WO2009043642A1 - Boîtier de carte de circuits imprimés pouvant être refermé hermétiquement et carte de circuits imprimés à utiliser dans ce boîtier - Google Patents

Boîtier de carte de circuits imprimés pouvant être refermé hermétiquement et carte de circuits imprimés à utiliser dans ce boîtier Download PDF

Info

Publication number
WO2009043642A1
WO2009043642A1 PCT/EP2008/061173 EP2008061173W WO2009043642A1 WO 2009043642 A1 WO2009043642 A1 WO 2009043642A1 EP 2008061173 W EP2008061173 W EP 2008061173W WO 2009043642 A1 WO2009043642 A1 WO 2009043642A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
housing
substrate
clamping means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/061173
Other languages
German (de)
English (en)
Inventor
Richard Gueckel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2009043642A1 publication Critical patent/WO2009043642A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/1418—Card guides, e.g. grooves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Definitions

  • the invention relates to a sealable printed circuit board housing and a particularly suitable for use in this circuit board housing circuit board.
  • printed circuit board housings are formed in two parts and comprise a serving for receiving the circuit board, upwardly open flat lower housing part in which the circuit board is inserted during assembly from above, so that the broad side surfaces of the circuit board are aligned parallel to a bottom of the housing base, as well an upper housing part, which is mounted after inserting the circuit board in the lower housing part on the latter to close the housing and possibly while the circuit board for fixing in the housing between the lower housing part and the upper housing part.
  • Such printed circuit board housings are disclosed, for example, in DE 89 12 800 U1 and in DE 202 15 425 U1.
  • the object of the invention is to provide a printed circuit board housing which is easy to seal and a printed circuit board which is particularly suitable for use in this printed circuit board housing, with which the number and / or length of the gaskets required for sealing the printed circuit board housing can be reduced.
  • circuit board housing with the features of claim 1.
  • closable insertion opening of the circuit board receiving cavity in the interior of the housing on five sides, namely above and below the two broad side surfaces of the circuit board and along three side edges of the circuit board sealed and needs after insertion of the circuit board in the housing are sealed only around the insertion opening, which is considerably smaller compared to the insertion opening of the known printed circuit board housing.
  • the housing preferably has two mutually opposite parallel guide slots which serve to receive two opposite side edges of the circuit board and are preferably formed in the production of the housing in the side edges of the circuit board opposite boundary walls of the housing.
  • the circuit board is expedient when reaching a desired insertion or end position at the end of the insertion path within of the housing clamped.
  • This is preferably done with the aid of clamping means, which are arranged according to a further preferred embodiment of the invention to the side facing away from the insertion opening front ends of the guide slots, so that they only then engage with the circuit board after it has been almost completely inserted into the housing .
  • the clamping means are preferably formed integrally with the housing, so that they can be formed during the production of a housing made of die-cast aluminum or thermoplastic material along the guide slots.
  • a further preferred embodiment of the invention provides that the clamping means are formed by portions of the guide slots, which taper in the direction of insertion of the circuit board, so that they can be formed in the case of manufacture of the housing by pressure or injection molding in a tool with no moving parts ,
  • the clamping means are expediently designed so that, in cooperation with a spring element of the printed circuit board, it is also possible to compensate for the tolerances occurring in the production of the housing and the guide slots or in the production of the printed circuit board.
  • the spring element of the circuit board is formed integrally with the existing of an insulating resin or plastic material substrate of the circuit board and preferably consists of an elongated, along its longitudinal extent separated from the substrate elastically deformable spring tongue, one of them Front end is integrally connected to the substrate.
  • a spring element can be very easily and inexpensively by milling a slot between the spring element and the rest of the circuit board produced.
  • a spring element is expediently provided on both opposite side edges of the circuit board, which is pressed against a portion of a boundary of the associated guide slot, when the circuit board reaches the desired insertion position when inserted into the guide slots.
  • the housing consists of an electrically conductive material, such as in the case of a housing made of die-cast aluminum
  • the contact pressure of one or both spring elements against the portion of a boundary of the associated guide slot can also be exploited to a ground connection between a ground conductor of the printed Make circuit on the circuit board and the housing.
  • a part of the surface of the spring element or of the spring elements coming into contact with the clamping means when inserting the printed circuit board is preferably provided with an electrically conductive coating which is in contact with the ground conductor.
  • Figure 1 is a partially cut away schematic perspective view of a printed circuit board housing according to the invention without closure.
  • FIG. 2 shows a schematic perspective view of a printed circuit board according to the invention for use in the printed circuit board housing from FIG. 1;
  • FIG. 2 shows a schematic perspective view of a printed circuit board according to the invention for use in the printed circuit board housing from FIG. 1;
  • Fig. 3 is an enlarged detail view of the detail III in Fig. 1;
  • FIG. 4 shows a sectional view of another printed circuit board housing according to the invention without a closure
  • Fig. 5 is a schematic perspective view of a printed circuit board according to the invention for use in the printed circuit board housing of Fig. 4;
  • Fig. 6 is a sectional view corresponding to FIG. 4, but after the insertion of the circuit board in the circuit board housing.
  • circuit board housing 2 shown in the drawing for a multilayer printed circuit board 4 of an airbag control for an occupant restraint device of a motor vehicle are introduced together with the in the housing 2
  • Printed circuit board 4 and the housing 2 a tightly closing closure (not shown in the drawing) intended for mounting in the motor vehicle.
  • the printed circuit board housing 2 made of die-cast aluminum have a flat rectangular shape.
  • the housing 2 each have five boundary walls, namely two opposite rectangular or square broad side walls 6, 8, the corresponding broad side surfaces of the circuit board 4 are opposite, two elongated narrow side walls 10, 12, the two opposite side edges 14, 16 of the circuit board 4 opposite, as well as a closed end side wall 18 at one of the two end sides of the housing 2.
  • the other end face of the housing 2 is provided with a printed circuit board insertion opening 20 which extends substantially over the entire end face of the housing 2.
  • the design of the housing 2 for insertion of the printed circuit board 4 and the arrangement of the insertion opening 20 on an end face of the housing 2 has the advantage that the housing 2 can be made inexpensively as a die-cast aluminum or possibly also by injection molding of plastic and the circuit board. 4 apart from the front side with the insertion opening 20 encloses moisture-tight, and that the housing 2 at the last mentioned end after insertion of the circuit board 4 can be easily sealed from the front by the insertion opening 20 by means of a provided with a single circumferential seal closure cover (not shown) is closed.
  • Guide slots 22, 24 respectively slightly tapered in the vicinity of their remote from the insertion opening 20 front ends in the insertion direction, so that the side edges 14, 16 of the printed circuit board 4 are clamped there in the guide slots 22, 24.
  • a section of a flat upper boundary 28 of each guide slot 22, 24 is inclined downwards at a shallow inclination angle ⁇ to a flat lower boundary 30 of the guide slot 22, 24 , so that there is the clear height of the latter to the end wall 18 toward smaller.
  • the circuit board 4 is provided in the vicinity of its two side edges 14, 16 with two milled into the circuit board 4 slots 40 which are parallel to the side edges 14, 16 are aligned and are open at the front side edge 42 of the circuit board 4 in the insertion direction.
  • the printed circuit board 4 like conventional printed circuit boards, consists of a multilayer substrate S made of a fabric impregnated with epoxy resin or the like, and a plurality of copper layers arranged between the fabric layers and on the upper and lower sides of the substrate S, each forming a printed circuit.
  • the two spring tongues 44 slide in the guide slots 22, 24 to the rear, until they with the inclined with respect to the longitudinal axes of the guide slots 22, 24 sections 26 (Fig. 1) and 34 (Fig 4 and 6) come into contact and are deflected out of their rest position. While the spring tongues 44 are deflected downwards by the sections 26 of the housing 4 shown in FIGS. 1 and 3, out of the plane of the printed circuit board 4, they become in the case shown in FIG. 4 and 6 shown deflected from the sections 34 in the direction of the median plane 36 of the housing 2, as shown in Fig. 6, wherein in the latter case, the milled slots 40 are narrower in the direction of their open end.
  • the length and width of the spring tongues 44 is designed so that a tolerance compensation is possible without too high bending stresses are introduced into the circuit board 4.
  • the contact between the spring tongues 44 of the printed circuit board 4 and the flexible tongues 44 deflecting portions 26 and 34 of the boundaries 28 and 32 of the guide slots 22, 24 can be exploited to serve as a ground connection electrical connection between one or more printed circuits on the Circuit board 4 and the metallic circuit board housing 2 manufacture.
  • a part of the surface of the spring tongues 44 is provided with a coating 46 of tin or a tin alloy, which extends to an adjacent ground conductor of the printed circuit or circuits of the printed circuit board 4.
  • each spring tongue 44 The tinned portion 46 of the surface of each spring tongue 44 is arranged so that it is the adjacent, the spring tongue 44 deflecting portion 26 and 34 of the boundary of the guide slots 22, 24 and enters upon insertion of the circuit board 4 in the housing 2 with this in pressure contact. Accordingly, in the circuit board 4 in Fig. 2, the top of the two spring tongues 44 is coated with tin, as shown by hatching, while in the circuit board 4 shown in Fig. 5, the opposite outer sides of the spring tongues 44 are coated with tin. The attachment of the tin coating on both spring tongues 44 ensures redundancy of the ground connection between the printed circuit board 4 and the housing 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

La présente invention concerne un boîtier (2) de carte de circuits imprimés pouvant être refermé hermétiquement, à utiliser en particulier dans des véhicules à moteur ainsi qu'une carte de circuits imprimés (4) convenant particulièrement bien à l'utilisation dans ledit boîtier (2). Le boîtier (2) de carte de circuits imprimés présente : une ouverture d'insertion (20) refermable disposée sur le côté frontal du boîtier (2); deux fentes de guidage (22, 24) parallèles opposées entre elles et destinées à recevoir des bords latéraux (14, 16) opposés d'une carte de circuits imprimés (4); ainsi que des moyens de serrage (26; 34) destinés à enserrer la carte de circuits imprimés (4) dans les fentes de guidage (22, 24) alors que la carte de circuits imprimés (4) comprend un substrat (S) en matière plastique ou en résine et au moins un élément de rappel (44) élastiquement déformable fait de la matière plastique ou de la résine du substrat (S), relié de façon monobloc audit substrat (4), qui, pour enserrer la carte de circuits imprimés (4) dans le boîtier (2) et compenser les tolérances, coopère avec les moyens de serrage (26; 34).
PCT/EP2008/061173 2007-09-28 2008-08-27 Boîtier de carte de circuits imprimés pouvant être refermé hermétiquement et carte de circuits imprimés à utiliser dans ce boîtier Ceased WO2009043642A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710046913 DE102007046913A1 (de) 2007-09-28 2007-09-28 Abdichtbares Leiterplattengehäuse sowie Leiterplatte zur Verwendung in dem Leiterplattengehäuse
DE102007046913.8 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009043642A1 true WO2009043642A1 (fr) 2009-04-09

Family

ID=39930730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/061173 Ceased WO2009043642A1 (fr) 2007-09-28 2008-08-27 Boîtier de carte de circuits imprimés pouvant être refermé hermétiquement et carte de circuits imprimés à utiliser dans ce boîtier

Country Status (2)

Country Link
DE (1) DE102007046913A1 (fr)
WO (1) WO2009043642A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103379776A (zh) * 2012-04-26 2013-10-30 罗伯特·博世有限公司 用于定位电路板的装置
EP3416465A1 (fr) * 2017-06-16 2018-12-19 PSA Automobiles SA Ensemble comportant un boitier avant, un boitier arriere, et une carte electronique destinee a etre fixee entre le boitier avant et un boitier arriere
CN110572975A (zh) * 2018-06-05 2019-12-13 台达电子工业股份有限公司 具有定位内部电路基板功能的电源供应器及其制作方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102539B4 (de) 2014-02-26 2024-10-24 Magna Pt B.V. & Co. Kg Steueranordnung für einen Kraftfahrzeugantriebsstrang
CN104185400B (zh) * 2014-06-17 2018-09-18 株洲南车时代电气股份有限公司 车载印制电路板的固定装置及机载设备
DE102024106969A1 (de) * 2024-03-12 2025-09-18 Deutsche Bahn Aktiengesellschaft Baugruppenträger

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29816142U1 (de) * 1998-09-08 1999-04-29 Siemens AG, 80333 München Kontaktierung für eine als Leiterbahn auf einer Leiterplatte ausgebildeten Antenne
US6178094B1 (en) * 1998-07-27 2001-01-23 Mitsubishi Denki Kabushiki Kaisha Device for mounting boards
WO2004036972A1 (fr) * 2002-10-14 2004-04-29 Siemens Aktiengesellschaft Procede de montage d'un module de commutation, module de commutation et barre de pression
WO2005075253A1 (fr) * 2004-02-04 2005-08-18 Conti Temic Microelectronic Gmbh Boitier metallique

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8912800U1 (de) 1989-10-28 1991-02-21 Philips Patentverwaltung Gmbh, 2000 Hamburg Leiterplattengehäuse
DE20215425U1 (de) 2002-10-08 2004-02-19 Knobel Ag Lichttechnische Komponenten Gehäuse für eine Leiterplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6178094B1 (en) * 1998-07-27 2001-01-23 Mitsubishi Denki Kabushiki Kaisha Device for mounting boards
DE29816142U1 (de) * 1998-09-08 1999-04-29 Siemens AG, 80333 München Kontaktierung für eine als Leiterbahn auf einer Leiterplatte ausgebildeten Antenne
WO2004036972A1 (fr) * 2002-10-14 2004-04-29 Siemens Aktiengesellschaft Procede de montage d'un module de commutation, module de commutation et barre de pression
WO2005075253A1 (fr) * 2004-02-04 2005-08-18 Conti Temic Microelectronic Gmbh Boitier metallique

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103379776A (zh) * 2012-04-26 2013-10-30 罗伯特·博世有限公司 用于定位电路板的装置
KR20130121038A (ko) * 2012-04-26 2013-11-05 로베르트 보쉬 게엠베하 인쇄 회로 기판의 포지셔닝 장치
KR102051840B1 (ko) 2012-04-26 2019-12-04 로베르트 보쉬 게엠베하 인쇄 회로 기판의 포지셔닝 장치
EP3416465A1 (fr) * 2017-06-16 2018-12-19 PSA Automobiles SA Ensemble comportant un boitier avant, un boitier arriere, et une carte electronique destinee a etre fixee entre le boitier avant et un boitier arriere
FR3067903A1 (fr) * 2017-06-16 2018-12-21 Peugeot Citroen Automobiles Sa Ensemble comportant un boitier avant, un boitier arriere, et une carte electronique destinee a etre fixee entre le boitier avant et un boitier arriere
CN109140379A (zh) * 2017-06-16 2019-01-04 标致雪铁龙汽车股份有限公司 包括前壳体、后壳体以及用于固定在所述前壳体与所述后壳体之间的电子电路板的组件
CN109140379B (zh) * 2017-06-16 2022-02-22 标致雪铁龙汽车股份有限公司 包括前壳体、后壳体以及用于固定在所述前壳体与所述后壳体之间的电子电路板的组件
CN110572975A (zh) * 2018-06-05 2019-12-13 台达电子工业股份有限公司 具有定位内部电路基板功能的电源供应器及其制作方法
CN110572975B (zh) * 2018-06-05 2020-12-15 台达电子工业股份有限公司 具有定位内部电路基板功能的电源供应器及其制作方法

Also Published As

Publication number Publication date
DE102007046913A1 (de) 2009-04-09

Similar Documents

Publication Publication Date Title
DE3936906C2 (de) Gehäuse für Kfz-Elektronik
EP2351473B1 (fr) Appareil électronique avec un boîtier tronconique et son procédé de fabrication
DE102004025627A1 (de) Solarmodul mit Anschlusselement
DE4035526C2 (fr)
DE102011013449A1 (de) Baugruppe mit einem Träger, einem SMD-Bauteil und einem Stanzgitterteil
DE102016224653B4 (de) Leiterplattenverbund und Verfahren zu dessen Herstellung
WO2015078460A1 (fr) Ensemble électronique comprenant un boîtier constitué d'une partie en matière plastique et d'une partie métallique
DE102007046913A1 (de) Abdichtbares Leiterplattengehäuse sowie Leiterplatte zur Verwendung in dem Leiterplattengehäuse
DE10014108A1 (de) Verfahren und Vorrichtung zum Verbinden elektrischer Schaltkreise und Komponenten
DE102014206453B4 (de) Elektronische Steuereinheit
EP2036414A1 (fr) Dispositif de fixation et procédé de fixation d'un circuit imprimé dans in boîtier
DE102016123369B4 (de) Dachantenne mit direkter Kontaktierung einer Antennenfolie zu einer Leiterplatte
DE102015222177B4 (de) Elektronische Steuervorrichtung für ein Fahrzeug unter Verwendung einer Gussmassenschicht und Herstellungsverfahren dafür
DE102014217923A1 (de) Leiterplattenanordnung, insbesondere für Kfz-Getriebesteuergerät, mit zwei miteinander verbundenen Leiterplatten und einem Spanschutz
DE102008058287B4 (de) Elektronisches Modul mit einem Dichtelement und Verfahren zum Herstellen des Moduls
DE29713988U1 (de) Verbinder zum Verbinden einer Leiterplatte mit einem flexiblen Folienleiter
WO2009030406A2 (fr) Élément composite, notamment panneau de toit ouvrant
DE102007007224B4 (de) Leistungshalbleitermodul mit einem Gehäuse
DE102017217797B4 (de) Verfahren zur Verarbeitung einer Leiterplatte
DE102006052459A1 (de) Elektronikgehäuse mit Standardinterface
DE102007002193B4 (de) Mehrteiliges Kontaktierungsbauteil
DE102009054767A1 (de) Abschlusselement für ein Gehäuse
DE102024136812B3 (de) Gehäuseanordnung, Batterieanordnung und Fahrzeug
DE102006021560B4 (de) Umspritzter Flachbandleiter mit heißgeprägter Schaltung
DE8623956U1 (de) Abschirmgehäuse für Fernsehsignal-Abzweigverteiler

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08803240

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 08803240

Country of ref document: EP

Kind code of ref document: A1