WO2010142272A3 - Siebdruckform - Google Patents

Siebdruckform Download PDF

Info

Publication number
WO2010142272A3
WO2010142272A3 PCT/DE2010/000638 DE2010000638W WO2010142272A3 WO 2010142272 A3 WO2010142272 A3 WO 2010142272A3 DE 2010000638 W DE2010000638 W DE 2010000638W WO 2010142272 A3 WO2010142272 A3 WO 2010142272A3
Authority
WO
WIPO (PCT)
Prior art keywords
cavities
screen printing
web
elements
printing frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2010/000638
Other languages
English (en)
French (fr)
Other versions
WO2010142272A2 (de
Inventor
Mike Becker
Dietmar LÜTKE-NOTARP
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NB TECHNOLOGIES GmbH
Original Assignee
NB TECHNOLOGIES GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NB TECHNOLOGIES GmbH filed Critical NB TECHNOLOGIES GmbH
Publication of WO2010142272A2 publication Critical patent/WO2010142272A2/de
Publication of WO2010142272A3 publication Critical patent/WO2010142272A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

Siebdruckform, welche eine erste Lage mit ersten Ausnehmungen und eine zweite Lage mit zweiten Ausnehmungen aufweist, wobei die Ausnehmungen so angeordnet sind, dass ein Druckmedium durch eine der ersten Ausnehmungen und von dort durch eine der zweiten Ausnehmungen auf ein unter der zweiten Lage platzierbares Substrat beförderbar ist, wobei in den ersten Ausnehmungen Stegelemente und in den zweiten Ausnehmungen Stützelemente vorgesehen sind, wobei die Stegelemente mit den Stützelementen verbunden sind, und mindestens ein Stegelement zusammen mit einem Stützelement eine Höhe besitzt, welche gleich der Siebdruckformenhöhe ist, wobei ein Stützelement mindestens ein darüber angeordnetes Stegelement stützt, wobei ein Vertikalquerschnitt eines der Stegelemente ungleich einem Vertikalquerschnitt eines der Stützelemente ist.
PCT/DE2010/000638 2009-06-09 2010-06-09 Siebdruckform Ceased WO2010142272A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009024877A DE102009024877A1 (de) 2009-06-09 2009-06-09 Siebdruckform
DE102009024877.3 2009-06-09

Publications (2)

Publication Number Publication Date
WO2010142272A2 WO2010142272A2 (de) 2010-12-16
WO2010142272A3 true WO2010142272A3 (de) 2011-03-10

Family

ID=43028918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2010/000638 Ceased WO2010142272A2 (de) 2009-06-09 2010-06-09 Siebdruckform

Country Status (3)

Country Link
CN (1) CN201824658U (de)
DE (2) DE102009024877A1 (de)
WO (1) WO2010142272A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011003287A1 (de) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone
TW201308616A (zh) * 2011-08-03 2013-02-16 Motech Ind Inc 於基板上形成導電性圖案之方法
CN103192589B (zh) * 2012-01-09 2016-12-14 昆山允升吉光电科技有限公司 双面蚀刻制作金属型太阳能网板的方法
CN103203969B (zh) * 2012-01-16 2017-04-05 昆山允升吉光电科技有限公司 一种三维立体掩模板及其制备工艺
CN103358671B (zh) * 2012-04-10 2017-06-06 昆山允升吉光电科技有限公司 蜂窝状金属丝网
GB2521344A (en) 2013-10-27 2015-06-24 Asm Assembly Systems Switzerland Gmbh Printing screens, methods of fabricating the same and methods of screen printing
JP6758333B2 (ja) * 2018-01-23 2020-09-23 マクセルホールディングス株式会社 スクリーン印刷用メタルマスク
JP6966580B2 (ja) * 2019-01-11 2021-11-17 マクセル株式会社 メタルマスク
JP6894141B2 (ja) * 2019-06-07 2021-06-23 株式会社プロセス・ラボ・ミクロン メタルマスク、及びその製造方法
CN111137002B (zh) * 2019-12-31 2021-06-25 帝尔激光科技(无锡)有限公司 一种新型网版及其制作方法
KR102595815B1 (ko) * 2021-02-03 2023-10-31 한빅솔라(주) 태양전지의 전극 인쇄용 스텐실 마스크
DE102022107163A1 (de) * 2022-03-25 2023-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Druckschablone und Druckvorrichtungen zur Ausbildung von Leiterbahnen auf einem Substrat und Verfahren zur Herstellung einer metallischen Kontaktstruktur einer photovoltaischen Solarzelle
DE102022209195A1 (de) * 2022-09-05 2024-03-07 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Bedrucken eines Substrats mit einem Dicht- und/oder Klebstoff
CN120245586A (zh) * 2023-12-29 2025-07-04 昇印光电（昆山）股份有限公司 一种印刷网版

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5361695A (en) * 1991-07-08 1994-11-08 Danippon Screen Mfg. Co., Ltd. Screen printing plate for limiting the spread of ink on an object
US5819652A (en) * 1994-12-14 1998-10-13 International Business Machines Corporation Reduced cavity depth screening stencil
EP1955863A1 (de) * 2005-11-28 2008-08-13 Mitsubishi Denki Kabushiki Kaisha Druckmaske und solarzelle und flachdisplay-ad-chip-condensator
US20090025581A1 (en) * 2007-07-27 2009-01-29 Samsung Electro-Mechanics Co., Ltd. Mask for screen printing and screen printing method using the same
DE102007059794A1 (de) * 2007-12-11 2009-06-25 Nb Technologies Gmbh Schablone für den technischen Siebdruck

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2307446A (en) * 1995-11-25 1997-05-28 Ibm Solder paste deposition
DE102005063510B4 (de) * 2005-09-22 2010-06-02 Siemens Aktiengesellschaft Verwendung eines Verfahrens zur Beschichtung einer Druckschablone eines SMT-Prozesses

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5361695A (en) * 1991-07-08 1994-11-08 Danippon Screen Mfg. Co., Ltd. Screen printing plate for limiting the spread of ink on an object
US5819652A (en) * 1994-12-14 1998-10-13 International Business Machines Corporation Reduced cavity depth screening stencil
EP1955863A1 (de) * 2005-11-28 2008-08-13 Mitsubishi Denki Kabushiki Kaisha Druckmaske und solarzelle und flachdisplay-ad-chip-condensator
US20090025581A1 (en) * 2007-07-27 2009-01-29 Samsung Electro-Mechanics Co., Ltd. Mask for screen printing and screen printing method using the same
DE102007059794A1 (de) * 2007-12-11 2009-06-25 Nb Technologies Gmbh Schablone für den technischen Siebdruck

Also Published As

Publication number Publication date
DE102009024877A1 (de) 2010-12-23
DE202010007773U1 (de) 2010-10-28
CN201824658U (zh) 2011-05-11
WO2010142272A2 (de) 2010-12-16

Similar Documents

Publication Publication Date Title
WO2010142272A3 (de) Siebdruckform
EP2120136A4 (de) Anzeigeschirmsubstrat, anzeigeschirm, anzeigeanordnung und verfahren zur herstellung eines anzeigeschirmsubstrats
TWI372267B (en) Touch panel, color filter substrate and fabricating method thereof
IL244776B (en) Composite product comprising an open-cell substrate layer
WO2011141850A3 (en) Panel and methods for manufacturing panels
TWI563592B (en) Thermal plate and substrate support assembly comprising the thermal plate and method for manufacturing the thermal plate
GB2481079B (en) Printing screens and method of fabricating the same
PL2352779T3 (pl) Polieterosiloksany zawierające grupy alkoksysililowe i sposób ich wytwarzania
TWI341033B (en) Pixel structure and method for manufacturing the same
JP2011515311A5 (ja) シート製造装置、シート製造方法、及びこれを用いた製造物
EP2314651A4 (de) Haftzusammensetzung, haftschicht und haftfolie
EP2381500A4 (de) Material für ein photovoltaikelement und photovoltaikelement
EP2439924A4 (de) Erweiterungsmodul und fernseher mit dem erweiterungsmodul
WO2011160829A3 (de) Filtermaterial für fluide und verfahren zur herstellung eines filtermaterials
WO2013040404A3 (en) Composite construction panels and applications thereof
PL2618927T3 (pl) Sposób wytwarzania funkcjonalizowanych i mało porowatych mikrokapsułek z polisiloksanu
PL2174921T3 (pl) Materiał wiążący dla struktury typu plastra miodu i struktura typu plastra miodu wykorzystująca ten materiał
DE602009000232D1 (de) Dünnfilmtransistor, Herstellungsverfahren dafür und Flachbildschirmanzeige mit dem Dünnfilmtransistor
EP2439246A4 (de) Lichthärtbare haftklebezusammensetzung, lichthärtbare haftklebeschicht und lichthärtbare haftklebefolie
TWI368076B (en) Pixel structure, display panel, electro-optical apparatus and manufacturing method the same
BRPI0921001A2 (pt) substrato de painel de exibição e painel de exibição.
TWI340451B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same
EP2508583A4 (de) Lichthärtbare und druckempfindliche haftklebezusammensetzung, lichthärtbare und druckempfindliche haftklebeschicht sowie lichthärtbare und druckempfindliche haftklebefolie
TWI340450B (en) Packaging substrate structure with capacitor embedded therein and method for fabricating the same
WO2010142271A3 (de) Siebdruckform

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10742395

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 10742395

Country of ref document: EP

Kind code of ref document: A2