WO2009060686A1 - 検査用粘着シート - Google Patents

検査用粘着シート Download PDF

Info

Publication number
WO2009060686A1
WO2009060686A1 PCT/JP2008/068338 JP2008068338W WO2009060686A1 WO 2009060686 A1 WO2009060686 A1 WO 2009060686A1 JP 2008068338 W JP2008068338 W JP 2008068338W WO 2009060686 A1 WO2009060686 A1 WO 2009060686A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
semiconductor wafer
adhesive sheet
base film
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068338
Other languages
English (en)
French (fr)
Inventor
Yoshio Terada
Fumiteru Asai
Hirokuni Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to EP08846263.5A priority Critical patent/EP2206757A4/en
Priority to US12/513,230 priority patent/US8146438B2/en
Priority to CN200880001162XA priority patent/CN101568610B/zh
Publication of WO2009060686A1 publication Critical patent/WO2009060686A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/516—Oriented mono-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　本発明の検査用粘着シートは、基材フィルム上に粘着剤層が設けられた検査用粘着シートであって、前記基材フィルム及び粘着剤層は導電性を有し、両者の間には電気的な導通経路が設けられている。これにより、半導体ウェハ、又は半導体ウェハのダイシングにより形成された半導体チップを貼り合わせた状態でも電気的な導通検査を行うことができ、その検査における半導体ウェハの変形（反り）や破損、裏面のキズやスクラッチの発生を防止することができる。
PCT/JP2008/068338 2007-11-08 2008-10-09 検査用粘着シート Ceased WO2009060686A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08846263.5A EP2206757A4 (en) 2007-11-08 2008-10-09 ADHESIVE FOIL FOR EYE PROTECTION
US12/513,230 US8146438B2 (en) 2007-11-08 2008-10-09 Pressure-sensitive adhesive sheet for testing
CN200880001162XA CN101568610B (zh) 2007-11-08 2008-10-09 检查用粘合片

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-291252 2007-11-08
JP2007291252A JP5055097B2 (ja) 2007-11-08 2007-11-08 検査用粘着シート

Publications (1)

Publication Number Publication Date
WO2009060686A1 true WO2009060686A1 (ja) 2009-05-14

Family

ID=40625587

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068338 Ceased WO2009060686A1 (ja) 2007-11-08 2008-10-09 検査用粘着シート

Country Status (6)

Country Link
US (1) US8146438B2 (ja)
EP (1) EP2206757A4 (ja)
JP (1) JP5055097B2 (ja)
KR (1) KR20100074082A (ja)
CN (1) CN101568610B (ja)
WO (1) WO2009060686A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011047782A (ja) * 2009-08-27 2011-03-10 Tokyo Electron Ltd 半導体素子評価方法
JP2013173852A (ja) * 2012-02-24 2013-09-05 Denki Kagaku Kogyo Kk 導電性粘着シート及び電子部品の製造方法
JPWO2012132520A1 (ja) * 2011-03-31 2014-07-24 リンテック株式会社 粘着シート
TWI677555B (zh) * 2014-08-28 2019-11-21 日商琳得科股份有限公司 導電性黏著薄片
WO2025192413A1 (ja) * 2024-03-12 2025-09-18 三井化学Ictマテリア株式会社 半導体部品の製造方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080042940A (ko) * 2004-05-18 2008-05-15 히다치 가세고교 가부시끼가이샤 점접착 시트 및 그것을 이용한 반도체장치 및 그 제조 방법
KR20100074083A (ko) * 2007-11-08 2010-07-01 닛토덴코 가부시키가이샤 점착 시트 및 그것을 사용한 반도체 장치의 제조 방법
TWI430426B (zh) * 2010-10-19 2014-03-11 國立交通大學 使用共用傳導層傳送晶片間多重信號之系統
WO2012157615A1 (ja) * 2011-05-19 2012-11-22 電気化学工業株式会社 粘着シートおよび電子部品の製造方法
JP5986452B2 (ja) * 2011-08-10 2016-09-06 バンドー化学株式会社 車両用床シート、車両の床構造体、車両の床構造体の施工方法
KR102591242B1 (ko) * 2011-08-31 2023-10-19 애버리 데니슨 코포레이션 접착성 아크릴레이트-올레핀 코폴리머, 이것의 제조방법, 및 이것을 사용하는 조성물
US9221231B2 (en) * 2011-11-22 2015-12-29 Samsung Display Co., Ltd. Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same
JP5607844B2 (ja) * 2012-03-16 2014-10-15 リンテック株式会社 導通検査用テープ及び該テープを用いた導通検査方法
WO2016031786A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート
CN104485294A (zh) * 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 一种晶圆临时键合及分离方法
JP6429711B2 (ja) * 2015-03-31 2018-11-28 キヤノン株式会社 探触子、及びそれを用いた被検体情報取得装置
KR20170095655A (ko) * 2016-02-15 2017-08-23 (주)제이티 소자검사장치 및 그에 사용되는 소자가압툴
EP3442013B1 (en) * 2016-03-30 2021-01-06 Mitsui Chemicals Tohcello, Inc. Semiconductor device manufacturing method
US11319466B2 (en) * 2017-02-17 2022-05-03 Showa Denko Materials Co., Ltd. Adhesive film
TWI795388B (zh) * 2017-02-17 2023-03-11 日商昭和電工材料股份有限公司 接著劑膜
CN108913057B (zh) * 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
JP6506461B1 (ja) * 2018-02-01 2019-04-24 積水化学工業株式会社 導電性粘着テープ
US11604105B2 (en) * 2018-12-05 2023-03-14 4Iiii Innovations Inc. Adhesive strain sensing pods with improved protection
JP7412082B2 (ja) * 2019-02-06 2024-01-12 日東電工株式会社 粘着シートおよびその利用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPS60102750A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用導電性接着フイルム
JPH07294585A (ja) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd 電子部品の通電検査方法
JPH1180682A (ja) * 1997-09-11 1999-03-26 Bridgestone Corp 架橋型導電性粘着テープ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2808352A (en) * 1951-03-22 1957-10-01 Burgess Battery Co Electrically conductive adhesive tape
US3475213A (en) * 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
JPS5724456Y2 (ja) * 1977-09-09 1982-05-27
JPS6052039A (ja) * 1983-08-31 1985-03-23 Hitachi Chem Co Ltd 半導体ウェハのチップ化方法
JPS6180834A (ja) * 1984-09-27 1986-04-24 Toshiba Corp ウエハ保持シ−ト
JPH0470937A (ja) 1990-07-04 1992-03-05 Matsushita Electric Ind Co Ltd ファイル更新方式
DE19626081A1 (de) * 1996-06-28 1998-01-02 Siemens Ag Halbleiter-Bauelement
JP3226889B2 (ja) * 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
JP3535412B2 (ja) 1999-04-06 2004-06-07 株式会社巴川製紙所 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。
US6344155B1 (en) * 1999-04-06 2002-02-05 Tomoegawa Paper Co., Ltd. Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof
JP4911839B2 (ja) 2001-07-09 2012-04-04 ソマール株式会社 難燃性に優れた導電性粘着剤組成物及びそれを用いた粘着加工品
JP2004251742A (ja) * 2003-02-20 2004-09-09 Denso Corp センサ装置
JP2004281453A (ja) * 2003-03-12 2004-10-07 Tokyo Seimitsu Co Ltd 半導体デバイス製造方法及びシステム
JP2005263876A (ja) 2004-03-16 2005-09-29 Lintec Corp 両面粘着シートおよび脆質部材の転写方法
US7270012B2 (en) * 2004-10-01 2007-09-18 Hitachi, Ltd. Semiconductor device embedded with pressure sensor and manufacturing method thereof
US7127948B2 (en) * 2005-02-17 2006-10-31 The Boeing Company Piezoelectric sensor, sensor array, and associated method for measuring pressure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPS60102750A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用導電性接着フイルム
JPH07294585A (ja) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd 電子部品の通電検査方法
JPH1180682A (ja) * 1997-09-11 1999-03-26 Bridgestone Corp 架橋型導電性粘着テープ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2206757A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011047782A (ja) * 2009-08-27 2011-03-10 Tokyo Electron Ltd 半導体素子評価方法
US8471585B2 (en) 2009-08-27 2013-06-25 Tokyo Electron Limited Method for evaluating semiconductor device
JPWO2012132520A1 (ja) * 2011-03-31 2014-07-24 リンテック株式会社 粘着シート
JP2013173852A (ja) * 2012-02-24 2013-09-05 Denki Kagaku Kogyo Kk 導電性粘着シート及び電子部品の製造方法
TWI677555B (zh) * 2014-08-28 2019-11-21 日商琳得科股份有限公司 導電性黏著薄片
WO2025192413A1 (ja) * 2024-03-12 2025-09-18 三井化学Ictマテリア株式会社 半導体部品の製造方法

Also Published As

Publication number Publication date
EP2206757A4 (en) 2013-10-16
CN101568610A (zh) 2009-10-28
JP2009114394A (ja) 2009-05-28
KR20100074082A (ko) 2010-07-01
US20100313667A1 (en) 2010-12-16
JP5055097B2 (ja) 2012-10-24
EP2206757A1 (en) 2010-07-14
CN101568610B (zh) 2013-03-20
US8146438B2 (en) 2012-04-03

Similar Documents

Publication Publication Date Title
WO2009060686A1 (ja) 検査用粘着シート
CN102401851B (zh) 薄晶片电流传感器
TW200942594A (en) Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
TW200744120A (en) Semiconductor structure, semiconductor wafer and method for fabricating the same
WO2008102548A1 (ja) 半導体発光素子および半導体発光装置の製造方法
EP2996140A3 (en) Multiple bonding layers for thin-wafer handling
WO2009001564A1 (ja) 半導体素子の実装構造体及びその製造方法、半導体素子の実装方法、並びに加圧ツール
EP1681713A4 (en) SURFACE PROTECTION FILM AND SEMICONDUCTOR WAFER LAPPING METHOD
TW200705519A (en) Semiconductor package without chip carrier and fabrication method thereof
TW200705621A (en) Interposer and semiconductor device
TW201130173A (en) Semiconductor light emitting device and method for manufacturing same
JP2009152565A5 (ja)
WO2008149322A3 (en) Mount for a semiconductor light emitting device
WO2009028578A3 (en) Semiconductor device including semiconductor constituent and manufacturing method thereof
TW200943477A (en) Method for manufacturing SOI substrate
TW200731518A (en) Semiconductor device and manufacturing method of the same
TW200746276A (en) Method for bonding a semiconductor substrate to a metal substrate
TW200707695A (en) Electrostatic chuck
TW200741934A (en) Wafer-shaped measuring apparatus and method for manufacturing the same
WO2011090572A3 (en) A method to form lateral pad on edge of wafer
JP2010287710A5 (ja) 半導体装置の製造方法
WO2009060687A1 (ja) 粘着シート及びそれを用いた半導体装置の製造方法
WO2010127320A3 (en) Methods for wafer bonding, and for nucleating bonding nanophases
TW200723382A (en) Method for processing wafer
TWI256112B (en) Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880001162.X

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020097007260

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12513230

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2008846263

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08846263

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE