WO2009058096A1 - Dispositif de support pour pièce de travail - Google Patents

Dispositif de support pour pièce de travail Download PDF

Info

Publication number
WO2009058096A1
WO2009058096A1 PCT/SG2008/000316 SG2008000316W WO2009058096A1 WO 2009058096 A1 WO2009058096 A1 WO 2009058096A1 SG 2008000316 W SG2008000316 W SG 2008000316W WO 2009058096 A1 WO2009058096 A1 WO 2009058096A1
Authority
WO
WIPO (PCT)
Prior art keywords
clamp
work piece
base
supporting surface
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SG2008/000316
Other languages
English (en)
Inventor
Siew Heng Yong
Choon Fei Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Manufacturing Integration Technology Ltd
Original Assignee
Manufacturing Integration Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manufacturing Integration Technology Ltd filed Critical Manufacturing Integration Technology Ltd
Priority to CN2008801136675A priority Critical patent/CN101842889B/zh
Publication of WO2009058096A1 publication Critical patent/WO2009058096A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present invention generally relates to semiconductor manufacturing, and in particular to a device for supporting a semiconductor wafer, especially a warped one, in a substantially planar form during backside marking process.
  • the chuck system comprises several separated positioners.
  • Each positioner has a support base, a horizontal and a vertical linear drive for finely positioning the support base, and a rotatory clamping mechanism for holding the wafer on the support base.
  • the configuration of this system poses a big challenge to synchronize and coordinate operation of individual positioners in order to achieve a sufficient level of planarity of the supported wafer. Any imprecise collective movement of the rotatory clamping mechanisms may cause a shifting movement of the wafer, which ruins the precision backside marking. And any error in the relative positions of the positioners, or uneven force exerted on different parts of the wafer by individual clamping mechanisms may even worsen deformation of the wafer.
  • the present invention provides a device for supporting a work piece, which comprises a continuous base having a planar supporting surface for holding the work piece disposed thereon, and an opening through the base for partially exposing the back surface of the work piece; and a continuous clamp having a planar clamping surface parallel to the supporting surface for clamping the work piece thereover.
  • the base further comprises at least one vacuum slot which has a first opening to the supporting surface, and a second opening in communication with a vacuum source, wherein a negative pressure is generated in the at least one vacuum slot so as to stabilize the contact between the work piece and the supporting surface, when the vacuum source is switched on.
  • the clamp has a plurality of extended clamp jaws, each having a planar clamping surface; and wherein the clamping surfaces fall within a common planar plane.
  • a device which further comprises at least one mechanical drive for adjusting the relative distance between the clamping surface and the supporting surface.
  • a device which further comprises at least one ejector coupled to the clamp for ejecting the work piece from the clamping surface when the clamp is undamped and moved away from the supporting surface.
  • the base further has a recess in the supporting surface for allowing an end effector to pass through so as to load/unload the work piece onto/from the device without collision with any parts of the device.
  • FIG. 1 shows a perspective view of a supporting device in accordance with one embodiment of the present invention.
  • FIG. 2 shows a side view of the supporting device in FIG. 1.
  • FIG. 3 shows an exploded view of the supporting device in FIG. 1.
  • FIG. 4A and 4B show partial cross section views of the supporting device when the clamp is in a standby and clamp position respectively.
  • FIG. 5 is a partial enlarged view of FIG. 4B.
  • the present invention may be understood more readily by reference to the following detailed description of certain embodiments of the invention.
  • the supporting device 100 comprises a base 1 for supporting a wafer 101 (not shown in FIG. 1) disposed thereon; a clamp 2 for clamping the wafer 101 over the base 1 so as to reduce bending of the wafer 101; two mechanical drives 3a and 3b for cooperatively adjusting the vertical distance between the clamp 2 and the base 1; and four ejectors 4a, 4b, 4c, 4d for facilitating the release of the wafer 101 from the clamp 2.
  • FIG. 3 there is provided an exploded view of the supporting device 100 in FIG. 1, illustrating assembly of the components in detail.
  • the base 1 has a planar supporting surface 11 with a through opening 12 therein.
  • the opening 12 is so dimensioned that in operation, the wafer 101 (not shown in FIG. 3) disposed on the base 1 has sufficient contact with the supporting surface 11 to secure a firm support, while the marking region on backside of the wafer 101 is fully exposed to a marking apparatus located beneath the opening 12.
  • wafers are often transferred by an end effector of a robot.
  • a recess 13 is carved on one side of the supporting surface 11, for allowing the end effector to go through, so that the wafer 101 transferred by the end effector can be properly positioned above and gently disposed onto the supporting surface 11.
  • the outer contour of the base 1 is a symmetric octagon, while the contour of the opening 12 is a circle that is coaxial with the octagon.
  • the configuration of the base 1 is not so limited.
  • the outer contour of the base 1 and the opening 12 are in a rectangular shape.
  • the outer contour of the base 1 and the opening 12 are both in a circular shape.
  • the base 1 further has four vacuum slots 14a, 14b, 14c and 14d (not shown in FIG. 3) cut into the supporting surface 11.
  • the details of the vacuum slots 14 are illustrated in FIG. 4A and 4B that provide partial cross section views of the supporting device 100.
  • Each vacuum slot 14 extends vertically into the base 1, with a first opening 141 to the supporting surface 11 and the second opening 142 in communication with a first end 141 of a horizontal air passage 14 in the base 1.
  • the air passage 15 has a second end 152 at the side of the base 1, blocked by a plug screw 16.
  • An aperture 17 is drilled into the base 1 from the lower side of the base 1, with a first opening 171 connected to the air passage 15, and a second opening 172 operable to be coupled to a vacuum source.
  • the vacuum source connected to the aperture 17 is actuated. Sequentially, air is removed from the air passage 15 and the vacuum slot 14; a negative pressure is generated therein, which causes the wafer 101 to stick firmly to the supporting surface 11.
  • the four vacuum slots 14 are in an arch shape and evenly spaced on the inner edge of the base 1.
  • the number, size, shape and location of the vacuum slots 14 are not so limited.
  • the base 1 has three arch-shaped vacuum slots 14 evenly spaced.
  • a plurality of vacuum slots 14 is spaced on the base 1, each being cut in a straight line.
  • the clamp 2 having an outer dimension larger than that of the opening 12, is co-axially mounted above the base 1.
  • the clamp 2 has four protruded clamp jaws 21a, 21b, 21c and 2 Id evenly spaced, each defining an individual clamping surface 22 (not shown in FIG. 1).
  • the four clamp jaws 21 are so configured that the corresponding clamping surfaces 22 fall in a common planar plane parallel to the supporting surface 11 of the base 1.
  • the clamp 2 is a circular ring.
  • the shape of the clamp is not so limited.
  • the clamp 2 is a rectangular ring.
  • the clamp jaws 21 are configured to be in alignment with the vacuum slots 14. In operation, when the clamp 2 gradually approaches the wafer 101 disposed on the base 1, the clamps jaws 21 eventually contact and impose clamping force on the wafer 101, flattening the bent edge portion of the wafer 101 over the first opening 141 of the vacuum slot 14, thereby forming a closed space for generating negative pressure therein.
  • the configuration of the clamp jaws are not so limited. An exact match with the vacuum slots is not required.
  • each mechanical drive comprises two guide shafts 31, two guide bushes 32, two spacer blocks 33, a carrier plate 34 and a driving means 35.
  • Each guide shafts 31 is secured to the base 1 with a screw, and having one guide bush 32 coupled thereto.
  • the driving means 35 is operable to actuate the two guide bushes 32 to simultaneously slide along the coupled guide shafts 31.
  • the carrier plate 34 is connected to the clamp 2 via three connectors 341, and to the two guide bushes 32 with two spacer blocks 33 disposed in between, for transmitting the movement of the guide bushes 32 to the clamp 2.
  • the two mechanical drives 3 move the clamp 2 vertically between a pre-determined standby position and a pre-determined clamp position with respect to the base 1.
  • FIG. 4 A and 4B there are provided partial cross sectional views of the supporting device at the pre-determined standby position and clamp position respectively.
  • the clamp 2 is away from the base 1, creating a space in between which allows the end effector to position the wafer 101 therein without colliding any part of the wafer 101 with either the clamp 2 or the base 1.
  • the end effector conducts fine positional adjustment in the X, Y directions, so that the wafer 101 is coaxial with the base 1.
  • the end effector is lowered into the recess 13 until the edge of the wafer 101 gets in contact with the supporting surface 11.
  • the two mechanical drives 3 lower the clamp 2 to the clamp position.
  • the clamping surface 22 is in contact with the wafer 101, imposing an appropriate pressure thereon to flatten warped edge without causing damage to the wafer surface.
  • the end effect is further lowered towards the bottom of the recess 13 away from the wafer 101, and then withdrawn therefrom.
  • the driving means 35 is a two positional, open loop system such as pneumatic cylinder. In another embodiment, the driving means 35 is a multi-positional, closed loop system such as a linear stepper or servo and guide.
  • the supporting device 100 has three mechanical drives 3 evenly distributed on the base 1.
  • four ejectors 4 are coupled to the clamp 2 for ejecting the wafer 101 from the clamping surfaces 22 after unclamping.
  • FIG. 3, 4A and 4B there are provided details of the ejectors 4.
  • Each ejector 4 comprises a support 41, an ejector pin 42, a stopper 43, and a biasing element 44.
  • the support 41 is fixed to the clamp 2, and having a through hole 411 in the top surface 413, which is vertically aligned with a through hole 23 in the clamp 2 for receiving the ejector pin 42.
  • the ejector pin 42 disposed therein is operable to move up and down with respect to the clamp 2.
  • the stopper 43 has one end coupled to the ejector pin 41 and the other end located in a vertical slot 412 on the side of the support 41.
  • the width of the vertical slot 412 restrains the horizontal movement of the stopper 43, thereby minimizing the rotation of the ejector pin 42 about the longitudinal axis thereof.
  • the length of the vertical slot 412 defines the vertical traveling range of the stopper 43, which in turn determines the vertical movement range of the ejector pin 42.
  • the biasing element 44 is disposed between the stopper 43 and the top surface 413 of the support 43, for biasing the stopper 43 towards the lower end of the slot 412, which in turn defines a default position of the ejector pin 42 accordingly. At the default position as shown in FIG. 4 A, the lower end
  • the end effector was moved through the recess 13 in order to be located beneath the wafer 101, and moved upward to come in contact with the wafer 101. Then the clamp 2 is undamped and moved upwards away from the clamp position to the standby position. There is a delay in the corresponding movement of the ejector pin 42 in the same direction, due to the biasing force exerted thereon.
  • the protruding portion 422 keeps in touch with the base 1, until the pre-determined distance to the clamping surface 22 is recovered. As a result, the wafer 101 that adheres to the clamping surface 22 can only travel upwards as far as the step height, before being ejected by the recess portion 423.
  • the biasing means 44 is a compression spring. In another embodiment, the biasing means 44 is a pneumatic pin.
  • each ejector 4 is mounted at the center of one clamp jaw 21. However, it is to be understood by a person skilled in the art that the number and location of the ejectors 4 are not so limited. For example, in one embodiment, two ejectors 4 are coupled to two ends of each clamp jaw 21. [0038] While the present invention has been described with reference to particular embodiments, it will be understood that the embodiments are illustrative and that the invention scope is not so limited.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de support pour pièce de travail se présentant sous une forme sensiblement plane, destiné en particulier à supporter une tranche de semi-conducteur pendant un processus de marquage en face arrière. Le dispositif est capable de prendre en charge des tranches gauchies et non gauchies, et est compatible avec diverses techniques existantes de transfert et de traitement des tranches. Le dispositif comprend une embase continue et une bride continue destinées à maintenir la pièce de travail entre celles-ci. L'embase présente une surface d'appui plane dans laquelle est pratiquée une ouverture débouchante. La bride est munie d'une pluralité de mâchoires de bride dotées de surfaces individuelles de bridage se situant dans un plan commun. Au moins un éjecteur est couplé à la bride afin de faciliter le dégagement de la pièce de travail des surfaces de bridage.
PCT/SG2008/000316 2007-10-29 2008-08-26 Dispositif de support pour pièce de travail Ceased WO2009058096A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801136675A CN101842889B (zh) 2007-10-29 2008-08-26 用于支撑工件的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200717274-5A SG152096A1 (en) 2007-10-29 2007-10-29 Device for supporting workpiece
SG200717274-5 2007-10-29

Publications (1)

Publication Number Publication Date
WO2009058096A1 true WO2009058096A1 (fr) 2009-05-07

Family

ID=40591304

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2008/000316 Ceased WO2009058096A1 (fr) 2007-10-29 2008-08-26 Dispositif de support pour pièce de travail

Country Status (4)

Country Link
CN (1) CN101842889B (fr)
SG (1) SG152096A1 (fr)
TW (1) TWI453858B (fr)
WO (1) WO2009058096A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104905487A (zh) * 2015-06-16 2015-09-16 浙江戈美其鞋业有限公司 一种皮鞋前帮结帮夹钳的移动机构
CN112846521A (zh) * 2020-12-31 2021-05-28 大族激光科技产业集团股份有限公司 一种夹具及激光标记系统

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023865B (zh) * 2015-07-16 2017-10-10 北京工业大学 一种磨削晶圆表面腐蚀装置
CN116354096B (zh) * 2021-12-28 2025-04-15 盟立自动化股份有限公司 夹爪装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161785A (ja) * 1993-12-09 1995-06-23 Sumitomo Electric Ind Ltd 半導体ウェハの固定治具
JP2003158169A (ja) * 2001-11-21 2003-05-30 Tomuko:Kk 基板真空吸着ハンド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW580745B (en) * 1997-12-15 2004-03-21 Ebara Corp Electroplating jig for semiconductor wafers and apparatus for electroplating wafers
TW471093B (en) * 1999-09-16 2002-01-01 United Microelectronics Corp Wafer clamp device for preventing plasma etching in a semiconductor manufacturing process
TW461015B (en) * 2000-11-17 2001-10-21 Unimicron Technology Corp Wafer plating clip
TWI266398B (en) * 2005-09-20 2006-11-11 Grand Plastic Technology Corp Electroplating holder for wafer plating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161785A (ja) * 1993-12-09 1995-06-23 Sumitomo Electric Ind Ltd 半導体ウェハの固定治具
JP2003158169A (ja) * 2001-11-21 2003-05-30 Tomuko:Kk 基板真空吸着ハンド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104905487A (zh) * 2015-06-16 2015-09-16 浙江戈美其鞋业有限公司 一种皮鞋前帮结帮夹钳的移动机构
CN112846521A (zh) * 2020-12-31 2021-05-28 大族激光科技产业集团股份有限公司 一种夹具及激光标记系统
CN112846521B (zh) * 2020-12-31 2024-03-12 大族激光科技产业集团股份有限公司 一种夹具及激光标记系统

Also Published As

Publication number Publication date
TW200921840A (en) 2009-05-16
CN101842889A (zh) 2010-09-22
SG152096A1 (en) 2009-05-29
TWI453858B (zh) 2014-09-21
CN101842889B (zh) 2012-02-08

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