WO2009011165A1 - Appareil de transfert de carte mince, système de traitement/transfert de carte mince et procédé de transfert de carte mince - Google Patents

Appareil de transfert de carte mince, système de traitement/transfert de carte mince et procédé de transfert de carte mince Download PDF

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Publication number
WO2009011165A1
WO2009011165A1 PCT/JP2008/059237 JP2008059237W WO2009011165A1 WO 2009011165 A1 WO2009011165 A1 WO 2009011165A1 JP 2008059237 W JP2008059237 W JP 2008059237W WO 2009011165 A1 WO2009011165 A1 WO 2009011165A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin board
transfer
main body
axis direction
apparatus main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059237
Other languages
English (en)
Japanese (ja)
Inventor
Kensuke Hirata
Kai Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
IHI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007185237A external-priority patent/JP4985170B2/ja
Priority claimed from JP2007185240A external-priority patent/JP5076697B2/ja
Application filed by IHI Corp filed Critical IHI Corp
Priority to KR1020107001066A priority Critical patent/KR101228002B1/ko
Priority to CN2008800246767A priority patent/CN101743632B/zh
Publication of WO2009011165A1 publication Critical patent/WO2009011165A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un appareil de transfert de carte mince qui comporte un corps principal d'appareil (17) agencé sur une station de transfert entre une première station de traitement et une seconde station de traitement ; une unité flottante agencée sur le corps principal d'appareil pour faire flotter une carte mince ; et une pluralité de bras de transfert (35) s'étendant dans une direction selon l'axe des X sur le corps principal d'appareil (17) pour être mobiles dans la direction de l'axe des X à des intervalles dans une direction selon l'axe des Y. Sur un côté d'extrémité de chaque bras de transfert (35) dans la direction de l'axe des X, un premier patin d'aspiration (47) est agencé pour aspirer la surface arrière d'une carte mince (W) au moment du prélèvement de la carte mince (W) vers le côté du corps principal d'appareil (17) à partir de premiers appareils de traitement de carte mince (3A, 3B, 3C). Sur l'autre côté d'extrémité de chaque bras de transfert (35) dans la direction de l'axe des X, un second patin d'aspiration (49) est agencé pour aspirer la surface arrière de la carte mince (W) au moment du transfert de la carte mince (W) à des seconds appareils de traitement de carte mince (5A, 5B, 5C) à partir du corps principal d'appareil (17).
PCT/JP2008/059237 2007-07-17 2008-05-20 Appareil de transfert de carte mince, système de traitement/transfert de carte mince et procédé de transfert de carte mince Ceased WO2009011165A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020107001066A KR101228002B1 (ko) 2007-07-17 2008-05-20 박판 이송 장치, 박판 처리 이송 시스템 및 박판 이송 방법
CN2008800246767A CN101743632B (zh) 2007-07-17 2008-05-20 薄板输送装置、薄板处理输送系统及薄板输送方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-185237 2007-07-17
JP2007185237A JP4985170B2 (ja) 2007-07-17 2007-07-17 薄板移送装置、薄板処理移送システム、及び薄板移送方法
JP2007185240A JP5076697B2 (ja) 2007-07-17 2007-07-17 薄板移送装置、薄板処理移送システム、及び薄板移送方法
JP2007-185240 2007-07-17

Publications (1)

Publication Number Publication Date
WO2009011165A1 true WO2009011165A1 (fr) 2009-01-22

Family

ID=40259508

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059237 Ceased WO2009011165A1 (fr) 2007-07-17 2008-05-20 Appareil de transfert de carte mince, système de traitement/transfert de carte mince et procédé de transfert de carte mince

Country Status (4)

Country Link
KR (1) KR101228002B1 (fr)
CN (1) CN101743632B (fr)
TW (1) TW200913119A (fr)
WO (1) WO2009011165A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102718047A (zh) * 2012-05-29 2012-10-10 广州欧凯特种陶瓷有限公司 一种用于微晶玻璃的转向机构

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102172551B1 (ko) * 2010-02-17 2020-11-02 가부시키가이샤 니콘 반송 장치, 반송 방법, 노광 장치, 및 디바이스 제조 방법
KR102086798B1 (ko) * 2013-01-31 2020-03-09 세메스 주식회사 기판 처리 장치
JP6339341B2 (ja) * 2013-10-11 2018-06-06 平田機工株式会社 処理システム及び処理方法
CN106494889A (zh) * 2016-12-23 2017-03-15 合肥欣奕华智能机器有限公司 一种基板输送装置及其控制方法
US12134118B2 (en) * 2019-06-04 2024-11-05 Nippon Steel Corporation Workpiece transport unit, hot pressing equipment, workpiece transport method, and hot pressing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243670A (ja) * 2004-02-24 2005-09-08 Tokyo Electron Ltd 塗布膜形成装置
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2006036471A (ja) * 2004-07-28 2006-02-09 Shinko Electric Co Ltd 基板の受渡し方法、及びその装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2005243670A (ja) * 2004-02-24 2005-09-08 Tokyo Electron Ltd 塗布膜形成装置
JP2006036471A (ja) * 2004-07-28 2006-02-09 Shinko Electric Co Ltd 基板の受渡し方法、及びその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102718047A (zh) * 2012-05-29 2012-10-10 广州欧凯特种陶瓷有限公司 一种用于微晶玻璃的转向机构

Also Published As

Publication number Publication date
CN101743632A (zh) 2010-06-16
KR20100032424A (ko) 2010-03-25
CN101743632B (zh) 2012-02-15
TWI357630B (fr) 2012-02-01
KR101228002B1 (ko) 2013-02-01
TW200913119A (en) 2009-03-16

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