WO2010142271A3 - Siebdruckform - Google Patents

Siebdruckform Download PDF

Info

Publication number
WO2010142271A3
WO2010142271A3 PCT/DE2010/000637 DE2010000637W WO2010142271A3 WO 2010142271 A3 WO2010142271 A3 WO 2010142271A3 DE 2010000637 W DE2010000637 W DE 2010000637W WO 2010142271 A3 WO2010142271 A3 WO 2010142271A3
Authority
WO
WIPO (PCT)
Prior art keywords
screen printing
printing template
cavities
height
designed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2010/000637
Other languages
English (en)
French (fr)
Other versions
WO2010142271A2 (de
Inventor
Mike Becker
Dietmar LÜTKE-NOTARP
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NB TECHNOLOGIES GmbH
Original Assignee
NB TECHNOLOGIES GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NB TECHNOLOGIES GmbH filed Critical NB TECHNOLOGIES GmbH
Priority to CN2010800253096A priority Critical patent/CN102458856A/zh
Publication of WO2010142271A2 publication Critical patent/WO2010142271A2/de
Publication of WO2010142271A3 publication Critical patent/WO2010142271A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

Siebdruckform, aufweisend: - einen Siebdruckschablonenträger, welcher als Folie ausgebildet ist, die mit ersten Ausnehmungen versehen ist, die so ausgebildet sind, dass sie von einer Oberseite zur Unterseite der Folie reichen, - eine Siebdruckschablone, welche als Maskierschicht ausgebildet ist, welche mit der Unterseite des Siebdruckschablonenträgers fest verbunden ist, wobei die Maskierschicht mit zweiten Ausnehmungen versehen ist, welche mindestens teilweise mit den ersten Ausnehmungen des Siebdruckschablonenträgers so in Überdeckung liegen, dass ein Druckmedium durch die ersten Ausnehmungen des Siebdruckschablonenträgers von dessen Oberseite durch die zweiten Ausnehmungen der Maskierschicht hindurch in Richtung zur Unterseite und auf ein darunter platzierbares Substrat beförderbar ist, wobei der Siebdruckschablonenträger und/oder die Maskierschicht so ausgebildet sind/ist, dass ein Vorsprung in den Bereich mindestens einer der ersten oder zweiten Ausnehmung hineinragt und deren Durchtrittsfläche für ein Druckmedium verringert, wobei die Höhe des Vorsprungs im Bereich der ersten Ausnehmung niedriger als die Höhe des Siebdruckschablonenträgers ist und/oder die Höhe des Vorsprungs in der zweiten Ausnehmung niedriger als die Höhe der Siebdruckschablone ist.
PCT/DE2010/000637 2009-06-09 2010-06-09 Siebdruckform Ceased WO2010142271A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010800253096A CN102458856A (zh) 2009-06-09 2010-06-09 丝网印版

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009024874.9 2009-06-09
DE200910024874 DE102009024874A1 (de) 2009-06-09 2009-06-09 Siebdruckform

Publications (2)

Publication Number Publication Date
WO2010142271A2 WO2010142271A2 (de) 2010-12-16
WO2010142271A3 true WO2010142271A3 (de) 2011-07-21

Family

ID=42675482

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2010/000637 Ceased WO2010142271A2 (de) 2009-06-09 2010-06-09 Siebdruckform

Country Status (4)

Country Link
CN (2) CN102458856A (de)
DE (2) DE102009024874A1 (de)
TW (1) TW201105517A (de)
WO (1) WO2010142271A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008012829U1 (de) * 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform
DE102009024874A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform
DE102011003287A1 (de) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone
TWI485755B (zh) * 2012-11-05 2015-05-21 Inventec Solar Energy Corp 一種多層結構網版與相關方法
CN108511899B (zh) * 2018-04-02 2020-02-14 Oppo广东移动通信有限公司 印刷天线组件的制作方法、印刷天线组件及电子设备
CN110126439B (zh) * 2019-06-04 2020-09-29 沃苏特电子科技（苏州）有限公司 一种互补式网版的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (de) * 1969-12-03 1971-06-09 Siemens Ag Siebdruckschablonen und Verfahren zu ihrer Herstellung
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
EP1482547A2 (de) * 2003-05-27 2004-12-01 Xerox Corporation Abstandshalter/Maske für eine elektische Verbindung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1192452A (en) * 1967-07-25 1970-05-20 Gestetner Ltd Thermographic Stencil
TW289901B (de) * 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
DE10231698A1 (de) * 2002-03-26 2003-10-23 Fraunhofer Ges Forschung Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone
JP4375232B2 (ja) * 2005-01-06 2009-12-02 セイコーエプソン株式会社 マスク成膜方法
TWI458648B (zh) * 2006-04-07 2014-11-01 Mitsubishi Paper Mills Ltd A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin
DE102009024874A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (de) * 1969-12-03 1971-06-09 Siemens Ag Siebdruckschablonen und Verfahren zu ihrer Herstellung
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
EP1482547A2 (de) * 2003-05-27 2004-12-01 Xerox Corporation Abstandshalter/Maske für eine elektische Verbindung

Also Published As

Publication number Publication date
WO2010142271A2 (de) 2010-12-16
CN201824659U (zh) 2011-05-11
DE202010007771U1 (de) 2010-09-02
CN102458856A (zh) 2012-05-16
TW201105517A (en) 2011-02-16
DE102009024874A1 (de) 2010-12-16

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