WO2012144760A2 - Lampe d'éclairage à led de type tube droit - Google Patents

Lampe d'éclairage à led de type tube droit Download PDF

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Publication number
WO2012144760A2
WO2012144760A2 PCT/KR2012/002698 KR2012002698W WO2012144760A2 WO 2012144760 A2 WO2012144760 A2 WO 2012144760A2 KR 2012002698 W KR2012002698 W KR 2012002698W WO 2012144760 A2 WO2012144760 A2 WO 2012144760A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat dissipation
coupling groove
straight
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/002698
Other languages
English (en)
Korean (ko)
Other versions
WO2012144760A3 (fr
Inventor
이승민
유진호
임수진
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanbeam Co Ltd
Original Assignee
Hanbeam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanbeam Co Ltd filed Critical Hanbeam Co Ltd
Publication of WO2012144760A2 publication Critical patent/WO2012144760A2/fr
Publication of WO2012144760A3 publication Critical patent/WO2012144760A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/108—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using hook and loop-type fasteners
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a straight-type LED (Light Emitting Diode) lamp, and more particularly to a straight-type LED lamp having improved heat dissipation and optical characteristics by the circuit board crimping portion.
  • a straight-type LED (Light Emitting Diode) lamp and more particularly to a straight-type LED lamp having improved heat dissipation and optical characteristics by the circuit board crimping portion.
  • LED is a semiconductor device that emits light when voltage is applied. It has a long life, low power consumption, and a response time of one million times faster than a fluorescent lamp. Recently, LED material technology has been developed, and products that exceed the light efficiency of fluorescent lamps have been released. Unlike conventional fluorescent lamps, light is emitted to the front, so no reflective structure is required. Therefore, considering the light loss of the reflective structure, the efficiency of an actual luminaire exceeds that of fluorescent lamps.
  • LEDs do not use harmful substances such as mercury, lead, and cadmium, and do not emit ultraviolet rays, and thus are attracting attention as eco-friendly products. Therefore, in recent years, attention has been focused on developing an intuitive LED lighting lamp by applying an LED device for the purpose of replacing the fluorescent lamp.
  • the LED device is a small point light source of less than 1mm, so it is harmful to the human body when the person directly sees the light source. Therefore, it is necessary to spread the light properly, and the light loss due to the diffusion structure used at this time usually occurs about 15 to 30%.
  • the LED is driven by electric current, and electrical energy that is not converted into light is converted into heat, and the generated heat causes the temperature rise of the device. LEDs should emit heat appropriately due to their deterioration in performance as the device's operating temperature rises. Therefore, a heat dissipation structure having good thermal conductivity is required, and the thermal resistance between the heat dissipation structure and the LED should be low.
  • intuition type LED lamps generally adopt a method of thermally connecting the heat dissipation structure and the LED by inserting a circuit board on which the LED is mounted into a slit formed on the heat dissipation structure or simply sticking it using an adhesive sheet.
  • this method alone has a problem in that the thermal conduction between the heat dissipation structure and the LED does not occur smoothly, so that the characteristic degradation due to heat in the LED occurs seriously.
  • the LED is a circuit board mounted with a thermally conductive adhesive sheet, but primarily attached to the heat sink, but the heat-conductive adhesive sheet alone does not form a strong adhesion through the structure of the assembly
  • the straight LED lamp of the present invention includes a circuit board on which a plurality of LEDs are disposed, a heat dissipation unit including a coupling groove for coupling and a circuit board accommodating unit accommodating the circuit board, and a coupling protrusion coupled to the coupling groove of the heat dissipation unit.
  • Cover portion to be;
  • a circuit board crimping part which is branched from an inner side of the cover part, and when the heat dissipation part and the cover part are coupled, compresses the circuit board toward the circuit board accommodating part to closely contact the heat dissipation part.
  • the circuit board crimping portion includes an elastic member.
  • the circuit board is formed integrally with the crimping portion, and further comprises a lens unit for diffusing light emitted from the LED.
  • the cover is made of a transparent material to increase the transmittance of light, and forms a concave-convex structure to further diffuse the light on the surface of the cover portion.
  • the cover part is made of a translucent material.
  • the cover part, the circuit board pressing part and the lens part are formed by extruding or injecting at the same time.
  • the coupling groove of the heat dissipation unit is formed in a double structure of the sub coupling groove and the main coupling groove.
  • the circuit board crimping part is closely fixed to the circuit board and the heat dissipation part to improve the emission of heat generated in the LED to improve the performance and life of the product.
  • the cover portion is made of a transparent material to improve the efficiency of light and widen the angle of reach of light even if the light transmittance is increased to reduce glare.
  • the cover portion is made semi-transparent to further prevent glare from direct sunlight of the LED.
  • the heat dissipation part structure is formed into a coupling groove of the double structure, thereby more firmly fixing the circuit board and the heat dissipation part.
  • FIG. 1 is a cross-sectional view before and after coupling of the LED tube lamp according to the invention.
  • Figure 2 is a cross-sectional view before and after coupling of the LED tube lamp according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a linear LED lamp according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a linear LED lamp according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a linear LED lamp including a coupling groove of a double structure according to an embodiment of the present invention.
  • Figure 6 is a bottom view of a straight LED lamp in accordance with the present invention.
  • a straight LED lamp according to the present invention includes a circuit board 101 on which the LED 100 is mounted, a heat dissipation unit 102, and a cover unit 103.
  • the heat dissipation unit 102 is formed in a hollow semi-circular columnar shape, a circuit for accommodating the circuit board in the center of the heat dissipation unit and a coupling groove 104 for coupling with the cover unit 103 at the outer side of the lower end of the semi-circle. And a substrate receiving portion 105.
  • the circuit board accommodating portion is concave inward from the lowest end surface of the heat dissipation portion, the stepped depth of the circuit board is formed to be shallower than the thickness of the circuit board, and the circuit board accommodating portion is heat spread to the heat dissipation portion through the entire bottom surface; It is preferable that the bottom surface is formed to have a structure in which the heat radiation efficiency is improved.
  • the present invention is not limited to this structure, and a part of the bottom surface may be opened depending on the heat dissipation mechanism.
  • the heat dissipation unit 102 may further include a heat dissipation fin (not shown) to improve heat dissipation efficiency.
  • the circuit board 101 is a plurality of LED chips 100 are arranged at a predetermined interval, the circuit board 101 is attached to the heat dissipation using a thermally conductive adhesive.
  • the thermally conductive adhesive material is to minimize the gap between the circuit board and the heat dissipation portion, and the thermal conductivity is formed to be as thin as possible using an adhesive tape or paste as a material having a thermal conductivity of about 1 W / mK or more.
  • the pressure-sensitive adhesive layer should be tens of microns or more to minimize the formation of a gap between the circuit board and the heat dissipation part by an appropriate pressure.
  • the adhesion of the adhesive material may be various.
  • the cover part 103 diffuses the light generated from the LED chip 100 over its entire surface, and is generally implemented by extruding or injection molding polystyrene, acrylic, or polycarbonate-based resin in the form of a semicircle.
  • the cover part 103 includes a coupling protrusion 106 that protrudes into the upper end of the semicircle and is coupled to the coupling groove 104 of the heat dissipation part 102.
  • the cover part and the heat dissipation part constitute a combination, and when the base having electrodes at both ends of the combination is assembled, the appearance of the lamp is constituted.
  • the circuit board crimping portion 107 is branched on the inner surface of the cover portion 103, and when the heat dissipation portion 102 and the cover portion 103 is coupled to the circuit board 101 to accommodate the circuit board It is pressed in the direction of the portion 105 is in close contact with the heat radiating portion.
  • the depth of the circuit board accommodating part is formed to be smaller than the thickness of the circuit board.
  • the circuit board accommodating part of the circuit board accommodating part is protruded upward from the circuit board accommodating part while the circuit board is accommodated in the circuit accommodating part. It can be compressed effectively.
  • the circuit board crimping unit may be implemented in a straight form as shown in FIG. 1, but the form is not limited to a straight line, and various structures for effectively increasing or distributing the force for pressing the circuit board may be applied. For example, if a portion of the crimp portion is bent in the process of applying pressure to the circuit board crimp in the form of a straight line, the pressure is concentrated at the edge of the circuit board, and thus the adhesion of the circuit board crimp portion to the heat dissipation portion is reduced at the center of the circuit board.
  • An elastic member protruding toward the circuit board may be formed at the end of the circuit board crimping portion so that pressure is effectively formed over the entire circuit board without bending, and the circuit board crimping portion is finished in the form of a semicircle having elasticity. It can be formed to further press (not shown).
  • Figure 2 is a cross-sectional view showing another embodiment of the present invention, (a) is a coupling before the LED tube lamp, and (b) shows a state after coupling the LED tube lamp.
  • the straight LED lamp shown in FIG. 2 includes an LED chip 200, a circuit board 201, a heat dissipation part 202, a cover part 203, a circuit board crimping part 207, and a lens part 209. .
  • a plurality of LED chips 200 are disposed on the circuit board 201 at predetermined intervals, and the circuit board is attached to the heat radiating part using the adhesive material.
  • the cover part 203 is transparent so that light generated from the LED chip is transmitted over the entire surface thereof.
  • the cover part 203 is formed by extruding or injection molding polystyrene, acrylic, or polycarbonate-based resin in the form of a semicircle.
  • the transparent cover part may be manufactured integrally by extrusion or injection molding with the circuit board crimping part 207 and the lens part 209.
  • the vertical cover pressure is applied to the circuit board by the circuit board crimping part. Apply it to support the heat sink.
  • the lens portion inside the cover portion is designed to widen the radiation angle of light, and is made of a transparent material so that the loss of light is small.
  • the lens unit may be implemented in the form of two semicircles that are symmetrical about the center of the LED chip, and as shown in FIG.
  • the lens is intended to disperse the luminous flux of the light-emitting diode concentrated in the center on both sides, and thus the structure is not limited to a semicircle, and the lens can be designed in various ways such as in the form of a prism or a reflector. This does not limit the shape of the lens if it is designed to emit light in a certain range.
  • circuit board crimping portion 207 may be formed to include an elastic member having a protruding shape as shown in FIG. 2, but may be embodied in a straight form without a protruding portion as a simple structure, or may press force the circuit board. Additional various structures are available for efficient raising and distribution (not shown).
  • FIG. 3 is a cross-sectional view showing a linear LED lamp according to another embodiment of the present invention.
  • the concave-convex structure 302 is formed on the surface of the cover part 301, and the light having a wider angle of radiation by the lens part inside the cover part 301 can be used by using the concave-convex structure. Scatter to further reduce glare.
  • the cover part 301 including the uneven structure is generally formed by extrusion or injection molding of polystyrene, acrylic or polycarbonate-based resin in the form of a semicircle.
  • FIG. 4 is a cross-sectional view showing a linear LED lamp according to another embodiment of the present invention.
  • the cover part 401 is made of translucent, and further diffuses the light having a wider angle of radiation by the lens part located inside the cover part in the translucent material to further reduce glare. do.
  • the translucent cover portion 401 is generally molded by extrusion or injection molding of polystyrene, acrylic or polycarbonate resin in the form of a semicircle.
  • FIG. 5 is a cross-sectional view showing a linear LED lamp including a coupling groove of a double structure according to another embodiment of the present invention.
  • 5 is another heat dissipation part structure of the present invention, the coupling groove formed by the double structure of the sub coupling groove 502 and the main coupling groove 503 in order to increase the coupling force of the heat dissipation portion 501 and the cover portion 504. It includes. 5 (a) shows a state in which the engaging projection 505 of the cover portion 504 is inserted into the sub coupling groove 502 of the heat dissipation portion 501 is engaged. Pressing the PCB while pushing it into the groove when assembling the heat dissipation part and the cover part gives a force in the longitudinal direction of the PCB, which makes the assembly process difficult and it is difficult to design strong pressure.
  • the straight LED lamp according to this embodiment as shown in FIG.
  • Figure 6 is a bottom view of a straight LED lamp in accordance with the present invention.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne une lampe d'éclairage à diodes électroluminescentes (LED) de type tube droit présentant de meilleures caractéristiques optiques et assurant une meilleure dissipation thermique. La lampe d'éclairage à LED de type tube droit selon l'invention comprend : une carte de circuit imprimé sur laquelle sont agencées plusieurs LED ; une partie dissipation thermique munie d'une rainure de raccordement pour son raccordement et un élément de logement de la carte de circuit imprimé qui loge la carte de circuit imprimé ; une partie couvercle munie d'une saillie de raccordement raccordée à la rainure de raccordement de la partie dissipation thermique ; et une partie compression de la carte de circuit imprimé qui forme une branche à partir de la surface intérieure de la partie couvercle et qui, lorsque la partie dissipation thermique et la partie couvercle sont raccordées, comprime la carte de circuit imprimé en direction de l'élément de logement de la carte de circuit imprimé pour amener la carte de circuit imprimé à adhérer étroitement à la partie dissipation thermique.
PCT/KR2012/002698 2011-04-19 2012-04-10 Lampe d'éclairage à led de type tube droit Ceased WO2012144760A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110036270A KR101071859B1 (ko) 2011-04-19 2011-04-19 직관형 ｌｅｄ조명등
KR10-2011-0036270 2011-04-19

Publications (2)

Publication Number Publication Date
WO2012144760A2 true WO2012144760A2 (fr) 2012-10-26
WO2012144760A3 WO2012144760A3 (fr) 2013-01-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/002698 Ceased WO2012144760A2 (fr) 2011-04-19 2012-04-10 Lampe d'éclairage à led de type tube droit

Country Status (2)

Country Link
KR (1) KR101071859B1 (fr)
WO (1) WO2012144760A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200482820Y1 (ko) * 2012-02-16 2017-03-07 루미마이크로 주식회사 튜브 타입의 ｌｅｄ 조명장치
WO2013131227A1 (fr) * 2012-03-05 2013-09-12 胡斌 Lentille de guidage de lumière à del
JP2013229245A (ja) * 2012-04-26 2013-11-07 Panasonic Corp Ｌｅｄ照明器具
KR200475918Y1 (ko) * 2013-07-08 2015-01-26 주식회사 알토 코너 조명 장치
KR200478971Y1 (ko) * 2014-04-30 2015-12-07 태석정공 주식회사 방수용 엘이디 형광등
US10920940B1 (en) 2019-11-19 2021-02-16 Elemental LED, Inc. Optical system for linear lighting
US10788170B1 (en) * 2019-11-19 2020-09-29 Elemental LED, Inc. Optical systems for linear lighting

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101057379B1 (ko) * 2008-12-12 2011-08-17 솔레즈 주식회사 조명체용 형광커버 및 이의 제조방법 그리고 엘이디 발광부를 이용한 조명체
KR100918995B1 (ko) * 2009-04-01 2009-09-25 (주)세미백아이엔씨 Ｌｅｄ 조명장치
KR20110038848A (ko) * 2009-10-09 2011-04-15 비나텍주식회사 직관형 발광다이오드 조명 램프 및 제조 방법
KR100949699B1 (ko) 2009-12-04 2010-03-29 엔 하이테크 주식회사 구조가 개선된 전원단자 및 방열테이프의 분리방지를 위한 고정수단이 구비된 엘이디 형광등

Also Published As

Publication number Publication date
WO2012144760A3 (fr) 2013-01-03
KR101071859B1 (ko) 2011-10-11

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