disposed is formed in the butt portion of the polymeric carrier tile.
  • the headlap portion has an opening formed therein, the photovoltaic element includes an electrical lead, and the electrical lead runs through the opening formed in the headlap portion of the polymeric carrier tile.
  • connection of the electrical lead to the remainder of the photovoltaic element can be hidden from view and/or protected from the environment, but the electrical lead can be connected into the photovoltaic power generation system on the top face of the photovoltaic roofing tile.
  • the photovoltaic roofing tile also includes a cover element substantially covering the photovoltaic element. As described above, the cover element overlaps and is affixed to at least part of the top surface of the polymeric carrier tile.
  • the photovoltaic roofing tile 700 includes a cover element 730, which substantially covers the active face 716 of the photovoltaic element 710 and overlaps and is affixed to the top surface 704 of the polymeric carrier tile 702. In certain embodiments of the invention, the cover element is sealed to the top surface of the polymeric carrier tile.
  • the photovoltaic roofing tile 800 includes a cover element 830 substantially covering the active face 816 of the top surface 814 of the photovoltaic element 810.
  • the cover element 830 overlaps and is affixed to at least part of the bottom surface 806 of the polymeric carrier tile 802.
  • the cover element is sealed to the bottom surface of the polymeric carrier tile.
  • the polymeric carrier tile has an indentation formed in its bottom surface, and the photovoltaic element is disposed in the indentation.
  • the lateral gap between each edge of the indentation and an edge of the photovoltaic element is less than about 100 ⁇ m. In some embodiments of the invention, the lateral gap between each edge of the indentation and an edge of the photovoltaic element is less than about 50 ⁇ m, or even less than about 25 ⁇ m.
  • the photovoltaic element may be affixed to the polymeric carrier tile in any of a number of ways.
  • an adhesive layer is disposed between the inactive area of the top surface of the photovoltaic element and the bottom surface of the polymeric carrier tile.
  • a photovoltaic roofing tile 900 includes a polymeric carrier tile 902 having a top surface 904 and a bottom surface 906, and a photovoltaic element 910 having a bottom surface 912 and a top surface 914.
  • the top surface 914 of the photovoltaic element 910 has an active area 916 and an inactive area 917.
  • the bottom surface 912 of the photovoltaic element 910 is affixed to the top surface 904 of the polymeric carrier tile 902.
  • the photovoltaic roofing tile 900 also includes a polymeric overlay 950, having a top surface 952 and a bottom surface 954, and an opening 958 formed therein.
  • the inactive area 917 of the top surface 914 of the photovoltaic element 910 is affixed to the bottom surface 954 of the polymeric overlay 950.
  • the active area 916 of the top surface 914 of the photovoltaic element 910 is substantially aligned with the opening 958 formed in the polymeric overlay 950.
  • the inactive area can include parts of the photovoltaic element which might otherwise be photovoltaically active, but instead provide an attachment area for the polymeric overlay.
  • the photovoltaic element may be affixed to the polymeric carrier tile in any of a number of ways.
  • an adhesive layer is disposed between the inactive area of the top surface of the photovoltaic element and the bottom surface of the polymeric overlay.
  • an adhesive layer is disposed between the bottom surface of the photovoltaic element and the top surface of the polymeric carrier tile.
  • Some embodiments of the invention have both a first adhesive layer disposed between the bottom surface of the polymeric overlay and the inactive area of the top surface of the photovoltaic element, and a second adhesive layer disposed between the bottom surface of the photovoltaic element and the top surface of the polymeric carrier tile.
  • the photovoltaic element can also be affixed to the polymeric carrier tile and/or the polymeric overlay by molding them together under conditions such that the material of the polymeric carrier tile, the affixed surface of the photovoltaic element, or both become adhesive or fuse or melt together.
  • the photovoltaic roofing tiles according to this embodiment of the invention can include a cover element.
  • the photovoltaic roofing tile 900 includes a cover element 930, which substantially covers the active area 916 of the top surface 914 of the photovoltaic element 910 and overlaps the top surface 952 of the polymeric overlay 950.
  • the cover element is sealed to the top surface of the polymeric overlay.
  • the cover element 1030 can substantially cover the active area 1016 of the top surface 1014 of the photovoltaic element 1010 and overlap the bottom surface 1054 of the polymeric overlay 1050.
  • the cover element is sealed to the bottom surface of the polymeric overlay.
  • the polymeric overlay may be integrated into the photovoltaic roofing tile in a number of ways.
  • the bottom surface of the polymeric overlay can be affixed to the top surface of the polymeric carrier tile.
  • bottom surface 954 of the polymeric overlay 950 is affixed to the top surface 904 of the polymeric carrier tile 902.
  • the polymeric overlay and the polymeric carrier tile can be affixed to one another using an adhesive layer.
  • the polymeric overlay substantially covers the polymeric carrier tile. In other embodiments of the invention, the polymeric overlay does not substantially cover the polymeric carrier tile.
  • the photovoltaic roofing tile includes a headlap portion and a butt portion as described above with reference to FIGS. 5 and 6, the polymeric overlay can be disposed in the butt portion of the photovoltaic roofing tile, but not in the headlap portion.
  • the lateral gap between each edge of the indentation of the polymeric overlay and an edge of the photovoltaic element is less than about 50 ⁇ m, or even less than about 25 ⁇ m.
  • the polymeric carrier tile can have an indentation formed in it, with the photovoltaic element being disposed in it.
  • polymeric carrier tile 902 has an indentation formed in its top surface 904, in which the bottom surface 912 of the photovoltaic element 910 is disposed.
  • the lateral gap between each edge of the indentation of the polymeric carrier tile and an edge of the photovoltaic element is less than about 100 ⁇ m. In some embodiments of the invention, the lateral gap between each edge of the indentation of the polymeric carrier tile and an edge of the photovoltaic element is less than about 50 ⁇ m, or even less than about 25 ⁇ m. In some embodiments of the invention, the top surface of the photovoltaic element is disposed in an indentation formed in the bottom surface of the polymeric overlay, and the bottom surface of the photovoltaic element is disposed in an indentation formed in the top surface of the polymeric carrier tile.
  • One or more of the photovoltaic roofing tiles described above can be installed on a roof as part of a photovoltaic system for the generation of electric power.
  • one embodiment of the invention is a roof comprising one or more photovoltaic roofing tiles as described above disposed on a roof deck.
  • the photovoltaic elements of the photovoltaic roofing tiles can be connected to an electrical system, either in series, in parallel, or in series-parallel.
  • the photovoltaic roofing tiles of the present invention can be installed on top of an existing roof; in such embodiments, there would be one or more layers of standard (i.e., non-photovoltaic) roofing elements (e.g., asphalt coated shingles) between the roof deck and the photovoltaic roofing tiles of the present invention.
  • Electrical connections can be, for example, made using cables, connectors and methods that meet UNDERWRITERS LABORATORIES and NATIONAL ELECTRICAL CODE standards.
  • Electrical interconnection systems suitable for use with the photovoltaic roofing tiles of the present invention include those described in U.S.
  • the roof can also include one or more standard roofing elements, for example to provide weather protection at the edges of the roof, or in any hips, valleys, and ridges of the roof.
  • standard roofing elements are distributed or interspersed throughout the roof to provide an aesthetic effect, for example as described in U.S. Patent Application serial no. 11/412,160, filed on April 26, 2006 and entitled "Shingle with Photovoltaic Element(s) and Array of Same Laid Up on a Roof (published as U.S. Patent Application Publication 2007/0251571), which is hereby incorporated herein by reference in its entirety.
  • the unfinished photovoltaic roofing tile is finished to provide a photovoltaic roofing tile, which has a polymeric carrier tile having a top surface and a bottom surface; and affixed to the carrier tile a photovoltaic element having a top surface and a bottom surface.
  • the top surface of the photovoltaic element has an active area.
  • Finishing the unfinished photovoltaic roofing tile can take many forms.
  • finishing the unfinished photovoltaic roofing tile can comprise (in any order) removing the unfinished photovoltaic roofing tile from the compression mold and allowing the unfinished photovoltaic roofing tile to cool.
  • the compression molding process will create flashing (i.e., excess polymeric material along one or more edges of the unfinished photovoltaic roofing tile).
  • finishing the unfinished photovoltaic roofing tile comprises removing flashing from the edges of the unfinished photovoltaic roofing tile.
  • electrical leads and/or connectors are included with the photovoltaic element during the molding step. They can be partially or completely molded into the polymeric carrier tile (e.g., as shown in FIG. 5) or can remain free from the polymeric carrier tile.
  • the photovoltaic element is supplied to the compression mold without an electrical lead and/or connector.
  • finishing the unfinished photovoltaic roofing tile comprises coupling an electrical lead and/or connector to the photovoltaic element, so that it may be connected into an electrical interconnection system.
  • the compression molding methods according to this aspect of the invention can be used to produce photovoltaic roofing tiles in any of the configurations described above.
  • the photovoltaic element in order to produce a photovoltaic roofing tile in which the bottom surface of the photovoltaic element is affixed to the top surface of the polymeric carrier tile, as shown in FIGS. 1 and 3, the photovoltaic element can be inserted into the compression mold so that its bottom surface is disposed adjacent to the top surface of the polymeric tile preform.
  • the bottom surface of the photovoltaic element is affixed to the top surface of the polymeric carrier tile.
  • the photovoltaic element can be inserted into the compression mold so that an inactive area on its top surface is disposed adjacent to the bottom surface of the polymeric tile preform, and the active area on its top surface is substantially aligned with an opening formed in the polymeric preform.
  • the inactive area of the top surface of the photovoltaic element is affixed to the bottom surface of the polymeric element.
  • the compression molding methods according to this aspect of the invention can also be used to produce a photovoltaic roofing tile in which the bottom surface of the photovoltaic element is affixed to the top surface of the polymer carrier tile, and the top surface of the photovoltaic element is affixed to the bottom surface of a polymeric overlay, as shown in FIG. 9.
  • the photovoltaic element is inserted into the compression mold so that an inactive area of its top surface is disposed adjacent to the bottom surface of a polymeric overlay preform, which has an opening formed therein; and its bottom surface is disposed adjacent to the top surface of the polymeric tile preform.
  • the inactive area of the top surface of the photovoltaic element is affixed the bottom surface of the polymeric overlay, and the bottom surface of the photovoltaic element is affixed to the top surface of the polymeric carrier tile.
  • the compression molding methods according to this aspect of the invention can be used to produce photovoltaic roofing tiles in which the photovoltaic element is disposed in an indentation formed in the polymeric carrier tile or in a polymeric overlay.
  • the compression molding step at least partially embeds the photovoltaic element into a surface of the polymeric carrier tile or the polymer overlay, thereby creating an indentation.
  • the compression molding can be performed in a manner such that there is very little lateral gap (e.g., less than about 100 ⁇ m, less than about 50 ⁇ m, or even less than about 25 ⁇ m) between each edge of the indentation and an edge of the photovoltaic element.
  • the compression molding step can, for example, leave each edge of the indentation in substantial contact with an edge of the photovoltaic element.
  • the compression molding step can also leave the top surface of the photovoltaic element substantially flush with the surface of the polymeric carrier tile, as described hereinabove.
  • the surface of the polymeric tile preform adjacent to which the photovoltaic element is disposed is in a softened (e.g., at least partially molten) state when the photovoltaic element is disposed adjacent to it and during the compression molding step.
  • the polymer can be in a state in which it is formable without any substantial residual stresses remaining in the product after pressure has been exerted during molding.
  • the photovoltaic element can be affixed to the polymeric carrier tile (and optionally a polymeric overlay) in a variety of ways.
  • an adhesive material is disposed between the photovoltaic element and the polymeric carrier tile.
  • the adhesive layer can be joined to the photovoltaic element and/or the polymeric carrier tile with appropriate relative positioning before insertion into the compression mold.
  • the adhesive layer can be joined to the photovoltaic element, the polymeric overlay and/or the polymeric carrier tile with appropriate relative positioning before insertion into the compression mold.
  • the photovoltaic element has an adhesive layer at the surface to be affixed to the polymeric carrier tile (e.g., at its bottom surface when making the photovoltaic roofing tile of FIG. 3 or FIG. 9; or at the edges of its top surface when making the photovoltaic roofing tile of FIG. 7).
  • the adhesive layer can melt, flow, and/or bond to the material of the polymeric tile preform.
  • Adhesive layers also known as "tie layers" are described in U.S. Provisional Patent Application 60/985,932, filed November 6, 2007, and in U.S.
  • tie layers include, for example, functionalized polyolef ⁇ ns having acid or acid anhydride functionality such as maleic anhydride (see, e.g., U.S. Patent 6,465,103, which is hereby incorporated by reference in its entirety); EVA or anhydride-modified EVA (see, e.g., U.S.
  • the tie layer is a blend of functionalized EVA and polyolefm.
  • a tie layer can be especially suitable for use with a polymeric carrier tile having an upper surface formed from polyolefms such as polypropylene and polyethylene.
  • polyolefms such as polypropylene and polyethylene.
  • blends containing 5-50% (e.g., 15- 35%) by weight of polyolefm can be suitable for use.
  • tie layers suitable for use in the present invention include HB Fuller HL2688PT (an EVA- based pressure sensitive adhesive); DuPont BYNEL E416 (maleic acid-grafted EVA); Equistar PLEXAR 6002 (maleic acid-grafted polypropylene); a blend of 70% polypropylene (Basell KS021P) and 30% EVA (BYNEL E418); a blend of polypropylene (Basell KS021P) and EVA (BYNEL E418) (e.g., in a 70/30 or a 50/50 ratio); Arkema LOTADER AX8900 (epoxy and maleic acid-grafted ethylene butyl acrylate); a blend of polypropylene (Basell KS021P), PVDF (Arkema 2500), and HP Fuller 9917 (a functionalized EVA-based pressure sensitive adhesive) (e.g., in a 50/25/25 ratio); Dow VERSIFY DE2300 (an EVA
  • Surfaces to be adhered can be treated or activated prior to application of the tie layer.
  • such methods can include the use of, for example, reducing agents (e.g., sodium naphthalide), primers such as those comprising amine-functional acrylics or amine-derived functionalities, corona treatment, flame treatment, gas- reactive plasma, atmospheric plasma activation, cleaning with solvent, or plasma cleaning.
  • reducing agents e.g., sodium naphthalide
  • primers such as those comprising amine-functional acrylics or amine-derived functionalities
  • corona treatment flame treatment, gas- reactive plasma, atmospheric plasma activation, cleaning with solvent, or plasma cleaning.
  • the tie layers can be continuous, or in other embodiments can be discontinous. In some embodiments of the invention, the tie layer underlies the entire area of the photovoltaic element. Alternatively, tie layer material can be configured in various manners at the bottom of the photovoltaic element, for example, as spots, stripes or lattices. Tie layer material can also be selectively located around the perimeter of the bottom side of the photovoltaic element.
  • the photovoltaic element can have a laminate structure.
  • the photovoltaic element is provided as a laminate having an upper transparent encapsulant layer, a layer of photovoltaic devices, and a lower tie layer (to be used in affixing the photovoltaic element to a polymeric tile preform), with adhesive layers in between the upper layer and the photovoltaic layer; and in between the photovoltaic layer and the lower layer.
  • a protective layer (e.g., formed from the fluoropolymers described above) can be provided between the photovoltaic devices and the tie layer.
  • a vacuum lamination process can be used to form a photovoltaic element having a laminate structure. Such a process can remove unwanted air bubbles between the surface of the upper transparent encapsulant layer and the photovoltaic layer, and to cause the EVA used as an adhesive encapsulant to melt, flow and cure.
  • the vacuum lamination process typically takes 10-30 minutes per cycle, depending on the chemistry of the EVA and the masses of the layers and the vacuum lamination apparatus structures.
  • vacuum lamination is used to form an upper transparent encapsulant layer on a photovoltaic layer, to which a tie layer can be added in a subsequent step.
  • the compression molding step is performed under vacuum.
  • the compression molding step can be performed in a vacuum enclosure.
  • the laminate layers and the polymeric tile preform can be arranged in the compression mold.
  • Heat and vacuum can then be applied, after which molding pressure can be applied to laminate the layers to the polymeric tile preform as well as shape the polymeric tile preform to form the polymeric carrier tile.
  • gas e.g., air
  • Vacuum compression molding as described below can also be used to affix a cover element to the photovoltaic roofing tile.
  • the photovoltaic roofing tile comprises a polymeric carrier tile having a top surface and a bottom surface, one of which has an indentation formed therein.
  • the photovoltaic roofing tile also comprises a photovoltaic element having a top surface and a bottom surface, the photovoltaic element being affixed to the polymeric carrier tile and disposed in the indentation therein.
  • the method comprises inserting into a compression mold a polymeric tile preform having a top surface and a bottom surface; compression molding the polymeric tile perform to form a polymeric carrier tile having the indentation formed in one of the surfaces; disposing the photovoltaic element in the indentation; and affixing the photovoltaic element to the polymeric carrier tile to provide the photovoltaic roofing tile.
  • the difference in lateral dimensions (i.e., in the plane of the photovoltaic element) between the photovoltaic element and the indentation are less than about 1 mm, less than about 500 ⁇ m, or even 100 ⁇ m.
  • the polymeric tile preform can be provided as described above.
  • the compression molding can be performed substantially as provided above, but using a molding element to provide the desired indentation in the appropriate surface of the polymeric carrier tile.
  • one of the compression molds can be surfaced to form an indentation of an appropriate size and shape (e.g., a size and shape about equal to that of the photovoltaic element to be disposed in the indentation).
  • a dummy insert or template of an appropriate size and shape can be placed in the compression mold along with the polymeric tile preform, and after compression molding can be removed from the surface of the molded polymeric carrier tile to leave the indentation.
  • the photovoltaic element can then be disposed in the indentation in the surface of the polymeric carrier tile.
  • the photovoltaic element can, for example, have an adhesive layer at the surface to be affixed to the polymeric carrier tile, or an adhesive material can be placed between the photovoltaic element and the polymeric carrier tile.
  • the adhesive material can, for example, be provided on the tile, on the photovoltaic element, or both, or can be provided as a separate sheet.
  • a cover element can be used to affix and/or seal the photovoltaic element in the indentation, as described above.
  • vibration welding is used to fuse the photovoltaic element to the polymeric carrier tile; this method can be advantaged in that it provides very specific areas of bonding, and does not require heating large areas of the polymeric carrier tile or photovoltaic element.
  • photovoltaic elements having laminate structures can be used in this aspect of the invention.
  • a laminate of the top four layers of the structure of FIG. 52 can be formed by vacuum lamination.
  • An adhesive tie layer can then be affixed to the bottom of the laminate, for example by extrusion coating.
  • the laminate photovoltaic element so formed can be placed into an indentation formed in a polymeric carrier tile, and affixed as described above.
  • Encapsulated photovoltaic elements see, e.g., U.S. Patent 5,273,608, which is hereby incorporated herein by reference in its entirety) can also be used.
  • Photovoltaic elements having laminate structures or encapsulated structures can also be used in the compression molding methods of the present invention.
  • the compression molding methods according to this aspect of the invention can be used to make the photovoltaic roofing elements including cover elements described above.
  • a cover element preform can be inserted in the compression mold along with the photovoltaic element and the polymeric tile preform.
  • a cover element can be inserted into the compression mold adjacent to the top surface of the photovoltaic element.
  • the cover element is affixed to at least part of the top surface of the polymeric carrier tile.
  • the cover element is affixed to at least part of the top surface of the polymeric carrier tile.
  • the cover element can be inserted into the compression mold between the top surface of the photovoltaic element and the bottom surface of the polymeric tile preform.
  • the cover element is affixed to at least part of the bottom surface of the polymeric carrier tile.
  • a cover element can be inserted into the compression mold adjacent to the top surface of the photovoltaic element.
  • the cover element is affixed to at least part of the top surface of the overlay.
  • a cover element can be inserted into the compression mold between the top surface of the photovoltaic element and the bottom surface of the polymeric overlay. During the compression molding step, the cover element is affixed to at least part of the bottom surface of the polymeric overlay.
  • other methods can be used to form cover elements on the photovoltaic roofing tiles of the present invention.
  • the cover element is affixed to the top surface of the photovoltaic element before insertion into the compression mold with the polymeric tile preform.
  • the cover element can be used to protect the photovoltaic element during manufacture of the photovoltaic roofing tile.
  • the cover element can also be used in the manufacturing process to provide an area for workers or machinery to grip while transporting or working with the photovoltaic element, thereby reducing handling during manufacture.
  • the cover element can also bear an adhesive, or have adhesive properties itself, such that it affixes the photovoltaic element to the polymeric carrier tile and/or the polymeric overlay during the compression molding.
  • a manufacturing process adaptable for performing the methods and making the photovoltaic roofing tiles of the present invention is described generally in U.S. Patent Application Publication no. 2006/0029775, and is described below with reference to FIGS. 11-20.
  • other manufacturing processes can be used for performing the methods and making the photovoltaic roofing tiles of the present invention.
  • a polymeric tile preform is first made by extruding a cross-section that will be generally similar to the finished cross-section of the polymeric carrier tile, with the polymeric tile preform then being allowed to cool somewhat prior to placement of it in the compression mold.
  • the amount of cooling of the polymeric tile preform is minimized prior to placement in the compression mold. In this way, significant amounts of heat do not need to be provided, allowing a shortened cooling cycle to be obtained. Also, higher molecular weight polymeric materials with higher viscosities and better polymer performance properties can be used, because the shape of the polymeric tile preform is close to that of the molded polymeric carrier tile, and so the amount of material flow necessary to produce the desired finished photovoltaic roofing tile shape is minimal.
  • an extruder is generally designated by the numeral 20 for receiving generally thermoplastic pellets 21 into an inlet hopper 22 thereof, and with an auger 23 being rotatably driven, to urge the pellets through the extruder 20 in the downward direction of the arrow 24, through the extruder, to be discharged at discharge end 25.
  • the pellets can be dried prior to adding them to the extruder. Such drying may include exposing the pellets to a drying cycle of up to 4 hours or more, at an elevated temperature (e.g., 180° F).
  • a suitable heater such as electric coils 26, is provided for heating the thermoplastic material 21 in the extruder, so that it can be extruded into a desired shape as may be determined by the outlet mouth 25 of the extruder 20.
  • the extrudate 27 is then moved horizontally in the direction of the arrow 28, beneath a transverse cutting mechanism 30 in the form of a guillotine, which is movable upwardly and downwardly in the direction of the double-headed arrow 31, with the blade 32 of the guillotine, operating against an anvil 29, to sever the extrudate 27 into a plurality of polymeric tile preforms 33.
  • the polymeric tile preforms 33 then pass onto an upper run 34 of a continuously moving conveyor belt 35 driven between idler end roller 36 and motor-driven end roller 37, with the upper run 34 of the belt 35 being supported by suitable idler rollers 38, as the polymeric tile preforms 33 are delivered rightward, in the direction of the arrow 40 illustrated in FIG. 11.
  • any other type of cutting mechanism such as for example only, a blade or other cutter movable transversely across the belt 35, or the die lip at the discharge end 25 of the extruder, in a direction perpendicular to the arrow 40 can be used to separate the extrudate into a plurality of polymeric tile preforms 33.
  • the belt which supports the polymeric tile preforms can be a vented belt made of a suitable material, such as, for example, a silicone coated belt, or a metal mesh belt, or the like, in order to control bubbling or outgassing of gasses from the extrudate, if desired.
  • a suitable material such as, for example, a silicone coated belt, or a metal mesh belt, or the like, in order to control bubbling or outgassing of gasses from the extrudate, if desired.
  • some embodiments of the manufacturing process can use a co-extrusion process, in which a capstock or skin material 47 is extruded through extruder 48, while a core material 50 is extruded through another extruder 51, each with their own thermoplastic heating systems 52, 53, such that the discharge mouth 45 of the co-extruder 55 produces multiple layer polymeric tile preforms 46, as shown.
  • the other details of the apparatus as shown in FIGS. 13 and 14, including the guillotine, anvil, conveyor belt, rollers, etc. are all otherwise similar to the comparable items described above with respect to FIGS. 11 and 12.
  • the conveyor can have a take-off speed that is matched to the extrusion speed, such that after extrusion of a given length, the cutting is affected by the guillotine or the like, and the speed of the conveyor can be controlled.
  • two conveyors can be disposed serially, with the speed of the upper run of the first conveyor being accelerated to deliver the polymeric tile preforms to the second conveyor after cutting, with the speed of the first conveyor then being re-set to match the extrusion speed of extrudate leaving the extruder, with the second conveyor being controlled for delivery of the polymeric tile preforms to the compression mold.
  • the delivery being automatic, the same could be done manually, if desired.
  • polymeric tile preforms 46 that are co-extruded as shown in FIGS. 13 and 14 are illustrated as being polymeric tile preforms comprising a core material 57 that is substantially the full length of the shapes as shown in FIG. 14, with a capstock material 58 on an upper surface thereof, that is slightly more than half the dimension of the full length of the shingle shapes 46 shown, terminating at 60 as shown.
  • capstock material 58 could cover a lesser or greater portion of the upper surface, or even the entire upper surface of the polymeric tile preform.
  • the extrusion and co-extrusion processes described above are continuous processes, and that the severing of the extrudate of whichever form by the guillotine is a serial, or substantially continuous process, and that the delivering of the polymeric tile preforms from the extruder or co-extruder along the conveyor belt allows for the dissipation of heat resulting from the extrusion process, from the polymeric tile preforms, in that, by allowing the shapes to substantially cool prior to placing them in the mold, rather than requiring the cooling to take place completely in the compression mold itself, reduces the required time for residence of the shapes in the compression mold during the compression process, as will be described hereinafter.
  • maintaining the temperature above a melting temperature of the material(s) of the polymeric tile preform so that a quick flow of the melt can occur in the compression mold is desired in some embodiments.
  • the maintaining of temperature above a crystallization or solidification temperature of the material(s) of the polymeric tile preform can minimize the development of internal stresses within the polymeric tile preforms that could be caused by deformation of polymers that have begun to enter the solid state.
  • some suitable device such as the pusher rod 62, shaft-mounted at 63 and suitably motor-driven by motor 64, and operating in a back- and- forth motion as shown by the double-headed arrow 65, pushes polymeric tile preforms 46 (or 33) rightward, in the direction of the arrow 66, along table 67, to the position shown, between upper and lower mold components 68, 70, respectively.
  • a photovoltaic element (not shown for the sake of simplicity) is also placed in the compression mold.
  • the compression mold generally designated 71 in FIG. 15 and including upper and lower mold components 68 and 70, respectively, is movable into and out of its position as shown at the center of the ram mechanism 72, in the direction of the double-headed arrow 73, from an indexable table 74 that will be described hereinafter.
  • the ram mechanism 72 operates like a press, wherein a ram 75 is pneumatically, hydraulically or electrically driven, generally by use of a piston or the like within the upper end of the ram mechanism, for driving an electromagnet 76 carried at the lower end of the ram 75, for lifting the upper mold component 68 upwardly as shown.
  • the closing of the compression mold can be done, at a force of, for example, 40 tons, in order to cause a material flow out on the edges of the unfinished photovoltaic roofing tile being molded, for 3-4 seconds, with the entire molding process as shown in FIG. 15 taking approximately one minute, after which the cooling of the unfinished photovoltaic roofing tile can take place, followed by removal of the unfinished photovoltaic roofing tile from the mold, for subsequent or simultaneous trimming of the flashing therefrom. Shorter molding cycles of less than 45 seconds, less than 20 seconds or even less than 15 seconds can also be used.
  • the two mold components 68 and 70 when moved from the closed position on table 74 shown at the right end of FIG. 15, to the open position shown at the center of the ram mechanism 72 of FIG. 15, separate such that the upper component 68 is movable upwardly and downwardly along guide rods 77, as the electromagnet 76 lifts a preferably ferromagnetic cap 78 carried by the upper mold component 68, such that, in the open position shown for the compression mold 71 in FIG. 15, a transfer mechanism (e.g., a pushrod 62) may move a polymeric tile preform 46 (or 33) along the table 67 in the direction of the arrow 66, to a position between the open mold components 68, 70 as shown.
  • a transfer mechanism e.g., a pushrod 62
  • a polymeric tile preform 46 or 33
  • other techniques can be used to open the compression mold, such as mechanical separation.
  • the ram mechanism 72 itself, is comprised of a base member 80 and a compression member 81, and the member 81 carries the ram 75.
  • the compression member 81 also moves vertically upwardly and downwardly, via its own set of guide rods 82, in the direction of the double-headed arrow 83, and is suitably driven for such vertical movement by any appropriate mechanism, such as hydraulically, pneumatically, electrically or mechanically (not shown).
  • the compression mold 71 can be moved to and from the ram mechanism 72, in the direction of the double-headed arrow 73, by any appropriate technique, such as by use of a hydraulic or pneumatic push/pull cylinder 89, driving a rod 84, that in turn has an electromagnetic push/pull plate 85, for engaging the ferromagnetic cap 78 of the upper mold component 68, as shown in FIGS. 15 and 17.
  • the indexable table 74 is rotatably driven by any suitable technique (not shown), to move compression molds 71 into position for delivering them to and from the ram station 72 as discussed above.
  • the indexable table 74 may be moved in the direction of the arrows 86.
  • cooling coils can be embedded in, or otherwise carried by the table 74, such coils being shown in phantom in FIG. 17, at 87, fed by a suitable source 88 of coolant, via coolant line 90, as shown.
  • the coolant can be, for example, water, ethylene glycol.
  • coolant coils are shown in phantom at 91 in FIG. 17 for the lower mold component 70 and can be provided with coolant from a suitable source 92, if desired.
  • the upper mold component 68 can be provided with internal coolant coils 93, shown in phantom in FIG. 18, likewise supplied by coolant from a suitable source 94.
  • the top mold component 68 (which engages the capstock material) is heated to a slightly greater temperature than that of the bottom component 70, in order to control internal stress development.
  • the top component 68 may be heated to 120 0 F, with the bottom component being heated to 70-80 0 F.
  • the subsequent cooling for the top plate 68 can be a natural cooling by simply allowing heat to dissipate, and the bottom plate can be cooled, for example, by well water, at about 67° F.
  • well water or other coolant could be circulated, first through the bottom component 70 and then to the top component 68; however, in some instances both components 68 and 70 can be cooled to the same temperature.
  • various other cooling techniques can be employed to regulate temperature at various locations in the compression mold, depending upon the thickness of the photovoltaic roofing tile being molded, and in various locations of the photovoltaic roofing tile being molded.
  • a lifting mechanism 95 can be provided, for opening the compression molds 71, one at a time.
  • a typical such lifting mechanism can include a hydraulic or pneumatic cylinder 96, provided with fluid via fluid lines 97, 98, for driving a piston 2000 therein, which carries a drive shaft 1 that, in turn, carries an electromagnet 2 for engaging the cap 78 of the upper mold component 68, as the drive shaft 1 is moved upwardly or downwardly as shown by the double-headed arrow 3.
  • the closing of the components 68 and 70 relative to each other could alternatively be done under a force of 30 tons, rather the 40 tons mentioned above, in order to obtain a consistent closing and flow of material.
  • the closing could begin at a high speed, and then gradually slow down, in order get an even flow at an edge of the shape that is being formed into a shingle.
  • other forces and closing speed profiles can be used in performing the methods and making the photovoltaic roofing elements of the present invention.
  • a plurality of spring pins 5, mounted in lower mold component 70, in generally cylindrical cavities 6 thereof, are pushed upwardly by compressed springs 7, such that the upper ends of the spring pins engage the compression molded shingle and pushed the same out of the lower mold cavity 8.
  • spring pins 4 engage "flashing", or other material that has been cut away from the periphery of the formed shingle, for pushing the same out of the trench 10 that surrounds the cavity 8 in the lower mold component 70.
  • the lower mold 70 has, at the periphery of its cavity 8, an upstanding cutting blade 9 separating the mold cavity 8 from the peripheral trench 10, for cutting the polymeric tile preforms placed therein to the precisely desired dimensions of the final photovoltaic roofing tile, during the compression molding process. That is, generally, the polymeric tile preforms may be slightly larger in size than the final photovoltaic roofing tile shape, to enable the cutting edge 9 to achieve the final desired dimensions for the photovoltaic roofing tile.
  • the cutting of flashing from the photovoltaic roofing tile should be done quickly, and it is preferably done in the compression mold. The flashing can be recycled back for re-use, most preferably for use as part of subsequent core material.
  • the flashing can also be trimmed during the molding process itself; in certain embodiments of the invention, when the compression mold is totally closed, cooperating surfaces on the upper mold component and the lower mold component cut any flashing away. While the trimming of the flashing can be done in the compression mold, it could, alternatively, be done as a secondary trimming and finishing operation which, in some cases may be more cost effective than trimming in the compression mold.
  • Both the upper and lower mold cavities 11 and 8 can be provided with protrusions 12, 13, respectively, which protrusions will form reduced-thickness nailing or fastening areas in the compression molded shingle, as will be described hereinafter.
  • the upper and lower mold cavities can also be provided with any protrusions or recesses necessary to form other features on the photovoltaic roofing tile.
  • the lower mold cavity can be provided with a protrusion in order to form a hollowed- out polymeric carrier tile, and with recesses to form ribs, as shown in the photovoltaic roofing tile of FIG. 4.
  • the indexable table 74 can be moved, for delivery of a next adjacent compression mold to the station for engagement by the lift mechanism 95, with the table 74, generally being rotatable on a floor 18, as allowed by a number of table-carrying wheels 20.
  • the upper mold component 68 (FIG. 17) can have a generally rectangular shaped upper mold cavity 11 that is essentially the shape of a natural slate shingle having a headlap portion 2025 and a butt or tab portion 2026. It will be noted that in the headlap portion there are a plurality of protrusions 12 that define reduced thickness areas in the compression molded shingle 17, to serve as nailing or fastening areas, to make it easier for nails or other fasteners to penetrate the shingle 17 when it is nailed to a roof.
  • the compression mold can also include a feature configured to embed the photovoltaic element into the polymeric carrier tile at a controlled depth.
  • the upper mold cavity shown in FIG. 18 has a slight recess 2029 into which the photovoltaic element fits during molding; the depth of the recess can be selected with reference to the thickness of the photovoltaic element to control the depth of the indentation formed in the polymeric carrier tile.
  • the 70 is provided with a lower mold cavity 8, also having protrusions 13 therein, for effecting a reduced-thickness (or other geometry) nailing or fastening area for application to a roof, in the final photovoltaic roofing tile 17.
  • the lower mold component can also, for example, include features to create the hollowed-out bottom surface and/or ribs shown in FIG. 4.
  • the mold cavity 11 could be the lower mold cavity and that the mold cavity 8 could be the upper mold cavity, if desired.
  • the two mold components 68 and 70 are thus adapted to compression mold a photovoltaic roofing tile such as that which is shown by way of example only, in FIG. 5.
  • the process described with reference to FIGS. 11-20 can be performed to compression mold a photovoltaic element into the surface of the polymeric carrier tile.
  • the process can also be performed to mold an indentation into the surface of the polymeric carrier tile (for example, using a specially-shaped mold or a dummy insert or template).
  • a photovoltaic element e.g., a laminate structure as described above
  • a photovoltaic element can then be placed in the indentation and affixed (e.g., by pressure and/or heat) therein.
  • a curvature can be provided to the photovoltaic roofing tile, for example by sandwiching the unfinished photovoltaic roofing tile between upper and lower plate components of a retention mechanism while it cools.
  • a curvature can be provided to the photovoltaic roofing tile, for example by sandwiching the unfinished photovoltaic roofing tile between upper and lower plate components of a retention mechanism while it cools.
  • no additional curvature need be imparted to the photovoltaic roofing element.
  • FIGS. 21-49 Referring now to FIGS. 21-49 in detail, reference is first made to FIG.
  • the molding methods are generally described as creating "polymeric carrier tiles.”
  • the polymeric carrier tile can be fabricated in the molding process to have a photovoltaic element molded therewith to form a photovoltaic roofing tile.
  • the process can also be performed to mold an indentation into the surface of the polymeric carrier tile (for example, using a specially-shaped mold or a dummy insert or template).
  • a photovoltaic element e.g., a laminate structure as described above
  • the carrier plates 2127 are then delivered to a speed-up conveyor 2140, at which the carrier plates are serially separated one from the other, for serial delivery to a compression mold 2141.
  • the molded polymeric carrier tile would be part of a photovoltaic roofing tile also including the photovoltaic element.
  • an insert or template can be positioned on the extruded polymeric tile preform material before molding, then removed after molding to provide an indentation into which a photovoltaic element can later be positioned and affixed.
  • the compression mold can also itself form the indentation.
  • a transfer mechanism 2147 which may be of the robot type, is provided for lifting a molded polymeric carrier tile 2148 from its carrier plate 2127, and delivering the polymeric carrier tile 2148 to a severing station 2150 for removing flashing therefrom.
  • the polymeric carrier tile 2148 is placed onto a secondary plate where blades will trim flashing from the various edges thereof, as will be described more fully hereinafter.
  • the robotic or other type of mechanism 2147 will then remove the polymeric carrier tile from the flash trimming station 2150 and deliver it to a cooling station 2151 as will also be described in detail hereinafter, and wherein the polymeric carrier tile is cooled down to ambient temperature, and in one embodiment provided with a curvature therein.
  • a representative mechanism 2130 illustrates the manner in which carrier plates 2127 can be delivered from the upper run of the conveyor mechanism 2126, which conveyor mechanism is moving in the direction of the arrows 2152, 2153, to lift the carrier plates 2127 upwardly in the direction of the arrows 2154, to place the same onto the upper run 2139 of the conveyor 2131, which conveyor 2131 is being driven to move its upper run in the direction of the arrows 2155, 2159.
  • FIG. 23 an alternative embodiment of a preheater 2128' is provided, wherein carrier plates 2127' are delivered leftward along a preferably steel plate 2129' (fragmentally shown) with heating elements 2160' disposed therebeneath for heating the plate 2129' for transferring heat to the carrier plates 2127'.
  • the carrier plates are moved along the plate 2129' by movable brackets 2109' of angle iron or other types, in the direction of arrow 2108', which are driven from the opposite side of the preheater 2128' to that shown in FIG. 23 by a conveyor chain 2126' (fragmentally shown), in turn driven by sprockets 2151 ' at ends thereof, turning in the direction of the arrow 2152'.
  • a transfer mechanism 2130' (shown in phantom), like the transfer mechanism 2130 of FIG. 21, lifts the carrier plates 2127' upwardly at the left end of the preheater 2128' to pass beneath the extruder 2132.
  • the heating elements 2160' can be any of those described above with reference to FIG. 22. Supplemental heating elements (not shown) can also be used, and they can be infrared elements, quartz lamps, or any other heater suitable to heat the plate 2129' or the carrier plates 2127'.
  • 2127 may have carrier pin holes 2166, to facilitate the proper placement of the carrier plates 2127 over pins 2167 as shown in FIG. 21 in the bottom 2168 of the compression mold 2141, when the carrier plates are delivered to the compression mold 2141, for proper and precise location of the carrier plates 2127 in the compression mold 2141.
  • the severing mechanism 2136 operates such that it can be lowered or raised as indicated by the direction of the double headed arrow 2170 shown in FIG. 29, with a severing blade 2171 thereof being moved transversely of the upper run 2139 of the conveyor 2131, in the direction of the double headed arrow 2172, to traverse the conveyor upper run 2139, to sever the polymeric tile preform material 2133 as shown in FIG. 6, to overlie each carrier plate 2127.
  • the severing mechanism 2136 may optionally be longitudinally moveable in correspondence with the longitudinal movement of the carrier plates, as shown in phantom in FIG. 29, via a pulley or the like 2115, rotating in unison with shaft 2112, and in turn, driving a belt or chain 2117 that in turn, is driving a shaft 2116 that drives a longitudinal conveyor 2118 connected at 2119 to a post 2120 of the severing mechanism 2136, so that the mechanism 2136 is longitudinally movable in the direction of the double headed arrow 2121.
  • This enables tracking of the severing mechanism 2136 with the progress of the carrier plates 2127 along the conveyor system, so that the precision of the cut is maintained.
  • the conveyor 2140 is driven such that its upper run 2149 moves in the direction of the arrow 2173, at a faster rate than the upper run 2139 of the conveyor mechanism 2131, such that the carrier plates 2127 become separated from each other.
  • the conveyor upper run 2149 may be driven in any suitable matter, such as being belt driven as at 2174 from a motor 2175, or in any other manner, as may be desired.
  • a plurality of extruder apparatus 2132 and severing mechanisms 2136 may, if desired, be used to supply extruded polymeric tile preform material 2133, disposed on carrier plates 2127, to any selected ones of a plurality of compression molds 2141, as may be desired.
  • the carrier plates 2127 with their polymeric tile preform material 2133 applied thereto are delivered along the upper run 2149 of the conveyor mechanism 2140, to the walking beam transport mechanism 2142, which is operated to be lifted upwardly as shown by the arrows 2176, 2177, to lift the carrier plates 2127 into the compression mold 2141, to place the carrier plates 2127 onto a base mold portion 2168 thereof, by which the pin recesses 2166 (FIG. 25) may be engaged by upstanding pins 2167 in order to properly secure the location of the carrier plates and the polymeric tile preform material 2133 thereon in the compression mold 2141.
  • the upper die portion 2178 of the compression mold 2141 is moved vertically downwardly in the direction of the arrow 2180, such that its lower surface 2181, being configured to have a reciprocal surface configuration to that which is desired for the upper surface of the polymeric carrier tile that is to be molded on the carrier plate 2127, engages the polymeric tile preform material 2133 under a predetermined pressure to force the polymeric tile preform material 2133 to conform to the reciprocal of the surface configuration 2181 of the die 2178, and thereafter, the die 2178 is moved upwardly in the direction of the arrow 2182 of FIG. 30 such that the then molded polymeric carrier tile is ready for discharge from the compression mold 2141.
  • a lifting motion of the walking beam mechanism 2142 then lifts the carrier plate 2127 and the polymeric carrier tile molded thereon from the compression mold 2141 and sequentially delivers the same to the two hold-down stations 2143, 2144 as shown in FIGS. 1 and 31.
  • the thus formed polymeric carrier tiles and carrier plates are engaged by respective hold-down members 2185, 2186, and cooling air may be delivered via optional fans or the like, 2145, 2146 to facilitate a partial cooling-down of the thus-formed polymeric carrier tiles.
  • an upper plate 2191 is brought vertically downwardly in the direction of the arrow 2192, to engage the upper surface of the thus- formed polymeric carrier tile 2133, such that four severing blades 2193, 2194, 2195,
  • the secondary plate 2187 may simultaneously be moved along the edges of the secondary plate 2187, in the directions of the arrows 2197, 2198, 2200 and 2201, respectively, to sever flashing 2202 therefrom, after which the plate 2191 is lifted upwardly in the direction of arrow 2203, and the robot arm 2147 or a different mechanism (not shown) or an operator (manually) engages the thus trimmed polymeric carrier tile 2133 and removes it from the flash trimming station 2150.
  • the severing blades 2193-96 could be driven to flash-trim in directions opposite to directions 2197, 2198, 2200 and 2201, or both in the directions
  • the robotic arm 2147 engages a polymeric carrier tile 2133 from the trimming mechanism 2150 and inverts the polymeric carrier tile, so that its upper face (which is the face that will be facing upwardly when installed on a roof) is facing downwardly, delivering the same to cooling tower 2151.
  • the polymeric carrier tile 2133 is then facing downwardly against a preferably ridged upper surface 2205 of a lower component plate 2206, as shown in FIG. 35 of a retention mechanism generally designated by the numeral 2207.
  • the retention mechanism 2207 comprises a lower component plate 2206 and an upper component plate 2208, sandwiching the polymeric carrier tile between the plates 2206 and 2208. This occurs at a loading station 2210 as shown in FIG. 33.
  • the ridged surfaces 2205 enable airflow for cooling. Other shaped surfaces that facilitate airflow for cooling could be used, as alternatives.
  • the polymeric carrier tiles 2133 could be engaged by their robotic arm 2147 and not inverted, but placed between opposed plates 2106, 2108 that have downwardly curved opposing surfaces, opposite to those curved surfaces shown in FIGS. 36 and 37.
  • the retention mechanism 2207 is moved in the direction of the arrow 2211 of FIG. 33, along the upper run 2212 of a conveyor 2213, to the left side 2214 of the cooling tower mechanism 2151 illustrated in FIG. 33.
  • a plurality of retention mechanisms 2207 with polymeric carrier tiles 2133 carried therein are lifted vertically upwardly, in the direction of the phantom arrow 2215, via an upward conveying device 2216 having engagement lugs 2217 carried thereby, during which cooling air is delivered via a fan or the like 2220 (FIG.
  • the polymeric carrier tiles are conveyed fully upwardly through the left tower portion 2214 of FIG. 33, to the upper end 2223 thereof (FIG. 34), they are delivered across the top of the tower mechanism 2151 via a suitable conveyor (shown in phantom) 2224 or the like, in the direction of the arrows 2225, to a downwardly conveying portion 2226 of the cooling tower, wherein they are conveyed downwardly in a manner similar to that which they are conveyed upwardly in tower portion 2214, so the same will not be duplicated by way of explanation herein.
  • a suitable conveyor shown in phantom 2224 or the like, in the direction of the arrows 2225
  • cooling air is likewise delivered from the fan 2220, with ambient air being thus delivered to the polymeric carrier tiles in the now downwardly moving retention mechanisms in tower portion 2226, with air being supplied in the direction of the arrows 2227.
  • a mechanism is provided for lifting the upper component plate 2208 of each retention mechanism 2207 both onto and away from a polymeric carrier tile 2133 being carried by a lower component plate 2206 of the retention mechanism 2207.
  • a vertically movable lift mechanism 2230 is provided, moveable upwardly and downwardly in the direction of the double headed arrow 2231, with a plurality of feet 2232 being carried thereby for engaging upper component plates 2208, and a vacuum delivery line 2233 is provided, such that as the feet 2232 engage a plate 2208, the vacuum is actuated and applied through the feet 2232, so that upper component plates 2208 of the retention mechanisms may be lifted from or placed downwardly onto a polymeric carrier tile 2133, either for delivery to an upwardly lifting portion 2214 of the cooling tower, or for removing an upper component plate 2208 from a polymeric carrier tile retention mechanism 2207 after it is delivered downwardly via tower portion 2226, in order to access a cooled polymeric carrier tile from a retention mechanism 2207.
  • thermoplastic polymeric carrier tiles are already sufficiently cooled/solidified at their surface locations such that such textures are already set but internally the thermoplastic polymeric carrier tiles remain sufficiently soft and hot enough to take on the set applied by the plates 2206, 2208 when cooled.
  • curvature By applying curvature to the polymeric carrier tiles 2133 in this manner, it allows use of flat carrier plates 2127 and allows the use of mold shapes that are easier to work with and are generally less expensive than molds with the arcuate-forming polymeric carrier tile features built into the mold components 2168 and 2178.
  • a lower component plate 2206 of the retention mechanism has its upper surface 2209 thereof, concavely configured as is most clearly illustrated in FIG. 36.
  • the lower surface of the upper component plate 2208 while being grooved as shown in FIGS. 37 and 39 complementary to the facing surface of the lower component plate 2206, is convexly configured, as is clearly shown in FIG. 37. Additionally, as shown in FIG.
  • the upper surface 2209 of the lower component plate 2206 is slightly dished, or concavely configured, from its left end 2240 to its right end 2241, as shown, ad as may be more clearly seen by reference to the space between surface portions thereof and a straight phantom line 2242 connecting said ends 2240 and 2241, to provide what is preferably a compound curved surface.
  • the compound curve can be adapted to prevent "smiling" of the tiles under weathering or thermal expansion conditions, where there is a capstock and core with different thermal expansion/contraction behaviors.
  • FIGS. 40 and 41 an alternative configuration is provided for a lower component plate 2244 of a retention mechanism for sandwiching a polymeric carrier tile therebetween, for providing an alternative mechanism for cooling a polymeric carrier tile carried on the lower component plate 2244.
  • a circuitous duct configuration 2245 may be provided in the lower component plate 2244, for receipt of a cooling medium, such as a refrigerant therethrough, if desired.
  • FIG. 43 an illustration similar to that of FIG. 42 is provided, but wherein a lower component plate 2250 having grooves 2251 therein is provided with cool air delivered via a fan 2252 blowing from an air conditioning mechanism 2253 or the like, for providing additional cooling over and above that which would be provided via ambient air, for a polymeric carrier tile carried on the lower component plate 2250.
  • FIG. 45 there is a representation of a polymeric carrier tile 2133 carried by a secondary plate 2187, prior to it being delivered to a cooling tower, in which a diagrammatic thermometer representation is shown at the left end, indicating that the temperature of the polymeric carrier tile 2133 is still at a relatively high level as shown by the temperature indicia 2260 for the thermometer 2261 thereof.
  • thermometer 2262 shows that the temperature level 2263 indicated thereon has been reduced substantially as indicated by the arrow 2264, so that the polymeric carrier tile is now fully formed and cooled, and substantially rigid in nature.
  • FIG. 47 there is a diagrammatic side view representation of the polymeric carrier tile 2133 with its downward- facing concave surface 2265, facing an upper surface 2266 of a roof 2267, prior to being fastened to the roof, showing a spacing 2268 between opposing arrows 2270, 2271, such that the bottom surface of the polymeric carrier tile 2133 is slightly arched and concave above the roof 2267, providing a top-to-bottom arch.
  • the polymeric carrier tile 2133 is dished in end view, as shown by the spacing 2272 between the arrows 2273, 2274, with the bottom surface 2275 of the polymeric carrier tile being slightly arched and concave above the roof 2276, providing a right/left arch.
  • a benefit of the curvature shown at surface 2275 for the polymeric carrier tile 2133 of FIG. 48 is that when fasteners such as those 2280 are applied as shown in FIG. 49 and the polymeric carrier tile 2133 engages against the surfaces 2266 of a roof, the built-in memory of the polymeric carrier tile 2133 of its shape as shown for example in FIG. 28, resists upward edge curl or "smile” that may otherwise result from thermal expansion, weathering, aging or stress relaxation of the polymeric carrier tile.
  • the curvature of the single as shown in FIG. 48 makes the contact of the polymeric carrier tiles with the roof more secure.
  • Photovoltaic device 2388 includes a photovoltaic element 2310 having a substrate 2389 and a top surface 2314. It also includes a cover element 2330, which substantially covers the photovoltaic element 2310 and is affixed to its top surface 2314.
  • the cover element 2330 is longer and/or wider than the substrate 2389 of the photovoltaic element 2310 by at least about 2 mm. In certain embodiments of the invention, the cover element is longer and/or wider than the substrate by at least about 4 mm, or even at least about 8 mm. In certain embodiments of the invention, the cover element is both longer and wider than the substrate by at least about 2 mm.
  • the cover element can overlap the substrate of the photovoltaic element on both edges of the substrate along the length of the substrate, the width of the substrate, or both (i.e., overlap on all sides).
  • Photovoltaic devices including a cover element affixed to the top surface of a photovoltaic element can be used as a precursor in the manufacture of photovoltaic roofing tiles as described above.
  • the cover element 2330 overlaps the photovoltaic element 2310, leaving a peripheral area 2335 of the cover element that can be affixed to a polymeric carrier tile as described above.
  • the photovoltaic device according to this aspect of the invention can also include a polymeric carrier tile disposed adjacent to the peripheral area of the cover element.
  • a laminate photovoltaic element having the structure of FIG. 52 was made by vacuum lamination.
  • the structure was constructed by placing an 4 mil ETFE top film (available from Saint-Gobain Corp., Wayne, New Jersey) with a cementable side facing the photovoltaic element, a 18 mil EVA encapsulant (available from STR Corp., Enfield, CT), a photovoltaic cell (T-CeIl available from Uni-Solar, Auburn Hills, MI), another film of EVA encapsulant, and a 10 mil tie layer of extruded blend of PP (Basell KS021P) and EVA (Bynel E418 from DuPont Corp).
  • 4 mil ETFE top film available from Saint-Gobain Corp., Wayne, New Jersey
  • EVA encapsulant available from STR Corp., Enfield, CT
  • T-CeIl available from Uni-Solar, Auburn Hills, MI
  • another film of EVA encapsulant and a 10 mil tie layer of extruded blend of
  • the T-CeIl had lateral dimensions of roughly 7.5" x 4.75", and the other laminate sheets had lateral dimensions of roughly 9" x 6.25".
  • Vacuum lamination was performed in model SPI- 480 vacuum laminator from Spire Corp. at temperature of 155 0 C, to form a laminate structure that extended roughly 0.75" on each side of the T-CeIl.
  • the laminate structure was placed on the top surface of a polypropylene polymeric tile preform just prior to the compression molding step, and a thin ETFE release film was placed on top to allow release from the mold.
  • the polypropylene polymeric tile preform had a temperature of approximately 270 0 F, and was in a soft and pliable state.
  • the EVA and tie layer of the laminate began to melt, become more clear, and adhere to the preform surface.
  • This assembly was allowed to dwell for 10-20 seconds, and then entered the mold cavity.
  • the mold cavity was as described above with respect to International Patent Application no. PCT/US07/85900, and had lateral dimensions of about 18" x 12".
  • the mold closed exerting approximately 40 tons pressure on the laminate structure and the polymeric tile preform.
  • the polymeric material of the polymeric tile preform flowed to fill the mold cavity. After 2-3 seconds under pressure, the photovoltaic roofing tile was released from the mold, trimmed, and allowed to cool in a cooling tower.
  • the assembly so formed can be placed on a carrier as described above with respect to International Patent Application no. PCT/US07/85900, then put into an oven hot enough to activate the adhesive.
  • a release film e.g., ETFE
  • ETFE e.g., ETFE
  • the press can be opened and the release film can be removed to form a photovoltaic roofing tile, for example as shown in FIG. 55.
  • the outer outline around the photovoltaic element is the outline of the release film.
  • the platen press can be appropriately release coated to obviate the use of a separate release film.
  • a photovoltaic laminate e.g., a laminate having an adhesive bottom later, e.g., as described above in Example 1
  • a photovoltaic laminate can be placed directly on the polymeric perform, covered with a release film made of ETFE and compression molded into the polypropylene tile.
  • heat from the polymeric perform activates the adhesive layer and bonds the photovoltaic element to the polypropylene tile. If the heat from the polymeric perform or the dwell time in the press is not sufficient enough to fully activate the adhesive layer, the assembly can be secondarily placed in a curing oven for a typical period of between 5 to 15 minutes.
  • FIG 55 shows two assemblies in which a photovoltaic element is placed in an indentation formed in a polymeric carrier tile, on the left, before a release film made of ETFE is added and the photovoltaic element is affixed to the polymeric carrier tile; and on the right, after the photovoltaic element was affixed and a release film removed.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Roof Covering Using Slabs Or Stiff Sheets (AREA)

Abstract

La présente invention concerne des tuiles photovoltaïques et des procédés de fabrication associés. Un aspect de la présente invention est une tuile photovoltaïque qui comprend : une tuile de support polymère qui possède une surface supérieure et une surface inférieure ; et un élément photovoltaïque fixé à la tuile de support polymère, l'élément photovoltaïque possédant une surface inférieure et une surface supérieure qui possède une zone active. Un autre aspect de l'invention est un procédé de fabrication d'une tuile photovoltaïque qui consiste à insérer dans un moule de compression une préforme de tuile photovoltaïque qui possède une surface supérieure et une surface inférieure, et un élément photovoltaïque, une surface de l'élément photovoltaïque étant disposée de façon adjacente à une surface de la préforme de tuile photovoltaïque ; à mouler par compression la préforme de tuile photovoltaïque et l'élément photovoltaïque ensemble pour former une tuile photovoltaïque non finie ; et à finir la tuile photovoltaïque non finie pour fournir la tuile photovoltaïque.
PCT/US2008/068373 2007-06-28 2008-06-26 Tuiles photovoltaïques et procédés de fabrication associés Ceased WO2009006213A2 (fr)

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EP08772049A EP2171769A2 (fr) 2007-06-28 2008-06-26 Tuiles photovoltaïques et procédés de fabrication associés
CA 2693049 CA2693049A1 (fr) 2007-06-28 2008-06-26 Tuiles photovoltaiques et procedes de fabrication associes

Applications Claiming Priority (4)

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US94690207P 2007-06-28 2007-06-28
US60/946,902 2007-06-28
US98621907P 2007-11-07 2007-11-07
US60/986,219 2007-11-07

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CA2693049A1 (fr) 2009-01-08
US20090000222A1 (en) 2009-01-01
WO2009006213A3 (fr) 2009-05-22
US20140326401A1 (en) 2014-11-06
US20120118493A1 (en) 2012-05-17

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