WO2012148218A3 - 수평열전 테이프 및 그 제조방법 - Google Patents

수평열전 테이프 및 그 제조방법 Download PDF

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Publication number
WO2012148218A3
WO2012148218A3 PCT/KR2012/003294 KR2012003294W WO2012148218A3 WO 2012148218 A3 WO2012148218 A3 WO 2012148218A3 KR 2012003294 W KR2012003294 W KR 2012003294W WO 2012148218 A3 WO2012148218 A3 WO 2012148218A3
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WIPO (PCT)
Prior art keywords
thermoelectric tape
horizontal thermoelectric
heat dissipation
manufacturing same
horizontal
Prior art date
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Ceased
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PCT/KR2012/003294
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English (en)
French (fr)
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WO2012148218A2 (ko
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민의홍
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Dasan Solueta Co Ltd
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Solueta Co Ltd
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Priority to CN201280020564.0A priority Critical patent/CN103563505B/zh
Publication of WO2012148218A2 publication Critical patent/WO2012148218A2/ko
Publication of WO2012148218A3 publication Critical patent/WO2012148218A3/ko
Priority to US14/065,198 priority patent/US8968867B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
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    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/321—Phosphates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
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    • C09J2400/163—Metal in the substrate
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    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/2852—Adhesive compositions
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    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 수평열전 테이프 및 그 제조방법에 관한 것으로서, 보다 구체적으로는 전자기파를 효과적으로 차단하고 방열효과가 우수한 수평열전 테이프 및 그 제조방법에 관한 것이다. 본 발명에 따른 수평열전 테이프는 점착층과 방열층의 이층구조를 단일화하여 보다 효과적으로 방열 효과를 달성하며 그 제조 공정을 단순화 시켰으며, 또한 증착하지 않은 메탈포일을 전도성 기재부로 사용함에 따르 열전도도가 우수하고 불순물이 첨가되지 않은 전도성 기재부를 사용한 수평열전 테이프의 제공이 가능하다.
PCT/KR2012/003294 2011-04-28 2012-04-27 수평열전 테이프 및 그 제조방법 Ceased WO2012148218A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280020564.0A CN103563505B (zh) 2011-04-28 2012-04-27 水平热电胶带及其制备方法
US14/065,198 US8968867B2 (en) 2011-04-28 2013-10-28 Horizontal thermoelectric tape and method for manufacturing same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110040327 2011-04-28
KR10-2011-0040327 2011-04-28
KR10-2012-0044489 2012-04-27
KR1020120044489A KR101314169B1 (ko) 2011-04-28 2012-04-27 수평열전 테이프 및 그 제조방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/065,198 Continuation US8968867B2 (en) 2011-04-28 2013-10-28 Horizontal thermoelectric tape and method for manufacturing same

Publications (2)

Publication Number Publication Date
WO2012148218A2 WO2012148218A2 (ko) 2012-11-01
WO2012148218A3 true WO2012148218A3 (ko) 2013-01-17

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PCT/KR2012/003294 Ceased WO2012148218A2 (ko) 2011-04-28 2012-04-27 수평열전 테이프 및 그 제조방법

Country Status (4)

Country Link
US (1) US8968867B2 (ko)
KR (1) KR101314169B1 (ko)
CN (1) CN103563505B (ko)
WO (1) WO2012148218A2 (ko)

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CN103865414A (zh) * 2012-12-18 2014-06-18 斯迪克新型材料（江苏）有限公司 散热型压敏胶带的制备工艺
CN103694918A (zh) * 2012-12-18 2014-04-02 斯迪克新型材料（江苏）有限公司 石墨导热胶粘带
CN103059760B (zh) * 2012-12-18 2014-10-15 斯迪克新型材料（江苏）有限公司 具有散热功能的导热贴膜及其制造方法
CN103865413A (zh) * 2012-12-18 2014-06-18 斯迪克新型材料（江苏）有限公司 电子器件用丙烯酸酯胶带
CN104152073B (zh) * 2012-12-18 2016-01-13 苏州斯迪克新材料科技股份有限公司 用于电子产品贴膜的制备方法
CN103694920A (zh) * 2012-12-18 2014-04-02 斯迪克新型材料（江苏）有限公司 用于制备石墨导热胶粘带的制造方法
CN103059757B (zh) * 2012-12-18 2014-06-04 苏州斯迪克新材料科技股份有限公司 用于散热的压敏胶带及其制备方法
CN103694919A (zh) * 2012-12-18 2014-04-02 斯迪克新型材料（江苏）有限公司 电子产品用石墨散热胶带
KR101457914B1 (ko) * 2014-03-05 2014-11-05 실리콘밸리(주) 전자파 흡수층을 구비한 열 확산시트 및 그 제조방법
WO2017018999A1 (en) * 2015-07-24 2017-02-02 Hewlett-Packard Development Company, L.P. Thermal radiation heat dissipation structure
KR101870644B1 (ko) * 2016-03-22 2018-06-25 주식회사 솔루에타 방열특성이 우수한 방열시트 및 이의 제조방법
JP6722488B2 (ja) * 2016-03-30 2020-07-15 星和電機株式会社 難燃性放熱シートの製造方法
US11271348B1 (en) * 2018-10-24 2022-03-08 Amphenol Corporation High performance electrical connector
JP7080920B2 (ja) * 2020-04-28 2022-06-06 星和電機株式会社 難燃性放熱シート
CN114058288B (zh) * 2021-12-10 2024-05-28 东莞澳中新材料科技股份有限公司 一种具有强粘接性能的散热胶带及其制备方法

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KR20050019696A (ko) * 2003-08-21 2005-03-03 주식회사 애드텍 Ｐｖｃ 지지체를 포함하는 감압형 다이싱용 점착제테이프의 제조방법 및 점착제 테이프
KR20090043633A (ko) * 2007-10-30 2009-05-07 쓰리엠 이노베이티브 프로퍼티즈 캄파니 열전도성 점착제 및 이를 이용하는 점착테이프

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WO2012148218A2 (ko) 2012-11-01
US8968867B2 (en) 2015-03-03
KR20120123645A (ko) 2012-11-09
US20140050916A1 (en) 2014-02-20
CN103563505B (zh) 2017-03-08
KR101314169B1 (ko) 2013-10-04

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