WO2012104023A1 - Procédé de fabrication d'un stratifié à mise en contact électrique conductrice - Google Patents

Procédé de fabrication d'un stratifié à mise en contact électrique conductrice Download PDF

Info

Publication number
WO2012104023A1
WO2012104023A1 PCT/EP2012/000218 EP2012000218W WO2012104023A1 WO 2012104023 A1 WO2012104023 A1 WO 2012104023A1 EP 2012000218 W EP2012000218 W EP 2012000218W WO 2012104023 A1 WO2012104023 A1 WO 2012104023A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal layer
recess
metal
laminate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/000218
Other languages
German (de)
English (en)
Inventor
Andreas Hinrich
Tihomir Klajic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Deutschland GmbH and Co KG
Original Assignee
Heraeus Materials Technology GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Technology GmbH and Co KG filed Critical Heraeus Materials Technology GmbH and Co KG
Publication of WO2012104023A1 publication Critical patent/WO2012104023A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]

Definitions

  • the invention relates to a method for producing a laminate for contacting at least one electronic component in which an insulating layer is arranged between a first metal layer and a second metal layer, the metal layers are contacted with one another in at least one contact region, at least one recess is produced in the insulating layer , the metal layers are laminated with the insulating layer.
  • the invention also relates to a laminate for contacting an electronic component.
  • the invention also relates to the use of such a laminate.
  • circuit substrates for example, printed circuit boards or stamped-laminated substrates are used.
  • the through-connection from the top to the bottom of such a board is often achieved by recesses in the board. These recesses may also receive conductive contacts of on-board electronic components that pass through the recesses and thereby provide a conductive connection of the two sides. As an alternative to this, the recesses on their surface may also comprise a continuous metallic layer as through-connection.
  • a connection (via) of two metal layers can be made to bridge a separating layer (insulator).
  • separating layer insulator
  • clocking may be employed within a multi-layer (package) carrier substrate, which is an electrical circuit and includes defined bottom pads for contacting and receiving electrical components requiring heat critical mounting and operating conditions, such as integrated circuits.
  • the plated-through hole can lie directly below the electronic component or directly next to it, if an improved heat dissipation from the electrical component to the lower layer is to be produced, or at any point if it is only about the electrical contacting of the electrical component.
  • a method for producing a metal-plastic laminate in which a metal foil is formed by embossing or deep drawing to form a trough and then a plastic film is laminated to the shaped metal foil.
  • the metal contact surface profile is retained.
  • a metal foil is attached to a plastic film and the metal foil is then shaped by embossing or deep drawing to form a trough.
  • the via is made possible by buckling of the metal foil in the region of the recess of the plastic film.
  • the actual via can be produced with a further conductive layer on the plastic film, which is conductively connected to the metal foil in the region of the trough.
  • a further disadvantage is that the quality of the via is not secure and there is no guarantee that even an electrically and / or thermally conductive connection is created.
  • a further disadvantage is that the application of the conductive layer must take place in a second work step.
  • a through-contact of two metal foils, between which a plastic film is arranged, is achieved by a method for producing a laminate for contacting an electronic component according to DE 102 05 521 A1.
  • two metal layers are laminated successively or simultaneously with an insulating layer.
  • a first metal layer comprises an embossment or bulge, wherein when laminating a second level metal layer with the insulating layer to make electrical contact between the two metal layers.
  • Another disadvantage is that it can not be ascertained whether an electrically and / or thermally conductive connection has been produced. Due to the small thicknesses of the metal layers and the much larger insulator layer, the vias used, for example, in printed circuit board technology do not have the properties that a multilayer carrier substrate made of laminated metal and insulator layers with through-contacts can exhibit, in particular with regard to heat conduction. Process monitoring, for example during laser welding, is not possible if the lower metal layer is not allowed to be damaged. Without a destructive test it is not possible to test the connection of both metal layers or their quality.
  • the object of the invention is to overcome disadvantages of the prior art.
  • a nondestructive testing of the connection should be made possible.
  • a high quality of the via with respect to the heat conduction and / or the electrical line should be ensured.
  • An efficient and cost-effective manufacturing process is to be ensured in order to be able to offer inexpensive laminates with verified and easily verifiable plated-through holes.
  • the object of the invention is achieved in that at least one recess in the region of the recess is produced in the first metal layer, the first metal layer and the second metal layer are conductively connected to one another in the region of the recess and the connection of the two metal layers is checked.
  • the contact zone is accessible, which changes by the connection of the metal layers.
  • the difference between the recess before and after the connection can be measured. If the state of the recess before the connection is known, that is, for example, stored in a memory, it can be provided that the recess or the connection therein is measured only after the construction of the connection or after the structure of the via. It can be provided that at least one recess and a recess are arranged at least partially overlapping.
  • the metal layers are firmly bonded together.
  • the distance of the two metal layers from one another is reduced in such a way that the two metal layers touch each other.
  • a sintering of the metal layers can be carried out according to the invention with a silver-sintered paste.
  • At least one recess is produced in at least one contact region.
  • the laminate with the electronic component is laminated with a plastic layer at least on the side with the electronic component.
  • a lens is mounted in the region of the recess or cavity, in particular above the first metal layer.
  • a development of the invention provides that in the first metal layer at least one embossing and / or at least one bulge is produced in the contact region, wherein in the regions of the at least one embossing and / or bulging the distance between the two metal layers is reduced to one another, preferably up to is reduced to zero, wherein in the first metal layer in the region of an embossing and / or bulging at least one recess is arranged.
  • a metal layer is made such that the shape of the bulge is given without the metal layer would have to be deformed or formed to form the bulge.
  • an embossing is to be understood in the present case that the shape of the embossing is caused by a deformation or deformation of a metal layer.
  • the metal layer can be previously flat. It can be provided that the dimensions of at least one embossing and / or at least one bulge for receiving at least one electronic component sufficient or sufficient, wherein in the first metal layer in the region of an embossing and / or bulging at least one recess is arranged.
  • the at least one electronic component is completely received in the at least one embossing and / or bulging and, based on the height (H) of the electronic component, at least partially received in the embossing or the bulging.
  • At least one electronic component is electrically and / or thermally conductively connected to the second metal layer.
  • first metal layer and the second metal layer are electrically and / or thermally conductively connected to one another.
  • a compound is generated, which completely covers the second metal layer in the recess, and is checked in the review of the connection of the two metal layers whether the second metal layer is completely covered.
  • the complete coverage makes it particularly easy to determine if the connection has been made as desired since it is much easier to determine if the surface of the second metal layer is completely covered than to evaluate how much the measurable surface of the second metal layer has decreased.
  • connection of the two metal layers is checked by an optical method, by a scanning method, by X-ray fluorescence and / or by an electron beam.
  • a measurement of the emissivity or the reflection characteristics can be used.
  • it can be easily evaluated in which direction light of a directional light source, such as a laser, is reflected in the region of the recess. While the second metal layer in the Covered state is flat, after soldering, welding or sintering, the surface in this area is curved and / or rough. The reflection of the light thus changes, from which a via can be determined. Alternatively or additionally, it can be determined non-destructively with ultrasound how well the two metal layers have joined together.
  • a stamped lamination is used to connect the metal layers to the insulating layer and at the same time at least one embossment, at least one recess, at least one bulge and / or at least one recess produce.
  • At least one recess, at least one embossing and / or at least one bulge is or are produced by embossing or bending the first metal layer.
  • At least one embossing and / or bulging comprising at least one recess in the first metal layer is positioned in at least one existing recess in the insulating layer.
  • the metal layers are joined to one another by welding, soldering, bonding with a conductive adhesive or composite in at least one contact region, preferably by laser welding.
  • At least one electronic component is connected to the first and the second metal layer with an electrically conductive connecting means, preferably by gluing, more preferably with a conductive adhesive, welding, soldering or sintering, particularly preferably with a silver sintering paste.
  • an electrically conductive connecting means preferably by gluing, more preferably with a conductive adhesive, welding, soldering or sintering, particularly preferably with a silver sintering paste.
  • a method according to the invention can be carried out in a particularly simple manner if the generation of at least one embossing and / or at least one bulging in the first metal layer takes place in one step with a contacting of the electronic component with the first metal layer.
  • At least one chip, at least one LED and / or at least one sensor is or is used as the at least one electronic component.
  • At least one electronic component is connected over a large area with the second metal layer, and is thereby preferably thermally coupled well to the second metal layer.
  • a plastic layer in particular a plastic film is used as an insulating layer, preferably comprising glass fiber reinforced plastic based on epoxy, PET or Pl film.
  • the second metal layer is preferably chosen to be large compared to the electronic component.
  • At least one of the metal layers is made from copper, aluminum and / or a copper alloy, preferably from a copper-tin alloy.
  • a development of the invention provides that the condition of the recess after the connection of the metal layers is measured to check the connection and is compared with a desired state, a measurement before the connection of the metal layers and / or stored in a memory value. These measures make it possible to automate the testing process in the production of the laminates.
  • a further particularly preferred embodiment of a method according to the invention can provide that, for checking the connection, a surface property of the second metal layer within the recess is measured, in particular a change in a profiling, a texture and / or the dissolution or change of a coating of the second metal layer.
  • a profiling, a coating and / or a texture is provided on the surface of the second metal layer, which faces the first metal layer.
  • a profiling, a coating and / or a texture is provided on the surface of the second metal layer, which faces the first metal layer.
  • a surface finish is advantageous.
  • a particularly cost-effective embodiment of the method results if it is provided that during the production of the via in the recess, it is measured whether the surface of the second metal layer in the recess changes sufficiently. If a sufficient change in surface area has been measured, the fabrication of the via can be completed and the fabrication of the next via started. As a result, a particularly time-efficient mass production of laminates with plated-through holes can be achieved.
  • a laminate for contacting an electronic component produced by a method according to one of the preceding claims, comprising a first metal layer and a first metal layer substantially parallel arranged second metal layer, of the first metal layer by an insulating Layer is partially separated, wherein at least one recess is arranged in the insulating layer and the first metal layer and the second metal layer in the recess are interconnected such that the second metal layer is covered, in particular completely covered, so that the Me tallstoffmaschineen thermally and / or electrically conductively connected to each other via a via.
  • At least one recess and a recess are arranged at least partially overlapping.
  • the first metal layer comprises at least one embossing and / or at least one bulge, wherein the metal layers in the region of the at least one embossing and / or the at least one bulge are thermally and / or electrically conductively connected via the plated-through hole.
  • a further embodiment of the invention provides that the second metal layer is 0.1 mm to 2 mm thick, preferably 0, 1 mm to 0.5 mm, particularly preferably 0.3 mm.
  • the first metal layer and / or the insulating layer 10 is up to 300 ⁇ m in thickness, preferably 50 ⁇ m to 200 ⁇ m, particularly preferably 100 ⁇ m.
  • At least one recess is arranged in at least one embossing and / or bulging.
  • a development of the invention provides that at least one recess, at least one embossing and / or at least one bulge has or have a cross section between 0.02 mm and 3 mm, preferably between 0.1 mm and 1 mm.
  • the thickness of the metal layers is between 0.02 mm and 3 mm, preferably between 0.04 mm and 2 mm, wherein preferably the second metal layer is thicker than the first metal layer.
  • the metal layers are joined together by welding, soldering, gluing with a conductive adhesive or sintering in at least one contact region.
  • at least one electronic component is connected to the second metal layer with an electrically conductive connecting means, preferably by soldering, sintering, particularly preferably with a silver sintering paste, or gluing, particularly preferably with a conductive adhesive.
  • a development of the invention provides that at least one electronic component is a chip, an LED and / or a sensor.
  • At least one electronic component is connected over a large area to the second metal layer and is therefore preferably thermally coupled to at least one metal layer, in particular the second metal layer.
  • the insulating layer is a plastic layer, in particular a plastic film, preferably comprising glass-fiber-reinforced plastic based on epoxy, PET or Pl film.
  • the second metal layer is thicker than the first metal layer.
  • the metal layers comprise copper, aluminum and / or a copper alloy, particularly preferably comprising a copper-tin alloy, or consist of copper, aluminum and / or a copper alloy, particularly preferably a copper-tin alloy.
  • the object of the invention is also achieved by the use of such a laminate as a board or flexible carrier substrate for electrical circuits with chips, sensors, LEDs, power components, mobile components, controllers or regulators.
  • the invention is based on the surprising finding that the accessibility of the recess and the surface of the second metal layer arranged therein make it possible to check whether it has been covered and / or altered during the construction of a via. From this it can be determined with the simplest and also automated methods, if the via was successful. Simple, non-destructive measuring methods can be used. In particular optical Methods are useful for determining very quickly and efficiently whether or not a through-connection has been successful.
  • the laminate may be discarded or another attempt is made to make a via in the same location.
  • the invention thus provides a process-reliable through-connection of a laminate for an electronic component.
  • the recess and the recess can be punched or generated by a laser.
  • the impression can be round or square.
  • the electronic component By the direct connection of an electronic component with the second metal layer, the electronic component can deliver its heat directly to the second metal layer. From there, the heat can be removed from the laminate. It is particularly advantageous if the electronic component, in particular with a large outer surface, is connected to a large area with a thin layer of a good heat-conducting connection means with the second metal layer.
  • the connection means may also be a material welded together from the two metal layers.
  • the recess according to the invention is particularly easy to produce when a stamped lamination technology is used for the production.
  • a contact element of the electronic component or the component itself can be used directly in the recess and connected there to the underlying second metal layer, via which a heat dissipation, in contrast to the first metal layer can be done directly.
  • the heat and / or the current can be transmitted from the at least one electronic component either directly into the second metal layer or via a connection means which conducts both current and a good heat conductor, such as copper or copper alloys.
  • the heat flow or the electric current must therefore only overcome one boundary layer or two boundary layers. Each boundary layer scatters phonons and thus acts as a thermal resistance as well as an electrical resistance.
  • a laminate produced according to the invention or a laminate according to the invention enables the use of electronic components with high performance.
  • the connecting means soldder, conductive adhesive, sintered paste or also the welding
  • the connecting means can be used to produce a thermally conductive and electrically conductive connection of the two metal layers or to connect the component directly to the second metal layer.
  • the physical framework conditions required for the installation of the electronic component can also be suitable for embossing the first metal layer and / or for forming the through-connection of the two metal layers. This makes it possible to perform the installation of the electronic component and the production of the via in a manufacturing step. In addition, it can be ensured that the positioning of the electronic component takes place at the desired location. The force required when inserting or pressing in the electronic component is thus simultaneously used to produce the embossing and / or deep-drawing of the first metallic layer.
  • connection means used for contacting and connecting the electronic component to the metal layers may also be used to support the entire structure.
  • connection surfaces desired by the user can be retained on the underside of the assemblies, without these being influenced or impaired by additional apertures or holes, for example due to penetration welding.
  • the upper first metal layer which is often thinner, complex structures for the electrical circuit and via can be made easier. For example, smaller slot and web widths are possible.
  • laminates according to the invention also the construction technique and the connection technology for the electronic component.
  • an improvement in process reliability is achieved by the present invention.
  • An optical control of the via is made possible by the introduced recess. On the basis of the state of the recess, a connection between the upper first metal layer and the lower second metal layer can be detected directly.
  • a via which has been realized by means of a welding process (for example by laser) is particularly suitable with regard to downstream processes or process steps (for example for a temperature stability). Laser welding is a particularly precise, fast and therefore preferred method of through-hole.
  • the via can be realized very small.
  • these can be arranged in the recess on the edge in order to place an electrical component in the center of the embossing.
  • FIG. 1 shows a schematic cross-sectional view of a laminate according to the invention
  • FIG. 2 shows a schematic cross-sectional view of a laminate according to the invention after through-plating.
  • FIG. 1 shows a schematic cross-sectional view of a laminate 1 according to the invention before through-plating or a schematic cross-sectional view of a laminate 1 produced by a method according to the invention.
  • the laminate 1 comprises a first metal layer 4, a second metal layer 6 and an insulator 8 as an insulating layer between them both metal layers 4, 6.
  • the metal layers 4, 6 are applied to the insulator 8 by lamination technology.
  • an embossment is provided, which is produced by embossing, thermoforming or another deformation technique in a previously planar metal layer 4.
  • a bulge may be provided, which is formed during the production of the first metal layer 4.
  • a bulge can also be generated in that the first metal layer 4 is immediately brought into a corresponding shape.
  • the first metal layer 4 can be applied, for example, to a corresponding shape or directly on the insulator 8, for example by vapor deposition or casting.
  • a recess 9 is provided in the insulator 8 and a recess 10 is provided in the first metal layer 4.
  • the recess 9 in the insulator 8 may either be previously provided or may be generated together with the deformation of the first metal layer 4.
  • the use of a stamped lamination technology is particularly suitable for this purpose.
  • an electronic component (not shown) can be arranged, which is connected to the bottom side via a connecting means conductive with the second metal layer 6 and laterally with the first metal layer 4.
  • Suitable connecting means are solders, conductive adhesives and conductive sinter pastes.
  • the connection means can also be produced by welding the two metal layers 4, 6.
  • the electronic component 8 may be a chip, an LED, an integrated circuit, in particular power circuits such as transistor circuits or a sensor.
  • the surface of the second metal layer 6 is shiny and flat in the region of the recess 10 and may comprise a coating or a profiling. By welding or soldering of the two metal layers 4, 6, this surface changes significantly in the recess 10. A previously glossy, even surface thus becomes a matt, curved surface. The gloss of the surface is reduced by oxidation of the surface during welding or soldering and the surface is thus converted into a matte surface.
  • the through-connection produced in this way can also comprise an electronic component.
  • FIG. 2 shows a schematic cross-sectional view of a laminate 11 according to the invention after through-plating.
  • a first metal layer 14 and a second metal layer 16 are separated from each other by an insulating layer 18.
  • the insulating layer 18 may for example be constructed of a dielectric, such as plastic, PET, glass or of a glass fiber-epoxy composite.
  • a recess 19 is arranged in the insulating layer 18. Within the recess 19, the two metal layers 14, 16 are interconnected. The connection can be generated for example by laser welding.
  • an electronic component 22 is arranged, which is electrically conductively and thermally conductively connected via a via 24 with the first and second metal layer 14, 16.
  • the two metal layers 14, 16 are welded directly to each other in the region of the recess 19 as a via 24.
  • a laser beam welding process is suitable.
  • other joining techniques can be used to make a conductive connection, such as soldering, gluing with a conductive adhesive, or sintered with a conductive sintering paste (for example, a silver-sintered paste).
  • the shiny, flat second metal layer 6 in the recess 10 of Figure 1 is by the structure of the via 24 to a matte, curved surface. If the second metal layer 6 has a profiling, a texture or a texture, this is lost by the soldering or welding. This can be determined by analyzing the area in the recess 9, 19 with a suitable measuring method. This can be done, for example, by an optical method by the scattering, absorption and / or reflection of light. X-ray fluorescence can also be used as an alternative method, for example, if the metal layers 4, 6, 14, 16 have different compositions or if the solder has a different composition than the second metal layer 6, 16.
  • the second metal layer 6, 16 may also be painted or have a tarnish color in order to be able to measure the difference between the laminate 1 without through-connection or with incomplete through-contacting and the laminate 11 with through-connection 24 on the basis of the color. Based on the height difference, the difference can also be determined by scanning the surface, ie a profile measurement or thickness measurement.
  • laminates 1, 11 optionally with integrated electronic component 22 can be readily on laminates 1, 11 with a plurality of recesses 10 and recesses 9, 19 expand by the structures shown arbitrarily side by side or in a row (based on the image plane of Figures 1 or 2) are arranged.
  • identical or different electronic components 22 or different contacts of the electronic components 22 can be arranged.
  • the metal layers 4, 6, 14, 16 can be contacted with each other or separated from each other in different ways.
  • the electronic components 22 can be connected in series or in parallel.
  • the thicknesses of the metal layers 4, 6, 14, 16 may vary depending on the heat capacity and heat transfer requirement - typically 0.04 mm to 2 mm. When Material is typically used a copper alloy.
  • the insulator 8, 18 is made of plastic, serves for electrical insulation and is 0.01 mm to 0.5 mm thick.
  • the embossing of the first metal layer 4, 14 serves to bridge the insulator layer 8, 18.
  • the diameter of the embossment is typically 0.2 mm to 2 mm, but it is usually the application to perform the embossing as small as possible.
  • the embossing can also be made larger and / or quadrangular, for example, to put electrical components 22, such as chips, in this impression. Typical sizes for this are edge lengths of 0.2 mm to 2 mm.
  • a recess 10 is introduced, which is produced for example with a laser beam or by a punching process.
  • the diameter of the recess 10 is typically 0.05 mm to 1 mm, but at least two thirds of the material thickness to be punched.
  • the recesses 10 are preferably arranged at the edge to arrange an electrical component 22 in the middle.
  • a connection to the lower second metal layer 6, 16 is produced, for example by means of a laser, the material is melted at the bottom 6, 16 and on the flanks of the recess 10.
  • a conductive medium can be filled in as a via 24, for example a solder or by dispensing with conductive adhesive.
  • the lower, second metal layer 6, 16 can be made thicker.
  • An active cooling of the second metal layer 6, 16, for example, by Peller elements, air cooling or liquid cooling is conceivable.
  • the laminates 1, 11 may be flexible and movable with a suitable choice of the metal layers 4, 6, 14, 16 and the insulating layers 8, 18. Also, based on the lamination, good corrosion resistance, solder bath stability and mechanical stability can be achieved. By additionally applied layer, the laminates 1, 11 can also be optically finished.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un stratifié destiné à la mise en contact électrique d'au moins un composant électronique, selon lequel une couche isolante est disposée entre une première couche métallique et une seconde couche métallique, les couches métalliques étant mises en contact électrique l'une avec l'autre dans au moins une zone de contact et au moins une découpe étant réalisée dans la couche isolante. En outre, les couches métalliques sont stratifiées avec la couche isolante, au moins un évidement étant produit dans la première couche métallique dans la zone de la découpe et la première couche métallique et la seconde couche métallique étant reliées ensemble de manière conductrice dans la zone de la découpe, la liaison des deux couches métalliques étant contrôlée. L'invention concerne également un stratifié destiné à la mise en contact électrique d'un composant électronique, fabriqué au moyen d'un tel procédé, comprenant une première couche métallique et une seconde couche métallique disposée sensiblement parallèlement à la première couche métallique et séparée par endroits de la première couche métallique par une couche isolante. Au moins une découpe est disposée dans la couche isolante et la première couche métallique et la seconde couche métallique sont reliées ensemble dans la découpe, de telle sorte que la seconde couche métallique soit recouverte, en particulier entièrement recouverte, de sorte que les couches métalliques soient reliées entre elles de manière thermoconductrice et/ou électroconductrice. L'invention concerne enfin également l'utilisation d'un tel stratifié comme platine ou substrat de support flexible pour des circuits électriques comprenant des puces, des capteurs, des DEL, des composants de puissance, des composants de téléphone portable, des commandes ou des régulateurs.
PCT/EP2012/000218 2011-02-02 2012-01-18 Procédé de fabrication d'un stratifié à mise en contact électrique conductrice Ceased WO2012104023A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011010186.1A DE102011010186B4 (de) 2011-02-02 2011-02-02 Verfahren zur Herstellung eines Laminats mit leitender Kontaktierung
DE102011010186.1 2011-02-02

Publications (1)

Publication Number Publication Date
WO2012104023A1 true WO2012104023A1 (fr) 2012-08-09

Family

ID=45722566

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/000218 Ceased WO2012104023A1 (fr) 2011-02-02 2012-01-18 Procédé de fabrication d'un stratifié à mise en contact électrique conductrice

Country Status (2)

Country Link
DE (1) DE102011010186B4 (fr)
WO (1) WO2012104023A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969815A (en) * 1973-09-19 1976-07-20 Siemens Aktiengesellschaft Process for forming a through connection between a pair of circuit patterns disposed on opposite surfaces of a substrate
JPS54150673A (en) * 1978-05-18 1979-11-27 Yazaki Corp Method of connecting two side copperrwired laminated board
US4501638A (en) * 1983-12-05 1985-02-26 E. I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
DE19852832A1 (de) 1998-11-17 2000-05-25 Heraeus Gmbh W C Verfahren zur Herstellung eines Metall-Kunststoff-Laminats
WO2001078475A1 (fr) * 2000-03-31 2001-10-18 Dyconex Patente Ag Procede et dispositif de fabrication d'elements de connexion electrique, et element de connexion resultant
DE10205521A1 (de) 2002-02-08 2003-08-28 Heraeus Gmbh W C Verfahren zur elektrischen Kontaktierung zweier Metallstrukturen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19811578A1 (de) * 1998-03-17 1999-10-14 Siemens Ag Mehrlagige Leiterplatte sowie Verfahren zu deren Herstellung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969815A (en) * 1973-09-19 1976-07-20 Siemens Aktiengesellschaft Process for forming a through connection between a pair of circuit patterns disposed on opposite surfaces of a substrate
JPS54150673A (en) * 1978-05-18 1979-11-27 Yazaki Corp Method of connecting two side copperrwired laminated board
US4501638A (en) * 1983-12-05 1985-02-26 E. I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
DE19852832A1 (de) 1998-11-17 2000-05-25 Heraeus Gmbh W C Verfahren zur Herstellung eines Metall-Kunststoff-Laminats
WO2001078475A1 (fr) * 2000-03-31 2001-10-18 Dyconex Patente Ag Procede et dispositif de fabrication d'elements de connexion electrique, et element de connexion resultant
DE10205521A1 (de) 2002-02-08 2003-08-28 Heraeus Gmbh W C Verfahren zur elektrischen Kontaktierung zweier Metallstrukturen

Also Published As

Publication number Publication date
DE102011010186B4 (de) 2018-10-18
DE102011010186A1 (de) 2012-08-02

Similar Documents

Publication Publication Date Title
EP2524394B1 (fr) Composant électronique, procédé pour sa fabrication et plaquette de circuits imprimés comportant un composant électronique
EP2286644B1 (fr) Procédé pour intégrer au moins un composant électronique dans un circuit imprimé et circuit imprimé
DE102012215705B4 (de) Gehäuse für ein optisches bauelement, baugruppe, verfahren zum herstellen eines gehäuses und verfahren zum herstellen einer baugruppe
DE4422216A1 (de) Mehrlagige metallische Leiterplatte und gegossener Baustein
WO2012059187A1 (fr) Laminé doté d'un composant électronique intégré
DE102008023457A1 (de) Elektronische Steuervorrichtung und Verfahren zum Herstellen einer elektronischen Steuervorrichtung
EP2516321B1 (fr) Capteur comportant un substrat céramique de préférence multicouche et procédé de fabrication correspondant
DE102016110862A1 (de) Modul und Verfahren zur Herstellung einer Vielzahl von Modulen
WO2012059186A1 (fr) Trou métallisé doté d'une puce intégrée pour substrats multicouches
DE102007010731A1 (de) Verfahren zum Einbetten von Chips und Leiterplatte
EP3146813B1 (fr) Module de commande électronique, en particulier destiné à une commande de boîte de vitesses, équipé de composants électriques soudés à des contacts insérés à force
WO2024175773A1 (fr) Composant électronique et procédé de montage d'un composant électronique
EP2583540B1 (fr) Procédé de fabrication d'une connection électrique et connecteur électrique
DE102013226549B4 (de) Verfahren zur Herstellung einer Leiterplatte
DE102009001932A1 (de) Chipmodul und Verfahren zur Herstellung eines Chipmoduls
DE112012002829T5 (de) Mehrschichtige Leiterplatte und Verfahren zum Herstellen einer mehrschichtigen Leiterplatte
DE102011010186B4 (de) Verfahren zur Herstellung eines Laminats mit leitender Kontaktierung
DE102014210576A1 (de) Hermetisch abgedichtete Elektronikeinheit mit flexibler Leiterplatte
DE102016200062B4 (de) Verfahren zur Ausbildung elektrisch leitender Durchkontaktierungen in keramischen Schaltungsträgern
EP2679969B1 (fr) Dispositif d'enregistrement de la température dans une pièce et procédé de fabrication d'un tel dispositif
DE102009044933A1 (de) Leistungshalbleitermodul mit mindestens zwei verbundenen Schaltungsträgern und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit mindestens zwei verbundenen Schaltungsträgern
DE102023110343B3 (de) Verfahren zur Herstellung einer mit einem Schaltungsträger bestückten SMD-Halbleiterbauelementbaugruppe, SMD-Halbleiterbauelementbaugruppe sowie Schaltungsträger
WO2007080027A1 (fr) Dispositif de refroidissement de composants de puissance sur des cartes de circuit imprimé et son procédé de fabrication
DE102011005933A1 (de) Verfahren zum Herstellen eines von einer Moldmasse umgebenen Schaltungsträgers
WO2018065268A1 (fr) Ensemble comportant un élément d'écartement et une carte de circuit imprimé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12705045

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 12705045

Country of ref document: EP

Kind code of ref document: A1