WO2009035094A1 - アンテナシート、トランスポンダ及び冊子体 - Google Patents

アンテナシート、トランスポンダ及び冊子体 Download PDF

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Publication number
WO2009035094A1
WO2009035094A1 PCT/JP2008/066570 JP2008066570W WO2009035094A1 WO 2009035094 A1 WO2009035094 A1 WO 2009035094A1 JP 2008066570 W JP2008066570 W JP 2008066570W WO 2009035094 A1 WO2009035094 A1 WO 2009035094A1
Authority
WO
WIPO (PCT)
Prior art keywords
transponder
antenna sheet
book form
substrate
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066570
Other languages
English (en)
French (fr)
Inventor
Junsuke Tanaka
Akihisa Yamamoto
Makoto Maehira
Yoshiyuki Mizuguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to PL08830775T priority Critical patent/PL2192530T3/pl
Priority to RU2010109058/08A priority patent/RU2471232C2/ru
Priority to AU2008297839A priority patent/AU2008297839B2/en
Priority to BRPI0817336-2A priority patent/BRPI0817336A2/pt
Priority to KR1020127006038A priority patent/KR101237107B1/ko
Priority to CN2008801124273A priority patent/CN101836225B/zh
Priority to MX2010002872A priority patent/MX2010002872A/es
Priority to ES08830775T priority patent/ES2415364T3/es
Priority to EP08830775A priority patent/EP2192530B1/en
Priority to JP2009532247A priority patent/JP5370154B2/ja
Priority to KR1020107006003A priority patent/KR101163300B1/ko
Priority to US12/733,666 priority patent/US8519905B2/en
Priority to CA2699552A priority patent/CA2699552C/en
Publication of WO2009035094A1 publication Critical patent/WO2009035094A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)

Abstract

　アンテナシートは、可撓性を有する基板と、ＩＣチップを備えた外部のＩＣモジュールの端子部に接続され基板上に設けられるアンテナコイルとを備え、基板には、ＩＣモジュールの少なくとも一部を収容する収容部が形成されている。
PCT/JP2008/066570 2007-09-14 2008-09-12 アンテナシート、トランスポンダ及び冊子体 Ceased WO2009035094A1 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
PL08830775T PL2192530T3 (pl) 2007-09-14 2008-09-12 Folia antenowa, transponder i książka
RU2010109058/08A RU2471232C2 (ru) 2007-09-14 2008-09-12 Антенный лист, ретранслятор и буклет
AU2008297839A AU2008297839B2 (en) 2007-09-14 2008-09-12 Antenna sheet, transponder and book form
BRPI0817336-2A BRPI0817336A2 (pt) 2007-09-14 2008-09-12 Chapa de antena, transponder e livreto
KR1020127006038A KR101237107B1 (ko) 2007-09-14 2008-09-12 안테나 시트, 트랜스폰더 및 책자체
CN2008801124273A CN101836225B (zh) 2007-09-14 2008-09-12 天线片、应答器及册子体
MX2010002872A MX2010002872A (es) 2007-09-14 2008-09-12 Hoja de antena, transpondedor y cuaderno.
ES08830775T ES2415364T3 (es) 2007-09-14 2008-09-12 Hoja de antena, transpondedor y libro
EP08830775A EP2192530B1 (en) 2007-09-14 2008-09-12 Antenna sheet, transponder and booklet
JP2009532247A JP5370154B2 (ja) 2007-09-14 2008-09-12 アンテナシート、トランスポンダ及び冊子体
KR1020107006003A KR101163300B1 (ko) 2007-09-14 2008-09-12 안테나 시트, 트랜스폰더 및 책자체
US12/733,666 US8519905B2 (en) 2007-09-14 2008-09-12 Antenna sheet, transponder, and booklet
CA2699552A CA2699552C (en) 2007-09-14 2008-09-12 Antenna sheet, transponder, and booklet

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-239982 2007-09-14
JP2007239982 2007-09-14
JP2008187007 2008-07-18
JP2008-187007 2008-07-18

Publications (1)

Publication Number Publication Date
WO2009035094A1 true WO2009035094A1 (ja) 2009-03-19

Family

ID=40452100

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066570 Ceased WO2009035094A1 (ja) 2007-09-14 2008-09-12 アンテナシート、トランスポンダ及び冊子体

Country Status (15)

Country Link
US (1) US8519905B2 (ja)
EP (2) EP2192530B1 (ja)
JP (1) JP5370154B2 (ja)
KR (2) KR101237107B1 (ja)
CN (1) CN101836225B (ja)
AU (1) AU2008297839B2 (ja)
BR (1) BRPI0817336A2 (ja)
CA (1) CA2699552C (ja)
ES (2) ES2563451T3 (ja)
MX (1) MX2010002872A (ja)
MY (1) MY159909A (ja)
PL (2) PL2602747T3 (ja)
RU (1) RU2471232C2 (ja)
TW (1) TWI379241B (ja)
WO (1) WO2009035094A1 (ja)

Cited By (14)

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Publication number Priority date Publication date Assignee Title
WO2010125818A1 (ja) * 2009-04-28 2010-11-04 凸版印刷株式会社 アンテナシート、非接触型ｉｃ付データキャリア及びアンテナシートの製造方法
JP2010257416A (ja) * 2009-04-28 2010-11-11 Toppan Printing Co Ltd 情報記録媒体、非接触型ｉｃ付データキャリア、および情報記録媒体の製造方法
WO2011024844A1 (ja) * 2009-08-26 2011-03-03 凸版印刷株式会社 非接触通信媒体
JP2011096055A (ja) * 2009-10-30 2011-05-12 Toppan Printing Co Ltd アンテナシート、トランスポンダ及び冊子体
JP2011113446A (ja) * 2009-11-30 2011-06-09 Toppan Printing Co Ltd 非接触型情報媒体と非接触型情報媒体付属冊子
JP2011237969A (ja) * 2010-05-10 2011-11-24 Toppan Printing Co Ltd 非接触型情報媒体及びこれを内蔵した冊子
JP2012037957A (ja) * 2010-08-04 2012-02-23 Nippon Signal Co Ltd:The リーダライタ及びドア開閉装置
JP2012073725A (ja) * 2010-09-28 2012-04-12 Toppan Printing Co Ltd 非接触通信媒体、冊子及びその製造方法
JP2012160108A (ja) * 2011-02-02 2012-08-23 Toppan Printing Co Ltd 非接触型情報記録媒体
JP2013025676A (ja) * 2011-07-25 2013-02-04 Toppan Printing Co Ltd 非接触通信媒体及びその製造方法
WO2013161781A1 (ja) * 2012-04-24 2013-10-31 凸版印刷株式会社 非接触型情報媒体及び非接触型情報媒体付属冊子
CN113346221A (zh) * 2017-03-30 2021-09-03 住友电气工业株式会社 无线模块
JP7095825B1 (ja) 2022-03-30 2022-07-05 豊田合成株式会社 車両用外装部品
JP2022536517A (ja) * 2019-06-13 2022-08-17 パスコン カンパニー リミテッド ワイヤレス充電用送受信アンテナと、その製造装置および製造方法

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CA2712602C (en) * 2008-02-22 2014-08-05 Toppan Printing Co., Ltd. Transponder and booklet
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EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
TWI453677B (zh) * 2011-12-01 2014-09-21 Mutual Pak Technology Co Ltd 射頻識別標籤與具有其之衣物
US8763914B2 (en) * 2012-01-17 2014-07-01 On Track Innovations Ltd. Decoupled contactless bi-directional systems and methods
US9093756B2 (en) * 2012-09-18 2015-07-28 Panasonic Intellectual Property Management Co., Ltd. Antenna, transmitter device, receiver device, three-dimensional integrated circuit, and contactless communication system
FR3001070B1 (fr) * 2013-01-17 2016-05-06 Inside Secure Systeme d'antenne pour microcircuit sans contact
US10909440B2 (en) * 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
FR3013152A1 (fr) * 2013-11-14 2015-05-15 Smart Packaging Solutions Antenne double face pour carte a puce
WO2015085064A1 (en) * 2013-12-05 2015-06-11 Uniqarta, Inc. Electronic device incorporated into a sheet
US11514288B2 (en) * 2014-08-10 2022-11-29 Amatech Group Limited Contactless metal card constructions
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
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US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
CN106909962A (zh) * 2017-02-08 2017-06-30 珠海恒冠宇科技有限公司 柔性接触式ic本证、读写机具及旧设备升级办法
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HUE060022T2 (hu) 2017-10-18 2023-01-28 Composecure Llc Fém, kerámia vagy kerámiabevonatos tranzakciókártya ablakkal vagy ablakmintával és opcionális háttévilágítással
JP7426693B2 (ja) * 2019-12-13 2024-02-02 日本パッケージ・システム株式会社 Ｒｆｉｄインレイ
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CN115424832B (zh) * 2022-09-05 2025-09-12 京东方科技集团股份有限公司 线圈结构及电子设备

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Cited By (31)

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Publication number Priority date Publication date Assignee Title
US9183488B2 (en) 2009-04-28 2015-11-10 Toppan Printing Co., Ltd. Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet
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TWI463737B (zh) * 2009-04-28 2014-12-01 Toppan Printing Co Ltd 天線薄片、附有非接觸型ｉｃ之資料載體及天線薄片之製造方法
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JP5370154B2 (ja) 2013-12-18
US20100277382A1 (en) 2010-11-04
AU2008297839B2 (en) 2011-10-27
PL2192530T3 (pl) 2013-08-30
JPWO2009035094A1 (ja) 2010-12-24
ES2563451T3 (es) 2016-03-15
ES2415364T3 (es) 2013-07-25
EP2192530A4 (en) 2010-10-27
CA2699552C (en) 2013-05-28
EP2602747A2 (en) 2013-06-12
TW200937302A (en) 2009-09-01
EP2602747A3 (en) 2014-07-30
TWI379241B (en) 2012-12-11
KR101237107B1 (ko) 2013-02-25
KR20120029484A (ko) 2012-03-26
EP2192530A1 (en) 2010-06-02
EP2192530B1 (en) 2013-03-27
RU2010109058A (ru) 2011-09-20
US8519905B2 (en) 2013-08-27
BRPI0817336A2 (pt) 2015-03-24
EP2602747B1 (en) 2016-01-13
KR101163300B1 (ko) 2012-07-05
MX2010002872A (es) 2010-04-09
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AU2008297839A1 (en) 2009-03-19
PL2602747T3 (pl) 2016-06-30
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