WO2009145461A3 - 세라믹 인쇄회로기판의 원판 및 그 원판의 제조 방법 - Google Patents

세라믹 인쇄회로기판의 원판 및 그 원판의 제조 방법 Download PDF

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Publication number
WO2009145461A3
WO2009145461A3 PCT/KR2009/001672 KR2009001672W WO2009145461A3 WO 2009145461 A3 WO2009145461 A3 WO 2009145461A3 KR 2009001672 W KR2009001672 W KR 2009001672W WO 2009145461 A3 WO2009145461 A3 WO 2009145461A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
thin film
manufacturing
depositing
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/001672
Other languages
English (en)
French (fr)
Other versions
WO2009145461A2 (ko
Inventor
김갑석
김용모
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOREA INSTRUMENT CO Ltd
Original Assignee
KOREA INSTRUMENT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080031284A external-priority patent/KR100867756B1/ko
Priority claimed from KR1020080031268A external-priority patent/KR100885664B1/ko
Application filed by KOREA INSTRUMENT CO Ltd filed Critical KOREA INSTRUMENT CO Ltd
Publication of WO2009145461A2 publication Critical patent/WO2009145461A2/ko
Publication of WO2009145461A3 publication Critical patent/WO2009145461A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

세라믹 인쇄회로기판의 원판 및 그 원판의 제조 방법이 개시된다. 본 발명의 원판 제조방법은, 세라믹 기판 상에 물리적 기상증착을 위한 스퍼터링 방법에 의해 접착층을 형성하는 단계와, 상기 접착층 상에 스퍼터링 방법에 의해 전도성 금속으로 이루어지고 압축 잔류응력을 가지는 제1박막을 증착하는 단계와, 상기 제1박막 상에 스퍼터링 방법에 의해 전도성 금속으로 이루어지고 인장 잔류응력을 가지는 제2박막을 증착하는 단계와, 상기 제1박막 및 제2박막을 증착하는 단계를 반복하여 전체 잔류 응력이 기 설정된 범위내로 제어된 후막의 전기 전도층을 증착하는 단계를 포함한다.
PCT/KR2009/001672 2008-04-03 2009-04-01 세라믹 인쇄회로기판의 원판 및 그 원판의 제조 방법 Ceased WO2009145461A2 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020080031284A KR100867756B1 (ko) 2008-04-03 2008-04-03 고속/고밀도 마그네트론 스퍼터링 법을 이용한 세라믹인쇄회로기판의 원판 제조 방법
KR10-2008-0031284 2008-04-03
KR10-2008-0031268 2008-04-03
KR1020080031268A KR100885664B1 (ko) 2008-04-03 2008-04-03 고속/고밀도 마그네트론 스퍼터링 법을 이용한 후막제조방법

Publications (2)

Publication Number Publication Date
WO2009145461A2 WO2009145461A2 (ko) 2009-12-03
WO2009145461A3 true WO2009145461A3 (ko) 2010-01-21

Family

ID=41313620

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/001672 Ceased WO2009145461A2 (ko) 2008-04-03 2009-04-01 세라믹 인쇄회로기판의 원판 및 그 원판의 제조 방법

Country Status (2)

Country Link
JP (1) JP2009253275A (ko)
WO (1) WO2009145461A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113174575B (zh) * 2021-03-31 2023-04-07 西安交通大学 一种AlN陶瓷基板金属化、热沉一体化制备方法
JP2024523448A (ja) * 2021-06-25 2024-06-28 コーニング インコーポレイテッド ガラス含有基板上に金属層を形成する方法および結果として得られるデバイス
CN116685714B (zh) 2021-12-29 2026-04-10 京东方科技集团股份有限公司 线路板、功能背板、背光模组、显示面板及显示装置
WO2023123328A1 (zh) 2021-12-31 2023-07-06 京东方科技集团股份有限公司 线路板、功能背板及其制备方法
WO2023159405A1 (zh) 2022-02-24 2023-08-31 京东方科技集团股份有限公司 线路板及其制造方法、功能背板、背光模组、显示装置
CN117378289A (zh) 2022-04-21 2024-01-09 京东方科技集团股份有限公司 线路板、发光基板、背光模组、显示面板及显示装置
TWI898203B (zh) * 2022-04-21 2025-09-21 中國商京東方科技集團股份有限公司 電路板、發光基板、背光模組、顯示面板及顯示裝置
NO347559B1 (en) * 2022-06-21 2024-01-15 Univ Of South Eastern Norway Process for producing single crystal silver films
DE112022007979T5 (de) 2022-10-31 2025-08-21 Boe Technology Group Co., Ltd. Leiterplatte, lichtemittierendes Substrat, Hintergrundbeleuchtungsmodul und Anzeigegerät

Citations (4)

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KR19980063389A (ko) * 1996-12-25 1998-10-07 다케모토히데하루 응력조정된 절연막의 형성방법, 반도체장치 및 그의 제조방법
JP2004087913A (ja) * 2002-08-28 2004-03-18 Yamaha Corp 銅メッキセラミックス基板およびその製造方法ならびに銅メッキセラミックス基板を備えた熱電モジュール
JP2005298833A (ja) * 2002-10-22 2005-10-27 Asahi Glass Co Ltd 多層膜付き基板とその製造方法
KR20060043282A (ko) * 2004-07-21 2006-05-15 삼성전기주식회사 고밀도 기판의 제조방법

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JPH07161637A (ja) * 1988-01-26 1995-06-23 Toshiba Corp 膜のスパッタリング形成方法
JPH0775124B2 (ja) * 1990-01-25 1995-08-09 工業技術院長 薄膜の堆積方法
KR950006415B1 (ko) * 1993-06-11 1995-06-15 주식회사에스.케이.씨 광자기기록매체의 제조방법
JP2002111176A (ja) * 2000-09-26 2002-04-12 Rohm Co Ltd 導電路の形成方法および基板
JP2006286971A (ja) * 2005-03-31 2006-10-19 Tdk Corp 複合基板およびその製造方法、ならびに薄膜デバイスおよびその製造方法
JP2007234397A (ja) * 2006-03-01 2007-09-13 Ulvac Japan Ltd 透明電極及びその形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980063389A (ko) * 1996-12-25 1998-10-07 다케모토히데하루 응력조정된 절연막의 형성방법, 반도체장치 및 그의 제조방법
JP2004087913A (ja) * 2002-08-28 2004-03-18 Yamaha Corp 銅メッキセラミックス基板およびその製造方法ならびに銅メッキセラミックス基板を備えた熱電モジュール
JP2005298833A (ja) * 2002-10-22 2005-10-27 Asahi Glass Co Ltd 多層膜付き基板とその製造方法
KR20060043282A (ko) * 2004-07-21 2006-05-15 삼성전기주식회사 고밀도 기판의 제조방법

Also Published As

Publication number Publication date
JP2009253275A (ja) 2009-10-29
WO2009145461A2 (ko) 2009-12-03

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