WO2009129997A1 - Raccord pour une sonde de mesure - Google Patents
Raccord pour une sonde de mesure Download PDFInfo
- Publication number
- WO2009129997A1 WO2009129997A1 PCT/EP2009/002896 EP2009002896W WO2009129997A1 WO 2009129997 A1 WO2009129997 A1 WO 2009129997A1 EP 2009002896 W EP2009002896 W EP 2009002896W WO 2009129997 A1 WO2009129997 A1 WO 2009129997A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature
- decoupling
- pressure
- module
- side terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/296—Acoustic waves
Definitions
- the invention relates to a process connection for a sensor, in particular for a TDR sensor for level measurement, comprising a housing, a process-side terminal, an evaluation-side terminal and at least one signal line routed between the process-side terminal and the evaluation-side terminal in the housing auswert generalige connection of the process-side terminal in terms of pressure and temperature by pressure decoupling means and temperature decoupling means in the housing is substantially decoupled.
- Process connections of the type described have long been known in industrial practice. They usually serve to connect the technical-physical process, which is usually to be observed by measurement, to an evaluation unit which frequently comprises a transducer and other electronics in order to receive the signal provided via the signal line from the actual sensor element in contact with the process, prepare, display and, if necessary, forward it.
- Object of the present invention is to avoid the disadvantages shown in known process connections - at least partially - to provide a particular easy to implement, reliable and inexpensive to produce process connection for high-pressure and high-temperature applications.
- the stated object, according to the invention is initially and essentially solved by the process connection in question in that the temperature decoupling means are provided in the housing in the area of the process-side connection, so that the area of the evaluation-side terminal is substantially decoupled in terms of temperature in the housing is, and that in the region of the evaluation-side terminal, the pressure decoupling means are provided.
- the temperature decoupling means provided in the region of the process-side connection ensures that the process temperature transmitted via the outside of the process-side connection to the process-side connection is at least partially reduced in the direction of the evaluation-side connection, whereby the process pressure over the temperature decoupling means passes in the process connection - at least essentially - can spread.
- a greatly reduced temperature ie, for example, a temperature which, judiciously, based on the ambient temperature, is, for example, only 30%, 20% or even significantly less than 10% Process overtemperature corresponds.
- the pressure decoupling agent provided in this area therefore no longer has to be temperature-resistant in the sense that is the case with known process connections; it no longer has to be resistant to high temperatures.
- the longitudinal extent and the thermal conductivity and / or the temperature resistance of the temperature decoupling agent are coordinated so that sets the desired temperature decoupling, in particular, for example, to achieve a desired temperature gradient.
- the temperature decoupling means mediates between the temperature at the process-side terminal and the temperature at the evaluation-side terminal of the process connection. Depending on the thermal conductivity of the temperature decoupling agent and depending on the respective thermal properties of the housing surrounding the temperature decoupling means, a certain temperature gradient sets within the temperature decoupling means.
- the temperature decoupling means can be made of a material which only has to fulfill comparatively low requirements in terms of temperature stability, since the extended longitudinal extent of the temperature decoupling agent already constructively provides for a mitigation of the thermal problem.
- a material may possibly have to be chosen for the temperature decoupling agent, which has considerably more flexible and better properties with respect to thermal conductivity and / or temperature resistance.
- the temperature decoupling means consists of at least two segments which are arranged one behind the other in the longitudinal extent of the process connection, wherein in particular the longitudinal extents and the thermal conductivities and / or the temperature strengths of the segments of the temperature decoupling agent are coordinated so that the desired temperature decoupling - Setting, in particular a desired temperature gradient sets.
- the use of multiple segments for the temperature decoupling means has several advantages. On the one hand, it is possible by combining several segments, very different lengths of the temperature decoupling agent, eg. As for very different lengths of process connections to realize what is advantageous in terms of manufacturing, storage and distribution of such designed temperature decoupling means. On the other hand, however, it is also possible to combine segments which have different thermal properties. For example, as the material closest to the process-side terminal, a material which has a high temperature resistance and thus takes into account the temperatures prevailing at this end of the process connection can be used. The subsequent segment and possibly further subsequent segments are only exposed to lower temperatures due to the temperature gradient which occurs and can therefore be made of material. exist that have not as high temperature resistance as the first segment, but may be significantly cheaper.
- the pressure decoupling means consists of at least two segments, which in the area of the evaluation-side connection of the process connection brings about the same advantages - related to the pressure - as has been previously carried out on the basis of the segment-like designed temperature decoupling means.
- the signal line is guided in the housing in the temperature decoupling means and / or in the decoupling means, wherein the temperature decoupling means - depending on the realized measuring principle - in particular a good electrical insulator, and / or wherein the decoupling means is in particular a good electrical insulator.
- the temperature decoupling means depending on the realized measuring principle - in particular a good electrical insulator, and / or wherein the decoupling means is in particular a good electrical insulator.
- TDR time domain Reflectometry-
- the signal line may be an arbitrary signal line, which is provided in the context of an entirely different measuring principle for measuring an entirely different measured variable.
- the signal line may be the terminal of the electrode of a conductively operating probe or the electrode of a temperature and / or pressure sensor.
- the invention is not limited to a specific type of sensor or to a specific measuring principle.
- the temperature decoupling agent is a material made of or using polyetheretherketone (PEEK).
- PEEK polyetheretherketone
- Such materials have a high mechanical strength - and so also compressive strength - so that they can be readily used in the field of process-side connection, where there is still a high pressure prevail.
- at least partially a softer material is used for the pressure decoupling agent, such as.
- PTFE polytetrafluoroethylene
- the pressure decoupling means comprises at least one O-ring for realizing a seal against the signal line and / or the pressure decoupling means comprises at least one O-ring for realizing a seal against the housing.
- a serial sequence of different decoupling and sealing means results from the process-side connection on the evaluation-side connection, forming a layer structure and successive barriers in this direction ("sandwich structure").
- the temperature decoupling means and / or the pressure decoupling means in the housing are detachably, in particular interchangeably / is arranged, whereby a single or uniform process connection by adapting suitable Druckentkopplungsstoff and temperature decoupling means is adaptable to different tasks ,
- the process connection is modular and has at least one temperature decoupling module and a pressure decoupling module
- the temperature decoupling module comprises the process-side terminal and a module-side terminal
- the pressure decoupling module comprises the evaluation-side terminal and also a module-side terminal
- the temperature decoupling module and the decoupling module via the corresponding module-side Connections are connectable.
- the temperature decoupling means is arranged in the temperature decoupling module and / or the Druckentkopplungsmitte] is arranged in the pressure decoupling module or is formed by the housing of the pressure decoupling module.
- the invention further relates to a pressure decoupling module for a modular process connection, which further comprises a temperature decoupling module, as described above, wherein the pressure decoupling module is connectable to the temperature decoupling module via corresponding module-side terminals.
- a pressure decoupling module is particularly advantageous if the module-side connection corresponds to the process-side connection or the counterpart to the process-side connection, so that known process connections and / or measuring sensors can be connected to the pressure decoupling module. In this way, it is possible to connect an existing process connection upstream of a process connection according to the invention and to relieve the existing process connection so that in many cases can be simpler and cheaper than to replace existing process connections completely.
- the process connection 1 comprises a housing 2a, 2b, a process-side terminal 3, an evaluation-side terminal 4 and a between the process-side terminal 3 and the evaluation-side terminal 4 in the housing 2a, 2b guided signal line 5.
- TDR Time domain Reflectometry-
- the process connection 1 for one Time domain Reflectometry- (TDR) -Meßlopeler thought the signal line 5 serves as a waveguide and protrudes when used as intended in a container, not shown, in which the level of a liquid or pourable medium to be determined.
- the signal line 5 is acted upon by an evaluation unit, not shown here, which is connected via the evaluation-side terminal 4 to the process connection 1, with an electromagnetic wave, the electromagnetic wave of The signal line 5 is guided in the direction of the monitored - also not shown - medium is reflected at the medium (discontinuity keitsstelle in the dielectric constant) and by measuring the transit time of the reflected electromagnetic wave back to the evaluation unit inference to the spacing of the Medium surface can be pulled.
- This measurement principle is well known and will not be discussed further.
- the process connection 1 shown in FIG. 1 can be used for any sensor having the stated properties and is not limited to the level measurement or even to the level measurement based on the TDR principle.
- the evaluation-side terminal 4 is substantially decoupled from the process-side terminal 3 in terms of pressure and temperature by a pressure decoupling means 6 and a temperature decoupling means 7 in the housing 2.
- Decoupled here means that the pressure acting on the process connection 1 via the outside of the process-side connection 3 and the temperature acting on the outside of the process-side connection 3 on the process connection 1 by means of a skilful structure of the process connection 1 hardly influence the evaluation side. conclusion have 4 and therefore safely an unillustrated evaluation can be connected to the evaluation-side terminal 4.
- the temperature decoupling means 7 are provided in the housing 2 in the region of the process-side terminal 3, so that the area of the evaluation-side terminal 4 in the housing 2 the process-side temperature is decoupled.
- the pressure decoupling means 6, is provided only in the region of the evaluation-side connection 4, whereby a strong temperature reduction has already been effected by the upstream temperature decoupling means 7, so that the pressure decoupling means 6 does not have to be resistant to high temperatures, but only fulfills significantly lower thermal load requirements have to.
- a cheap way is provided in a simple manner to provide a high-pressure resistant high-temperature process connection.
- the longitudinal extent, the thermal conductivity and the temperature resistance of the temperature decoupling means 7 are coordinated so that the desired temperature decoupling results, namely z.
- the desired temperature decoupling results namely z.
- an effective temperature of about 30 ° C. results in the region of the evaluation-side connection 4.
- the longitudinal extent of the temperature decoupling means 7 on the heat transfer between the process-side terminal 3 and the evaluation-side terminal 4 effects.
- the temperature decoupling means 7 is pressure-resistant, it need not absorb pressure on one side. Consequently, the process-side pressure can propagate into the transition region between temperature decoupling means 7 and pressure decoupling means 6, but is then absorbed there by the pressure decoupling means 6, so that only a small part of the process pressure finally reaches the evaluation-side terminal 4.
- the pressure decoupling agent 6 does not have to be high-temperature-resistant at the same time, since the temperature has already been intercepted upstream.
- the temperature decoupling means 7 consists of three equal-length segments 7a, 7b, 7c, which are arranged one behind the other in the longitudinal extension of the process connection 1.
- the longitudinal extension and the thermal conductivity and the temperature resistances of the segments 7a, 7b, 7c of the temperature decoupling means 7 are so superficial. matched otherwise that results in the desired temperature decoupling.
- the choice of the temperature strengths of the individual segments 7a, 7b, 7c of the temperature decoupling means 7 has been taken into account that the nearest to the process-side terminal 3 segment 7a of the temperature decoupling means 7 is exposed to the highest absolute temperature. This high temperature resistance is not given in the downstream segments 7b, 7c of the temperature decoupling means 7, which is why for these segments 7b, 7c a - cheaper - material with lower temperature resistance can be selected.
- the signal line 5 is guided in the housing 2 in the temperature decoupling means 7 and in the pressure decoupling means 6, the temperature decoupling means 7 and the decoupling means 6 respectively being good electrical insulators, in particular the temperature decoupling means 7 or its segments 7a, 7b, 7c Made of polyether ether ketone (PEEK), a very resistant and mechanically rigid material with very good temperature resistance.
- the pressure decoupling means 6 is partially - namely in the individual segment 6a - made of a slightly softer material, namely polytetrafluoroethylene (PTFE), which has a good elasticity and realizes a good flameproof enclosure, which in particular with regard to compliance with standards for explosive-endangered areas (Ex) is relevant.
- the pressure decoupling means 6 moreover comprises an O-ring 6b for sealing against the signal line 5 and a further O-ring 6c for sealing with respect to the housing 2.
- the materials of which the pressure decoupling means 6 is formed consisting of the individual segment 6a and the two O-rings 6b, 6c, need not be high-temperature-resistant, since the temperature decoupling upstream of the temperature decoupling means 7 has been realized is.
- the temperature decoupling means 7 consisting of the three segments 7a,
- Segments 7a, 7b, 7c despite equal length - longitudinal extent - of the pro- kessan gleiches 1 on the process-side terminal 3, different compressive strengths can be realized.
- materials for the temperature decoupling means 6 glass and ceramic materials come into question.
- all segments 7a, 7b, 7c of the temperature decoupling means 7 have a sleeve shape.
- the illustrated process connection 1 has a modular design and a temperature decoupling module Ia - corresponding to a first part 2b of the housing 2 - and a pressure decoupling module Ib - corresponding to a second part 2a of the housing 2 -, wherein the temperature decoupling module 1a comprises the process-side terminal 3 and a module-side terminal 8 and the pressure decoupling module Ib comprises the evaluation-side terminal 4 and a module-side terminal 9, wherein the temperature decoupling module 1a and the decoupling module Ib are connectable via the corresponding module-side terminals 8, 9, in present case are releasably connectable.
- the temperature decoupling means 7 is arranged in the temperature decoupling module 1a and the pressure decoupling means 6 is arranged in the pressure decoupling module 1b.
- the pressure decoupling module Ia taken alone if it is intended for a modular process connection 1 with a temperature decoupling module Ib, as described above. It is important that the pressure decoupling module Ia can be connected to the temperature decoupling module Ib via corresponding module-side connections 8, 9.
- the pressure decoupling module Ia is designed so that the module-side terminal 8 forms the counterpart to the process-side terminal 3, so that known process connections with a known process-side terminal 3 can be connected to the pressure decoupling module Ia. This makes it possible to combine existing process connections with the pressure decoupling module Ia and to use, for example, at temperatures for which the process connection or sensor was originally not intended.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
L'invention concerne un raccord destiné à une sonde de mesure, en particulier à une sonde de mesure TDR pour la mesure de niveau, et comprenant un boîtier (2a, 2b), un raccord côté processus (3), un raccord côté évaluation (4), ainsi qu'au moins une ligne de signaux (5) conduite dans le boîtier (2a, 2b) entre le raccord côté processus (3) et le raccord côté évaluation (4), le raccord côté évaluation (4) étant sensiblement découplé du raccord côté processus (3), quant à la pression et à la température, par des moyens de découplage de pression (6) et des moyens de découplage de température (7) dans le boîtier (2a, 2b). L'invention vise à éviter - au moins en partie - les inconvénients des raccords connus de l'état de la technique et, en particulier, à fournir un raccord fiable, simple à réaliser et économique à produire pour des applications haute pression et haute température. A cet effet, les moyens de découplage de température (7) sont placés dans la zone du raccord côté processus (3) dans le boîtier (2a, 2b), de sorte que la zone du raccord côté évaluation (4) est sensiblement découplée dans le boîtier (2a, 2b) eu égard à la température, et les moyens de découplage de pression (6) sont placés dans la zone du raccord côté évaluation (4).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008020034.4 | 2008-04-21 | ||
| DE102008020034.4A DE102008020034B4 (de) | 2008-04-21 | 2008-04-21 | Prozeßanschluß für einen Meßfühler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009129997A1 true WO2009129997A1 (fr) | 2009-10-29 |
Family
ID=41060076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2009/002896 Ceased WO2009129997A1 (fr) | 2008-04-21 | 2009-04-21 | Raccord pour une sonde de mesure |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102008020034B4 (fr) |
| WO (1) | WO2009129997A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011020668A3 (fr) * | 2009-08-18 | 2011-08-18 | Endress+Hauser Gmbh+Co.Kg | Appareil de mesure de la technique d'automatisation des processus, destiné à la détermination et à la surveillance d'une grandeur chimique ou physique dans un processus à haute température se déroulant dans un contenant |
| WO2018114186A1 (fr) * | 2016-12-20 | 2018-06-28 | Endress+Hauser SE+Co. KG | Appareil de mesure de niveau de remplissage thermorésistant |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999042794A1 (fr) * | 1998-02-18 | 1999-08-26 | Christian Michelsen Research As | Dispositif de mesure du facteur de reflexion caracteristique d'ondes electromagnetiques dans un ecoulement polyphase |
| US20020121907A1 (en) * | 2000-11-23 | 2002-09-05 | Karl Griessbaum | Combination of a feedthrough element for an electric high-frequency signal and a probe, and a level meter metering device including a combination of this type |
| US20030201842A1 (en) * | 2002-04-29 | 2003-10-30 | Gard Alan Moravec | Coaxial probe for high temperature and high pressure applications |
| WO2004076982A2 (fr) * | 2003-02-26 | 2004-09-10 | Endress+Hauser Gmbh+Co. Kg | Dispositif permettant de determiner et/ou de surveiller le niveau de remplissage d'un agent dans un contenant |
| US20060225499A1 (en) * | 2005-04-07 | 2006-10-12 | Rosemount Inc. | Tank seal for guided wave radar level measurement |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4169037A (en) * | 1978-10-06 | 1979-09-25 | Petrolite Corporation | Entrance bushing |
| DE102006021621A1 (de) * | 2006-05-09 | 2007-11-15 | Linde Ag | Stromdurchführvorrichtung für hohe Drücke und Tempetaturen |
-
2008
- 2008-04-21 DE DE102008020034.4A patent/DE102008020034B4/de not_active Expired - Fee Related
-
2009
- 2009-04-21 WO PCT/EP2009/002896 patent/WO2009129997A1/fr not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999042794A1 (fr) * | 1998-02-18 | 1999-08-26 | Christian Michelsen Research As | Dispositif de mesure du facteur de reflexion caracteristique d'ondes electromagnetiques dans un ecoulement polyphase |
| US20020121907A1 (en) * | 2000-11-23 | 2002-09-05 | Karl Griessbaum | Combination of a feedthrough element for an electric high-frequency signal and a probe, and a level meter metering device including a combination of this type |
| US20030201842A1 (en) * | 2002-04-29 | 2003-10-30 | Gard Alan Moravec | Coaxial probe for high temperature and high pressure applications |
| WO2004076982A2 (fr) * | 2003-02-26 | 2004-09-10 | Endress+Hauser Gmbh+Co. Kg | Dispositif permettant de determiner et/ou de surveiller le niveau de remplissage d'un agent dans un contenant |
| US20060225499A1 (en) * | 2005-04-07 | 2006-10-12 | Rosemount Inc. | Tank seal for guided wave radar level measurement |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011020668A3 (fr) * | 2009-08-18 | 2011-08-18 | Endress+Hauser Gmbh+Co.Kg | Appareil de mesure de la technique d'automatisation des processus, destiné à la détermination et à la surveillance d'une grandeur chimique ou physique dans un processus à haute température se déroulant dans un contenant |
| US20120186339A1 (en) * | 2009-08-18 | 2012-07-26 | Endress + Hauser Gmbh + Co. Kg | Measuring device of process automation technology for ascertaining and monitoring a chemical or physical process variable in a high temperature process in a container |
| US9110165B2 (en) | 2009-08-18 | 2015-08-18 | Endress + Hauser Gmbh + Co. Kg | Measuring device of process automation technology for ascertaining and monitoring a chemical or physical process variable in a high temperature process in a container |
| WO2018114186A1 (fr) * | 2016-12-20 | 2018-06-28 | Endress+Hauser SE+Co. KG | Appareil de mesure de niveau de remplissage thermorésistant |
| CN110268232A (zh) * | 2016-12-20 | 2019-09-20 | 恩德莱斯和豪瑟尔欧洲两合公司 | 耐温的填充水平测量设备 |
| CN110268232B (zh) * | 2016-12-20 | 2021-10-15 | 恩德莱斯和豪瑟尔欧洲两合公司 | 耐温的填充水平测量设备 |
| US11187570B2 (en) | 2016-12-20 | 2021-11-30 | Endress+Hauser SE+Co. KG | Temperature-resistant fill level measurement device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008020034B4 (de) | 2016-08-11 |
| DE102008020034A1 (de) | 2009-10-29 |
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