WO2009054108A1 - 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法 - Google Patents

加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法 Download PDF

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Publication number
WO2009054108A1
WO2009054108A1 PCT/JP2008/002921 JP2008002921W WO2009054108A1 WO 2009054108 A1 WO2009054108 A1 WO 2009054108A1 JP 2008002921 W JP2008002921 W JP 2008002921W WO 2009054108 A1 WO2009054108 A1 WO 2009054108A1
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WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
thermal expansion
adhesive tape
expansion type
acrylic pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002921
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English (en)
French (fr)
Inventor
Eiji Yamanaka
Tooru Nakashima
Greet Bossaert
Bart Forier
Walter Eevers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Belgium NV
Nitto Denko Corp
Original Assignee
Nitto Europe NV
Nitto Denko Corp
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Publication date
Application filed by Nitto Europe NV, Nitto Denko Corp filed Critical Nitto Europe NV
Priority to CN200880112806A priority Critical patent/CN101835862A/zh
Priority to EP08841435A priority patent/EP2204425B1/en
Priority to US12/734,231 priority patent/US20120034407A1/en
Publication of WO2009054108A1 publication Critical patent/WO2009054108A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1405—Capsule or particulate matter containing [e.g., sphere, flake, microballoon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　被着体の素材に限定されることなく、高い常態接着力を維持しつつ、加熱により容易に分離・解体できる加熱発泡型再剥離性アクリル系粘着テープを提供する。 　本発明の加熱発泡型再剥離性アクリル系粘着テープ又はシートは、少なくとも熱発泡剤含有粘着剤層、剥離性フィルム層、微粒子含有粘弾性基材から構成されており、熱発泡剤含有粘着剤層の少なくとも一方の面に、少なくとも剥離性フィルム層と微粒子含有粘弾性基材とを含む積層構造が、熱発泡剤含有粘着剤層と剥離性フィルム層とが直接又は他の層を介して接する形態で設けられている構造を有することを特徴とする。
PCT/JP2008/002921 2007-10-22 2008-10-15 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法 Ceased WO2009054108A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880112806A CN101835862A (zh) 2007-10-22 2008-10-15 加热发泡型再剥离性丙烯酸类粘合带或粘合片及剥离方法
EP08841435A EP2204425B1 (en) 2007-10-22 2008-10-15 Thermal expansion type removable acrylic pressure-sensitive adhesive tape or sheet and method of removal
US12/734,231 US20120034407A1 (en) 2007-10-22 2008-10-15 Heat expandable removable acrylic pressure-sensitive adhesive tape or sheet, and method of removing the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-273915 2007-10-22
JP2007273915 2007-10-22
JP2008-162476 2008-06-20
JP2008162476A JP5171425B2 (ja) 2007-10-22 2008-06-20 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法

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WO2009054108A1 true WO2009054108A1 (ja) 2009-04-30

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PCT/JP2008/002921 Ceased WO2009054108A1 (ja) 2007-10-22 2008-10-15 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法

Country Status (5)

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US (1) US20120034407A1 (ja)
EP (1) EP2204425B1 (ja)
JP (1) JP5171425B2 (ja)
CN (1) CN101835862A (ja)
WO (1) WO2009054108A1 (ja)

Cited By (7)

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WO2011048701A1 (en) * 2009-10-20 2011-04-28 Nitto Europe Nv Heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet, and method of removing the same
US20130029147A1 (en) * 2011-07-28 2013-01-31 Nitto Denko Corporation Pressure-sensitive adhesive sheet
EP2436741A4 (en) * 2009-05-26 2014-01-15 Mitsubishi Plastics Inc REDUCOLLABLE ADHESIVE MATERIAL
CN103963417A (zh) * 2014-04-18 2014-08-06 中国吉林森林工业集团有限责任公司 一种抗菌复合百叶窗叶片的制备方法
JP2016026239A (ja) * 2010-04-13 2016-02-12 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 硬化性組成物、複合材製造のための前記組成物の使用プロセス、ならびに優れた表面仕上げおよび高い繊維固着を有する複合材の製造プロセス
WO2017098649A1 (ja) * 2015-12-10 2017-06-15 株式会社寺岡製作所 保持用粘着テープ
JP2019162881A (ja) * 2011-12-29 2019-09-26 スリーエム イノベイティブ プロパティズ カンパニー 低温振動減衰感圧性接着剤及び構造物

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CN102405269A (zh) * 2009-04-21 2012-04-04 日东电工株式会社 加热膨胀型再剥离性丙烯酸类粘合带或粘合片
KR101266195B1 (ko) 2009-09-16 2013-05-21 주식회사 엘지화학 양면 점착 테이프, 그 제조 방법 및 터치 패널
JP2012102301A (ja) * 2010-11-13 2012-05-31 Nitto Denko Corp 気泡含有熱伝導性樹脂組成物層およびその製造方法、それを用いた感圧性接着テープ又はシート
FR2970197B1 (fr) * 2011-01-11 2013-12-20 Snecma Procede de desolidarisation/solidarisation par induction d'une piece mecanique magnetique collee a une piece mecanique.
DE102011117831A1 (de) * 2011-02-15 2012-08-16 Huhtamaki Forchheim Zweigniederlassung Der Huhtamaki Deutschland Gmbh & Co. Kg Trennfolie mit rauher Oberflächenstruktur
JP2013076031A (ja) * 2011-09-30 2013-04-25 Sekisui Chem Co Ltd 接着剥離シート
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US8863809B2 (en) * 2011-11-14 2014-10-21 The Boeing Company Methods and systems for recycling of laminated materials
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TWI671141B (zh) * 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
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KR102069936B1 (ko) 2016-04-29 2020-01-23 주식회사 엘지화학 발열체
KR102069937B1 (ko) 2016-04-29 2020-01-23 주식회사 엘지화학 발열체의 제조방법
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
JP7466464B2 (ja) * 2018-06-01 2024-04-12 スリーエム イノベイティブ プロパティズ カンパニー アクリル－エポキシ接着剤組成物
CN111333768B (zh) * 2018-12-18 2022-03-29 浙江海虹控股集团有限公司 一种丙烯酸树脂热膨胀发泡微球及其制备方法
EP3951910A4 (en) 2019-03-29 2022-05-25 SANYO Electric Co., Ltd. POWER SUPPLY DEVICE, ELECTRIC VEHICLE AND ENERGY STORAGE DEVICE THEREOF, FIXING MEMBER FOR A POWER SUPPLY DEVICE, METHOD OF MANUFACTURING A POWER SUPPLY DEVICE AND METHOD OF MANUFACTURING A MOUNTING MEMBER FOR A POWER SUPPLY DEVICE
WO2020222730A1 (en) 2019-04-29 2020-11-05 Hewlett-Packard Development Company, L.P. Three-dimensional printing
EP3739665A1 (en) 2019-05-14 2020-11-18 Nitto Belgium NV Safety valve with debonding function
KR102197833B1 (ko) * 2019-08-30 2021-01-05 울산과학기술원 열을 이용한 형상기억 접착 구조물
JP7722357B2 (ja) * 2020-03-25 2025-08-13 大日本印刷株式会社 発泡性接着シートおよび物品の製造方法
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CN112787033A (zh) * 2021-01-29 2021-05-11 东莞新能德科技有限公司 热减粘保护膜及应用其的电子装置
CN113046010A (zh) * 2021-03-19 2021-06-29 立铠精密科技(盐城)有限公司 一种保护胶体及其使用方法
JP2024511830A (ja) * 2021-03-30 2024-03-15 スリーエム イノベイティブ プロパティズ カンパニー 接着剤前駆体組成物及びそれから得られる熱膨張性仮接着剤
DE102022121016B4 (de) * 2022-08-19 2025-08-21 Tesa Se Laminat, Verfahren und Verwendung
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CN121495474A (zh) * 2024-08-07 2026-02-10 德莎欧洲股份公司 可电热分离的背衬、胶带及其用途、胶带的分离方法和热激活方法
EP4715016A1 (de) * 2024-09-20 2026-03-25 Sika Technology AG Härtbare (meth)acrylat zusammensetzung und ablösbarer klebeverbund
CN119191224B (zh) * 2024-11-27 2025-05-02 烟台齐新半导体技术研究院有限公司 一种基于阴影掩膜工艺的半导体预制件及预制件制备方法

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2016026239A (ja) * 2010-04-13 2016-02-12 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 硬化性組成物、複合材製造のための前記組成物の使用プロセス、ならびに優れた表面仕上げおよび高い繊維固着を有する複合材の製造プロセス
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JPWO2017098649A1 (ja) * 2015-12-10 2018-09-27 株式会社寺岡製作所 保持用粘着テープ

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