WO2009044524A1 - 液体材料の塗布装置、塗布方法およびプログラム - Google Patents

液体材料の塗布装置、塗布方法およびプログラム Download PDF

Info

Publication number
WO2009044524A1
WO2009044524A1 PCT/JP2008/002705 JP2008002705W WO2009044524A1 WO 2009044524 A1 WO2009044524 A1 WO 2009044524A1 JP 2008002705 W JP2008002705 W JP 2008002705W WO 2009044524 A1 WO2009044524 A1 WO 2009044524A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid material
time
amount
sub
program
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002705
Other languages
English (en)
French (fr)
Inventor
Kazumasa Ikushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Priority to CN2008801184043A priority Critical patent/CN101878071B/zh
Priority to KR1020107009473A priority patent/KR101523294B1/ko
Priority to HK10111843.4A priority patent/HK1145474B/xx
Priority to EP08836355.1A priority patent/EP2202005B1/en
Publication of WO2009044524A1 publication Critical patent/WO2009044524A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet

Landscapes

  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

課題：液体材料の応答時間の遅れや経時的な粘度の変化などの問題を予め多数の制御データを準備しなくとも解消することができる液体材料の塗布装置、塗布方法およびプログラムの提供。 解決手段：ワークと、ワークと対向するスクリュー式ディスペンサを一定速度で相対移動させ、液体材料の吐出量を非一定で連続塗布するにあたり、塗布開始前に吐出量を変化させる際の応答遅れ時間を算出する応答時間算出工程を有する塗布方法であって、応答時間算出工程は、移動速度を一定とした塗布の途中でディスペンサに吐出量を変化させる信号を送信し、その時間を記憶する第１工程と、塗布された液体材料を計測することで吐出量の変化開始時間を算出し、その時間を記憶する第２工程と、第１工程で記憶した時間と第２工程で記憶した時間との差分値を吐出量を変化させる際の応答遅れ時間として記憶する第３工程と、を有する液体材料の塗布方法、塗布装置およびプログラム。
PCT/JP2008/002705 2007-10-01 2008-09-29 液体材料の塗布装置、塗布方法およびプログラム Ceased WO2009044524A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801184043A CN101878071B (zh) 2007-10-01 2008-09-29 液体材料的涂布装置以及涂布方法
KR1020107009473A KR101523294B1 (ko) 2007-10-01 2008-09-29 액체 재료의 도포 장치, 도포 방법 및 프로그램이 기억된 기억 매체
HK10111843.4A HK1145474B (en) 2007-10-01 2008-09-29 Liquid material applicator and application method
EP08836355.1A EP2202005B1 (en) 2007-10-01 2008-09-29 Liquid material applicator, application method, and program

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-258115 2007-10-01
JP2007258115A JP5154879B2 (ja) 2007-10-01 2007-10-01 液体材料の塗布装置、塗布方法およびプログラム

Publications (1)

Publication Number Publication Date
WO2009044524A1 true WO2009044524A1 (ja) 2009-04-09

Family

ID=40525956

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002705 Ceased WO2009044524A1 (ja) 2007-10-01 2008-09-29 液体材料の塗布装置、塗布方法およびプログラム

Country Status (7)

Country Link
EP (1) EP2202005B1 (ja)
JP (1) JP5154879B2 (ja)
KR (1) KR101523294B1 (ja)
CN (1) CN101878071B (ja)
MY (1) MY155532A (ja)
TW (1) TWI473662B (ja)
WO (1) WO2009044524A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120036974A (ko) * 2009-06-15 2012-04-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 도포 방법, 그 장치 및 그 프로그램을 기억한 기억 매체
JPWO2015083722A1 (ja) * 2013-12-06 2017-03-16 武蔵エンジニアリング株式会社 液体材料塗布装置
CN108480139A (zh) * 2018-05-29 2018-09-04 天津爱码信自动化技术有限公司 一种智能涂布刻印机

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5638768B2 (ja) 2009-04-24 2014-12-10 武蔵エンジニアリング株式会社 ノズル回転機構およびそれを備える塗布装置
JP5437752B2 (ja) * 2009-09-24 2014-03-12 富士機械製造株式会社 塗布装置および塗布状態補正方法
JP5434781B2 (ja) * 2010-04-28 2014-03-05 東京エレクトロン株式会社 処理液供給機構
JP6084376B2 (ja) * 2012-06-19 2017-02-22 武蔵エンジニアリング株式会社 液体材料吐出装置の洗浄装置および洗浄方法
KR102015793B1 (ko) 2012-11-13 2019-08-29 엘지디스플레이 주식회사 디스플레이 패널과 합착재 도포장치 및 합착재 도포방법
CN105050730B (zh) * 2013-03-14 2019-12-03 武藏工业株式会社 液体材料吐出装置、其涂布装置及涂布方法
JP6304617B2 (ja) * 2013-09-09 2018-04-04 兵神装備株式会社 流体塗布システムおよび流体塗布方法
JP6467132B2 (ja) * 2013-12-27 2019-02-06 蛇の目ミシン工業株式会社 ロボット、ロボットの制御方法、およびロボットの制御プログラム
CN106179887A (zh) * 2015-05-08 2016-12-07 铕晟事业股份有限公司 胶体涂布方法
US9789497B1 (en) 2016-06-20 2017-10-17 Nordson Corporation Systems and methods for applying a liquid coating to a substrate
CN109574511A (zh) * 2017-09-29 2019-04-05 中外炉工业株式会社 基板的涂布方法以及基板的涂布装置
JP6787294B2 (ja) 2017-10-31 2020-11-18 セイコーエプソン株式会社 ロボットシステム、制御方法、及びロボット
EP3706920B1 (en) * 2017-11-10 2026-04-29 Nordson Corporation Systems and methods for enhanced coating dispensing controls
DE102019212373A1 (de) * 2019-08-19 2021-02-25 Rampf Holding Gmbh & Co. Kg Dosieranlage
CN115461159B (zh) * 2020-05-08 2024-06-18 发那科株式会社 模拟装置
CN113318919B (zh) * 2021-06-30 2022-05-10 成都飞机工业（集团）有限责任公司 一种机器人在飞机部件密封胶自动涂覆工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH078872A (ja) * 1993-06-29 1995-01-13 Matsushita Electric Ind Co Ltd 塗布剤の塗布装置
JPH1110054A (ja) * 1997-06-19 1999-01-19 Dainippon Screen Mfg Co Ltd 塗布液塗布装置
JP2001126975A (ja) * 1999-10-26 2001-05-11 Dainippon Screen Mfg Co Ltd 基板塗布装置
WO2006118088A1 (ja) * 2005-04-26 2006-11-09 Shibaura Mechatronics Corporation ペースト塗布装置及びペースト塗布方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05231546A (ja) * 1991-03-07 1993-09-07 Fanuc Ltd 産業用ロボットによるシーリングにおけるシール材流量制御方法
JP2001009339A (ja) * 1999-06-28 2001-01-16 Mitsubishi Electric Corp 液体塗布装置とその制御方法
US7048964B2 (en) * 2000-12-08 2006-05-23 Ged Integrated Solutions, Inc. Controlled dispensing of material
JP4216034B2 (ja) * 2002-10-07 2009-01-28 芝浦メカトロニクス株式会社 液状物質滴下装置および方法
JP2005000910A (ja) * 2003-05-19 2005-01-06 Matsushita Electric Ind Co Ltd 流体塗布装置及び流体塗布方法並びにプラズマディスプレイパネル
JP2006167534A (ja) * 2004-12-14 2006-06-29 Seiko Epson Corp 液滴量測定方法、液滴吐出ヘッドの駆動信号適正化方法および液滴吐出装置
CN100482447C (zh) * 2005-02-21 2009-04-29 江南模塑科技股份有限公司 汽车安全扰流板中空吹塑工艺技术及其制品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH078872A (ja) * 1993-06-29 1995-01-13 Matsushita Electric Ind Co Ltd 塗布剤の塗布装置
JPH1110054A (ja) * 1997-06-19 1999-01-19 Dainippon Screen Mfg Co Ltd 塗布液塗布装置
JP2001126975A (ja) * 1999-10-26 2001-05-11 Dainippon Screen Mfg Co Ltd 基板塗布装置
WO2006118088A1 (ja) * 2005-04-26 2006-11-09 Shibaura Mechatronics Corporation ペースト塗布装置及びペースト塗布方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120036974A (ko) * 2009-06-15 2012-04-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 도포 방법, 그 장치 및 그 프로그램을 기억한 기억 매체
EP2444164A4 (en) * 2009-06-15 2013-10-23 Musashi Engineering Inc PROCESS FOR APPLYING LIQUID MATERIAL AND DEVICE AND PROGRAM THEREFOR
US8809075B2 (en) 2009-06-15 2014-08-19 Musashi Engineering, Inc. Method for applying liquid material utilizing capillary phenomenon
JP5632838B2 (ja) * 2009-06-15 2014-11-26 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
KR101677487B1 (ko) 2009-06-15 2016-11-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 도포 방법, 그 장치 및 그 프로그램이 기억된 기억 매체
JPWO2015083722A1 (ja) * 2013-12-06 2017-03-16 武蔵エンジニアリング株式会社 液体材料塗布装置
CN108480139A (zh) * 2018-05-29 2018-09-04 天津爱码信自动化技术有限公司 一种智能涂布刻印机
CN108480139B (zh) * 2018-05-29 2024-04-05 天津爱码信自动化技术有限公司 一种智能涂布刻印机

Also Published As

Publication number Publication date
TW200936250A (en) 2009-09-01
KR20100072324A (ko) 2010-06-30
JP2009082859A (ja) 2009-04-23
TWI473662B (zh) 2015-02-21
EP2202005B1 (en) 2020-01-01
MY155532A (en) 2015-10-30
CN101878071A (zh) 2010-11-03
HK1145474A1 (en) 2011-04-21
EP2202005A1 (en) 2010-06-30
KR101523294B1 (ko) 2015-05-27
JP5154879B2 (ja) 2013-02-27
EP2202005A4 (en) 2018-03-07
CN101878071B (zh) 2012-10-10

Similar Documents

Publication Publication Date Title
WO2009044524A1 (ja) 液体材料の塗布装置、塗布方法およびプログラム
WO2008024596A3 (en) Elongate medical device and method of coating the same
WO2008044617A3 (en) Method of manufacturing liquid crystal display device
EP3521183A3 (en) Dynamic adjustment of wrap force parameter responsive to monitored wrap force and/or film break reduction
WO2012052449A3 (en) Handheld applicator with gun valve containers
WO2010048501A3 (en) Material dispensing system and method for making same
IL172245A0 (en) Dual-ended applicator for dispensing two fluids, in particular glue components
AU2009204214A8 (en) Electronic control of metered film dispensing in a wrapping apparatus
MX2012003594A (es) Sistema de dispensacion de fluidos.
AU2013201817B2 (en) A flow restrictor
CN102950812B (zh) 一种上胶装置
WO2010040067A3 (en) Case for cosmetics or other products
WO2009019862A1 (ja) 画像生成装置、画像表示装置、画像生成方法、画像表示方法、画像生成プログラム、および画像表示プログラム
HK1243034A1 (zh) 分配流体的系统和方法
EP4025128A4 (en) ANALYTE SENSOR APPLICATOR
WO2010086804A3 (en) Vaginal-health products comprising colored applicators
CA2513643A1 (en) Centrifugal applicator
EP4043179A4 (en) DEVICE FOR DETERMINING THE EXTENT OF OPERATION, MOLDING APPARATUS SYSTEM, MOLDING MACHINE, COMPUTER PROGRAM, METHOD FOR DETERMINING THE EXTENT OF OPERATION AND STATUS DISPLAY DEVICE
WO2019094282A8 (en) Systems and methods for enhanced coating dispensing controls
EP4066990A4 (en) DISPLAY DEVICE, MACHINE TOOL, AND LIQUID EJECTION METHOD
WO2014039666A3 (en) Dynamic application system priming
WO2010031502A8 (en) Fat-based confectionery material and process for production thereof
CA2502925A1 (en) Fluid dispenser calibration system and method
WO2005070561A3 (en) Method and apparatus for controlling coating width
WO2009046240A3 (en) Applicating machine

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880118404.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08836355

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008836355

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20107009473

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: PI 2010001455

Country of ref document: MY