WO2011053093A2 - Plaque d'impression d'affichage à cristaux liquides, procédé de fabrication de celle-ci, procédé d'impression utilisant celle-ci, et procédé de fabrication d'un moule maître de réplication et d'une plaque d'impression de réplication à l'aide de celle-ci - Google Patents

Plaque d'impression d'affichage à cristaux liquides, procédé de fabrication de celle-ci, procédé d'impression utilisant celle-ci, et procédé de fabrication d'un moule maître de réplication et d'une plaque d'impression de réplication à l'aide de celle-ci Download PDF

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Publication number
WO2011053093A2
WO2011053093A2 PCT/KR2010/007662 KR2010007662W WO2011053093A2 WO 2011053093 A2 WO2011053093 A2 WO 2011053093A2 KR 2010007662 W KR2010007662 W KR 2010007662W WO 2011053093 A2 WO2011053093 A2 WO 2011053093A2
Authority
WO
WIPO (PCT)
Prior art keywords
printing plate
pattern
liquid crystal
crystal display
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/007662
Other languages
English (en)
Korean (ko)
Other versions
WO2011053093A3 (fr
Inventor
박재석
이용인
구찬규
홍범선
강현욱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090105173A external-priority patent/KR20110048395A/ko
Priority claimed from KR1020090105245A external-priority patent/KR20110048605A/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of WO2011053093A2 publication Critical patent/WO2011053093A2/fr
Publication of WO2011053093A3 publication Critical patent/WO2011053093A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making

Definitions

  • the present invention relates to a printing plate for a liquid crystal display device and a manufacturing method thereof.
  • a device such as a thin film transistor is provided in each pixel to drive the flat panel display device.
  • the PR pattern forming process is an important process that greatly affects the performance of the manufactured device. Accordingly, researches to improve the performance of devices have been recently conducted. In particular, various attempts have been made to improve the performance of devices by forming fine metal patterns.
  • PR photoresist
  • the most common PR pattern forming process is to apply photoresist (PR), which is a photosensitive material, and to expose and develop the photoresist using a mask.
  • PR photoresist
  • the photoresist process since the photoresist process must be performed separately to form each pattern, the manufacturing cost increases, which is undesirable. Therefore, in recent years, a method of forming a PR pattern using a printing method has been proposed.
  • the printing method of the photoresist may include a second transparent material which is a printed object directly on the first transparent insulating substrate 110 on which a printing pattern P 1 is formed and used as a printing plate.
  • the photoresist pattern P2 is once transferred to the blanket 100, which is a surface of which is made of silicon rubber or the like, and serves as a medium.
  • the photoresist pattern P2 is transferred again using the insulating substrate 120 as a transfer target.
  • FIG. 2 (a) depositing a metal film 111 on the first transparent insulating substrate 110, and (b) photoresist 112 to pattern the metal film 111. ), (C) etching the metal film 111 through wet etching, (d) stripping the photoresist 112, (e) first transparent insulating substrate 110 Etching to form the print pattern (P1), (f) etching and removing the metal film 111.
  • the wet etching used in the above-described manufacturing process has an isotropic etching characteristic showing a uniform etching characteristic regardless of the crystal plane direction, the minimum line width (CD; The loss of critical dimension is large, which makes it difficult to manufacture a precise printed plate having a fine pattern. That is, as shown in FIG. 2C, the printing pattern P 1 on the first transparent insulation substrate 110 is ideally formed to have an accurate width of a1. However, when the printing plate is manufactured through wet etching, As shown in (e) of FIG. 2, a loss by a2 occurs on both sides.
  • the left and right loss widths a2 increase in accordance with the etching depth in accordance with the characteristics of the isotropic etching, so that as shown in FIG.
  • the depth b1 is set to "1”
  • the printing pattern P 1 etched on the printing plate has a narrower width and a deeper depth, and a greater ratio of depth and width results in better printing characteristics.
  • the width becomes wider as the depth is deeper. Therefore, it is disadvantageous to manufacture a printing plate having a fine pattern, which results in a problem that it is difficult to improve pattern resolution and transfer characteristics.
  • an object of the present invention is to form a photosensitive pattern using photolithography, to enable the production of a printing plate through electroplating, to increase the efficiency of the implementation of the fine pattern
  • the present invention provides a manufacturing process capable of improving the resolution and transfer characteristics of a pattern and significantly reducing the manufacturing cost of a printing plate for a liquid crystal display device.
  • Yet another object of the present invention is to dry-etch a glass substrate directly using a metal pattern as an etch mask, thereby implementing a fine pattern, thereby improving the resolution, and increasing the ratio of the depth and width of the fine pattern to improve transfer characteristics. It can be, and to provide a manufacturing process that can reduce the manufacturing cost of the printing plate.
  • the solution of the technical problem according to the object of the present invention is to increase the efficiency of the implementation of the fine pattern, and to improve the resolution and transfer characteristics of the pattern by using the method of patterning through photolithography and electroplating or dry etching.
  • a photosensitive pattern is formed using photolithography, and a printing plate can be manufactured by electroplating, thereby increasing the efficiency of realizing fine patterns, improving the resolution and transfer characteristics of the pattern, and a liquid crystal display device.
  • a manufacturing process that can significantly reduce the manufacturing cost of the printing plate for.
  • the manufacturing process according to the present invention is very easy to implement a fine pattern compared to the manufacturing process using a conventional wet etching or dry etching process, it is effective to improve the transfer characteristics of the pattern by increasing the ratio of depth and width have.
  • the photoresist may have a selectivity to be adhered well, thereby achieving excellent transfer characteristics.
  • 1 to 3 is a view showing a manufacturing method of a printing plate according to the prior art.
  • 6 and 7 illustrate a manufacturing process and a printing plate replication process of the master mold for the replication process of the printing plate according to the present invention.
  • FIG. 8 and 9 illustrate a manufacturing process flow chart and process diagram of a printing plate according to another embodiment of the present invention.
  • a photosensitive pattern is formed on a photomask, and through this, electroplating is used to efficiently manufacture a printing plate and a replica thereof, thereby implementing a fine pattern, and The point is to make it possible to improve the resolution and transfer characteristics.
  • the manufacturing process of the printing plate according to the present invention is largely the first step of forming a photosensitive pattern of the printing plate pattern on the photomask, the second step of forming a seed layer on the photomask, and the printing plate by electroplating on the seed layer It includes three steps to form.
  • the glass substrate itself is dry-etched to have the same surface characteristics as that of the transparent insulating substrate of a liquid crystal display device generally used. It is possible to provide an efficient manufacturing process while manufacturing a printing plate having a selectivity with excellent transfer characteristics that are well adhered.
  • the manufacturing process of the first step may be implemented in the following process.
  • a photomask in which a specific pattern is formed on the transparent substrate is prepared in step S1.
  • the specific pattern of the photomask is a structure having a light shielding pattern 20 made of a light blocking material such as Cr or a transflective material on the transparent substrate 10.
  • a photosensitive material is coated on the photomask, and a photosensitive pattern is realized through an exposure phenomenon.
  • the photoresist 30 is coated on the photomask (step S21), and the photoresist 30 is exposed to form a photosensitive pattern.
  • a photosensitive pattern 30 having a structure in which a photosensitive material is stacked is formed on the light shielding pattern 20 on the photomask as shown in step S23.
  • step S 3 the seed layer 40 is deposited on the photosensitive pattern and the photomask (step S 31). Then, electroplating is performed on the region where the seed layer 40 is formed (step 32).
  • the seed layer is a metal seed layer of the metal material of Cr, Au, Ti, Ta, Pt, Ni, Cu, Al, Zn, Fe, Co, W, etc. are all applicable, but one to five of the above metals It can also be deposited in combination.
  • the method for depositing the metal seed layer is different depending on the components of the seed metal to be deposited and the components of the substrate, but physical vapor deposition (PVD) methods such as sputtering or evaporating Uniform deposition is possible.
  • PVD physical vapor deposition
  • sputtering or evaporating Uniform deposition is possible.
  • the use of a Cu layer will be described as an example.
  • the electroplating may be Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, P, etc., in particular, mechanical properties and chemical stability, such as ease of plating and the strength, hardness, elasticity of the plating film Plating can be performed using this excellent Ni, Ni-W, or Ni-Co component.
  • the transfer material film 60 may be coated on a region where the pattern of the printing plate 50 is formed.
  • a material of Si-base having good transfer characteristics may be used.
  • materials such as a-Si, SiN x , and SiO x may be used.
  • the material of Si-base may be applied in addition to the above.
  • the depth T 1 of the pattern of the printing plate manufactured by the above-described manufacturing process is implemented to be greater than or equal to the height of the pattern of the photomask.
  • 6 and 7 are schematic process diagrams showing a process of manufacturing a replica printing plate using the printing plate manufactured by the first embodiment.
  • a passivation film 70 is formed on the upper surface of the manufactured printing plate 50 (P 1 step), and the master mold 80 is first implemented through electroplating on the upper surface of the passivation film (P 2 step). ). After the electroplating is completed, by separating the above-described printing plate 50 can form a master mold 80 (P 3 step).
  • a passivation layer 81 is again formed on the upper surface of the master mold 80 (step Q 1), and a replica printing plate 90 is implemented by performing pre-plating on the passivation layer (step Q 2). .
  • replica printing plate 90 may be separated from the master mold 80 to produce a replica printing plate.
  • a replica printing plate 90 has a very simple process and a micropattern is realized, and an advantage of producing a mass-produced product having an improved resolution is realized.
  • Another printing plate or replica printing plate in the above-described manufacturing process is formed in the same structure, it can be implemented in the following configuration.
  • the printing plate according to the present invention includes at least one or more of a printing plate body 91 having a predetermined depth d1 and width d2 formed on an upper surface of the printing plate body. It consists of a printing plate pattern 92.
  • the printing plate body and the printing plate pattern may be any one of Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, P, or a combination of two or more thereof.
  • the ease of plating and the strength of the plating film, As described above, the mechanical properties such as hardness, elasticity, and the like, and the chemical stability of Ni, Ni, and Ni are excellent.
  • the transfer material film may be coated on the surface of the printing plate pattern
  • the transfer material film may be a material of Si-base, for example, materials such as a-Si, SiN x , SiO x may be used. May be as described above.
  • the manufacturing process of the printing plate according to the present invention is easy to implement a fine pattern by solving the problem of the loss of the minimum line width occurred in the conventional wet etching process, in particular, by increasing the ratio of the depth and width of the fine pattern, the transfer characteristics of the pattern It will be possible to improve.
  • it is possible to duplicate the printing plate in a very easy process the manufacturing process is simplified, thereby reducing the manufacturing cost there is an advantage.
  • the method of applying photolithography and electroplating in the second embodiment, a method of forming a replica printing plate using the first embodiment, and in the third embodiment, photolithography is used. It implements a process of forming a printing plate by applying dry etching directly to a transparent substrate.
  • the metal pattern layer 20 is formed on the transparent substrate 10 (step S1).
  • the metal pattern layer may be formed using various methods such as sputtering, chemical vapor deposition (CVD), evaporation, and electroplating.
  • the metal pattern layer may be made of a material such as Cr, Cu, Ni, Mo, amorphous silicon (a-Si), poly-Si to serve as a mask for dry etching, in one embodiment of the present invention It is preferable to form the layer formed by the.
  • step S 2 a photoresist is applied to the upper surface of the metal pattern layer 20 (step S 21), and then exposed and developed and patterned (step S 22).
  • the metal pattern layer 20 is etched to form a metal pattern (step S23).
  • the etching process of the metal pattern layer may be implemented by a dry or wet etching method.
  • step S3 the photoresist pattern is preferably removed.
  • step S4 dry etching is performed on the transparent substrate itself using the above-described metal pattern as a mask pattern.
  • the dry etching described above uses the ICP-RIE mode, and the gas used may be implemented using C 4 F 8 and O 2 .
  • the ratio of depth can only be formed at a ratio of 1 or less to the width, and in the present invention, a ratio of depth to depth can be formed at a ratio of 0.5 or more.
  • the pattern of the printing plate embodied by the present invention is able to implement a range of (0.5 ⁇ 6): the ratio of the width (d2) to the etched depth (d1), which is the conventional wet etching described above Etching depth and left and right loss width due to isotropic etching generated at the same time occurs to overcome the limitation of the difficulty of realizing the minimum line width, the width of the printed pattern etched on the printing plate can be formed narrow and deep.
  • the printing plate pattern according to the present invention can be achieved excellent printing characteristics by remarkably increasing the ratio of depth and width.
  • the manufacturing method of the printing plate according to the present invention is easier to implement a fine pattern than the conventional wet etching method, and the advantage of improving the transfer characteristics by increasing the ratio of the etched depth and width.
  • the dry etching of the conventional transparent substrate itself is performed, so that the printing plate has the same surface characteristics as that of the transparent insulating substrate of the liquid crystal display device, so that the adhesion ratio of the photoresist can be realized to have a very good selection ratio. .
  • the present invention can greatly reduce the manufacturing cost in the manufacturing process of the printing plate for the liquid crystal display device, in particular, it is possible to increase the efficiency of the implementation of the fine pattern, and to improve the resolution and transfer characteristics of the fine pattern.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Liquid Crystal (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une plaque d'impression afin d'imprimer un motif de résine lors de la fabrication d'un affichage à cristaux liquides. Le procédé comprend les étapes consistant à : former un motif photosensible d'un motif de plaque d'impression sur un masque photo, former une couche d'amorce sur le masque photo, et former une plaque d'impression sur la couche d'amorce par électroformage. En variante, un motif de plaque d'impression est formé sur un substrat transparent par attaque à sec en utilisant un motif métallique en qualité de masque sur le substrat transparent. Selon la présente invention, les coûts de fabrication peuvent être grandement réduits lors du processus de fabrication d'une plaque d'impression pour affichage à cristaux liquides. Plus particulièrement, il est possible d'augmenter l'efficacité dans le cas de motifs fins, ainsi que la résolution et les propriétés de réplication des motifs fins.
PCT/KR2010/007662 2009-11-02 2010-11-02 Plaque d'impression d'affichage à cristaux liquides, procédé de fabrication de celle-ci, procédé d'impression utilisant celle-ci, et procédé de fabrication d'un moule maître de réplication et d'une plaque d'impression de réplication à l'aide de celle-ci Ceased WO2011053093A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2009-0105173 2009-11-02
KR1020090105173A KR20110048395A (ko) 2009-11-02 2009-11-02 액정표시장치용 클리체 및 그 제조방법, 이를 이용한 복제용마스터몰드 및 복제 클리체의 제조방법
KR1020090105245A KR20110048605A (ko) 2009-11-03 2009-11-03 액정표시장치용 클리체 및 그 제조방법
KR10-2009-0105245 2009-11-03

Publications (2)

Publication Number Publication Date
WO2011053093A2 true WO2011053093A2 (fr) 2011-05-05
WO2011053093A3 WO2011053093A3 (fr) 2011-09-15

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PCT/KR2010/007662 Ceased WO2011053093A2 (fr) 2009-11-02 2010-11-02 Plaque d'impression d'affichage à cristaux liquides, procédé de fabrication de celle-ci, procédé d'impression utilisant celle-ci, et procédé de fabrication d'un moule maître de réplication et d'une plaque d'impression de réplication à l'aide de celle-ci

Country Status (1)

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WO (1) WO2011053093A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203958A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 一种电铸模板的制作工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11221975A (ja) * 1998-02-06 1999-08-17 Dainippon Printing Co Ltd グラビア印刷版
KR100763170B1 (ko) * 2001-10-04 2007-10-08 엘지.필립스 엘시디 주식회사 액정표시장치용 인쇄장비 및 이를 이용한 인쇄방법
KR100716304B1 (ko) * 2005-06-30 2007-05-08 엘지.필립스 엘시디 주식회사 액정 표시 장치용 인쇄판 및 그의 제조 방법
JP2009014828A (ja) * 2007-07-02 2009-01-22 Nec Lcd Technologies Ltd 液晶表示装置の製造方法およびそれによって得られる液晶表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203958A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 一种电铸模板的制作工艺

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