WO2011003713A1 - Dispositif lumineux à plaquette souple - Google Patents

Dispositif lumineux à plaquette souple Download PDF

Info

Publication number
WO2011003713A1
WO2011003713A1 PCT/EP2010/058488 EP2010058488W WO2011003713A1 WO 2011003713 A1 WO2011003713 A1 WO 2011003713A1 EP 2010058488 W EP2010058488 W EP 2010058488W WO 2011003713 A1 WO2011003713 A1 WO 2011003713A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive element
light source
semiconductor light
lighting device
potting compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2010/058488
Other languages
German (de)
English (en)
Inventor
Thomas Preuschl
Steffen Strauss
Florian Zeus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to CN201080030915.7A priority Critical patent/CN102483204B/zh
Priority to US13/383,154 priority patent/US8502262B2/en
Priority to EP10723613.5A priority patent/EP2452116B1/fr
Publication of WO2011003713A1 publication Critical patent/WO2011003713A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another

Definitions

  • the invention relates to a lighting device with at least one flexible printed circuit board and a method for producing such a lighting device.
  • the lighting device has at least one flexible printed circuit board ('Flexband'), which is equipped with at least one semiconductor light source, wherein at least one populated Side of the circuit board is covered with a potting material which exposes at least one emitting surface of the semiconductor light source, and wherein the semiconductor light source is at least partially covered by an adhesive element, wherein the adhesive element (i) partially protrudes from the potting compound, (ii) laterally enclosed by the potting compound and (iii) has better adhesion with the potting compound than the semiconductor light source.
  • a possible equipped Flexband can be a Flexband of the LINEARLight series of the company OSRAM.
  • the type of semiconductor light source is basically not limited, but as an emitter, an LED or a laser diode is preferred.
  • the semiconductor light source may include one or more semiconductor emitters.
  • the semiconductor emitter or semiconductors may be mounted on a carrier on which other electronic components such as resistors, capacitors, logic devices, etc. may be mounted.
  • the semiconductor emitters can, for example, be applied to the printed circuit board by means of conventional soldering methods.
  • the semiconductor emitters can also be connected to a substrate by chip-level connection types, such as bonding (wire bonding, flip-chip bonding), etc. (“submount”), e.g. B. by equipping a substrate made of AlN with LED chips.
  • one or more submounts may be mounted on a circuit board.
  • the semiconductor emitters can at least partially also have a different jet color, z. Red (R), green (G), blue (B), amber (A) and / or white (W).
  • R red
  • G green
  • B blue
  • A amber
  • W white
  • a beam color of the light source can be tuned, and it can be set any color point.
  • semiconductor emitters it may be preferable for semiconductor emitters to differ Licher jet color can produce a white mixed light.
  • z. B. based on InGaN or AlInGaP organic LEDs (OLEDs) are generally used. Also z. B. diode lasers are used.
  • the adhesive element protrudes from the potting compound means that it lies partially below a surface of the potting compound and consequently is embedded in the potting compound with this part and partially lies above the surface of the potting compound.
  • the part lying below the surface of the potting compound is thus surrounded by the potting compound, at least laterally. Since the adhesive element at least partially covers the semiconductor light source, the semiconductor light source can thus lie below the surface of the potting compound; In other words, the potting compound can thus extend beyond the semiconductor light source.
  • the adhesive element has better adhesion with the potting compound than the semiconductor light source, cracking at the interface between potting compound and adhesive element can be suppressed compared to the adhesion between potting compound and luminescent element, whereby a more reliable IP protection can be maintained even with stronger bends , and without the potting compound impairing the luminous efficiency.
  • the adhesive element may advantageously completely cover an upper side of the respective semiconductor light source. As a result, a particularly small deformation of the adhesive element under a bending load is achieved.
  • the adhesive element can be configured for guiding light. It is then also very easy to handle.
  • an adhesive layer which does not completely cover the upper side of the respective semiconductor light source may also be provided.
  • element can be used advantageously, for. B. an annular adhesive element.
  • Such an adhesive element has the advantage that it can surround the luminous surface of the semiconductor luminous element on the outside and the luminous surface is exposed, so that there is further improved adhesion to the surface of the potting compound only between the adhesive element and the potting compound, but at the same time no absorption of light by a semiconductor light source covering material takes place.
  • the adhesive element may advantageously have a side projection covered by the potting compound. This improves the adhesion with the potting compound due to a larger common interface. In addition, handling of the adhesive element is facilitated.
  • the adhesive element can advantageously at least partially cover the respective semiconductor light source laterally relative to the potting compound. As a result, adhesion in depth regions can be further improved and thus make crack propagation into the depth along the interface of the potting compound more difficult if surface cracks already exist.
  • a wall thickness of a region of the adhesive element which laterally covers the respective semiconductor light source can be for the most part 0.2 mm to 1 mm.
  • the adhesive element may be particularly advantageous for preventing crack propagation up to the printed circuit board when the adhesive element completely covers the respective semiconductor light source laterally.
  • the semiconductor light source can also be protected against the liquid potting material during potting, in particular if the potting material is a hotmelt adhesive.
  • the adhesive element has a circumferential, upwardly bent projection or collar ('collar collar'). A crack tip can then be stopped by means of the collar, so that a lifting of the potting compound from the conductor can be severely hampered. In addition, there is a good positive connection between the adhesive element and the potting compound.
  • this collar may advantageously be present at a lower edge of the adhesive element for easy production.
  • the adhesive element has an optical element, in particular lens, which is optically connected downstream of the semiconductor light source.
  • the optical element can, for. B. for beam guidance or protection (protective lens, cover lens) serve.
  • the optical element can cover the light emission surface (s) of the semiconductor light source.
  • the optical element may advantageously be an integral or integral part of the adhesive element.
  • the adhesive element or, as part of it, the optical element can be connected to the semiconductor light source by means of an index-matching material, since such a Fresnel reflection at the surface of the optical element can be reduced.
  • a material of the adhesive element or as part thereof of the optical element may comprise macrolone, silicone and / or glass.
  • Makrolon is the brand name for a developed by Bayer AG, Germany, polycarbonate, which is transparent (coloration is possible), has a very high breaking strength, is very light and also has a high degree of dimensional stability even at high temperatures. Material combinations are also possible z.
  • the material of the adhesive element or of the optical element has a lower light absorption than the potting compound.
  • the potting compound may comprise a hot-melt adhesive (also called hot-melt adhesive or hot-melt), in particular completely made thereof, since this allows a particularly simple and inexpensive production to be achieved.
  • a hot-melt adhesive also called hot-melt adhesive or hot-melt
  • the method is for producing a lighting device and comprises at least the following steps: compressing at least one adhesive element with a respective semiconductor light source mounted on the printed circuit board; and casting the printed circuit board and the at least one adhesive element.
  • Section of a lighting device according to a first embodiment 2 shows a sectional side view of a detail of a lighting device according to a second embodiment
  • 3 shows a plan view of a tool for producing a
  • FIG. 1 shows a sectional side view of a lighting device 1 according to a first embodiment in the area of a semiconductor light source in the form of a light emitting diode 2.
  • the light emitting diode 2 is on the underside on a ribbon-shaped flexible printed circuit board ('Flexband') 3 attached and radiates mainly upwards (along the z-axis).
  • the flex band 3 is fitted on one side and has a base layer 4 made of a flexible insulating circuit board material, for. B. polyimide.
  • the flex strip 3 is covered for electrical wiring of the light emitting diode 2 and possibly other electronic components on its underside with a wiring layer 5 in the form of a copper cladding.
  • An upper side 6 of the light-emitting diode 2, which also has the luminous surface, is completely and extensively covered by an adhesive element 7.
  • the adhesive element 7 projects laterally circumferentially (in a direction perpendicular to the z-axis
  • the adhesive element 7 has a lenticular part or an integral lens 8 as well as a circumferential collar-shaped part or collar 9.
  • the populated side of the flexible strip 3 is so by means of a potting compound 10 in the form of a hot melt adhesive ('hotmelt') potted that the LED 2 and a (lower) part 11 of the adhesive element 7 are embedded in the potting compound 10.
  • a free surface 12 of the potting compound 10 is higher than the upper surface 6 of the light emitting diode and higher than an embedded part 11 of the adhesive element 7. Consequently, an (upper) part 13 of the adhesive element 7 protrudes from the potting compound 10.
  • the lens 8 is from the surface 6 of the light emitting diode 2 upwardly exiting light under negligible Light absorption in the adhesive element 7 by means of the lenticular portion 8 of the adhesive element 7 is guided substantially in the upper part 13 of the adhesive element 7 and from there to the outside.
  • the collar 9 By means of the collar 9, first, a comparatively large interface or contact surface between the adhesive element 7 and the potting compound 10 is created, which improves adhesion. Secondly, a detachment or lifting of the adhesive element 7 from the light-emitting diode 2 is prevented by the potting compound located above the collar.
  • the adhesive element 7 is connected to ensure a planar connection with the light emitting diode 2 via a layer of immersion material (o. Fig.).
  • the adhesive element 7 is now executed bell-shaped, ie, that it widens from top to bottom to the flex band 3 and the light emitting diode 2 completely covers the top and side and thus completely shields from the potting compound 10. This firstly a particularly strong adhesion and thus suppression of cracking is achieved, and secondly, a thermal load the light emitting diode 2 are reduced during a hot spillage.
  • the adhesive element 7 in turn has a lenticular part 8, which emits the radiated from an upper side of the LED 2 light without or without substantial passage through the potting compound 10 to the outside.
  • the adhesive element 7 has at its lower edge an upwardly turned collar 16, which rests on the flex belt 3. First, by means of the collar 16, a crack propagation along the interface between the adhesive element 7 and the potting compound 10 can be stopped before reaching the flexible band 3, and secondly, a good positive connection of the connection between the adhesive element 7 and the potting compound 10 can be achieved.
  • the adhesive element 7 is designed as a one-piece glass body.
  • the lens 8 may be made of the same material as the rest of the adhesive element 7, the adhesive element 7 thus consist in particular of a single material or composite material or consist as a volume of a different material volume from the rest of the adhesive element 7, the adhesive element 7 thus in particular of different material components consist.
  • a wall thickness d of the adhesive element 7 at the side of the light-emitting diode 2 in a different region from the collar 16 is in this case 0.2 mm to 1 mm.
  • 3 shows a plan view of a tool 17 for producing a lighting device, explained here by way of example with reference to the lighting device of FIG.
  • the tool 17 has a groove 18 for inserting the light strip 3.
  • recesses 19 are introduced, in which the adhesive element 7 can be inserted with that (upper) part, which is to protrude beyond the potting compound.
  • a flexible band 3 equipped with LEDs 2 is placed upside down, ie, with the side equipped with the LEDs 2 pointing in the direction of the workpiece 17, inserted into the channel 18 such that the LEDs 2 come to rest on the adhesive element 7.
  • the warm hot-melt adhesive is conducted via Anspritzdome 20 to the channel 18, as indicated by the arrow.
  • the lighting device is separated from the tool 17.
  • the adhesive elements can also be placed directly on the folded Flexband, which has the advantage that the Flexband 3 need not be reversed.
  • printed circuit boards equipped with light sources on both sides can also be further processed to illuminate lighting devices on both sides.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

La présente invention concerne un dispositif lumineux (1) comportant au moins une plaquette souple (3) équipée d'au moins une source lumineuse semi-conductrice (2). L'une au moins des faces de la plaquette (3) est garnie d'un matériau d'encapsulation (10) laissant apparente au moins une surface de rayonnement de la source lumineuse semi-conductrice (2), le dessus de cette source lumineuse (2) étant recouvert au moins en partie d'un élément adhésif (7). En l'occurrence, cet élément adhésif (7) dépasse de la masse d'encapsulation (10), est entouré avec adhérence sur les bords par la masse d'encapsulation (10), et présente une meilleure adhérence à la masse d'encapsulation (10) que la source lumineuse semi-conductrice (2).
PCT/EP2010/058488 2009-07-09 2010-06-16 Dispositif lumineux à plaquette souple Ceased WO2011003713A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201080030915.7A CN102483204B (zh) 2009-07-09 2010-06-16 具有柔性印刷电路板的发光装置
US13/383,154 US8502262B2 (en) 2009-07-09 2010-06-16 Luminous device having a flexible printed circuit board
EP10723613.5A EP2452116B1 (fr) 2009-07-09 2010-06-16 Dispositif d'éclairage comportant un circuit imprimé flexible

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009032424A DE102009032424A1 (de) 2009-07-09 2009-07-09 Leuchtvorrichtung mit einer flexiblen Leiterplatte
DE102009032424.0 2009-07-09

Publications (1)

Publication Number Publication Date
WO2011003713A1 true WO2011003713A1 (fr) 2011-01-13

Family

ID=42332489

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/058488 Ceased WO2011003713A1 (fr) 2009-07-09 2010-06-16 Dispositif lumineux à plaquette souple

Country Status (5)

Country Link
US (1) US8502262B2 (fr)
EP (1) EP2452116B1 (fr)
CN (1) CN102483204B (fr)
DE (1) DE102009032424A1 (fr)
WO (1) WO2011003713A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013007641A1 (de) * 2013-05-06 2014-11-06 Paulmann Licht Gmbh Beleuchtungsanordnung
DE102013208388A1 (de) * 2013-05-07 2014-11-13 Osram Gmbh Flexible Leiterplatte
US9642566B2 (en) 2013-10-04 2017-05-09 General Electric Company Flexible embedded sensor arrays and methods of making the same
US9582237B2 (en) 2013-12-31 2017-02-28 Ultravision Technologies, Llc Modular display panels with different pitches
US20150187237A1 (en) 2013-12-31 2015-07-02 Ultravision Holdings, Llc System and Method for a Modular Multi-Panel Display
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display
US9207904B2 (en) 2013-12-31 2015-12-08 Ultravision Technologies, Llc Multi-panel display with hot swappable display panels and methods of servicing thereof
US9416551B2 (en) 2013-12-31 2016-08-16 Ultravision Technologies, Llc Preassembled display systems and methods of installation thereof
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
JP6191541B2 (ja) * 2014-05-20 2017-09-06 株式会社デンソー 撮像装置のレンズモジュール
US10706770B2 (en) * 2014-07-16 2020-07-07 Ultravision Technologies, Llc Display system having module display panel with circuitry for bidirectional communication
DE102015204057B4 (de) * 2015-03-06 2024-12-12 Inventronics Gmbh Herstellen eines Beleuchtungsmoduls
US20170356640A1 (en) 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
EP4072632A1 (fr) * 2019-12-11 2022-10-19 Sanofi Système modulaire pour un dispositif d'administration de médicament avec des composants électroniques et des modules correspondants et procédé

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761720A (en) * 1987-05-14 1988-08-02 Wolo Manufacturing Corporation Illuminated tape
US5559681A (en) * 1994-05-13 1996-09-24 Cnc Automation, Inc. Flexible, self-adhesive, modular lighting system
EP0760448A2 (fr) * 1995-08-28 1997-03-05 Stantech Ligne éclairante en un pièce à diodes émettrices de lumière

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188527B1 (en) * 1999-04-12 2001-02-13 Hewlett-Packard Company LED array PCB with adhesive rod lens
JP2009051876A (ja) * 2007-08-23 2009-03-12 Three M Innovative Properties Co コーティング組成物及びそれを使用した物品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761720A (en) * 1987-05-14 1988-08-02 Wolo Manufacturing Corporation Illuminated tape
US5559681A (en) * 1994-05-13 1996-09-24 Cnc Automation, Inc. Flexible, self-adhesive, modular lighting system
EP0760448A2 (fr) * 1995-08-28 1997-03-05 Stantech Ligne éclairante en un pièce à diodes émettrices de lumière

Also Published As

Publication number Publication date
DE102009032424A1 (de) 2011-01-13
US8502262B2 (en) 2013-08-06
EP2452116A1 (fr) 2012-05-16
EP2452116B1 (fr) 2018-09-05
CN102483204B (zh) 2015-01-21
US20120112235A1 (en) 2012-05-10
CN102483204A (zh) 2012-05-30

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